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Hsinchu, Taiwan, September 9, 2024 -SEMICON Taiwan officially opened on September 6, 2024, with ACE Solution and HON. PRECISION is joining forces to showcase its latest advancements in silicon photonics testing technology, precision measurement, and automated machinery integration. Their exhibition focused on high-density optoelectronic integration testing solutions designed to meet the increasing demands of silicon photonics for high-capacity and high-channel testing. The integrated optoelectronic signal testing system effectively addresses the challenges posed by increased data center traffic and high-speed transmission needs, significantly boosting transmission rates and reducing energy consumption. With semiconductor packaging evolving towards Co-Packaged Optics (CPO), ACE Solution highlighted its silicon photonics solutions developed through deep collaboration with Quantifi, integrating PXI testing modules to offer an efficient, multi-system testing solution supporting 800G and 1.6T high-speed transmission. These integrated solutions meet the research and production needs for high-speed, high-precision, and high-efficiency testing while offering programmable automation for flexible applications. ACE Solution also demonstrated its latest innovations in compound semiconductor testing. The Teradyne ETS-88 testing platform is widely used for SiC, GaN, PMIC, automotive electronics, aerospace, and defense industries. Key features include multi-site CP, second-contact KGD, dynamic/static power device FT, and fully automated high-output module FT. The ETS-364 and ETS-800 platforms are tailored for mixed-signal, digital, and analog testing, offering the industry's highest-spec power IC testing capabilities with support for up to 6000V and 4000A, making them ideal for high-current, high-voltage applications, particularly in EV power and battery management. The TZ-6000 non-destructive wafer and materials inspection system utilizes terahertz (THz) technology, focusing on compound semiconductor testing for GaAs, SiC, and GaN. It offers greater penetration depth and flexibility, handling various sizes and shapes of wafers. Equipped with advanced wafer probes and intelligent software analysis, it can simultaneously measure parameters such as thickness, refractive index, resistivity, dielectric constant, surface/subsurface defects, and full wafer scans, enabling non-destructive wafer quality measurements. The Electro-Optic Terahertz Pulse Reflectometer (EOTPR) is the world's first instrument to use isolation technology to detect IC package faults and monitor package quality, making it ideal for non-destructive defect detection in 3DIC package analysis. With 5-micron pinpoint precision, the EOTPR is widely used in advanced IC packaging fault analysis for devices such as stacked packages (PoP), flip-chip, and TSV in 3D packaging. Major semiconductor companies have extensively deployed EOTPR for advanced IC packaging quality assurance in manufacturing environments. Steve Hsu, President of ACE Solution, stated, "With over 20 years of experience in hardware-software integration, ACE Solution has expanded from wireless communication testing to various testing fields, meeting the needs of our local clients. We are thrilled to collaborate with HON. PRECISION to showcase our achievements in automation and precision testing." Alan Hsieh, President of HON. PRECISION commented, "This exhibition marks a new milestone in our partnership with ACE Solution. We look forward to offering more advanced solutions, fostering greater collaboration and innovation across the industry." For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Peter Lee, Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw Website: https://www.acesolution.com.tw/en/ About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to the specific requirements of our customers in the field of electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished team of technical experts who offer unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively.
Hsinchu, Taiwan – ACE Solution, the leader and the provider in customized test solutions to meet customer needs in electrical components, devices and system manufactures, is pleased to announce the product launch of the TZ6000 – a nondestructive wafer quality measurement tool for the compound semiconductor industry. Incorporated with TeraView’s TeraPulse Lx technologies, the TZ6000 achieves nondestructive wafer quality measurements of thickness, refractive index, resistivity, dielectric constant, surface/subsurface defects at selected positions and whole wafer scanning map. Dr. JC Chen, VP of R&D of ACE Solution, commented “The quality of the semiconductor wafer determines the maximum achievable conversion efficiency to the final device. Subsurface damages (SSD) of semiconductor wafers are easily induced during surface machining process includes rough grinding, fine grinding, and chemical mechanical polishing. Current wafer inspection systems which rely on VIS/IR/UV optical inspection can analysis the surface properties of the wafer but not the SSD, due to their low penetration depth. Terahertz (THz) wave has higher penetration depth in semiconductor wafers as silicon, silicon carbide and gallium nitride. We developed the THz-based TZ6000 to meet the market need of nondestructive inspection of the compound semiconductor wafer.” Dr. Philip F. Taday, Head of Applications and Principal Scientist of TeraView, commented “The TeraPulse Lx system is TeraView’s world-leading product family for terahertz analysis. It has been designed to meet the needs of the material inspection in imaging or spectroscopy applications, and is ideal for compound semiconductors. The system’s modular architecture and TeraView patented laser-gated photoconductive emitters and detectors gives the user both flexibility and expandability. The system also boasts an industry-leading 3,200 ps time-delay line, as standard.” Steve Hsu, CEO of ACE