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SEOUL, South Korea, March 6, 2025 /PRNewswire/ -- SK keyfoundry, an 8-inch pure-play foundry in Korea, announced today that it offers a new 3D Hall-effect sensor technology that can measure speed and direction through three-dimensional magnetic field detection for its foundry customers. The Hall-effect sensor is a device that measures the strength of a magnetic field using the Hall-effect, which detects the voltage difference generated when a conductor or semiconductor passes through a magnetic field. The measured magnetic field is utilized in applications that leverage the position, speed, rotation, direction, and current of devices. SK keyfoundry has provided a variety of products using existing 1D (one-dimensional) and 2D (two-dimensional) Hall-effect sensors, and this new 3D Hall-effect sensor integrates both Vertical and Planar Hall-effect sensors on a single chip. It features enhanced sensitivity beyond that of existing 2D products, enabling real-time measurement of minute three-dimensional direction and speed changes with rapid response times. Another important feature of the 3D Hall-effect sensor provided by SK keyfounrdry is that it can be designed to easily integrate into customer products by adding masks to existing processes. Additionally, the integration of the 3D Hall-effect sensor is offered across multiple nodes in the range of 0.13μm to 0.18μm while maintaining electrical characteristics. The new 3D Hall-effect sensor is expected to be utilized in various fields. In particular, it can be applied in the automotive sector for safe driving assistance and autonomous driving systems, in consumer electronics for smart appliances and gaming consoles, and in industrial automation for robot control, drones, virtual reality, augmented reality, and wearable devices. Derek D. Lee, the CEO of SK keyfoundry, stated, "The newly launched 3D Hall-effect sensor technology is expected to be utilized in the design of products across various industries, including home appliances, automotive, robotics, and drones, due to its high sensitivity and ability to detect minute three-dimensional movements." He added, "We plan to support our customers in integrating more diverse functions into a single semiconductor through ongoing technology openness." About SK keyfoundry Headquartered in Korea, SK keyfoundry provides specialty Analog and Mixed-Signal foundry services for semiconductor companies to serve a wide range of applications in the consumer, communications, computing, automotive and industrial industries. With a broad range of technology portfolios and process nodes, SK keyfoundry has the flexibility and capability to meet the ever-evolving needs of semiconductor companies across the globe. Please visit https://www.skkeyfoundry.com for more information.
GRENOBLE, France, Feb. 25, 2025 (GLOBE NEWSWIRE) -- Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, introduces Lince5M™ NIR, a state-of-the-art high-speed CMOS image sensor. Leveraging Teledyne e2v’s advanced imaging technologies, this new sensor delivers enhanced performance in both visible and near-infrared (NIR) wavelengths, making it ideal for a wide range of commercial, industrial, and medical applications. The Lince5M NIR is a monochrome image sensor with a resolution of 5.2 megapixels (2,560 x 2,048). Building on the established Lince5M, this new sensor combines high-speed capabilities and high Quantum Efficiency (35% at 850 nm) in both visible and near-infrared wavelengths. It achieves a high frame rate of 250 fps (full resolution, 12-bit ADC), using the 24 LVDS output channels. Lince5M NIR delivers superior performance for demanding applications that require sharp images at very high-speeds and in low-light conditions, such as motion capture, sport analytics, industrial metrology, retinal imaging, and intelligent traffic monitoring. Designed around Teledyne e2v’s 5 µm global shutter pixel, this image sensor offers a dynamic range of 55 dB in standard mode and over 100 dB in High Dynamic Range mode, making it perfect for observing high-contrast scenes. Lince5M NIR is housed in a robust 28 x 28 mm 181 PGA (Pin-Grid Array) ceramic package and features a 1-inch optical format compatible with a broad range of C-mount lenses, for cost-effective camera integration. With an operating temperature range from -40°C up to 125°C, the Lince5M NIR is suitable for both indoor and outdoor applications. François Trolez, Marketing Manager at Teledyne e2v, said, “We are very pleased to release Lince5M NIR, specifically designed to offer unique features for high-speed imaging beyond the visible spectrum, with high performance in the near-infrared region. With its robust design, Lince5M NIR meets the demands of both industrial and commercial applications. Camera manufacturers currently using our Lince5M will find it easy to switch to Lince5M NIR, as both products share the same mechanical and electrical interfaces. This new product will enhance our ability to address new markets and applications.” Lince5M NIR will be showcased during Vision