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THIRDREALITY Launches Motion Sensor R1: Enhancing Smart Home Experiences

SAN JOSE, Calif., April 7, 2025 /PRNewswire/ -- As smart home technology evolves, there are still areas where convenience and security can be improved. THIRDREALITY's new Motion Sensor R1, offers precise motion detection, unaffected by heat or sunlight. Unlike traditional PIR sensors, which can trigger false alarms, the R1 ensures reliable and accurate detection in any condition, making it a valuable upgrade for modern homes. Motion Sensor R1 Precision Detection Recently showcased at CES 2025, the Motion Sensor R1 received positive feedback for its innovative design and performance, highlighting its versatility and ease of integration into smart home systems. For Lisa, a busy mom, the Motion Sensor R1 became a key part of her home safety routine. After a near-accident with her child, Lisa installed the R1 in the hallway outside the bedroom. Thanks to the adjustable sensitivity, she was able to customize the sensor's detection range to cover just the areas she needed, ensuring it only triggered alerts when necessary. Powered by three AA batteries, the sensor's long battery life eliminated the need for frequent maintenance, giving Lisa peace of mind without complicated wiring or installation. Mark, a tech enthusiast, found the Motion Sensor R1 equally impressive. He integrated it into his Home Assistant, extending his smart home capabilities. With OTA (Over-The-Air) updates and customizable features, Mark adjusted the sensor to suit his needs, from turning on garage lights to optimizing energy efficiency. The R1's long battery life and reliable detection across diverse spaces gave him the flexibility to perfect his smart home automation. For both Lisa and Mark, the Motion Sensor R1 wasn't just a motion detector—it was a step forward in smart home technology, offering both enhanced security and convenient automation in a simple, long-lasting package. For more information about THIRDREALITY and the Smart Motion Sensor R1, please contact us. About THIRDREALITY Third Reality is a smart home technology company, dedicated to developing high-quality, user-friendly, and secure smart home products. Through continuous innovation and a deep understanding of market needs, the company strives to provide an improved smart home experience for users worldwide. THIRDREALITY Motion Sensor R1 is now available for purchase online, including Amazon. Please visit https://www.amazon.com/dp/B0DX61CQPW or https://3reality.com/product/motion-sensor-r1/ for more details on how this advanced security device can be part of your smart home solution. For more information and products about THIRDREALITY, you can visit the official website: https://www.3reality.com/  Related Links: Facebook: https://www.facebook.com/ThirdReality.offical Twitter: https://twitter.com/thirdrealityinc YouTube: https://www.youtube.com/channel/UCG_rpEZrPoJNErGtvh5juHg TikTok: https://www.tiktok.com/@thirdrealityofficial Instagram: https://www.instagram.com/thirdreality_inc  Media Contact:Tina ZhuMarketing ManagerThird Reality, Inc.info@3reality.com 

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LeddarTech to Demonstrate Advanced ADAS Sensor Fusion and Perception Solutions at Auto Shanghai 2025