Solution, commented “ACE Solution is the leading company in providing electrical precision test, integrating service and solution. It is great opportunity to collaborate with TeraView and incorporate the TeraPulse Lx module into TZ6000 system for nondestructive wafer quality inspection. TZ6000 has high flexibilities for various sizes and forms of wafers. It is provided with TeraView’s unique THz-TDS probe for simultaneous measurement of multiple parameters of wafer characterization. TZ 6000 has a user-friendly and graphic illustrate software for quality inspection in wafer manufacturing process and R&D.” Dr. Don Arnone, CEO of TeraView, commented “This is another first from TeraView to have a close collaboration with ACE Solution to develop this product, and we are quite confident that this product will set a new standard in compound semiconductor wafer quality analysis and defect inspection. The TeraPulse Lx system is designed with a lightweight compact core unit which allows for easy transport between locations. Incorporated with TeraView’s TeraPulse Lx modules, we can address the growing needs of the compound semiconductor wafer industry with this product.” About ACE Solution Founded in 2000, ACE Solution (https://www.acesolution.com.tw/en/index/) is located in Hsinchu City, Taiwan with branch offices in Suzhou and Shenzhen in China. Our mission is to provide customized test solutions to meet customer needs in electrical components, devices and system manufactures, as well as providing technology solutions through our partners. We are focused on RF, mmWave and terahertz with the expert technical support team. ACE Solution provides professional, innovative and multi-functional integrated techniques and solutions. About TeraView Founded in 2001, TeraView (https://teraview.com/) is the world’s first and leading company solely focused on the application of terahertz light to provide solutions to customer issues. A spin out from the Toshiba Corporation and Cambridge University, TeraView has developed its proprietary technology across a number of markets. These include fault analysis and quality assurance for semiconductor chips used in mobile computing and communications, as well as non-destructive inspection of high value coatings used in the automotive, pharmaceutical, food and solar industries. Contact ACE Solution, Co., Ltd. Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 E-mail: thzlab@acebiotek.com WebSite: https://www.acesolution.com.tw/en/index/
ACE Group develops smart hospital upload systems and third-generation semiconductor material testing solutions based on 20 years of wireless communication, IoT, software, and hardware integration experience. National Yang-Ming Chiao Tung University (NYCU) and Linköping University (LiU) visit the enterprise to see digital healthcare, Terahertz (THz), and semiconductor performance. Industry-Academy Platform to Build Compound Semiconductor Advanced Materials Cooperation NYCU conducts a crucial project on the compound semiconductor. It applies advanced materials such as silicon carbide (SiC), gallium nitride (GaN) and gallium oxide (Ga2O3) to Power IC and RF. The project can build up advanced materials, software services, and platform design. Moreover, this can reach industry-academy partnerships. The Thin Film Physics Division of LiU conducts application-inspired basic research on thin films to fundamentally understand the atomistic nature of materials' properties and behavior and learn how to make materials perform better through new methods of synthesis and processing. The research concerns the design of new multifunctional materials for rigid and wear-resistant coatings, energy materials, magnetic materials, electronics, neutron-converting materials for the European spallation Source (ESS), wide-band gap semiconductors, and more. Prof. of NYCU, Horng, Ray-Hua recognizes that" ACE Group differentiates from other material testing companies. We look forward to cooperating with THz technology on non-destructive detection and failure analysis of materials; on the other hand, the Uniiform digital handwriting system can contribute to education." The Professors from LiU also indicates that the THz technology is awe-inspiring and suggests that the possibilities with polarized waves, used for instance in THz-ellipsometry, may further improve and expand the technology. The visitors also commented that the Uniiform digital handwriting system could be a great tool in education. ACE Group Competitive Advantages: Wireless Communication, Smart Hospital, and Semiconductor Integration Testing ACE Group specializes in RF electronic components, measuring instruments, communication system tests, and integration. Since 2014, the company has been committed to digital medicare and precision medical treatment of early diagnosis technology and devices. Combined with AI, it invents the Uniiform digital handwriting system and Data Stream (DS) for Anesthesiology (Spark), Ophthalmology (Eagle Park 100), and Dentistry medical form digital recording system particularly. ACE uses THz technology (TZ-6000) for wafer testing in the semiconductor testing field. Nowadays, ACE establishes partnerships with Teradyne to promote Eagle Test System (ETS). For the third-generation semiconductor, ETS can fulfill the high voltage and high current test solutions in automotive semiconductor production test requirements. ACE Group invites Dr. Philip F. Taday, the scientist of Teraview, to join the panel discussion at this event. Electro-Optical Terahertz Pulse Reflectometry (EOTPR) is an innovative time domain reflectometry (TDR) system that Intel and TeraView have successfully developed. It uses the isolation technique that is the first place in the world to detect package failures and monitor the quality of integrated circuits. It’s the first choice for non-destructive defect detection of integrated circuit packaging. Interdisciplinary skills swapping creates the novel industry application and research of advanced semiconductor materials.
