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LAS VEGAS, Jan. 9, 2025 /PRNewswire/ -- From January 7-10, , Goertek stole the spotlight at the 58th International Consumer Electronics Show (CES) in Las Vegas, unveiling a range of groundbreaking technological solutions in acoustics, optics, and microelectronics. The innovations significantly enhance audio-visual interaction. Goertek has launched its latest XR innovations, focusing on lightweight AR reference designs, Mulan 2 and Wood 2, which tip the scales at just 36 grams and 58 grams respectively, dramatically improving comfort. Mulan 2 features an ultra-thin carbon fiber frame and ultra-light titanium alloy hinges, combined with holographic waveguide lenses and Micro LED optics for a sleek design with minimal light leakage. Wood 2 integrates breakthrough technologies, including an ultra-light front frame and ultra-small SiP module, to support full-color display, high-definition recording and multi-modal AI interaction. In the VR space, Goertek presented a PC VR reference design featuring a single-eye 4K Micro OLED display and a 3P Pancake optical solution. Thanks to optimized design and materials, the device weighs approximately 145 grams, reducing the burden of extended use. In addition, Goertek introduced a single-optic dual-eye diffractive waveguide AR display module with Surface Relief Grating (SRG) that combines thinness with exceptional display quality. Goertek showcased a series of cutting-edge acoustic and haptic components for mobile phones, tablets, TWS earbuds, VR/AR and smart glasses. Highlights included the DPS speaker, which delivers high-quality stereo sound while ensuring privacy during calls. The company also introduced the industry's first side-facing, waterproof, full-metal BOX and TWS earbuds with a single-sided tweeter/woofer combo speaker. High-performance linear motors were also on display, offering a completely improved acoustic and tactile experience. On the audio front, Goertek exhibited a call noise reduction solution that integrates VPU sensors and DNN algorithms to significantly improve voice clarity in high wind noise environments. In addition, the company continues to push the boundaries of open-ear audio technology with its leading anti-leakage sound chamber designs, coupled with proprietary sound enhancement and active acoustic algorithms. These innovations deliver private and immersive audio experiences for OWS and AI glasses. Goermicro brought an extensive array of sensors, microsystems, and smart interaction modules at the forefront of microelectronics. The lineup includes acoustic, pressure, ToF, SiP, and piezoelectric touch offerings for smartphones, wearable health devices, smart earbuds, VR/AR, and other smart devices. Notably, its acoustic sensors stand out in AI audio processing, delivering exceptional noise cancellation, sound quality enhancement, and sound localization. Leveraging a high-precision packaging process that breaks size limitations, Goermicro has developed ultra-small acoustic sensors that can make sound clearer, more accessible, and intelligent. Furthermore, the company presented innovative piezoelectric buttons, adding to its diverse portfolio of microelectronic solutions. Goertek has announced the release of several smart wearables that seamlessly integrate health monitoring and multi-modal interaction capabilities. A standout smart ring features an array of PPG, body temperature, and IMU sensors for comprehensive all-day health monitoring. It supports a range of controls, including tapping, swiping, air mouse, and gesture recognition, for seamless interaction with connected smart devices. Another innovative ring employs both reflective and transmissive PPG for medical-grade health monitoring. Its in-built microphone allows users to interact with an AI assistant, making it easy to control connected smart devices. Additionally, the ring is equipped with the industry's smallest micro-motor, providing precise vibration feedback for an enhanced user experience. Goertek has made significant strides in the automotive electronics sector with the introduction of its innovative in-vehicle UWB technology. This innovation enables a single remote control to manage multiple in-car devices via UWB anchors. The system is designed to detect breathing patterns to determine if a child has been left in the vehicle, and to detect foot kicks to open and close the trunk, enhancing both driving safety and convenience. In addition, Goertek unveiled its automotive AR-HUD coaxial dual focal-plane module. This solution addresses issues of viewing angle adjustment and display blurriness, ensuring a smooth and uninterrupted driver's gaze. Looking ahead, Goertek remains committed to exploring cutting-edge technologies, continuously innovating and breaking industry barriers. The company's goal is to drive technological advancements and provide customers and consumers with smarter, more convenient products and technological solutions that contribute to a healthier and better life.