QUEBEC CITY, Canada, April 01, 2025 (GLOBE NEWSWIRE) -- LeddarTech® Holdings Inc. (“LeddarTech”) (Nasdaq: LDTC), an automotive software company that provides patented disruptive AI-powered low-level sensor fusion and perception software technology, LeddarVision™, for ADAS, AD and parking applications, announces its participation at Auto Shanghai 2025, taking place from April 23 to May 2, 2025. LeddarTech will be exhibiting at Booth # 1BG040 in Hall 1.2, where its team will engage with customers and industry partners to discuss its latest advancements in sensor fusion and perception technology. Attendees will also have the chance to take a live demonstration ride in the LeddarNavigator, LeddarTech’s demo vehicle equipped with LeddarVision. This AI-driven low-level sensor fusion software enhances object detection, improves situational awareness and optimizes driving automation. The demo ride offers a firsthand experience of how LeddarVision enhances ADAS performance and vehicle safety in real-world scenarios. At Auto Shanghai 2025, LeddarTech will showcase its latest low-level sensor fusion innovations, powered by the Texas Instruments (TI) TDA4 processor platform. LeddarTech and TI’s collaboration optimizes performance and cost, addressing key challenges in the Chinese automotive market, such as the development of “see-through” perception solutions and efficient 5V5R sensor configurations for highway “Navigate on Autopilot” (NoA) applications. “China is one of the fastest-growing markets for ADAS and AD technology, and we are excited to showcase how LeddarTech’s scalable and cost-efficient perception solutions help OEMs and Tier 1 suppliers achieve enhanced safety and driving intelligence,” said Clive Szeto, Senior Director of Sales and Business Development, Asia at LeddarTech. “Our collaboration with Texas Instruments and our industry-leading low-level sensor fusion technology make LeddarTech a key enabler of next-generation ADAS solutions in China and beyond.” Join us at Auto Shanghai 2025 to experience the future of ADAS technology firsthand. Visit LeddarTech at Booth #1BG040, schedule a meeting with our team or learn more on LeddarTech’s website. About LeddarTech A global software company founded in 2007 and headquartered in Quebec City with additional R&D centers in Montreal and Tel Aviv, Israel, LeddarTech develops and provides comprehensive AI-based low-level sensor fusion and perception software solutions that enable the deployment of ADAS, autonomous driving (AD) and parking applications. LeddarTech’s automotive-grade software applies advanced AI and computer vision algorithms to generate accurate 3D models of the environment to achieve better decision making and safer navigation. This high-performance, scalable, cost-effective technology is available to OEMs and Tier 1-2 suppliers to efficiently implement automotive and off-road vehicle ADAS solutions. LeddarTech is responsible for several remote-sensing innovations, with over 170 patent applications (87 granted) that enhance ADAS, AD and parking capabilities. Better awareness around the vehicle is critical in making global mobility safer, more efficient, sustainable and affordable: this is what drives LeddarTech to seek to become the most widely adopted sensor fusion and perception software solution. Additional information about LeddarTech is accessible at www.leddartech.com and on LinkedIn, Twitter (X), Facebook and YouTube. Forward-Looking Statements Certain statements contained in this Press Release may be considered forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995, Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended (which forward-looking statements also include forward-looking statements and forward-looking information within the meaning of applicable Canadian securities laws), including, but not limited to, statements relating to LeddarTech’s anticipated strategy, future operations, prospects, objectives and financial projections and other financial metrics. Forward-looking statements generally include statements that are predictive in nature and depend upon or refer to future events or conditions, and include words such as “may,” “will,” “should,” “would,” “expect,” “anticipate,” “plan,” “likely,” “believe,” “estimate,” “project,” “intend” and other similar expressions among others. Statements that are not historical facts are forward-looking statements. Forward-looking statements are based on current beliefs and assumptions that are subject to risks and uncertainties and are not guarantees of future performance. Actual results could differ materially from those contained in any forward-looking statement as a result of various factors, including, without limitation: (i) our ability to continue to maintain compliance with Nasdaq continued listing standards following our transfer to the Nasdaq Capital Market; (ii) our ability to timely access sufficient capital and financing on favorable terms or at all; (iii) our ability to maintain compliance with our debt covenants, including our ability to enter into any forbearance agreements, waivers or amendments with, or obtain other relief from, our lenders as needed; (iv) our ability to execute on our business model, achieve design wins and generate meaningful revenue; (v) our ability to successfully commercialize our product offering at scale, whether through the collaboration agreement with Texas Instruments, a collaboration with a Tier 2 supplier or otherwise; (vi) changes in our strategy, future operations, financial position, estimated revenues and losses, projected costs and plans; (vii) changes in general economic and/or industry-specific conditions; (viii) our ability to retain, attract and hire key personnel; (ix) potential adverse changes to relationships with our customers, employees, suppliers or other parties; (x) legislative, regulatory and economic developments; (xi) the outcome of any known and unknown litigation and regulatory proceedings; (xii) unpredictability and severity of catastrophic events, including, but not limited to, acts of terrorism, outbreak of war or hostilities and any epidemic, pandemic or disease outbreak, as well as management’s response to any of the aforementioned factors; and (xiii) other risk factors as detailed from time to time in LeddarTech’s reports filed with the U.S. Securities and Exchange Commission (the “SEC”), including the risk factors contained in LeddarTech’s Form 20-F filed with the SEC. The foregoing list of important factors is not exhaustive. Except as required by applicable law, LeddarTech does not undertake any obligation to revise or update any forward-looking statement, or to make any other forward-looking statements, whether as a result of new information, future events or otherwise. Contact:Maram Fityani, Media and Public Relations, LeddarTech Holdings Inc.Tel.: + 1-418-653-9000 ext. 623, maram.fityani@leddartech.com Investor relations website: investors.leddartech.com Investor relations contact: Mike Bishop, mike@bishopir.com Leddar, LeddarTech, LeddarVision, LeddarSP, VAYADrive, VayaVision and related logos are trademarks or registered trademarks of LeddarTech Holdings Inc. and its subsidiaries. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. LeddarTech Holdings Inc. is a public company listed on the Nasdaq under the ticker symbol “LDTC.”

