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SHENZHEN, China, Oct. 12, 2024 /PRNewswire/ -- On September 27, the Third GMIF2024 Innovation Summit (Global Memory Innovation Forum) was successfully concluded in Renaissance Shenzhen Bay Hotel. The event was hosted by the Semiconductor Investment Alliance and the Shenzhen Memory Industry Association, co-organized by the Guangdong Integrated Circuit Industry Association and the Shenzhen Semiconductor Industry Association, and organized by JW Insights Consulting (Xiamen) Co., Ltd. and Haitong Securities Co., Ltd. In recognition of outstanding achievements and innovation in the storage industry, the GMIF2024 Annual Awards winners were unveiled at the summit. Following a rigorous selection process, many companies, including Intel, Micron, CXMT, YMTC, GigaDevice, Arm, UNISOC, SIXUNITED, Victory Giant, BIWIN Storage, Solidigm, Western Digital, Rockchip, Allwinner Technology, Weibu Information, Heyan Technology, OKN Technology, Attach Point Intelligent Equipment, iWISEETEC, Tytantest, Hemei Jingyi, Silicon Motion, Maxio, QUANXING, MICROFROM, Konsemi, Silergy, Tongfang, LKAUTO, Maxwell, Skyverse, RORZE, ExTripod Electronics, EPS, InnoGrit, POWEV, KingSpec, LANYI and more, had been honored with the 2024 Annual Awards. The GMIF2024 Annual Awards feature over 38 subcategories across three main categories: Outstanding Industry Award, Outstanding Product Award, and Outstanding Brand Award. The list of winners is as follows: Outstanding SSD Product Breakthrough Award: Micron Technology Micron Technology, a leading global provider of storage and memory solutions, has been dedicated to promoting industry advancement through technological innovation. The latest addition to its data center SSD lineup, the Micron 9550 NVMe™ SSD, achieves industry-leading performance and demonstrates notable advancements in performance and energy efficiency for AI workloads. This breakthrough by Micron Technology illustrates its profound expertise and innovative abilities in storage technology and further emphasizes its leadership in AI storage solutions. Outstanding AI Storage Application Award: Solidigm Solidigm, a leader in AI storage solutions, draws on its rich experience in QLC SSD technology to deliver high-performance and high-capacity storage solutions for AI applications. Through ongoing technological innovation, Solidigm addresses the high requirements for storage density and efficiency in the AI sector, significantly improving data processing capabilities and overall performance for AI applications. Solidigm exhibits robust technical strength and market leadership in the implementation of AI storage solutions, providing vital support for the rapid growth of the AI industry. Outstanding Technology Innovation Award: Western Digital As a premier global data storage solutions provider, Western Digital remains at the cutting edge of technological innovation. Thanks to its vertical integration in NAND flash and hard disk technology, Western Digital has successfully released various high-performance and high-capacity storage products, greatly enhancing the efficiency and performance of data centers and enterprise storage. Its relentless pursuit of technological breakthroughs not only fosters the growth of the storage industry but also offers exceptional storage experiences to customers around the world. Western Digital's commitment to innovation sets a new benchmark in the industry. Outstanding Technology Leadership Award: Intel (China) Ltd. Intel (China) Ltd. exemplifies strong technological leadership through its sustained innovation in the semiconductor and computing sectors. As a frontrunner in the global technology landscape, Intel drives the evolution of computing and storage technologies with its state-of-the-art processor architectures and innovative solutions. The company's technological advancements in pioneering fields like AI and data centers offer global customers high-performance, highly reliable product experiences, further solidifying its leadership status in the industry. Intel sets new standards for development in the industry through its exceptional technological innovation. Outstanding AIoT Platform Contribution Award: Rockchip Electronics Co., Ltd. Rockchip Electronics Co., Ltd. excels in the AIoT platform sector, and leverages its innovative chip designs and robust technological capabilities to further promote the fast development of the AIoT ecosystem. The company provides efficient and stable solutions for smart devices and the Internet of Things through a comprehensive product portfolio and technological breakthroughs, which significantly enhances the overall performance of AIoT platforms. With its continuous innovation and deep commitment to the ecosystem, Rockchip has made significant contributions to the industry, and has now become a key player in the AIoT platform field. Outstanding Intelligent Terminal Application Award: Allwinner Technology Co., Ltd. Allwinner Technology Co., Ltd. provides high-performance and low-power SoC solutions by relying on its ongoing innovations in smart terminal