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符合「compound semiconductor」新聞搜尋結果， 共 30 篇 ，以下為 1 - 24 篇 訂閱此列表，掌握最新動態
ACE Solution x HON. PRECISION at SEMICON Taiwan 2024, ACE Solution President Steve Hsu (left) and HON. PRECISION President Alan Hsieh (right)
Global Business News
ACE Solution and HON. PRECISION Unveil Advanced Compound Semiconductor and Silicon Photonics Technologies at SEMICON Taiwan 2024

Hsinchu, Taiwan, September 9, 2024 -SEMICON Taiwan officially opened on September 6, 2024, with ACE Solution and HON. PRECISION is joining forces to showcase its latest advancements in silicon photonics testing technology, precision measurement, and automated machinery integration. Their exhibition focused on high-density optoelectronic integration testing solutions designed to meet the increasing demands of silicon photonics for high-capacity and high-channel testing. The integrated optoelectronic signal testing system effectively addresses the challenges posed by increased data center traffic and high-speed transmission needs, significantly boosting transmission rates and reducing energy consumption. With semiconductor packaging evolving towards Co-Packaged Optics (CPO), ACE Solution highlighted its silicon photonics solutions developed through deep collaboration with Quantifi, integrating PXI testing modules to offer an efficient, multi-system testing solution supporting 800G and 1.6T high-speed transmission. These integrated solutions meet the research and production needs for high-speed, high-precision, and high-efficiency testing while offering programmable automation for flexible applications.   ACE Solution also demonstrated its latest innovations in compound semiconductor testing. The Teradyne ETS-88 testing platform is widely used for SiC, GaN, PMIC, automotive electronics, aerospace, and defense industries. Key features include multi-site CP, second-contact KGD, dynamic/static power device FT, and fully automated high-output module FT. The ETS-364 and ETS-800 platforms are tailored for mixed-signal, digital, and analog testing, offering the industry's highest-spec power IC testing capabilities with support for up to 6000V and 4000A, making them ideal for high-current, high-voltage applications, particularly in EV power and battery management.   The TZ-6000 non-destructive wafer and materials inspection system utilizes terahertz (THz) technology, focusing on compound semiconductor testing for GaAs, SiC, and GaN. It offers greater penetration depth and flexibility, handling various sizes and shapes of wafers. Equipped with advanced wafer probes and intelligent software analysis, it can simultaneously measure parameters such as thickness, refractive index, resistivity, dielectric constant, surface/subsurface defects, and full wafer scans, enabling non-destructive wafer quality measurements.   The Electro-Optic Terahertz Pulse Reflectometer (EOTPR) is the world's first instrument to use isolation technology to detect IC package faults and monitor package quality, making it ideal for non-destructive defect detection in 3DIC package analysis. With 5-micron pinpoint precision, the EOTPR is widely used in advanced IC packaging fault analysis for devices such as stacked packages (PoP), flip-chip, and TSV in 3D packaging. Major semiconductor companies have extensively deployed EOTPR for advanced IC packaging quality assurance in manufacturing environments.   Steve Hsu, President of ACE Solution, stated, "With over 20 years of experience in hardware-software integration, ACE Solution has expanded from wireless communication testing to various testing fields, meeting the needs of our local clients. We are thrilled to collaborate with HON. PRECISION to showcase our achievements in automation and precision testing." Alan Hsieh, President of HON. PRECISION commented, "This exhibition marks a new milestone in our partnership with ACE Solution. We look forward to offering more advanced solutions, fostering greater collaboration and innovation across the industry."   For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Peter Lee, Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw Website: https://www.acesolution.com.tw/en/   About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to the specific requirements of our customers in the field of electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished team of technical experts who offer unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively.    

