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RESEARCH TRIANGLE PARK, N.C., June 5, 2024 /PRNewswire/ -- Kymera International ("Kymera"), a global leading specialty materials and surface technologies company, has signed an agreement to acquire Fiven ASA ("Fiven") from OpenGate Capital. The deal is expected to close following customary regulatory approvals. Kymera International to acquire Fiven ASA, adding advanced silicon carbide capabilities to their high-growth specialty materials portfolio. With production facilities in Norway, Belgium and Brazil, as well as a global distribution network, Fiven is a pioneer in the development of technically advanced silicon carbide materials to a wide range of high-growth end markets. Through its recent R&D initiatives, Fiven has developed and marketed unique, high purity materials for the power electronics industries, such as semiconductors and lithium-ion batteries. Under the leadership of Fiven's CEO, Falk Ast, the company continues to drive innovation, deep collaborative relationships with its customers and a strong emphasis on ESG. "Fiven has all of the strong attributes we look for in an acquisition. They have an excellent reputation for quality and service, are aligned with Kymera's strategy of focusing on attractive end markets such as electronics, aerospace and defense, and have an outstanding management team and dedicated workforce," comments Barton White, CEO of Kymera. "We are excited to partner with Falk and his team to continue growing Fiven and capitalize on the numerous operational and commercial synergies we have already identified." Kymera has been owned by affiliates of Palladium Equity Partners, LLC (collectively, "Palladium"), a middle market private equity firm with over $3 billion in assets under management, since 2018. "The acquisition of Fiven will accelerate Kymera's mission to become a high-growth specialty materials and chemicals platform, and unlocks substantial organic growth opportunities for the combined business," adds Adam Shebitz, Partner at Palladium Equity Partners. "Altogether, Kymera is well on its way towards achieving Palladium's investment objectives, having more than tripled in size from our initial investment, while creating a more resilient business oriented towards the industries of tomorrow." The terms of the transaction were not disclosed. Kymera's M&A efforts were advised by Lazard and Paul, Weiss, Rifkind, Wharton & Garrison LLP, and its debt financing was advised by Piper Sandler, Goldman Sachs and Paul, Weiss, Rifkind, Wharton & Garrison LLP. OpenGate Capital was advised by Baird and Willkie Farr & Gallagher LLP. About Kymera InternationalKymera International, through acquisitions, can trace its roots back to the 1800's. Today, Kymera International is a U.S. owned, leading global developer and manufacturer of advanced specialty materials and high-performance surface coatings. Kymera sells its technically developed products into a wide variety of end markets, including aerospace, defense, medical, electronics, chemical, specialty auto, additive manufacturing, and numerous industrial applications. Kymera International has manufacturing facilities in the U.S., Canada, Australia, Europe, UK and Asia. For more information, please visit www.kymerainternational.com. About Palladium Equity Partners, LLCSince its founding in 1997, Palladium has invested in more than 210 companies (40 platforms and more than 170 add-ons). With over $3 billion in AUM, the firm focuses primarily on buyout equity investments in the range of $50 million to $150 million. Palladium seeks to acquire and grow companies in partnership with founders and experienced management teams by providing capital and strategic guidance. The partners of the firm have meaningful experience in consumer, services, industrials, and healthcare businesses, with a focus on companies they believe will benefit from the growth in the U.S. Hispanic population. For more information, visit www.palladiumequity.com. About Fiven ASAFiven is a global leader in silicon carbide (SiC), a material used a variety of industrial applications. SiC is recognized for superior hardness, high thermal conductivity and chemical inertness, making it the preferred material for demanding applications: abrasive, metallurgy, filtration, technical ceramics and other uses. Fiven has manufacturing sites in Norway, Brazil and Belgium. For more information, please visit www.fiven.com. About OpenGate CapitalOpenGate Capital is a global private equity firm specializing in the acquisition and operation of businesses to create new value through operational improvements, innovation, and growth. Established in 2005, OpenGate Capital is headquartered in Los Angeles, California with a European office in Paris, France. OpenGate's professionals possess the critical skills needed to acquire, transition, operate, build, and scale successful businesses. To date, OpenGate Capital has executed more than 40 platform acquisitions across North America and Europe. To learn more about OpenGate, please visit www.opengatecapital.com.