processors, and now its products have been widely used in smart terminal devices across the globe. Dedicated to refining product performance, Allwinner has taken a big leap in enhancing the computational power and user experience of smart devices, contributing to driving both technological advancement and application expansion in the smart terminal industry. The company's outstanding achievements in this field have garnered it broad industry recognition, establishing it as one of the leaders in the smart terminal sector. Outstanding Intelligent Terminal Award: Weibu Information Inc. Weibu Information Inc. has drawn on its strong innovation capabilities and deep technical expertise to roll out a set of effective and intelligent terminal solutions. The company has enhanced the performance and user experience of smart terminal devices by optimizing its technical architecture, with applications spanning multiple industries. Through its continued innovation, Weibu Information has not only expanded the use of smart terminal devices but also invigorated the industry, earning widespread acclaim from the market and its clients. Outstanding Packaging Equipment Support Award: Shenyang Heyan Technology Co., Ltd. Shenyang Heyan Technology Co., Ltd. continues to make strides in the semiconductor packaging equipment sector, offering robust support for chip packaging technology through its innovative fully automatic grinding and polishing machines and film lamination and stripping machines. With considerable efforts put in the enhancement of equipment's precision and efficiency, Heyan now provides the market with more thinner, more precise chips, making a difference to the progress of domestic semiconductor packaging technology. Outstanding Memory Testing System Gold Award: Suzhou OKN Technology Co., Ltd. Suzhou OKN Technology Co., Ltd. has successfully introduced a series of efficient and reliable testing equipment, backed by its professional expertise and ongoing innovation in memory testing systems. Through years of technical accumulation, the company has continuously refined the accuracy and performance of its testing systems, delivering effective memory testing solutions to its clients. OKN's excellent products and services have garnered widespread trust from customers, and it's now recognized as a crucial contributor in the memory testing field. Outstanding Packaging Equipment Service Award: Dongguan Attach Point Intelligent Equipment Co., Ltd. Reinforced by its strength in innovative R&D of semiconductor packaging equipment, Dongguan Attach Point Intelligent Equipment Co., Ltd. has brought out a variety of high-precision and high-efficiency packaging solutions to the market. The company remains focused on improving equipment performance and service standards to deliver more competitive packaging support to its clients. Supported by outstanding technology and dependable service, APIE has earned significant market recognition and become a key partner in the semiconductor packaging equipment industry. Outstanding Product Award: Shenzhen Hemei Jingyi Semiconductor Technology Co., Ltd. Shenzhen Hemei Jingyi Semiconductor Technology Co., Ltd. takes the full advantage of its excellence in IC packaging substrate design and manufacturing to launch a range of high-quality products that are widely used across multiple industries. The company's commitment to ongoing technological innovation and strict quality assurance has resulted in enhanced product performance and reliability, earning significant customer recognition. Hemei Jingyi's outstanding product performance has made it a prominent supplier in the packaging substrate industry, setting a benchmark for the market. Outstanding Controller Leadership Award: Silicon Motion Technology Corp. The SM2508 from Silicon Motion is a high-performance, low-power PCIe Gen5 SSD controller solution designed specifically for AI laptops requiring high capacity, high performance, and low-power storage solutions. The company's continuous innovation in flash controller technology has driven performance enhancements in solid-state storage devices, solidifying its leadership position in the industry. Outstanding Controller Market Application Award: Maxio Technology (Hangzhou) Co., Ltd. Maxio Technology (Hangzhou) Co., Ltd. has leveraged its deep technological expertise in storage controller chips to launch a range of high-performance solutions that meet the diverse needs of the market. By continuously optimizing product performance and application scenarios, the company has effectively covered both consumer and enterprise markets, and its products has now been acknowledged widely by customers. Endorsed by its outstanding market performance and strong application capabilities, Maxio has become a significant driver in the controller chip market. Outstanding Brand Influence Award: iSoftStone Computing (Tongfang Computer) Tongfang Computer has successfully established an internationally competitive brand image through its continuous efforts in technological innovation and product quality. The company's remarkable performance in