China, Shanghai, China from 26-28 March 2025. Visit us on Teledyne stand 5413 in Hall W5 or contact us online for more information. Documentation, samples, and kits for evaluation or development are available upon request. About Teledyne e2v Teledyne e2v innovations lead developments in healthcare, life sciences, space, transportation, defense and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of their customers and partnering with them to provide innovative standard, semi-custom or fully custom imaging solutions, bringing increased value to their systems. For more information, visit https://www.teledynevisionsolutions.com/ Teledyne e2v media enquiries contact:Jessica.Broom@teledyne.com A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/9a26992d-b72c-43e8-9c89-5b13b58e21fb
Asia Pacific Microsystems (APM) has successfully developed the ULPS pressure sensor series, leveraging years of technical expertise and innovation. ULPS pressure sensor series are capable to detect pressure changes below 0.01 atmospheric pressure. The ULPS has extensive applications in medical devices, air conditioning systems, industrial manufacturing, and automotive industries, offering an enhanced solution to the market. Using unique manufacturing processes, APM has created 2 models with ranges of 0.15psi (1kPa) and 0.3psi (2kPa). Compared to international competitors, these sensors outperform in several key areas, including chip size, zero output, burst pressure, and resistance to vibration and noise. The strength of the ULPS pressure sensors are small chip size, concentrated zero output, over 30 times the burst pressure and high-performance vibration and noise resistance. They meet the high precision requirements of medical devices or providing exceptional support in industrial applications, the ULPS series offers a more reliable solution. The General Manager of APM – Dr. Jason Wu stated: "The successful development of the ULPS represents a significant breakthrough for APM in pressure sensing technology. In the past, there were few low pressure sensors with small and stable measurement ranges available on the market. Leveraging the expertise accumulated from years of developing and manufacturing pressure sensing chips, APM has overcome numerous technical challenges and provided the market with another high-quality chip option. These technological efforts represent our response to customer needs and our commitment to future innovation." APM remains dedicated to developing and producing reliable, competitive pressure sensing chips for global customers, and looks forward to the ULPS series offering better solutions in the medical and industrial fields. For more information about APM's MEMS technology services, or if you are seeking a high-quality MEMS manufacturer with extensive production experience and capabilities for your applications, please feel free to contact us via email: sales@apmsinc.com. For more detailed information, please visit APM's official website: https://reurl.cc/Y4DK4l
Integrated with eYs3D's Proprietary XINK-ll Edge Spatial Computing Platform and the Sense and React™ Human-Machine Interaction Development Interface, These Innovations Provide Robust Support for Human-Machine Interfaces in Next-Generation AI Applications. LAS VEGAS and TAIPEI, Jan. 2, 2025 /PRNewswire/ -- With the rapid rise of AI image sensing and edge computing technologies, the market for robots and intelligent unmanned vehicles is experiencing explosive growth. Etron Technology (TPEx: 5351.TW) subsidiary eYs3D Microelectronics has launched the new eSP936 multi-sensor image controller IC. The eSP936 supports the synchronous processing of data from up to seven visual sensors, providing high image recognition accuracy. Paired with the Sense and React™ human-machine interaction developer interface, it enables intelligent control through human-machine interaction, becoming a key driver for the implementation of smart applications. The eSP936 can be integrated with multi-modal visual language models (VLM), combining multiple visual sensors with real-time AI edge computing capabilities. It is suitable for smart application scenarios such as unmanned vehicles like automated guided vehicles, autonomous mobile robots, and drones. The eSP936 can process multiple 2D images at high speeds and generate 3D depth maps, enhancing precise environmental recognition. Embedded AI chips further enable dynamic navigation in complex environments. Additionally, industrial and service robots can achieve more precise intelligent perception in complex scenarios, combining real-time computing and automated operations for high-efficiency performance. In immersive human-machine interaction systems, the eSP936 can be integrated with AI SoC platforms to enhance the Sense and React interaction experience, widely applicable in Drones, USV (Unmanned Surface Vehicle), video conferencing, augmented education, and extended reality (XR) fields. Key technology highlights of the eSP936: support for synchronized processing of data from up to seven visual sensors, built-in DRAM chip, and wide-angle image de-warping