文章來源 : 筑波科技股份有限公司 發表時間 : 瀏覽次數 : 849 加入收藏 :
TZ6000, CEO Steve Hsu, and Dr. Philip Taday
Global Business News
TZ6000 – a nondestructive wafer quality measurement tool for the compound semiconductor industry

Hsinchu, Taiwan – ACE Solution, the leader and the provider in customized test solutions to meet customer needs in electrical components, devices and system manufactures, is pleased to announce the product launch of the TZ6000 – a nondestructive wafer quality measurement tool for the compound semiconductor industry. Incorporated with TeraView’s TeraPulse Lx technologies, the TZ6000 achieves nondestructive wafer quality measurements of thickness, refractive index, resistivity, dielectric constant, surface/subsurface defects at selected positions and whole wafer scanning map.     Dr. JC Chen, VP of R&D of ACE Solution, commented “The quality of the semiconductor wafer determines the maximum achievable conversion efficiency to the final device.  Subsurface damages (SSD) of semiconductor wafers are easily induced during surface machining process includes rough grinding, fine grinding, and chemical mechanical polishing. Current wafer inspection systems which rely on VIS/IR/UV optical inspection can analysis the surface properties of the wafer but not the SSD, due to their low penetration depth. Terahertz (THz) wave has higher penetration depth in semiconductor wafers as silicon, silicon carbide and gallium nitride. We developed the THz-based TZ6000 to meet the market need of nondestructive inspection of the compound semiconductor wafer.” Dr. Philip F. Taday, Head of Applications and Principal Scientist of TeraView, commented “The TeraPulse Lx system is TeraView’s world-leading product family for terahertz analysis. It has been designed to meet the needs of the material inspection in imaging or spectroscopy applications, and is ideal for compound semiconductors. The system’s modular architecture and TeraView patented laser-gated photoconductive emitters and detectors gives the user both flexibility and expandability. The system also boasts an industry-leading 3,200 ps time-delay line, as standard.” Steve Hsu, CEO of ACE Solution, commented “ACE Solution is the leading company in providing electrical precision test, integrating service and solution. It is great opportunity to collaborate with TeraView and incorporate the TeraPulse Lx module into TZ6000 system for nondestructive wafer quality inspection. TZ6000 has high flexibilities for various sizes and forms of wafers. It is provided with TeraView’s unique THz-TDS probe for simultaneous measurement of multiple parameters of wafer characterization. TZ 6000 has a user-friendly and graphic illustrate software for quality inspection in wafer manufacturing process and R&D.” Dr. Don Arnone, CEO of TeraView, commented “This is another first from TeraView to have a close collaboration with ACE Solution to develop this product, and we are quite confident that this product will set a new standard in compound semiconductor wafer quality analysis and defect inspection. The TeraPulse Lx system is designed with a lightweight compact core unit which allows for easy transport between locations. Incorporated with TeraView’s TeraPulse Lx modules, we can address the growing needs of the compound semiconductor wafer industry with this product.” About ACE Solution Founded in 2000, ACE Solution (https://www.acesolution.com.tw/en/index/) is located in Hsinchu City, Taiwan with branch offices in Suzhou and Shenzhen in China. Our mission is to provide customized test solutions to meet customer needs in electrical components, devices and system manufactures, as well as providing technology solutions through our partners. We are focused on RF, mmWave and terahertz with the expert technical support team. ACE Solution provides professional, innovative and multi-functional integrated techniques and solutions. About TeraView Founded in 2001, TeraView (https://teraview.com/) is the world’s first and leading company solely focused on the application of terahertz light to provide solutions to customer issues. A spin out from the Toshiba Corporation and Cambridge University, TeraView has developed its proprietary technology across a number of markets. These include fault analysis and quality assurance for semiconductor chips used in mobile computing and communications, as well as non-destructive inspection of high value coatings used in the automotive, pharmaceutical, food and solar industries.   Contact ACE Solution, Co., Ltd. Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 E-mail: thzlab@acebiotek.com WebSite: https://www.acesolution.com.tw/en/index/

文章來源 : 筑波科技股份有限公司 發表時間 : 瀏覽次數 : 2516 加入收藏 :
ACE, NYCU, LiU, Dr. Philip (Sixth from the left)
Global Business News
National Yang Ming Chiao Tung University (NYCU) and Linköping University (LiU) Visit ACE Biotek-Achieves Digital Healthcare and Compound Semiconductor Cooperation Innovation