Completely Upgraded Servers with the New Intel® Xeon® 6900 Series Processors with P-Cores Optimized for Maximum Performance are Now Shipping in Volume, Featuring Next-Generation GPU Support, Higher-Bandwidth Memory, 400GbE Networking, E1.S and E3.S Drives, and the Industry's Leading Direct-to-Chip Liquid Cooling Solutions SAN JOSE, Calif., Jan. 9, 2025 /PRNewswire/ -- Supermicro, Inc. (NASDAQ: SMCI) a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge is commencing shipments of max-performance servers featuring Intel Xeon 6900 series processors with P-cores. The new systems feature a range of new and upgraded technologies with new architectures optimized for the most demanding high-performance workloads including large-scale AI, cluster-scale HPC, and environments where a maximum number of GPUs are needed, such as collaborative design and media distribution. SBI-612BA-1NE34 "The systems now shipping in volume promise to unlock new capabilities and levels of performance for our customers around the world, featuring low latency, maximum I/O expansion providing high throughput with 256 performance cores per system, 12 memory channels per CPU with MRDIMM support, and high performance EDSFF storage options," said Charles Liang, president and CEO of Supermicro. "We are able to ship our complete range of servers with these new application-optimized technologies thanks to our Server Building Block Solutions® design methodology. With our global capacity to ship solutions at any scale, and in-house developed liquid cooling solutions providing unrivaled cooling efficiency, Supermicro is leading the industry into a new era of maximum performance computing." Click here for more information. There are currently several X14 systems available to customers for remote testing and validation via Supermicro's JumpStart program. The Supermicro X14 systems are available in a variety of form factors, each optimized for a range of performance-intensive workloads: GPU-optimized supporting the latest generation of SXM and PCIe GPUs, featuring enhanced thermal capacities and direct-to-chip liquid cooling on some models. High density multi-nodes including all-new FlexTwin™ and GrandTwin® models as well as the proven, award-winning SuperBlade® architecture. These models leverage shared components to increase efficiency and can be fitted with direct-to-chip liquid cooling for maximum performance density. Market-proven Supermicro Hyper rackmounts combine single or dual socket architectures with flexible I/O and storage configurations in traditional rackmount form factors to help enterprises and data centers scale up and out as their workloads evolve. Supermicro's max-performance X14 systems support the Intel Xeon 6900 series processors with P-cores, which feature up to 128 performance cores per CPU, support for high bandwidth MRDIMMs up to 8800 MT/s, and built-in accelerators including the AI-specific Intel AMX. The X14 systems represent the perfect building blocks for data centers at any scale, with Supermicro able to provide complete rack-level integration services including design, building, testing, validation, and delivery. An industry-leading global manufacturing capacity of up to 5,000 racks per month (2,000 liquid cooled) and extensive testing and burn-in facilities allow Supermicro to deliver solutions at any scale in a matter of weeks, not months. With Supermicro's complete in-house liquid-cooled direct-to-chip cold plate solutions, liquid cooling can be easily included in rack-level integrations to further increase system efficiency, reduce instances of thermal throttling, and lower both the TCO and Total Cost to Environment (TCE) of data center deployments. These turn-key solutions include the rack, cabling, power, and cooling infrastructure to simplify solution deployment at scale. To maximize the performance and density potential of the latest X14 systems, Supermicro also offers complete in-house developed liquid cooling solutions including cold plates for CPUs, GPUs, memory, Cooling Distribution Units, Cooling Distribution Manifolds, hoses, connectors, and cooling towers. Liquid cooling is easily included in rack-level integrations to increase system efficiency, reduce instances of thermal throttling, and lowers both the TCO and Total Cost to the Environment (TCE) of data center deployments. Supermicro max-performance X14 systems featuring Intel Xeon 6900 series processors with P-cores include: GPU-optimized – The highest performance Supermicro X14 systems designed for large-scale AI training, large language models (LLMs), generative AI and HPC, and supporting eight of the latest-generation SXM5 and SXM6 GPUs. These systems are available in air-cooled or liquid-cooled configurations. PCIe GPU – Designed for maximum GPU flexibility, supporting up to 10 double-width PCIe 5.0 accelerator cards in a thermally-optimized 5U chassis or edge-optimized 3U chassis. These servers are ideal for AI inferencing, media, collaborative design, simulation, cloud gaming, and virtualization workloads. Intel® Gaudi® 3 AI Accelerators – Supermicro is now shipping the industry's first AI server based on the Intel Gaudi 3 accelerator hosted by Intel Xeon 6 processors. Designed to increase the efficiency and lower the cost of large-scale AI model training and AI inferencing, the system features eight Intel Gaudi 3 accelerators on an OAM universal baseboard, six integrated