high-performance computing and storage solutions covers multiple application sectors and has earned it high acclaim from users globally. By consistently enhancing its brand influence and market performance, Tongfang Computer has become a well-known brand in the storage industry, driving sustainable development in the sector. Outstanding Market Breakthrough Award: Shenzhen Like Automation Equipment Co., Ltd. Shenzhen Like Automation Equipment Co., Ltd. has achieved significant market breakthroughs through its continuous innovation in the field of semiconductor packaging and testing intelligent equipment. The company's independently developed fully automatic IC substrate ball bonder machine demonstrates outstanding competitiveness in both technical performance and market performance, filling a gap in the domestic equipment landscape. By continuously enhancing its product technology level and market coverage, LKAUTO has earned high recognition from its customers. Outstanding Equipment Technology Breakthrough Award: Suzhou Maxwell Technologies Co., Ltd. Maxwell Technologies, a provider of complete process solutions for semiconductor wafer grinding and 2.5D/3D advanced packaging in the post-Moore era, has continually invested in R&D and adhered to independent innovation. In recent years, the company has achieved breakthroughs in high-end equipment and core components for wafer thinning, cutting, and bonding/debonding. Maxwell is dedicated to producing high-quality products and delivering exceptional service, aiming to create more value for customers and foster win-win outcomes. Outstanding Semiconductor Metrology Technology Innovation Award: Skyverse Technology Co., Ltd. Skyverse Technology Co., Ltd. has become an industry benchmark thanks to its technological innovations in the field of semiconductor testing and measurement. By continuously investing in R&D and making significant technological breakthroughs, the company has enhanced the accuracy and efficiency of measurements in semiconductor manufacturing processes, fostering technological progress across the industry. Skyverse has garnered high recognition from clients both at home and abroad and has achieved multiple independent innovations in measurement technology, positioning itself as an important force in the development of the industry. Outstanding Controller Contribution Award: InnoGrit Corporation InnoGrit Corporation has leveraged its in-depth expertise and innovation in the storage controller chip sector to successfully introduce multiple high-performance controller chips, catering to a diverse range of applications from SATA to PCIe. Through ongoing technological advancements, InnoGrit not only delivers efficient and reliable storage solutions to clients worldwide but also promotes the development and evolution of storage controller technology, demonstrating formidable technical leadership and making significant contributions to the industry. Outstanding Industry Award: Victory Giant Technology (Huizhou) Co., Ltd. Victory Giant Technology (Huizhou) Co., Ltd., one of the top 100 global printed circuit board manufacturers, has been dedicated to advancing smart manufacturing in China while actively promoting technological innovation in the PCB industry. Adhering to principles of intelligent manufacturing, green development, and innovation leadership, Victory Giant has achieved stable growth bolstered by its outstanding products, technologies, and service advantages, setting an industry benchmark in electronic circuit boards. Its high-quality products and services have earned it wide recognition in the market. Outstanding Testing Equipment Leadership Award: Tytantest Co., Ltd. Tytantest Co., Ltd. has made significant strides in the chip testing equipment sector by introducing several high-performance testing devices through its innovative R&D efforts, greatly enhancing the efficiency and accuracy of chip testing. The company focuses on optimizing product design and performance to provide clients with effective testing solutions. Tytantest is recognized widely in the market for its superior technical expertise and reliable equipment support. Outstanding Industry Service Award: ChangXin Memory Technologies Inc. (CXMT) CXMT has been awarded for its outstanding performance in DRAM technology research, development, and production. As an innovative pioneer in China's high-end memory sector, CXMT has become a backbone of the progress in China's semiconductor industry by independently developing core technologies and launching high-quality products, contributing to the high-level development of the domestic memory industry chain. Outstanding Storage Technology Breakthrough Award: Yangtze Memory Technologies Co., Ltd. (YMTC) Yangtze Memory Technologies Co., Ltd. (YMTC) has made significant strides in the 3D NAND flash technology sector since its establishment in 2016, achieving remarkable breakthroughs from the ground up. Notably, the third-generation QLC flash memory released by YMTC in 2020 garnered widespread acclaim for its industry-leading I/O speed and storage density. The company's ongoing