ACE Group develops smart hospital upload systems and third-generation semiconductor material testing solutions based on 20 years of wireless communication, IoT, software, and hardware integration experience. National Yang-Ming Chiao Tung University (NYCU) and Linköping University (LiU) visit the enterprise to see digital healthcare, Terahertz (THz), and semiconductor performance.   Industry-Academy Platform to Build Compound Semiconductor Advanced Materials Cooperation NYCU conducts a crucial project on the compound semiconductor. It applies advanced materials such as silicon carbide (SiC), gallium nitride (GaN) and gallium oxide (Ga2O3) to Power IC and RF. The project can build up advanced materials, software services, and platform design. Moreover, this can reach industry-academy partnerships. The Thin Film Physics Division of LiU conducts application-inspired basic research on thin films to fundamentally understand the atomistic nature of materials' properties and behavior and learn how to make materials perform better through new methods of synthesis and processing. The research concerns the design of new multifunctional materials for rigid and wear-resistant coatings, energy materials, magnetic materials, electronics, neutron-converting materials for the European spallation Source (ESS), wide-band gap semiconductors, and more.   Prof. of NYCU, Horng, Ray-Hua recognizes that" ACE Group differentiates from other material testing companies. We look forward to cooperating with THz technology on non-destructive detection and failure analysis of materials; on the other hand, the Uniiform digital handwriting system can contribute to education." The Professors from LiU also indicates that the THz technology is awe-inspiring and suggests that the possibilities with polarized waves, used for instance in THz-ellipsometry, may further improve and expand the technology. The visitors also commented that the Uniiform digital handwriting system could be a great tool in education.     ACE Group Competitive Advantages: Wireless Communication, Smart Hospital, and Semiconductor Integration Testing ACE Group specializes in RF electronic components, measuring instruments, communication system tests, and integration. Since 2014, the company has been committed to digital medicare and precision medical treatment of early diagnosis technology and devices. Combined with AI, it invents the Uniiform digital handwriting system and Data Stream (DS) for Anesthesiology (Spark), Ophthalmology (Eagle Park 100), and Dentistry medical form digital recording system particularly. ACE uses THz technology (TZ-6000) for wafer testing in the semiconductor testing field. Nowadays, ACE establishes partnerships with Teradyne to promote Eagle Test System (ETS). For the third-generation semiconductor, ETS can fulfill the high voltage and high current test solutions in automotive semiconductor production test requirements.   ACE Group invites Dr. Philip F. Taday, the scientist of Teraview, to join the panel discussion at this event. Electro-Optical Terahertz Pulse Reflectometry (EOTPR) is an innovative time domain reflectometry (TDR) system that Intel and TeraView have successfully developed. It uses the isolation technique that is the first place in the world to detect package failures and monitor the quality of integrated circuits. It’s the first choice for non-destructive defect detection of integrated circuit packaging. Interdisciplinary skills swapping creates the novel industry application and research of advanced semiconductor materials.

文章來源 : 筑波醫電股份有限公司 發表時間 : 瀏覽次數 : 5317 加入收藏 :
ACE, NYCU, LiU, Dr. Philip (Sixth one from left)
Global Business News
National Yang Ming Chiao Tung University (NYCU) and Linköping University (LiU) Visit ACE Biotek-Achieves Digital Healthcare and Compound Semiconductor Cooperation Innovation

ACE Group develops smart hospital upload systems and third-generation semiconductor material testing solutions based on 20 years of wireless communication, IoT, software, and hardware integration experience. National Yang-Ming Chiao Tung University (NYCU) and Linköping University (LiU) visit the enterprise to see digital healthcare, Terahertz (THz), and semiconductor performance.   Industry-Academy Platform to Build Compound Semiconductor Advanced Materials Cooperation NYCU conducts a crucial project on the compound semiconductor. It applies advanced materials such as silicon carbide (SiC) and gallium nitride (GaN) to Power IC and RF. The project can build up advanced materials, software services, and platform design. Moreover, this can reach industry-academy partnerships. The Semiconductor Materials Division of LiU develops and investigates materials for novel electronics, especially on wide bandgap semiconductors, semiconductor device materials, and the sublimation materials unit. LiU focuses on silicon carbide, III-nitrides, and graphene for fundamental and application-motivated issues of interest for Swedish and European industries.   ACE Group Competitive Advantages: Wireless Communication, Smart Hospital, and Semiconductor Integration Testing ACE Group specializes in RF electronic components, measuring instruments, communication system tests, and integration. Since 2014, the company has been committed to digital medicare and precision medical treatment of early diagnosis technology and devices. Combined with AI, it invents the Uniiform digital handwriting system and Data Stream (DS) for Anesthesiology (Spark), Ophthalmology (Eagle Park 100), and Dentistry medical form digital recording system particularly. ACE uses THz technology (TZ-6000) for wafer testing in the semiconductor testing field. Nowadays, ACE establishes partnerships with Teradyne to promote Eagle Test System (ETS). For the third-generation semiconductor, ETS can fulfill the high voltage and high current test solutions in automotive semiconductor production test requirements.   ACE Group invites Dr. Philip F., the scientist of Teraview, to join the panel discussion at this event. Electro-Optical Terahertz Pulse Reflectometry (EOTPR) is an innovative time domain reflectometry (TDR) system that Intel and TeraView have successfully developed. It uses the isolation technique that is the first place in the world to detect package failures and monitor the quality of integrated circuits. It’s the first choice for non-destructive defect detection of integrated circuit packaging. Interdisciplinary skills swapping creates the novel industry application and research of advanced semiconductor materials.