OSFP ports for cost-effective scale-out networking, and an open platform designed to use a community-based, open-source software stack, requiring no software licensing costs. SuperBlade® – Supermicro's X14 6U high-performance, density-optimized, and energy-efficient SuperBlade maximizes rack density, with up to 100 servers and 200 GPUs per rack. Optimized for AI, HPC, and other compute-intensive workloads, each node features air cooling or direct-to-chip liquid cooling to maximize efficiency and achieve the lowest PUE with the best TCO, as well as connectivity up to four integrated Ethernet switches with 100G uplinks and front I/O supporting a range of flexible networking options up to 400G InfiniBand or 400G Ethernet per node. FlexTwin™ – The new Supermicro X14 FlexTwin architecture is purpose-built for HPC, cost-efficient, and designed to provide maximum compute power and density in a multi-node configuration with up to 24,576 performance cores in a 48U rack. Optimized for HPC and other compute-intensive workloads, each node features direct-to-chip liquid cooling only to maximize efficiency and reduce instances of CPU thermal throttling, as well as HPC low latency front and rear I/O supporting a range of flexible networking options up to 400G per node. Hyper – X14 Hyper is Supermicro's flagship rackmount platform designed to deliver the highest performance for demanding AI, HPC, and enterprise applications, with single or dual socket configurations supporting double-width PCIe GPUs for maximum workload acceleration. Both air cooling and direct-to-chip liquid cooling models are available to facilitate the support of top-bin CPUs without thermal limitations and reduce data center cooling costs while also increasing efficiency. About Super Micro Computer, Inc. Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first to market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are a Total IT Solutions provider with server, AI, storage, IoT, switch systems, software, and support services. Supermicro's motherboard, power, and chassis design expertise further enables our development and production, enabling next generation innovation from cloud to edge for our global customers. Our products are designed and manufactured in-house (in the US, Asia, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling). Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc. All other brands, names, and trademarks are the property of their respective owners. SYS-212HA-TN SYS-212HA-TN-FRONT SYS-222FT-HEA-LCC-ANGLE SYS-222FT-HEA-LCC-FRONT SYS-422GA-NBRT-LCC SYS-522GA-NRT SYS-A22GA-NBRT
LAS VEGAS, Jan. 9, 2025 /PRNewswire/ -- From January 7th to 10th, BICV Technology Co., Ltd. (BICV) made its debut at CES 2025. BICV showcased over 30 self-developed products in Intelligent Cockpit Domain, Intelligent Driving Domain, Cockpit-Driving Fusion Domain, and Telematics & Communication. Ranging from mass-produced items to cutting-edge innovations, these products spotlighted BICV's leading position in auto intelligent connected. This appearance at CES heralded a new phase of its international expansion. BICV's Debut at CES 2025 In this exhibition, BICV launched products such as the MARS Series Intelligent Cockpit, IntelliDrive 2.0 Cockpit-Driving Fusion Domain Controller, CMS Electronic Exterior Mirror, Driving-Parking Fusion Domain Controller, 5G+V2X+High Precision Navigation Controller, Smart Antenna, 4G/5G T-BOX, and ECALL - BOX. Among them, the SA8775 - based IntelliDrive 2.0 Cockpit-Driving Fusion Domain Controller demonstrates BICV's technological innovation strength in cross - domain fusion.IntelliDrive 2.0 enhances system synergy and performance, enables high - level functions like high - speed NOA, MNP Memory Driving, and HPA Memory Parking, and optimizes the driving experience. The MARS 06 Intelligent Cockpit, based on the MT8678 platform, can achieve a full - scene 3D interactive interface and drive four screens simultaneously. Its high computing power enables natural human - machine interaction functions. It integrates functions such as IVI, instrument panel, AVM, DMS, IMS, AI large models, and APA. The infrared night - vision product, developed in collaboration with Pioneer, supports the expansion of multiple product categories and can achieve DMS/IMS functions. The Acute 2.0 CMS features high image quality, low power consumption, and low latency. With strong engineering capabilities, it integrates ISP tuning and algorithm integration. Drawing on project - development experience, BICV has successfully launched many cockpit - domain and other intelligent - connected projects based on platforms such as Qualcomm and MTK, winning global automotive customers' positive recognition. In 2024, BICV witnessed a remarkable overseas sales surge. Some cockpit products passed AA/CA certification and are exported to Europe and North America. It has also entered Middle - East, Southeast - Asian and other overseas markets. With a factory in Thailand, an office in Japan, and expanded business in Germany and South Korea, BICV's overseas reach now spans over 10 countries and regions. BICV, as a technology innovation company with rich experience and strong development potential in the auto intelligent connected industry, will meet global market needs, break tech boundaries, and offer consumers worldwide more convenient, comfortable, and intelligent travel experiences.