innovation has not only elevated the technological standards of China's semiconductor industry but also spurred competition and innovation within the sector, allowing more cost-effective domestic products to secure a vital position in the global market. Outstanding Industry Contribution Award: GigaDevice Semiconductor Inc. GigaDevice, as a leading global fabless chip supplier, has played a pivotal role in the rapid development of the semiconductor industry through its outstanding product research and development capabilities and technological innovations. Its achievements in memory and microcontroller fields have not only enhanced the international competitiveness of China's chip industry but also provided global customers with high-quality, high-performance solutions. With its ongoing contributions and profound impact, GigaDevice has become a key driving force behind industry advancement. Outstanding Industry Promotion Award: Arm As a leading global provider of semiconductor intellectual property, Arm is dedicated to advancing technological development and innovation within the semiconductor industry. Through its exceptional chip architecture design and extensive ecosystem, Arm not only provides robust technical support for global technological progress but also actively promotes collaborative development and technical exchange across the industry chain. Its ongoing contributions to the construction of the global semiconductor ecosystem have ushered in considerable transformations, facilitating higher levels of technological breakthroughs and advancements within the industry. Outstanding Industry Ecosystem Award: UNISOC (Shanghai) Technologies Co., Ltd. UNISOC, a leading chip design company in China, has become a pivotal force in advancing the semiconductor industry ecosystem. With the backing of innovative chip technology and a broad product portfolio, the company actively promotes collaborative development within the industry chain, driving technological progress in various fields, including smart terminals, the Internet of Things (IoT), and 5G. Through its outstanding technological prowess and capability in ecosystem development, UNISOC has made significant contributions to the sustainable growth of the global technology industry, further enhancing the global competitiveness of China's semiconductor sector. Outstanding Industry Innovation Award: BIWIN Storage Technology Co., Ltd. BIWIN Storage Technology Co., Ltd. has successfully established an "Integrated R&D and Packaging" business model through continuous technological innovation and strong R&D capabilities. The company demonstrates exceptional competitiveness in research on storage medium characteristics, firmware algorithm development, and packaging testing technologies. BIWIN Storage actively invests in IC design, advanced packaging and testing, and test equipment development, continually driving advancements in storage technology. This commitment enables the company to provide efficient and stable storage solutions to the global market, making it a significant force in leading industry innovation and development. Outstanding Packaging Equipment Market Performance Award: Suzhou iWISEETEC Co., Ltd. Suzhou iWISEETEC Co., Ltd. has excelled in the semiconductor packaging equipment sector, leveraging its innovative R&D capabilities and efficient equipment solutions to provide reliable packaging support for customers. The company continually enhances the precision and efficiency of its devices to meet diverse packaging requirements. With stable product performance and high-quality service, iWISEETEC has garnered significant recognition from the market and its clients, establishing itself as a key partner in the packaging equipment field. AI Storage Innovation Breakthrough Award: Shenzhen Quanxing Technology Co., Ltd. Capitalizing on its strategic foresight in the AI storage solutions sector, Shenzhen Quanxing Technology Co., Ltd. has successfully developed several innovative storage products with high performance and large capacity in the AI storage solutions sector, which meet the stringent data storage requirements of AI applications. Through continuous technological breakthroughs, the company provides efficient and reliable storage support for training and inference of large AI models, facilitating the practical application of AI across industries. With its outstanding innovative capabilities, QUANXING has received widespread recognition from the industry, and emerged as a significant force for innovation in the AI storage field. Outstanding Industrial-Grade Storage Service Award: Shenzhen Micro Innovation Industry Co., Ltd. (MICROFROM) With a strong focus on industrial control storage, Shenzhen Micro Innovation Industry Co., Ltd. has developed a series of stable and reliable storage solutions that are widely applied across various industrial environments. The company has made considerable efforts to continuously enhance the performance and reliability of its products, ensuring their stable operations under stringent industrial control settings. MICROFROM's commitment to quality and