文章來源 : 筑波醫電股份有限公司 發表時間 : 瀏覽次數 : 3140 加入收藏 :
4/30化合物半導體檢測技術與自動化論壇
產經商業
敬邀：4/30 筑波科技化合物半導體檢測技術與自動化論壇

(台灣新竹，2025年04月11日)，隨著電動車、5G 通訊與 HPC 快速發展，化合物半導體材料如 SiC 和 GaN 具備高頻率、耐高壓、優異的散熱性能與高效能轉換特性，成為車用半導體與電源管理 IC 領域關鍵技術。但也面臨高功率元件測試的精準性、3DIC 封裝技術檢測需求及生產效率挑戰。   為了突破高功率類比與混合訊號測試的瓶頸，筑波科技與美商 Teradyne 合作 ETS 測試解決方案。涵蓋從 MA、FA 到車用半導體測試的完整技術支持，以太赫茲技術，實現非破壞性晶圓材料測試與 3DIC 高階封裝檢測，協助產業達成從研發到量產的無縫銜接。   UR/MiR 協作自動化解決方案已成為提升半導體製程效率的關鍵利器，能有效降低人工成本，還能提升檢測與搬運過程的精準性與穩定性。   本次論壇匯聚產學研界專家，共同探討創新應用與未來趨勢。誠摯邀請您至報名網站登記參與。     日期：2025年04月30日 (三) 13:00-16:40 地點：筑波醫電大樓1F 諾貝爾講堂(新竹縣竹北市生醫二路66號) 報名：https://register.acesolution.com.tw/20250430_WBGSemiconductor_Seminar   VIP 貴賓/講師陣容/主題： l   鴻海研究院/ 蕭逸楷博士 組長：AI 時代的碳化矽：智慧設計加速功率技術革新 l   筑波科技/ 謝易錚 業務經理：化合物半導體市場趨勢及高功率類比與混合訊號測試創新 l   筑波科技/ 官暉舜博士 研發經理：化合物半導體材料與晶圓測試挑戰與解決方案 l   Onsemi 安森美/ 翁紹洋 產品暨市場行銷經理：DrWBG application for AI server l   Teradyne Robotics/ 王永廸 商務發展經理：運用 MiR 打造廠區高穩定、無人化配送網絡   精彩展示體驗： l   高功率類比與混合訊號測試方案 l   晶圓材料與 3DIC 非破壞性測試 l   半導體協作 Robots 自動化   聯絡筑波科技 筑波科技股份有限公司ACE Solution, Co., Ltd. 地址：新竹縣竹北市台元街28號2樓之1 電話：03-5500909 電子郵件：service@acesolution.com.tw 網站：https://www.acesolution.com.tw/en/index/   關於筑波科技（ACE Solution） 筑波科技（https://www.acesolution.com.tw/en/index/）成立於2000年，位於台灣新竹，在中國蘇州和深圳以及越南設有分公司，可提供服務。我們的使命是提供訂製的測試解決方案，以滿足電氣元件、設備和系統製造商的客戶需求，通過合作夥伴提供技術解決方案。我們專注於射頻、毫米波和太赫茲領域，擁有專業的技術支援團隊，提供專業、創新和多功能的綜合技術和解決方案。

文章來源 : 筑波科技股份有限公司 發表時間 : 瀏覽次數 : 2109 加入收藏 :
Global Business News
2025 Japan Prize Laureates Announced