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SK keyfoundry Launches 3D Hall-effect Sensor Technology Capable of Measuring Speed and Direction

SEOUL, South Korea, March 6, 2025 /PRNewswire/ -- SK keyfoundry, an 8-inch pure-play foundry in Korea, announced today that it offers a new 3D Hall-effect sensor technology that can measure speed and direction through three-dimensional magnetic field detection for its foundry customers. The Hall-effect sensor is a device that measures the strength of a magnetic field using the Hall-effect, which detects the voltage difference generated when a conductor or semiconductor passes through a magnetic field. The measured magnetic field is utilized in applications that leverage the position, speed, rotation, direction, and current of devices. SK keyfoundry has provided a variety of products using existing 1D (one-dimensional) and 2D (two-dimensional) Hall-effect sensors, and this new 3D Hall-effect sensor integrates both Vertical and Planar Hall-effect sensors on a single chip. It features enhanced sensitivity beyond that of existing 2D products, enabling real-time measurement of minute three-dimensional direction and speed changes with rapid response times. Another important feature of the 3D Hall-effect sensor provided by SK keyfounrdry is that it can be designed to easily integrate into customer products by adding masks to existing processes. Additionally, the integration of the 3D Hall-effect sensor is offered across multiple nodes in the range of 0.13μm to 0.18μm while maintaining electrical characteristics. The new 3D Hall-effect sensor is expected to be utilized in various fields. In particular, it can be applied in the automotive sector for safe driving assistance and autonomous driving systems, in consumer electronics for smart appliances and gaming consoles, and in industrial automation for robot control, drones, virtual reality, augmented reality, and wearable devices. Derek D. Lee, the CEO of SK keyfoundry, stated, "The newly launched 3D Hall-effect sensor technology is expected to be utilized in the design of products across various industries, including home appliances, automotive, robotics, and drones, due to its high sensitivity and ability to detect minute three-dimensional movements." He added, "We plan to support our customers in integrating more diverse functions into a single semiconductor through ongoing technology openness." About SK keyfoundry Headquartered in Korea, SK keyfoundry provides specialty Analog and Mixed-Signal foundry services for semiconductor companies to serve a wide range of applications in the consumer, communications, computing, automotive and industrial industries. With a broad range of technology portfolios and process nodes, SK keyfoundry has the flexibility and capability to meet the ever-evolving needs of semiconductor companies across the globe. Please visit https://www.skkeyfoundry.com for more information.

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Teledyne e2v announces new high-speed sensor with extended sensitivity in NIR wavelengths