service has garnered significant trust from its customers, making it a prominent service provider in the industrial control storage industry. Outstanding Product Performance Award: Hefei Kangxinwei Storage Technology Co., Ltd. (KONSEMI) With its technical expertise in storage controller chips and storage modules, Hefei Kangxinwei Storage Technology Co., Ltd. has introduced a range of high-performance products that find extensive applications in consumer and automotive markets. The company's independently developed eMMC products have earned high praise from customers for their rapid read and write speeds, low power consumption, and exceptional reliability, achieving cumulative sales of over 50 million units. Outstanding Market Performance Award: Silergy Corp. Silergy Corp. stands as a leader in the analog chip industry and focuses on independent innovation with a global strategy. It has achieved a sustained annual growth rate of over 30% for several years. Aided by its industry-leading process technologies, the company designs innovative mixed-signal and analog chips, and its products encompass a wide range of fields including DC conversion, power management, LED lighting, and battery management systems. Silergy's developed solutions empower applications across automotive, industrial, consumer electronics, cloud computing, and telecommunications. Outstanding Market Service Award: RORZE Createch Co., Ltd. RORZE Createch Co., Ltd. has demonstrated exceptional innovation and market service in the field of industrial automation equipment. Through continuous breakthroughs in precision control and intelligent manufacturing solutions, the company has significantly improved its clients' production efficiency and product quality. With robust technical support and strong market responsiveness, RORZE has earned widespread recognition from its customers. Outstanding Packaging and Testing Equipment Service Award: ExTripod Electronics Technology Limited ExTripod Electronics Technology Limited has emerged as a leader in the semiconductor packaging and testing equipment sector through continuous innovation and outstanding performance. Specializing in advanced packaging and power semiconductor fields, the company provides efficient and reliable packaging and testing equipment and solutions, offering comprehensive technical support to OSAT, IDM, and Fabless customers. ExTripod Electronics has gained strong customer trust by driving technological advancements and optimizing services, making significant contributions to the industry's development. Outstanding Packaging Substrate BT Materials Service Award: Guangdong EPS Technology Co., Ltd. Guangdong EPS Technology Co., Ltd. has achieved remarkable success in providing advanced BT substrate materials and solutions for the IC packaging and Mini & Micro LED display industries. Through continuous technological innovation and efficient services, the company has successfully satisfied the demand for high-end packaging materials, driving the localization of semiconductor packaging materials. EPS has not only reached international standards in technology but also earned strong industry recognition for its excellent customer support and market responsiveness. Outstanding Domestic Storage Brand Influence Award: Powev Electronic Technology Co., Ltd. As a leading provider of high-end domestic storage solutions, POWEV has always adhered to offering customers high-performance, stable, and reliable storage products with excellent value, helping them navigate diverse market demands. POWEV's achievements are not only reflected in its technological breakthroughs but also in elevating the influence of domestic storage brands, setting trends in the localization of the market. Outstanding Industrial-Grade Storage Solution Award: Shenzhen KingSpec Electronics Technology Co., Ltd. Shenzhen KingSpec Electronics Technology Co., Ltd. has distinguished itself in the industrial control sector with its stable and reliable storage solutions. Underpinned by deep technical expertise and continuous innovation, the company has introduced a range of high-quality storage products capable of withstanding harsh industrial environments. These innovations not only offer high performance and stability but also demonstrate exceptional reliability under extreme conditions, making them widely applicable in fields such as industrial automation and the Internet of Things (IoT), delivering significant value and earning strong market recognition. Outstanding High-Precision Testing Service Award: Dongguan Lanyi Electronic Technology Co., Ltd. Dongguan Lanyi Electronic Technology Co., Ltd. has established itself as an industry leader through its innovative advancements in high-precision test probes and test sockets. With continuous investment in research and development, Lanyi Electronic has mastered several proprietary core technologies, offering customers high-precision, highly reliable testing solutions. This dedication to quality and innovation has earned the company widespread trust and recognition from clients and the market alike. Outstanding Terminal