technology, enabling high-precision environmental perception and multi-view 3D depth map generation. It also features high-performance data compression capabilities to reduce latency, providing developers with a flexible and efficient platform. The MIPI+USB simultaneous processing technology ensures high-quality 2D image and 3D depth map output, improving image recognition accuracy. We hope to create more opportunities for applications where customers can leverage the single-chip eSP936 IC to maximize the potential of AI Agency! Source：eYs3D Microelectronics Unveils XINK-II, eSP936, YX9670, YX9170 Latest YX9170 Spatial Awareness Solution for Autonomous Vehicles Debuting at CES 2025, eYs3D Microelectronics proudly unveils its cutting-edge spatial awareness solution, YX9170. Powered by the eYs3D multi-sensor image control chip eSP936 and the XINK-ll edge spatial computing platform, this solution leverages advanced multi-sensor fusion and AI-driven technologies to deliver breakthroughs in spatial perception and recognition. It provides robust support for the development of intelligent systems such as industrial and service robots and autonomous vehicles, emerging as a critical driver for smart system innovation. The core strength of the YX9170 solution lies in its comprehensive sensor fusion capabilities. It integrates dual-depth sensors, supporting high-definition images up to 1280x720 resolution, and synchronizes four RGB cameras for enhanced perception range and recognition accuracy. With support for multiple stereo lens baseline integrations, it overcomes the limitations of traditional stereo vision measurement techniques. This innovation surpasses previous challenges in multi-camera image processing and computational architecture integration, forming a holistic AI-based spatial awareness system. A highlight of the YX9170 solution is its intelligent sensing features. The embedded AI algorithms enable real-time multi-object recognition from synchronized images, achieving a 30% reduction in system computational load and latency. Through YX9170 and XINK-ll's highly flexible and adaptable software solutions, customers can swiftly design tailored spatial awareness solutions with integrated multi-sensor fusion, showcasing eYs3D Microelectronics' unparalleled technical prowess. Latest YX9670 Navigation Solution for Autonomous Vehicles eYs3D introduces its groundbreaking YX9670 navigation solution for autonomous vehicles. Equipped with the eYs3D multi-sensor image control chip eSP936 and the XINK-ll edge spatial computing platform, this innovative solution revolutionizes environmental awareness and navigation capabilities through advanced multi-sensor fusion and AI-driven technology. The core advantage of the YX9670 solution lies in its comprehensive sensor fusion capabilities. It integrates a dual-depth sensor system supporting high-definition images up to 1280x720 resolution and synchronizes four RGB cameras to deliver a 278-degree panoramic field of view. Additionally, a monochrome camera provides a 145-degree overhead view, with an embedded high-efficiency AHRS (Attitude and Heading Reference System) for vessel coordination and posture recognition. The system also incorporates a thermal imaging sensor, creating a highly advanced perception system. The YX9670 solution's embedded AI algorithms enable real-time panoramic object recognition, navigation direction analysis, and multi-target tracking. Even in complex or harsh environments, the system maintains high detection and recognition efficiency, showcasing its exceptional technical capabilities. Already successfully deployed in autonomous vessel navigation, the YX9670 solution provides safe and efficient navigation support for logistics vessels, environmental monitoring ships, and specialized unmanned marine applications. With its cutting-edge sensing technology and AI computational power, the solution not only meets current needs but also paves the way for a new era of intelligent navigation and human-machine interaction interfaces. XINK-ll Edge Spatial Computing Platform and Sense and React™ Human-Machine Interaction Developer Toolkit eYs3D Microelectronics will debut its XINK-ll Edge Spatial Computing Platform at CES 2025. This innovative "Platform as a Service (PaaS)" development solution is equipped with the eYs3D AI chip eCV5546, featuring ARM Cortex-A and Cortex-M CPU cores, along with an NPU (Neural Processing Unit). The platform supports the integration of AHRS, thermal imaging, and millimeter-wave radar sensors while incorporating AI convolutional neural network (CNN) technology to significantly enhance object recognition and detection capabilities for edge AI devices. Notably, ARM IoT Capital has provided not only funding but also exceptional performance enhancements for the XINK-ll platform. ARM CPUs with Neon instruction set support SIMD processing capabilities, accelerating vector and matrix operations for better computer vision and signal processing performance. Additionally, the low-power ARM Cortex-M4 processor serves as an MCU for system control, motor operation, and timeline