ACE Group develops smart hospital upload systems and third-generation semiconductor material testing solutions based on 20 years of wireless communication, IoT, software, and hardware integration experience. National Yang-Ming Chiao Tung University (NYCU) and Linköping University (LiU) visit the enterprise to see digital healthcare, Terahertz (THz), and semiconductor performance. Industry-Academy Platform to Build Compound Semiconductor Advanced Materials Cooperation NYCU conducts a crucial project on the compound semiconductor. It applies advanced materials such as silicon carbide (SiC) and gallium nitride (GaN) to Power IC and RF. The project can build up advanced materials, software services, and platform design. Moreover, this can reach industry-academy partnerships. The Semiconductor Materials Division of LiU develops and investigates materials for novel electronics, especially on wide bandgap semiconductors, semiconductor device materials, and the sublimation materials unit. LiU focuses on silicon carbide, III-nitrides, and graphene for fundamental and application-motivated issues of interest for Swedish and European industries. ACE Group Competitive Advantages: Wireless Communication, Smart Hospital, and Semiconductor Integration Testing ACE Group specializes in RF electronic components, measuring instruments, communication system tests, and integration. Since 2014, the company has been committed to digital medicare and precision medical treatment of early diagnosis technology and devices. Combined with AI, it invents the Uniiform digital handwriting system and Data Stream (DS) for Anesthesiology (Spark), Ophthalmology (Eagle Park 100), and Dentistry medical form digital recording system particularly. ACE uses THz technology (TZ-6000) for wafer testing in the semiconductor testing field. Nowadays, ACE establishes partnerships with Teradyne to promote Eagle Test System (ETS). For the third-generation semiconductor, ETS can fulfill the high voltage and high current test solutions in automotive semiconductor production test requirements. ACE Group invites Dr. Philip F., the scientist of Teraview, to join the panel discussion at this event. Electro-Optical Terahertz Pulse Reflectometry (EOTPR) is an innovative time domain reflectometry (TDR) system that Intel and TeraView have successfully developed. It uses the isolation technique that is the first place in the world to detect package failures and monitor the quality of integrated circuits. It’s the first choice for non-destructive defect detection of integrated circuit packaging. Interdisciplinary skills swapping creates the novel industry application and research of advanced semiconductor materials.
TOKYO, Jan. 22, 2025 /PRNewswire/ -- The Japan Prize Foundation announced the winners of the 2025 Japan prize on January 22, 2025. Prof. Russell Dean Dupuis of the USA has been awarded the Japan Prize in the fields of Materials Sciences and Production, and Prof. Carlos M. Duarte of Spain has been awarded the Japan Prize in the fields of Biological Production, Ecology/Environment. - Field Eligible for the Award: Materials Sciences and ProductionProf. Russell Dean DupuisImage:https://cdn.kyodonewsprwire.jp/prwfile/release/M000319/202501152911/_prw_PI1fl_tS7bGu5Q.jpg - Field Eligible for the Award: Biological Production, Ecology/EnvironmentProf. Carlos M. DuarteImage:https://cdn.kyodonewsprwire.jp/prwfile/release/M000319/202501152911/_prw_PI2fl_75vq5Xm9.jpg For this year's Japan Prize, Prof. Dupuis is being recognized for his distinguished contributions