Industry Award: Shanghai Sixunited Intelligent Technology Co., Ltd. SIXUNITED is committed to driving global innovation and technological transformation, creating an exciting digital lifestyle through information technology. The company has made significant strides in the smart terminal industry, particularly with its contributions to AI computing power products. These advancements highlight SIXUNITED's comprehensive presence and strong capabilities in the intelligent computing sector, earning widespread recognition within the industry. ABOUT GMIF GMIF (Global Memory Innovation Forum) is the most important annual event of Shenzhen Memory Industry Association (SMIA). The forum aims to build a globally-focused, professional platform for the storage industry to collectively explore new technologies, applications, collaborations, and emerging opportunities. The Third GMIF2024 Innovation Summit had been successfully concluded on September 27, 2024 at Renaissance Shenzhen Bay Hotel. Under the theme of "AI Leads Memory's New Momentum", the summit aims to foster communication and interaction among both upstream and downstream enterprises in the storage industry. By promoting collaboration and complementary growth among industry partners, the GMIF seeks to help participating companies expand their product and brand reach and contribute to a thriving, win-win ecosystem in the global storage sector. For more information about GMIF, please visit https://www.gmif.com.cn/. Media Contact:Ms. Gu, +86 15064010336, wenjing.gu@gmif.com.cn
New Solution of TMR Sensor and 0.4mm-Pitch Magnetic Scale Offers Accurate Linear Displacement Measurement with Excellent Temperature Stability and High Immunity to Stray Field Interference, Achieving Micron-Level Precision for Consumer and Industrial Applications NUREMBERG, Germany and ZHANGJIAGANG, China, June 11, 2024 /PRNewswire/ -- MultiDimension Technology Co., Ltd. (MDT), a leading manufacturer of magnetic sensors specializing in Tunneling Magnetoresistance (TMR) technology, has launched a worldwide sales initiative for the TMR4101 micron-precision magnetic scale sensor at Sensor+Test 2024. The TMR4101 magnetic scale sensor is designed for consumer electronics and industrial applications, including camera autofocus and zoom, micron-level displacement measurement, linear and angular position measurement, and magnetic encoders. It operates in conjunction with a multi-pole magnetic scale with a 0.4mm magnetic pole pitch. As the sensor moves along the magnetic scale, its two push-pull TMR half-bridge structures output sine and cosine signals with a 90° phase shift. The signal period corresponds to the 0.8mm length of a pair of adjacent north and south poles. Featuring excellent signal sensitivity and low noise thanks to MDT's unique TMR technology, the TMR4101's differential gradiometric sensor design provides high immunity to stray field interference. The TMR4101 supports temperature-compensated precision measurement capabilities that effectively negate temperature impacts on measurement accuracy by calculating the position through both sine and cosine signals with identical temperature characteristics. MDT also offers high-precision 0.4mm pole-pitch magnetic scales to complement the TMR4101, with the length and width of the magnetic scale customizable according to application requirements. In typical applications, the combination of the TMR4101 and magnetic scale can achieve a repeatability precision within +/-1 micron. Key Features of TMR4101: Consistent micron-precision in unrestricted linear displacement ranges Stable signal output with large tolerance to mechanical alignment and air gap High immunity to stray field interference Support for temperature-compensated precision measurement solutions Ultra-thin DFN4L package (1.32×0.66×0.3mm) suitable for space-constrained applications such as smartphone camera modules RoHS/REACH compliance The TMR4101 sensor and corresponding magnetic scales are available for order from Digi-key and MDT's online store at www.tmr-sensors.com. For volume pricing, delivery, and technical inquiries, please contact MDT at sales@dowayusa.com or visit their booth 1-239 at Sensor+Test 2024 in Nuremberg, Germany, from June 11-13. About MDTMultiDimension Technology was founded in 2010 in Zhangjiagang, Jiangsu Province, China, with branch offices in Beijing, Shanghai, Chengdu, and Ningbo in China, Tokyo, Japan, and San Jose, Calif., USA. MDT has developed a unique intellectual property portfolio, and state-of-the-art manufacturing capabilities that can support volume production of high-performance, low-cost TMR magnetic sensors to satisfy the most demanding application needs. Led by its core management team of elite experts and veterans in magnetic sensor technology and engineering services, MDT is committed to creating added value for its customers and ensuring their success. For more information about MDT please visit http://www.multidimensiontech.com. Media ContactsJinfeng Liu, jinfeng.liu@dowayusa.com,Tel: +1-650-275-2318 (US), +86-189-3612-1156 (China)Jilie Wei, kevin.wei@dowaytech.com,Tel: +86-189-3612-1160 (China)