synchronization. With a next-generation AI accelerator, the platform delivers superior performance compared to its peers, offering programmable development capabilities that supports various AI models. In the rapidly evolving AI landscape, XINK-ll is well-positioned to meet future computational demands. XINK-ll supports a wide range of AI development and acceleration frameworks, including ONNX, TensorFlow, TensorFlow Lite, PyTorch…etc., providing complete development kits and services to help developers more efficiently develop NPU (Neural Processing Unit) applications. eYs3D Microelectronics also introduces the Sense and React™ Human-Machine Interaction Developer Interface, which integrates LLM (Large Language Models) and CNN sensing technology. This advanced technology leverages environmental sensing and uses LLM to trigger action commands and language prompts. It enables machines to issue commands or interact naturally with users through conversational language, marking a new era in human-machine interface technology. Sense and React™ offers environmental awareness and cognition, action triggering with language prompts, and adaptability with flexibility. Through CNN sensing technology, the system efficiently perceives the surrounding environment, capturing subtle changes and dynamics for more accurate judgments and decisions. By employing LLM technology, the system generates action commands and language prompts based on sensor data, enhancing user convenience and delivering a more intelligent experience. CES is a globally influential technology event, and Etron Technology Group focuses on the theme of "Innovation in Action, AI Implementation, and Connecting MemorAiLink to Shape the Future." Etron Technology Group demonstrates its commitment to developing innovative products with IC solutions that embody "Pervasive Intelligence" and "Heterogeneous Integration." These products empower electronic devices with AI capabilities such as cognition, vision, neural networks, and privacy, enriching AI applications while advancing the vision of future living. Etron Technology Group's booth (Booth Number: 15741, Central Hall, LVCC) is open for visits and collaboration, aiming for a win-win partnership！www.etron.com About eYs3D Microelectronics eYs3D Microelectronics Corp.is a pioneer in 3D sensing technologies, and aims to develop semiconductor oriented technologies and products related to 3D vision-simulating computer vision technologies integrated with computer intelligence. With its strong foundation and experience in memory design and computer vision, as well as close co-operation with its parent company, Etron Technology, Inc., and ARM Holdings Plc., eYs3D strives to develop new technologies to take advantage of computer vision chips and subsystems. It targets blue-ocean markets such as smart products, intelligence of things (IoT), and industrial and consumer level automation, to become a leading brand in the market of computer vision processing. For more information, visit www.eys3d.com About Etron Technology, Inc. Etron Technology, Inc. (TPEx: 5351.TW) is a world-class fabless and heterogeneous integration IC design company that specializes in application-driven buffer memory, known-good die memory (KGDM), long-retention time DRAM (RPC DRAM), and other artificial intelligence and machine learning induced DRAM products. Etron also develops system-in-packages, including high-speed transfer interface chips of USB Type-C, and 3D depth sensing computer vision and panoramic image capturing chips. www.etron.com For further information, please contact: Corporate Spokesperson:Ms. Justine TsaiCorporate Deputy Spokesperson:Mr. Eason ChengTel: +886-3-578-2345 #8670Email: pr@etron.com.tw
SEOUL, South Korea, Dec. 16, 2024 /PRNewswire/ -- SOLiDVUE, Korea's exclusive enterprise specialized in CMOS LiDAR (Light Detection and Ranging) sensor IC development, announced that its groundbreaking single-chip LiDAR sensor IC, the SL-2.2, boasting a world-first 400x128 resolution, has been honored with the CES Innovation Award® at CES 2025. SOLiDVUE’s LiDAR sensor chip, SL-2.2, and demonstration images (Photo=SOLiDVUE) LiDAR is a next-generation core component for autonomous vehicles and robotics, capable of precisely measuring the shape and distance of objects to output 3D images. This technology enables accurate object recognition for applications such as autonomous vehicles, drones, robots, security cameras, and traffic management systems. Established in 2020, SOLiDVUE focuses on designing SoCs (System-on-Chip) for LiDAR sensors, which form the core of a LiDAR system. "While mechanical LiDAR has been the standard, the latest trend is to replace it with semiconductor chips," said co-CEO, Jung-Hoon Chun. SOLiDVUE is the only company in South Korea to have developed LiDAR sensors that completely replace mechanical components with semiconductor technology. SOLiDVUE's LiDAR sensors are compatible with solid-state LiDAR systems, which are 10 times smaller and 100 times cheaper than traditional mechanical LiDAR systems. "Our sensors offer ultra-compact chip solution compared