to the development of metalorganic chemical vapor deposition technology for compound semiconductor electronic and optoelectronic devices, and pioneering contribution to its large-scale commercialization; and Prof. Duarte is being recognized for his contribution to the understanding of marine ecosystems in a changing Earth, especially through pioneering research on Blue Carbon. For the 2025 Japan Prize, the Foundation asked approximately 15,500 prominent scientists and engineers from around the world to nominate researchers working in this year's fields. It received 149 nominations for the fields of Materials Sciences and Production, and 72 nominations for the fields of Biological Production, Ecology/Environment. This year's winners were selected from a total of 221 nominees. About the Japan Prize The establishment of the Japan Prize in 1981 was motivated by the Japanese government's desire to create an internationally recognized award that would contribute to scientific and technological development around the world. With the support of numerous donations, the Japan Prize Foundation received endorsement from the Cabinet Office in 1983. The Japan Prize is awarded to scientists and engineers from around the world who have made creative and dramatic achievements that help progress their fields and contribute significantly to realizing peace and prosperity for all humanity. Researchers in all fields of science and technology are eligible for the award, with two fields selected each year in consideration of current trends in scientific and technological development. In principle, one individual in each field is recognized with the award, and receives a certificate, a medal, and a monetary prize. Each Award Ceremony is attended by the reigning Emperor and Empress, heads of the three branches of government and other related officials, and representatives from various other elements of society. For more information, please visit the official website: https://www.japanprize.jp/en/index.html
筑波科技 (ACE Solution) 攜手美商泰瑞達 (Teradyne)，於2024年11月14日成功舉辦年度壓軸「化合物半導體與矽光子技術研討會」。本次活動由國立陽明交通大學、中原大學電子工程學系共同主辦，打造產官學交流平台。主題涵蓋Teradyne ETS高功率類比與混合訊號測試，適用於晶片探測 (CP)、良品晶片 (KGD)、功率器件 (PD)、功率模組 (PM) 等多樣需求。同時，矽光子結合半導體應用提供優化測試支援。太赫茲非破壞性檢測技術則適用於材料及晶圓測試及高階封裝的非破壞性測試方案。 此次特別融入半導體自動化應用，包括協作型機器人及自主移動機器人整合方案，靈活應用於智慧製造環境，提升操作效率並降低人力成本。隨著電動車及新能源市場需求增長，化合物半導體材料如碳化矽 (SiC) 和氮化鎵 (GaN)，其高頻率、耐高壓及優異的散熱性能，成為車用半導體及電源管理IC關鍵技術。筑波科技攜手泰瑞達推廣ETS，提供業界最高規格功率IC測試平台可支持達6000V和4000A測試，應對高電流、高電壓需求。也應用太赫茲檢測技術，滿足非破壞性晶圓材料及3DIC高階封裝測試需求，涵蓋從研發到量產的製程管理，提升效率並減少潛在風險。 活動開幕引言由筑波科技許深福董事長致詞：「因應化合物半導體及車用市場需求，筑波科技致力於跨足產業鏈，專注提供彈性系統整合測試方案，引進協作手臂自走車，推動半導體產業的工廠自動化。很榮幸邀請來自全球的專家學者共同參與，期望創造更大的合作效益。」在上半場活動，由筑波科技工程部專案經理邱世耀介紹ETS測試系統在高功率類比與混合訊號測試上的應用，SEMI Taiwan/陽明交大光電所教授郭浩中則分享矽光子技術在AI Data Center前景。日本九州大學系統資訊科學研究生院資訊電子學系加藤和利教授也專題探討化合物半導體光混頻器於太赫茲波應用成果。會場提供四大展示體驗站，包括高功率類比與混合訊號測試方案、矽光子光電整合測試模組方案、晶圓及材料非破壞性測試方案，及UR與MiR的整合解決方案。 下半場活動由合晶科技新產品技術處資深處長徐文浩探討氮化鎵基板材料的創新應用，筑波科技總經理徐舜範分享UR (協作型機器人) 與 MiR (自主移動機器人) 半導體自動化應用，系統整合專案經理吳煜坤則介紹PXIE介面提升矽光子光電整合測試效率、相干光技術及多通道解決方案。最後，專案經理許永周講解化合物半導體材料晶圓及3DIC測試。 筑波科技期盼未來能與更多客戶及合作夥伴攜手合作，可提供完整測試與自動化解決方案，共同推動產業創新，拓展商業契機與市場機會。 聯絡筑波科技 筑波科技股份有限公司ACE Solution, Co., Ltd. 地址：新竹縣竹北市台元街28號2樓之1 電話：03-5500909 電子郵件：service@acesolution.com.tw 網站：https://www.acesolution.com.tw/en/index/ 關於筑波科技（ACE Solution） 筑波科技（https://www.acesolution.com.tw/en/index/）成立於2000年，位於台灣新竹，在中國蘇州和深圳設有分公司。我們的使命是提供訂製的測試解決方案，以滿足電氣元件、設備和系統製造商的客戶需求，通過合作夥伴提供技術解決方案。我們專注於射頻、毫米波和太赫茲領域，擁有專業的技術支援團隊，提供專業、創新和多功能的綜合技術和解決方案。
A12 藝術空間
compound semiconductor
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