DÜSSELDORF, Germany, Jan. 9, 2025 /PRNewswire/ -- Henkel returns to CES® 2025 with a splash, with the official unveiling of its Smartwash™ Technology, an AI-driven, cartridge-based detergent dosing system that can power washing machines and dishwashers. The global consumer and industrial business leader spearheads this innovation with the launch of Persil® and Somat® Smartwash, targeting the European market as of 2025. Henkel's presence at the show also sets the stage for multiple industry partnership discussions with global appliance manufacturers and technology leaders, around the creation of the machine of the future. Henkel's Smartwash Laundry Concept Machine Persil and Somat Smartwash devices break ground for Henkel's autonomous sensing innovation, dispensing the right amount of detergent at the right times during multiple wash cycles, delivering optimal results in any machine, existing or new. Henkel's Smartwash laundry concept machine, showcased at the Venetian Expo, builds on the functionality of its smart devices, demonstrating the exponential possibilities for laundry and dish care. "Our Smartwash concept leverages Henkel's chemical expertise, our understanding of our consumers, and our ability to innovate at pace with AI technology," says Frank Meyer, Corporate Senior Vice President and Head of R&D of Henkel Consumer Brands. "After years of internal development, now collaborating with industry partners is a pivotal moment. With Smartwash, together we will transform the laundry and dish care industry with elevated performance, more convenience, and a lower environmental impact." Smartwash demos with appliance and tech leaders at CES have generated an appetite for partnership. Potential partners laud Henkel's ability to couple state of the art compacted disaggregated chemistry with an advanced algorithmic approach to dosing, to achieve unparalleled performance and efficiency. Excitement generated from meetings aligns with Henkel's intent to increase speed of development and marketability, bringing more value and impact to partners and customers, faster. Research shows that consumers continue to seek better solutions to clean and care for their garments. Additionally, many consumers are unsure about which detergents to use (71%) and how much to dose (57%).1 Smartwash solves all these issues by selecting ideal washing configurations for each load, for less work and waste, and a new level of performance. Dorothee Boivin, Corporate Vice President of New Business and Homecare, expressed excitement around bringing a co-created product to market, "Laundry continues to be viewed as a household chore filled with pain points. With Smartwash and our partners, we will reinvent the user experience by setting a new standard of clean and care, while offering a more engaging and personalized solution for consumers." Building on the successes from this week, Henkel aims to continue showcasing the Smartwash Technology at additional conferences and trade shows, including the American Cleaning Institute Annual Meeting & Industry Convention in Orlando, FL. Companies interested in learning more about partnering with Henkel can request additional information by emailing henkel-ces@henkel.com. About Henkel With its brands, innovations and technologies, Henkel holds leading market positions worldwide in the industrial and consumer businesses. The business unit Adhesive Technologies is the global leader in the market for adhesives, sealants and functional coatings. With Consumer Brands, the company holds leading positions especially in laundry & home care and hair in many markets and categories around the world. The company's three strongest brands are Loctite, Persil and Schwarzkopf. In fiscal 2023, Henkel reported sales of more than 21.5 billion euros and adjusted operating profit of around 2.6 billion euros. Henkel's preferred shares are listed in the German stock index DAX. Sustainability has a long tradition at Henkel, and the company has a clear sustainability strategy with specific targets. Henkel was founded in 1876 and today employs a diverse team of about 48,000 people worldwide – united by a strong corporate culture, shared values and a common purpose: "Pioneers at heart for the good of generations." More information at www.henkel.com. 1 Source: Laundry Dairies 2023 (Global) & Insight Screener 2024 (Germany)
HONG KONG, Jan. 9, 2025 /PRNewswire/ -- Tech manufacturer JSAUX has revealed today, at the CES in Las Vegas, its new FlipGo Horizon portable dual monitor, a new entry on the family of the FlipGo portable monitors, which won the iF and Red Dot Design Awards in 2024. The new FlipGo Horizon is a highly portable device that allows users to seamlessly rotate their screens and is compatible with 13" up to 16" laptops. Journalists can visit the JSAUX Booth at the LVCC- South Hall 1, booth no. 32344 for a hands-on test of the new FlipGo Horizon. Visit us at LVCC - South Hall 1, Booth 32344 for a hands-on demo! ABOUT THE FLIPGO HORIZON The FlipGo Horizon portable monitor is a new product in the family of the Award winning FlipGo series that comes with a few advantageous features such as allowing for multiple orientations for the screens, versatile combinations with other devices such as phones and tablets, high portability with easy and compact folding/unfolding, and a flexible