to competitors, but their performance is not just on par—it's superior," co-CEO, Jaehyuk Choi stated confidently. The company's proprietary technologies, such as CMOS SPAD (Single Photon Avalanche Diode) technology, single-chip sensor architecture, and image signal processor, underpin its competitive edge. CMOS SPAD technology enhances measurement accuracy by detecting sparse photons even the single-photon level. Globally, only a few companies, including SOLiDVUE, possess such single-chip sensor technology. SOLiDVUE's technological prowess has been repeatedly acknowledged at the IEEE ISSCC (International Solid-State Circuits Conference), marking a remarkable achievement for a Korean fabless company. Furthermore, the recent CES Innovation Award has once again affirmed its prominence in the LiDAR sensor industry. SOLiDVUE's award-winning SL-2.2 pushes the boundaries of resolution with its ability to output high-resolution 3D images up to 400x128 pixels, surpassing the 200x116 resolution of existing products. The SL-2.2 can detect objects up to 200 meters away with an exceptional 99.9% accuracy. As a single-chip sensor, the SL-2.2 is fabricated using standard CMOS semiconductor processes and benefits from SOLiDVUE's proprietary ultra-miniaturization technology. The sensor core measures just 0.9cm x 0.9cm and is packaged in a compact 1.4cm x 1.4cm BGA-type package, enabling seamless integration into various LiDAR systems. Its single-chip design reduces power consumption, enhancing energy efficiency and ensuring high reliability. The SL-2.2 is a successor to the company's first product, the SV-110, which features a 200x116 resolution and a 128-meter detection range. The SL-2.2 is scheduled for an official release in 2025 and is expected to play a pivotal role in advancing LiDAR technology across applications such as autonomous vehicles, robotics, drones, and smart cities. Co-CEO Jaehyuk Choi emphasized, "At SOLiDVUE, we are actively collaborating with numerous domestic and international companies and research institutions to push the boundaries of LiDAR technology. With the rapidly growing demand for LiDAR, we are committed to continuously expanding our product lineup to meet diverse market needs. Our mission is to lead the LiDAR industry by delivering innovative solutions that address the evolving challenges of tomorrow." Media contact: contact@solid-vue.com
SHANGHAI, Oct. 23, 2024 /PRNewswire/ -- As automobile safety and comfort standards rise, the demand for high-performance sensors is surging. NOVOSENSE Microelectronics, a global supplier of automotive chips, offers an extensive portfolio of automotive-grade sensor products, ranging from current sensing to environmental monitoring. Chip-level Current Sensor with Integrated Current Path: NSM2019-Q0 It supports continuous primary currents of up to 100A with an ultra-low primary resistance of 0.27mΩ, making it ideal for AC/DC current measurement in automotive systems. The sensor delivers accurate current sensing without the need for external isolation components. NSM2019 can deliver high isolation and low heat generation, thanks to its superior design. With a creepage distance of 8.2mm and a UL-compliant isolation withstand voltage of 5000Vrms, NSM2019 also ensures safety in high-voltage applications. Automotive CMOS Integrated Temperature Sensors with Digital/Analog Output: NST175-Q1, NST235-Q1, NST86-Q1 These are automotive-grade temperature sensors designed for high precision and low power consumption. These CMOS integrated circuit sensors support an input voltage range of 2.4V to 5.5V and offer both analog and digital output options, catering to different application needs. In terms of the accuracy, NST86-Q1 and NST235-Q1 achieve a maximum temperature error of ±2.5°C, while NST60-Q1 maintains a ±4°C error across the full temperature range. By eliminating the need for extra circuitry, these sensors offer a cost-effective alternative to traditional thermistors, reducing system costs and enhancing reliability in harsh automotive environments. Automotive I2C Digital Interface Temperature and Humidity Sensor: NSHT30-Q1 It integrates a capacitive relative humidity sensor with a CMOS temperature sensor. Packaged in a compact DFN design with an I2C interface, NSHT30-Q1 is tailored for automotive applications that demand precise environmental monitoring. As vehicles become increasingly reliant on environmental data to drive intelligent decision-making, sensors like the NSHT30-Q1 are poised to support in autonomous vehicle systems, cabin comfort control, and smart climate regulation. With a strong R&D focus and a reliable supply chain, NOVOSENSE provides robust and reliable solutions in sensor, signal chain and power management. These offerings are widely used in automotive applications. In the first half of 2024 NOVOSENSE achieved over 33% of its revenue from automotive electronics, and the shipment of more than 400 million automotive chips since 2022. For more information about NOVOSENSE's automotive sensor solutions, visit: www.novosns.com/en.
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