TOKYO, Jan. 22, 2025 /PRNewswire/ -- The Japan Prize Foundation announced the winners of the 2025 Japan prize on January 22, 2025. Prof. Russell Dean Dupuis of the USA has been awarded the Japan Prize in the fields of Materials Sciences and Production, and Prof. Carlos M. Duarte of Spain has been awarded the Japan Prize in the fields of Biological Production, Ecology/Environment. - Field Eligible for the Award: Materials Sciences and ProductionProf. Russell Dean DupuisImage:https://cdn.kyodonewsprwire.jp/prwfile/release/M000319/202501152911/_prw_PI1fl_tS7bGu5Q.jpg  - Field Eligible for the Award: Biological Production, Ecology/EnvironmentProf. Carlos M. DuarteImage:https://cdn.kyodonewsprwire.jp/prwfile/release/M000319/202501152911/_prw_PI2fl_75vq5Xm9.jpg  For this year's Japan Prize, Prof. Dupuis is being recognized for his distinguished contributions to the development of metalorganic chemical vapor deposition technology for compound semiconductor electronic and optoelectronic devices, and pioneering contribution to its large-scale commercialization; and Prof. Duarte is being recognized for his contribution to the understanding of marine ecosystems in a changing Earth, especially through pioneering research on Blue Carbon. For the 2025 Japan Prize, the Foundation asked approximately 15,500 prominent scientists and engineers from around the world to nominate researchers working in this year's fields. It received 149 nominations for the fields of Materials Sciences and Production, and 72 nominations for the fields of Biological Production, Ecology/Environment. This year's winners were selected from a total of 221 nominees. About the Japan Prize The establishment of the Japan Prize in 1981 was motivated by the Japanese government's desire to create an internationally recognized award that would contribute to scientific and technological development around the world. With the support of numerous donations, the Japan Prize Foundation received endorsement from the Cabinet Office in 1983.  The Japan Prize is awarded to scientists and engineers from around the world who have made creative and dramatic achievements that help progress their fields and contribute significantly to realizing peace and prosperity for all humanity. Researchers in all fields of science and technology are eligible for the award, with two fields selected each year in consideration of current trends in scientific and technological development. In principle, one individual in each field is recognized with the award, and receives a certificate, a medal, and a monetary prize. Each Award Ceremony is attended by the reigning Emperor and Empress, heads of the three branches of government and other related officials, and representatives from various other elements of society.  For more information, please visit the official website: https://www.japanprize.jp/en/index.html 

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 639 加入收藏 :
2024壓軸登場！筑波科技化合物半導體與矽光子技術研討會，引領智慧製造未來
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敬邀：11/14筑波科技 化合物半導體與矽光子技術研討會
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筑波科技攜手格斯科技與格棋化合物半導體，共創電池與SiC晶圓檢測新紀元
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Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years, SEMI Reports
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筑波科技與鴻勁精密亮相 SEMICON Taiwan 2024 展示先進化合物半導體與矽光子技術
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The elexcon2024 Shenzhen International Electronics Show Is Set to Grandly Open, Showing Full-stack Technology and Products and Leading the Wave of Industrial Innovation
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Invitation: ACE Solution to Showcase Latest Semiconductor and Silicon Photonics Technologies at SEMICON Taiwan 2024
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敬邀：筑波科技參與SEMICON Taiwan 2024 展示最新半導體及矽光子技術
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ACE Solution and Teradyne Collaborate to Pioneer New Horizons in Semiconductor Testing - Interview with Marketing Director Aik-Moh Ng
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筑波科技與美商泰瑞達攜手共創半導體測試新局面-專訪市場總監Aik-Moh Ng
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筑波科技x美商泰瑞達共創卓越-4/17化合物半導體材料與測試技術研討會
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敬邀：4/17筑波科技 化合物半導體材料與測試技術研討會
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Axcelis Announces Participation in SEMICON China 2024
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A Korean UV Sensor Manufacturer, Genicom Introduces Breakthrough Far UV & VUV Optical Sensor for Safe and Efficient Pathogen Control
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VisIC Technologies Revolutionizes Automotive Power Electronics with V22TG D3GAN in Advanced Top Side Cooled Isolated Package
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筑波科技與泰瑞達合作成功舉辦2023年壓軸化合物半導體應用交流會
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2023年度壓軸、千萬別錯過：筑波科技11/09化合物半導體應用交流會
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SEMICON Taiwan 2023
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2025 年 4 月 26 日 (星期六) 農曆三月廿九日
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