GRENOBLE, France, Feb. 25, 2025 (GLOBE NEWSWIRE) -- Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, introduces Lince5M™ NIR, a state-of-the-art high-speed CMOS image sensor. Leveraging Teledyne e2v’s advanced imaging technologies, this new sensor delivers enhanced performance in both visible and near-infrared (NIR) wavelengths, making it ideal for a wide range of commercial, industrial, and medical applications. The Lince5M NIR is a monochrome image sensor with a resolution of 5.2 megapixels (2,560 x 2,048). Building on the established Lince5M, this new sensor combines high-speed capabilities and high Quantum Efficiency (35% at 850 nm) in both visible and near-infrared wavelengths. It achieves a high frame rate of 250 fps (full resolution, 12-bit ADC), using the 24 LVDS output channels. Lince5M NIR delivers superior performance for demanding applications that require sharp images at very high-speeds and in low-light conditions, such as motion capture, sport analytics, industrial metrology, retinal imaging, and intelligent traffic monitoring. Designed around Teledyne e2v’s 5 µm global shutter pixel, this image sensor offers a dynamic range of 55 dB in standard mode and over 100 dB in High Dynamic Range mode, making it perfect for observing high-contrast scenes. Lince5M NIR is housed in a robust 28 x 28 mm 181 PGA (Pin-Grid Array) ceramic package and features a 1-inch optical format compatible with a broad range of C-mount lenses, for cost-effective camera integration. With an operating temperature range from -40°C up to 125°C, the Lince5M NIR is suitable for both indoor and outdoor applications. François Trolez, Marketing Manager at Teledyne e2v, said, “We are very pleased to release Lince5M NIR, specifically designed to offer unique features for high-speed imaging beyond the visible spectrum, with high performance in the near-infrared region. With its robust design, Lince5M NIR meets the demands of both industrial and commercial applications. Camera manufacturers currently using our Lince5M will find it easy to switch to Lince5M NIR, as both products share the same mechanical and electrical interfaces. This new product will enhance our ability to address new markets and applications.” Lince5M NIR will be showcased during Vision China, Shanghai, China from 26-28 March 2025. Visit us on Teledyne stand 5413 in Hall W5 or contact us online for more information. Documentation, samples, and kits for evaluation or development are available upon request. About Teledyne e2v Teledyne e2v innovations lead developments in healthcare, life sciences, space, transportation, defense and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of their customers and partnering with them to provide innovative standard, semi-custom or fully custom imaging solutions, bringing increased value to their systems. For more information, visit https://www.teledynevisionsolutions.com/ Teledyne e2v media enquiries contact:Jessica.Broom@teledyne.com A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/9a26992d-b72c-43e8-9c89-5b13b58e21fb

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APM launches ULPS Pressure Sensor for Precise Control!

Asia Pacific Microsystems (APM) has successfully developed the ULPS pressure sensor series, leveraging years of technical expertise and innovation. ULPS pressure sensor series are capable to detect pressure changes below 0.01 atmospheric pressure. The ULPS has extensive applications in medical devices, air conditioning systems, industrial manufacturing, and automotive industries, offering an enhanced solution to the market. Using unique manufacturing processes, APM has created 2 models with ranges of 0.15psi (1kPa) and 0.3psi (2kPa). Compared to international competitors, these sensors outperform in several key areas, including chip size, zero output, burst pressure, and resistance to vibration and noise. The strength of the ULPS pressure sensors are small chip size, concentrated zero output, over 30 times the burst pressure and high-performance vibration and noise resistance. They meet the high precision requirements of medical devices or providing exceptional support in industrial applications, the ULPS series offers a more reliable solution. The General Manager of APM – Dr. Jason Wu stated: "The successful development of the ULPS represents a significant breakthrough for APM in pressure sensing technology. In the past, there were few low pressure sensors with small and stable measurement ranges available on the market. Leveraging the expertise accumulated from years of developing and manufacturing pressure sensing chips, APM has overcome numerous technical challenges and provided the market with another high-quality chip option. These technological efforts represent our response to customer needs and our commitment to future innovation." APM remains dedicated to developing and producing reliable, competitive pressure sensing chips for global customers, and looks forward to the ULPS series offering better solutions in the medical and industrial fields. For more information about APM's MEMS technology services, or if you are seeking a high-quality MEMS manufacturer with extensive production experience and capabilities for your applications, please feel free to contact us via email: sales@apmsinc.com.  For more detailed information, please visit APM's official website: https://reurl.cc/Y4DK4l

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eYs3D Microelectronics Unveils Multi-Sensor Controller IC eSP936, YX9170 Spatial Perception Solution, and YX9670 Navigation Solution for Unmanned Vehicles