- Unveiled by Shri Ashwini Vaishnaw, Union Minister for Communications, Electronics & Information Technology & Railways, at IMC 2023 NEW DELHI, LONDON and COLUMBIA, S.C., Oct. 28, 2023 /PRNewswire/ -- In a proud achievement for India's R&D capability, STL [NSE: STLTECH], a leading optical and digital solutions company, today announced that it has developed the world's slimmest fibre for telecommunications - 160-micron Optical Fibre. Commending the technology innovations which are Designed in India and Made in India, Mr Ashwini Vaishnaw, Union Minister for Communications, Electronics & Information Technology & Railways, unveiled this world-leading product at STL's booth in IMC 2023. Post unveiling the 160-micron Fibre, the H'onable minister 'spliced' or 'joined' two strands of optical fibre - a highly calibrated process of perfectly connecting the cores of two hair-thin optical fibres. Shri Ashwini Vaishnav at STL's booth at IMC 2023 Cable made with STL's 160-micron fibre can pack 3X more capacity than traditional 250-micron fibre. This has been conceptualised and developed indigenously at STL's Centre of Excellence in Maharashtra, making STL among the first companies globally to develop and patent this industry-leading technology. As India becomes the fastest-growing digital economy in the world, there's a need for densely fiberised networks, both in backhaul and closer to customers. Laying ducts account for ~60% of the entire fibre deployment cost, making duct space a precious asset. Network builders all over the globe are in a continued quest to reduce fibre size to pack in more and more capacity in the available duct space. By packing more capacity in limited duct space with a reduced diameter cable of 6.4mm (~32% reduction compared to 250-micron fibre), STL's 160-micron fibre will revolutionise deployment, bandwidth capacity and green quotient of the networks. The at-scale impact of this innovation on India's broadband landscape can be immense. For example - In a large-scale project like Bharatnet, where India needs to deploy ~20 Million fibre km cable by 2025, using 160-micron fibre instead of the standard 250-micron fibre can potentially reduce the deployment time by ~15%. This enables the use of ducts with a smaller diameter, thereby reducing the plastic footprint in the ground by ~30%. "This slimmest fibre is a noteworthy development and depicts our commitment to innovation and continuous R&D efforts in photonics and materials science," said Dr Badri Gomatam, Group CTO, STL. Incremental reduction in fibre size is an incredibly challenging feat which has captured the imagination of optical experts across the world. Some of the key challenges in reducing fibre size below 250-micron include enhanced sensitivity towards micro-bending and increased complexity in the fibre drawing process. Talking about solving these challenges, Dr Badri added, "Through highly calibrated process and material engineering, we have achieved a breakthrough in manufacturing processes and glass compositions to realise micro bend insensitivity. " This product meets telecom-grade optical performance standards and complies with the ITU G.657A2 standard. This announcement comes after a series of innovations by our R&D experts, including India's first multicore fibre with 4X capacity and 180-micron fibre. "This groundbreaking innovation exemplifies our passion to put Indian technology and R&D on the world map. I am extremely excited to imagine the future of India's digital networks with this disruptive fibre design," said Ankit Agarwal, Managing Director, STL. About STL - Sterlite Technologies Ltd: STL is a leading global optical and digital solutions company providing advanced offerings to build 5G, Rural, FTTx, Enterprise and Data Centre networks. Read more, Contact us, stl.tech | Twitter | LinkedIn| YouTube Shri Ashwini Vaishnav unveils 160 micron - the slimmest fibre at IMC 2023
SHENZHEN, China, March 31, 2025 /PRNewswire/ -- Against the industrial backdrop of surging demand for 5G-A and AI servers, high-end PCB manufacturer JarnisTech announced the official put into production of its Chongqing smart factory. The factory redefines the standard for intelligent manufacturing of high-precision electronic components through an advanced AOI in-line scanning system that increases board quality inspection efficiency to six times that of traditional manual inspection. JarnisTech's Smart Factory The smart automated factory is equipped with 25-micron resolution 2D camera systems capable of analyzing 1,800 boards hourly per unit – each requiring only one operator. The proprietary AOI technology examines 2,000+ detection points per board within 0.2 seconds, enabling 99.98% yield rates for complex 72-layer backplanes and slashing average delivery cycles to 72 hours. "Where traditional PCB plants struggle with labor-intensive quality checks, our closed-loop automation ensures military-grade precision at commercial production speeds," said Xu, Production Director at JarnisTech. The facility's 18 international certifications including IPC Class 3 and IATF16949 