SAN LUIS OBISPO, Calif., Jan. 16, 2024 /PRNewswire/ -- Revasum Inc, a global leader in semiconductor manufacturing equipment, and Asahi Diamond America, Inc, a renowned provider of diamond and cubic boron nitride tools, are pleased to announce their strategic collaboration aimed at enhancing silicon carbide (SiC) wafer grinding. The collaboration centers around the utilization of Revasum's industry-leading 7AF-HMG Silicon Carbide Grinder, a cutting-edge solution specifically designed for the unique challenges posed by 150mm and 200mm silicon carbide wafers. This collaboration brings together Revasum's expertise in semiconductor grinding and Asahi Diamond America's cutting-edge abrasive technology, marking a significant step forward in silicon carbide wafer manufacturing. The 7AF-HMG is distinguished by its hard material optimized grind engine that quickly and precisely thins and planarizes 150mm and 200mm silicon carbide wafers. Its advanced features and precision make it a game changer in the industry, ensuring highly efficient and productive processing of bare substrates and device wafers at customer facilities. Scott Jewler, CEO of Revasum Inc, expressed his enthusiasm stating, "Our work with Asahi Diamond America is a testament to our commitment to innovation and excellence in semiconductor manufacturing. The 7AF-HMG Silicon Carbide Grinder is a groundbreaking solution that addresses the unique challenges of silicon carbide wafers, and this cooperation will propel the industry forward by improving efficiency and performance." Koichi "Ken" Kikuchi, President of Asahi Diamond America, Inc, echoed this sentiment, saying, "Asahi Diamond America is thrilled to collaborate with Revasum Inc to elevate silicon carbide wafer grinding to new heights. Our cutting-edge grind wheels combined with Revasum's advanced tools will empower semiconductor manufacturers to achieve unprecedented precision and efficiency in silicon carbide wafer processing." For more information, please contact: Info@revasum.com About Revasum Inc: Revasum Inc is a global leader in the design and manufacturing of advanced semiconductor processing equipment. With a focus on innovation and reliability, Revasum provides cutting-edge solutions for the production of silicon carbide wafers and other semiconductor materials. About Asahi Diamond America, Inc: Asahi Diamond America, Inc is a leading provider of diamond and cubic boron nitride tools for a wide range of industries, including semiconductor manufacturing. With a commitment to quality and precision, Asahi Diamond America delivers advanced tools that enhance the efficiency and performance of semiconductor processing.
SAN LUIS OBISPO, Calif., Oct. 5, 2023 /PRNewswire/ -- Revasum, Inc., a leading provider of advanced semiconductor manufacturing equipment, is thrilled to announce a strategic partnership with SGSS, a global leader in high-performance materials and innovative solutions. This partnership aims to revolutionize the semiconductor industry by developing a cutting-edge line of grinding wheels specifically designed for Silicon Carbide (SiC) wafers. Silicon Carbide is a critical material in the production of power devices and has gained significant prominence in the semiconductor industry due to its exceptional properties. The demand for SiC wafers has been steadily growing, and achieving the highest quality wafers is paramount to meet the evolving needs of the market. The partnership between Revasum and SGSS represents a collaboration between two industry giants with a shared commitment to innovation and excellence. By combining Revasum's expertise in semiconductor manufacturing equipment with SGSS's cutting-edge abrasive materials, this alliance seeks to develop a new generation of surface finishing solutions that will set new standards for precision, efficiency, and surface quality in SiC wafer production with sustainability and environmental responsibility at the core of our collaboration. This partnership holds great promise for the semiconductor industry, paving the way for enhanced SiC wafer production processes that will contribute to the advancement of power electronics, electric vehicles, renewable energy, and various other technology sectors. Mr. Scott Jewler, CEO of Revasum, Inc., commented on the partnership, saying, "We are excited to join forces with Saint-Gobain Surface Solutions, a renowned leader in materials science and innovation. This partnership will enable us to provide our customers with cutting-edge tools and solutions to address the increasing demand for high-quality Silicon Carbide wafers." Mr. Jean-Claude Lasserre, CEO Saint-Gobain Surface Solutions stated, "Our collaboration with Revasum exemplifies our commitment to delivering high-performance materials and solutions that push the boundaries of what is possible. Together, we will unlock new levels of precision and efficiency in Silicon Carbide wafer grinding with highest levels of sustainable products and solutions." Both Revasum, Inc. and