Integrated with eYs3D's Proprietary XINK-ll Edge Spatial Computing Platform and the Sense and React™ Human-Machine Interaction Development Interface, These Innovations Provide Robust Support for Human-Machine Interfaces in Next-Generation AI Applications. LAS VEGAS and TAIPEI, Jan. 2, 2025 /PRNewswire/ -- With the rapid rise of AI image sensing and edge computing technologies, the market for robots and intelligent unmanned vehicles is experiencing explosive growth. Etron Technology (TPEx: 5351.TW) subsidiary eYs3D Microelectronics has launched the new eSP936 multi-sensor image controller IC. The eSP936 supports the synchronous processing of data from up to seven visual sensors, providing high image recognition accuracy. Paired with the Sense and React™ human-machine interaction developer interface, it enables intelligent control through human-machine interaction, becoming a key driver for the implementation of smart applications. The eSP936 can be integrated with multi-modal visual language models (VLM), combining multiple visual sensors with real-time AI edge computing capabilities. It is suitable for smart application scenarios such as unmanned vehicles like automated guided vehicles, autonomous mobile robots, and drones. The eSP936 can process multiple 2D images at high speeds and generate 3D depth maps, enhancing precise environmental recognition. Embedded AI chips further enable dynamic navigation in complex environments. Additionally, industrial and service robots can achieve more precise intelligent perception in complex scenarios, combining real-time computing and automated operations for high-efficiency performance. In immersive human-machine interaction systems, the eSP936 can be integrated with AI SoC platforms to enhance the Sense and React interaction experience, widely applicable in Drones, USV (Unmanned Surface Vehicle), video conferencing, augmented education, and extended reality (XR) fields. Key technology highlights of the eSP936: support for synchronized processing of data from up to seven visual sensors, built-in DRAM chip, and wide-angle image de-warping technology, enabling high-precision environmental perception and multi-view 3D depth map generation. It also features high-performance data compression capabilities to reduce latency, providing developers with a flexible and efficient platform. The MIPI+USB simultaneous processing technology ensures high-quality 2D image and 3D depth map output, improving image recognition accuracy. We hope to create more opportunities for applications where customers can leverage the single-chip eSP936 IC to maximize the potential of AI Agency! Source:eYs3D Microelectronics Unveils XINK-II, eSP936, YX9670, YX9170 Latest YX9170 Spatial Awareness Solution for Autonomous Vehicles Debuting at CES 2025, eYs3D Microelectronics proudly unveils its cutting-edge spatial awareness solution, YX9170. Powered by the eYs3D multi-sensor image control chip eSP936 and the XINK-ll edge spatial computing platform, this solution leverages advanced multi-sensor fusion and AI-driven technologies to deliver breakthroughs in spatial perception and recognition. It provides robust support for the development of intelligent systems such as industrial and service robots and autonomous vehicles, emerging as a critical driver for smart system innovation. The core strength of the YX9170 solution lies in its comprehensive sensor fusion capabilities. It integrates dual-depth sensors, supporting high-definition images up to 1280x720 resolution, and synchronizes four RGB cameras for enhanced perception range and recognition accuracy. With support for multiple stereo lens baseline integrations, it overcomes the limitations of traditional stereo vision measurement techniques. This innovation surpasses previous challenges in multi-camera image processing and computational architecture integration, forming a holistic AI-based spatial awareness system. A highlight of the YX9170 solution is its intelligent sensing features. The embedded AI algorithms enable real-time multi-object recognition from synchronized images, achieving a 30% reduction in system computational load and latency. Through YX9170 and XINK-ll's highly flexible and adaptable software solutions, customers can swiftly design tailored spatial awareness solutions with integrated multi-sensor fusion, showcasing eYs3D Microelectronics' unparalleled technical prowess. Latest YX9670 Navigation Solution for Autonomous Vehicles eYs3D introduces its groundbreaking YX9670 navigation solution for autonomous vehicles. Equipped with the eYs3D multi-sensor image control chip eSP936 and the XINK-ll edge spatial computing platform, this innovative solution revolutionizes environmental awareness and navigation capabilities through advanced multi-sensor fusion and AI-driven technology. The core advantage of the YX9670 solution lies in its comprehensive sensor fusion capabilities. It integrates a dual-depth sensor system supporting high-definition images up to 1280x720 resolution and synchronizes four RGB cameras to deliver a 278-degree panoramic field of view. Additionally, a monochrome camera provides a 145-degree overhead view, with an embedded high-efficiency AHRS (Attitude and Heading Reference System) for vessel coordination and posture recognition. The system also incorporates a thermal imaging sensor, creating a highly advanced perception system. The YX9670 solution's embedded AI algorithms enable real-time panoramic object recognition, navigation direction analysis, and multi-target