setup which allows for quick and easy deployment. JSAUX will showcase the FlipGo Horizon before running a Kickstarter campaign to fund it during Q1, 2025. KEY FEATURES Portability. The FlipGo Horizon folds like a laptop, taking minimum space and allowing you to transport it easily. Seamless Screen Rotation: The FlipGo Horizon allows you to switch between landscape and portrait modes, supporting flexible single and dual-screen setups. Magnetic screens. The FlipGo Horizon has evolved the magnetic snap-on design of its predecessor, allowing it to attach screens (and either phones and tablets) thanks to the magnets located at each side. Plug-and-Play. The FlipGo Horizon doesn't force you to install any drivers. You can use it as soon as you get it out of the box. Enhanced Productivity: Perfect for multitasking scenarios. Wide Compatibility: Works with Windows, Linux, and macOS, and supports laptops ranging from 13" to 16". ABOUT THE FLIPGO The iF and Red Dot Design Award JSAUX FlipGo Dual Stacked Portable Monitor has been designed for digital nomads, remote workers and creatives featuring portability (it weighs between 1.1kg and 1.9kg), convenience (only needs one USB-C cable to power up) and efficiency. There are three models of the dual-screen portable monitor: 13.5" and 16" models, more suitable for Mac computers, and the 15.6" Lite version, designed for Windows computers. The FlipGo Monitor is a new product aimed at professionals, financial analysts, content creators, graphic designers, video editors, and digital nomads. It allows customers to add a giant second screen (or two additional small screens) to their work setup, boosting their efficiency and enhancing their remote work capabilities. ASSETS All visual assets for JSAUX's products can be found at this link. CONTACT For further information requests, feel free to contact us at marketing@jsaux.com. Also, you can reach out to a brand representative and follow the new product updates on social media! Twitter Facebook Instagram ABOUT JSAUX JSAUX, a pioneer brand in innovation and quality, boasts products that are best-sellers across over 100 countries and regions worldwide, serving more than 20 million consumers. Since 2016, multiple JSAUX product lines sold on Amazon have been designated as "#1 Best Sellers", ranking first in several categories. This success has solidified JSAUX's foothold in the electronics accessories market and has further established the brand as one of the top 100 Chinese brands on Amazon. In 2022, JSAUX swiftly rose to become one of the most popular brands in gaming accessories. The brand has maintained its position as the #1 Steam Deck accessories brand on Amazon for two consecutive years, 2023 and 2024. JSAUX's strong product innovation, superior quality, robust supply chain, and consumer-centric strategy have enabled it to continuously design and produce exceptional products. This approach has resulted in a diverse lineup of accessories for other gaming handhelds, such as the ROG Ally, ROG Ally X, Legion Go, and the highly anticipated successor to the Nintendo Switch. Recently, JSAUX has expanded its product portfolio to include other innovative lines. Its FlipGo dual-stacked portable monitor, an IF and Red Dot Design Award winner, raised over $1,000,000 on Kickstarter. Additionally, the company has collaborated with Bitmo Lab to release iPhone 15 and 16 Pro cases, leveraging its gaming expertise to excel in new markets.
TURFAN, China, Jan. 9, 2025 /PRNewswire/ -- On January 9th, the 220 kV transmission project of the Turfan Fannan Boosting and Gathering Station was officially completed and commenced operation. This project is designed to meet the demand for transmitting 1 million kilowatts of wind power from Toksun County, with an expected annual addition of 1.8 billion kilowatt-hours of clean energy. The wind power project, constructed by Guangdong Energy Group Xinjiang Co., Ltd., is a key initiative in Xinjiang's new energy sector. Upon reaching full capacity and connecting to the grid, this project will significantly advance Xinjiang's low-carbon transformation and contribute to building a green ecological system. It is estimated that the project will result in the equivalent of avoiding 225,000 tonnes of standard coal consumption and reducing carbon dioxide emissions by 1.7892 million tonnes annually. To ensure the seamless delivery of clean energy, State Grid Turfan Power Supply Company invested RMB 41.04 million to construct a new 22.5-kilometer transmission line and 64 towers. During the project implementation, Turfan Power Supply Company established a task force to streamline the grid connection process, provide professional technical guidance to wind power construction enterprises, and coordinate solutions to various challenges. As a result, by the end of 2024, the new energy grid-connected installed capacity of the Turfan Power Grid reached 5.54 million kilowatt-hours, representing a year-on-year increase of 56.72%. By the end of 2025, it is anticipated that Turpan will add an additional 5.05 million kilowatt-hours of energy installation, bringing the total to over 10 million kilowatt-hours. This will further stimulate the development of the new electric power system and promote the low-carbon transformation of energy.
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