SGSS are eager to embark on this journey of innovation and look forward to delivering groundbreaking solutions that will shape the future of Silicon Carbide wafer manufacturing. For further information and inquiries about this partnership, please contact: Nick LangstonVP Sales & Marketing, RevasumNick.Langston@revasum.com About Revasum, Inc.: Revasum specializes in the design and manufacturing of capital equipment used in the semiconductor device manufacturing process. Our product portfolio includes grinding, polishing and CMP equipment used to manufacture substrates and devices for the global semiconductor industry. The company has leveraged its significant intellectual property portfolio to develop the new flagship 6EZ Silicon Carbid Polisher, which, alongside the 7AF-HMG Silicon Carbide Grinder, provides Revasum's customers with an optimized, fully automated single-wafer grind and polish toolset The solution is configurable for SiC wafers 200mm and below. The company's headquarters and manufacturing facility is based in San Luis Obispo, California, United States. About Saint-Gobain Surface Solutions Saint-Gobain Surface Solutions, part of Saint-Gobain Group, is a global business creating surface solutions for a better world thanks to its product offer including Abrasives, Adhesives, Sealants, Tapes, Composites, Films. Its abrasives solutions are powerful, precise, user-friendly solutions, which enable customers to cut, shape and finish all materials in the most complex and challenging applications. By working closely with end-users and grinding expert partners, Saint-Gobain Surface Solutions designs and provides customized solutions to secure the best option for performance, cost and safety. Leveraging its global manufacturing presence in 28 countries, Saint-Gobain Surface Solutions serves its customers globally and locally through its structured sales operations, employing over 11,000 people. As part of the Saint-Gobain Group, we believe in progress and seek to be a game-changer that improves individual and collective health and wellness. We are convinced that the solutions that meet everyone's essential needs and allow us to live better together, without jeopardizing future generations, are still to be invented. Our commitment to reach this ambitious objective is guided by our shared purpose: "MAKING THE WORLD A BETTER HOME". For more information, please visit www.saint-gobain-abrasives.com https://www.linkedin.com/company/saint-gobain-surface-solutions/ Logo - https://mma.prnasia.com/media2/2147901/Revasum_Black_Logo.jpg?p=medium600
SAN LUIS OBISPO, Calif., July 28, 2023 /PRNewswire/ -- This planned purchase, which will ship to Senic in Q4-2023, reinforces the 6EZ's position as the most flexible chemical mechanical polishing (CMP) platform available to support silicon carbide (SiC) substrate manufacturing and the fabrication of devices such as SiC-based MOSFET's. The recent release of the 6EZ's 200mm conversion kit will enable the tool to support 150mm and 200mm SiC substrate manufacturing at the Senic facility in Cheonan, South Korea. The 6EZ CMP system was developed with Revasum's 7AF-HMG SiC grinder to remove sub-surface damage from the grind process. The 6EZ provides minimal total thickness variation (TTV) across the wafer and surface roughness (RA) to be on the order of 1.5 Angstroms. Commenting on the developing partnership with this strategic customer in South Korea, Chris Sloan, Revasum's Vice President of Worldwide Sales and Marketing said: "This is an important next step for Revasum in the truly global landscape for manufacturing silicon carbide substrates. The demand for silicon carbide devices is forcing international supply chains to align to support the effort and, with our industry-leading 6EZ CMP platform, we are excited to establish a partnership with the innovative team at Senic." Mr. J.D. Seo, Senic's Vice President of Wafer Business Division said: "We believe that this partnership will create positive synergy between the two companies and through Revasum's 6EZ CMP System, Senic will be able to provide SiC wafers with better surface quality to its customers. With the 6EZ already having proved itself in silicon carbide substrate manufacturing, we believe the 6EZ system is the best option for Senic as we increase our production to meet the global industry demands." About Revasum, Inc.:Revasum (https://www.revasum.com) manufactures capital equipment used in semiconductor manufacturing. Our current product portfolio includes grinding and chemical mechanical polishing equipment used to manufacture silicon carbide substrates and devices for the global semiconductor industry. About SENIC, Inc.:SENIC (http://www.senic.co.kr) is a global silicon carbide wafer manufacturing innovator based in Cheonan in South Korea. The company provides 150mm and 200mm silicon carbide (SiC) ingots and substrates for RF and Power Electronics as well as SiC wafer reclaim service. Media Contact:Bruce Raybruce.ray@revasum.com Logo - https://mma.prnasia.com/media2/2147901/Revasum_Black_Logo.jpg?p=medium600