tracking. Even in complex or harsh environments, the system maintains high detection and recognition efficiency, showcasing its exceptional technical capabilities. Already successfully deployed in autonomous vessel navigation, the YX9670 solution provides safe and efficient navigation support for logistics vessels, environmental monitoring ships, and specialized unmanned marine applications. With its cutting-edge sensing technology and AI computational power, the solution not only meets current needs but also paves the way for a new era of intelligent navigation and human-machine interaction interfaces. XINK-ll Edge Spatial Computing Platform and Sense and React™ Human-Machine Interaction Developer Toolkit eYs3D Microelectronics will debut its XINK-ll Edge Spatial Computing Platform at CES 2025. This innovative "Platform as a Service (PaaS)" development solution is equipped with the eYs3D AI chip eCV5546, featuring ARM Cortex-A and Cortex-M CPU cores, along with an NPU (Neural Processing Unit). The platform supports the integration of AHRS, thermal imaging, and millimeter-wave radar sensors while incorporating AI convolutional neural network (CNN) technology to significantly enhance object recognition and detection capabilities for edge AI devices. Notably, ARM IoT Capital has provided not only funding but also exceptional performance enhancements for the XINK-ll platform. ARM CPUs with Neon instruction set support SIMD processing capabilities, accelerating vector and matrix operations for better computer vision and signal processing performance. Additionally, the low-power ARM Cortex-M4 processor serves as an MCU for system control, motor operation, and timeline synchronization. With a next-generation AI accelerator, the platform delivers superior performance compared to its peers, offering programmable development capabilities that supports various AI models. In the rapidly evolving AI landscape, XINK-ll is well-positioned to meet future computational demands. XINK-ll supports a wide range of AI development and acceleration frameworks, including ONNX, TensorFlow, TensorFlow Lite, PyTorch…etc., providing complete development kits and services to help developers more efficiently develop NPU (Neural Processing Unit) applications. eYs3D Microelectronics also introduces the Sense and React™ Human-Machine Interaction Developer Interface, which integrates LLM (Large Language Models) and CNN sensing technology. This advanced technology leverages environmental sensing and uses LLM to trigger action commands and language prompts. It enables machines to issue commands or interact naturally with users through conversational language, marking a new era in human-machine interface technology. Sense and React™ offers environmental awareness and cognition, action triggering with language prompts, and adaptability with flexibility. Through CNN sensing technology, the system efficiently perceives the surrounding environment, capturing subtle changes and dynamics for more accurate judgments and decisions. By employing LLM technology, the system generates action commands and language prompts based on sensor data, enhancing user convenience and delivering a more intelligent experience. CES is a globally influential technology event, and Etron Technology Group focuses on the theme of "Innovation in Action, AI Implementation, and Connecting MemorAiLink to Shape the Future." Etron Technology Group demonstrates its commitment to developing innovative products with IC solutions that embody "Pervasive Intelligence" and "Heterogeneous Integration." These products empower electronic devices with AI capabilities such as cognition, vision, neural networks, and privacy, enriching AI applications while advancing the vision of future living. Etron Technology Group's booth (Booth Number: 15741, Central Hall, LVCC) is open for visits and collaboration, aiming for a win-win partnership!www.etron.com About eYs3D Microelectronics eYs3D Microelectronics Corp.is a pioneer in 3D sensing technologies, and aims to develop semiconductor oriented technologies and products related to 3D vision-simulating computer vision technologies integrated with computer intelligence. With its strong foundation and experience in memory design and computer vision, as well as close co-operation with its parent company, Etron Technology, Inc., and ARM Holdings Plc., eYs3D strives to develop new technologies to take advantage of computer vision chips and subsystems. It targets blue-ocean markets such as smart products, intelligence of things (IoT), and industrial and consumer level automation, to become a leading brand in the market of computer vision processing. For more information, visit www.eys3d.com  About Etron Technology, Inc. Etron Technology, Inc. (TPEx: 5351.TW) is a world-class fabless and heterogeneous integration IC design company that specializes in application-driven buffer memory, known-good die memory (KGDM), long-retention time DRAM (RPC DRAM), and other artificial intelligence and machine learning induced DRAM products. Etron also develops system-in-packages, including high-speed transfer interface chips of USB Type-C, and 3D depth sensing computer vision and panoramic image capturing chips. www.etron.com For further information, please contact: Corporate Spokesperson:Ms. Justine TsaiCorporate Deputy Spokesperson:Mr. Eason ChengTel: +886-3-578-2345 #8670Email: pr@etron.com.tw 

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2025 年 4 月 13 日 (星期日) 農曆三月十六日
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