SAN LUIS OBISPO, Calif., July 12, 2023 /PRNewswire/ -- Revasum today announced the release of improvements to the system control software for their flagship silicon carbide CMP tool, 6EZ, which increase the throughput of the system by up to 20%+. The throughput improvements are included in our latest SW release 3.1 and include a number of improvements in the 6EZ wafer handling control software. The upgrade has been successfully deployed on existing 6EZ production systems at the factories of multiple Tier 1 customers. This software significantly reduces the 6EZ's cost of ownership per wafer for our customers. 'The wafer handling control software in previous 6EZ software releases included wafer handling moves that were optimized for some early SiC polishing recipes but were imposing unnecessary constraints for the production recipes that are currently implemented by our customers. By removing these constraints, and implementing other wafer handling improvements, we were able to significantly increase the throughput of the tool without any detrimental impact on tool reliability. We have also ensured that these improvements would not change the excellent process results from the production recipes currently being used by our customers.' Said Bill Kalenian, Vice President of Engineering at Revasum. 'Since achieving our initial goals of demonstrating reliable high-volume operations and repeatable, high-quality polishing results on hard SiC substrates, it was right time for Revasum to enable higher productivity for our customers as they ramp to higher wafer volumes. SW 3.1 enables a significant increase in productivity, and has a number of other new features that will improve the flexibility and reliability of the 6EZ in high volume production,' said Scott Jewler, Revasum CEO. 'Software version 3.1 has been installed and released to production at multiple leading SiC substrate customers and will ship installed on future orders.' About Revasum, Inc.:Revasum specializes in the design and manufacturing of grinding and polishing equipment for semiconductor manufacturing. Revasum has leveraged its significant intellectual property portfolio to develop two flagship products designed from the ground up for silicon carbide. The new products are configurable for SiC wafer sizes up to 200mm. Media Contact:Bruce Raybruce.ray@revasum.com Logo - https://mma.prnasia.com/media2/2147901/Revasum_Black_Logo.jpg?p=medium600
SAN LUIS OBISPO, Calif., July 6, 2023 /PRNewswire/ -- Revasum today announced the availability of 200mm SiC wafer polishing capability on the 6EZ platform. The 6EZ has already proven its value in high-volume manufacturing of 150mm SiC substrates and a 200mm conversion kit has now been fully tested and released, giving customers the option of upgrading 6EZ systems in the field. Dr. Fred Sun, Vice President of R&D and Process Technologies at Revasum said, "While the 6EZ was designed from the start to polish 200mm substrates, due to scarcity of these larger substrates in the market, we had not been able to fully characterize polishing performance on 200mm substrates until recently. The tool performed incredibly well on the 200mm wafers - we achieved the same PV (Pressure x Velocity) operating range that we had seen previously on 150mm SiC wafers, even with a doubling of the surface area under polish." The 6EZ is the first single wafer CMP tool designed from the ground up for SiC wafer polishing. The 6EZ's architecture coupled with patented cooling technology allows for the higher downforce and table speeds preferred for CMP of hard materials like SiC. The proprietary ViPRR carrier design secures the wafer while minimizing polishing friction on the pad to allow for reduced pad conditioning, better wafer-to-wafer consistency and extended consumables life. Scott Jewler, CEO of Revasum said, "We believe that polishing prime SiC wafers requires a different approach to head design than the conventional membrane-based heads. The polishing head should hold the wafer in position while applying controlled pressure to the backside of the wafer to produce a uniform high removal rate with good thermal management. We are very pleased with the 200mm SiC wafer results achieved on the 6EZ and I believe our customers will also appreciate how easy the tool is to maintain in a high-volume production environment at this larger wafer size." About Revasum, Inc.: Revasum specializes in the design and manufacturing of capital equipment used in the semiconductor substrate and device manufacturing process. Our current product portfolio includes the 7AF-HMG grinder and 6EZ CMP platform used to manufacture silicon carbide substrates up to 200mm and the packaging of SiC-based devices for the global semiconductor industry. CONTACT: Bruce Ray, bruce.ray@revasum.com Logo - https://mma.prnasia.com/media2/2147916/Revasum_Black_Logo.jpg?p=medium600
silicon carbide
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