have secured its position in multiple Fortune 500 tech vendors' approved supplier lists. The factory's dedicated R&D center is accelerating innovation in specialty circuit boards, including cutting-edge products like 100Gbps transmission backplanes and aerospace-grade circuits capable of withstanding 300°C extremes. Its fully-equipped laboratory features advanced testing instruments including ROHS analyzers, enabling 90% of inspection items to be completed within four hours - providing rapid verification support for emerging applications such as medical stretchable flexible circuits. With 68% fewer personnel than conventional PCB factories, the 300-employee plant delivers $214 million annual output while maintaining 48-hour rush order capabilities. "This isn't just scaling production, but reengineering value chains," emphasized JarnisTech's CTO. "We transform PCB procurement from cost centers into technical differentiators – clients report 12-15% margin improvements through our engineered solutions." About JarnisTechJarnisTech is a leading high-end specialty PCB manufacturer in China, specializing in high multilayer PCBs, high frequency/high speed PCBs such as Rogers RO4835™, Isola I-Tera® MT40, Taconic RF-35A2™, and others. With precision capabilities such as 22-layer HDI and ±5% impedance control, the company provides complete PCB solutions for high-end electronics industries such as automotive radar, 5G base station AAU, aerospace and medical electronics. Contact for the pressCyndi XiongMarketing managerJarnisTechPhone: +86 135 3094 7255Email: sales@jarnistech.com Learn more at www.jarnistech.com
YANTAI, China, March 19, 2025 /PRNewswire/ -- Raythink Technology Co., Ltd. ("Raythink"), an innovator in the thermal imaging industry, is making a high-profile appearance at Secon 2025 in Korea. Raythink is showcasing its latest 1920×1080 Infrared Module and flagship thermal imaging solutions at hall 3 booth B030 at KINTEX. Turing F1920: Redefining Thermal PrecisionRaythink's Turing F1920 is boasting a resolution of 1920×1080, which redefines the boundaries of thermal imaging technology with unprecedented clarity. The Turing F1920 features an advanced 8-micron infrared detector, delivering a qualitative leap in infrared imaging. Even the slightest temperature differences are captured with remarkable precision, presenting a richly detailed and layered thermal "view". Visitors have expressed astonishment at the clarity and quality of images produced by this innovative module. Intelligent Inspection RobotCentral to Raythink's showcase is its PC2 Dual-Spectrum Thermal Camera, it can integrate with autonomous patrol robots for 24/7 infrastructure monitoring. Deployed in South Korean projects, these robots navigate complex environments like Markets and warehouses, using thermal imaging to detect temperature irregularities in real time. Equipped with Raythink's thermal module, the system ensures visibility in total darkness and adverse weather conditions, instantly alerting operators to potential hazards. "Our fire patrol robots represent the future of urban safety," said a Seoul city official. "They provide a proactive shield against disasters, safeguarding both infrastructure and citizens." Diverse Solutions for Varied ScenariosRaythink's solutions also address fire risks in public spaces, such as tourist sites, by monitoring smoking activities and unauthorized intruders. Its non-contact, visual temperature analysis enables rapid response, preventing incidents before they escalate. As thermal imaging evolves, Raythink remains committed to advancing safety technologies worldwide. Visit Booth B030 at SECON 2025 to experience how Raythink's innovations are reshaping fire prevention and industrial safety.
SYDNEY, March 19, 2025 /PRNewswire/ -- LONGi, a world-renowned solar panel manufacturer is proud to announce the installation of Hi-MO X6 Anti-Glare solar modules in an airport in China. This product delivers optimal power generation while ensuring the safety and comfort of communities in proximity to solar projects. Conventional solar modules, with metallic silver busbars and blue cell surfaces, can generate intense reflection at specific angles and unintentionally cause annoying and even dangerous glare. This mirrored effect not only poses an annoyance but also threatens the visual safety of pilots, train engineers, drivers, and residents living near solar installations. Australia's unique landscape, with ample commercial and industrial rooftops, provides a fertile ground for adopting solar energy; yet, the challenge of glare is amplified in zones where industrial activities are directly adjacent to residential areas, including warehouses, production facilities, and small ground power stations near urban areas. Against this backdrop, LONGi Hi-MO X6 Anti-Glare module, with the matte black cell and sub-micron small textured surface, inherent anti-glare properties eliminating the need for front-facing metallic busbars, features Nano-scale anti-reflective coating and specially treated glass to minimize light reflection. It has passed rigorous testing by Singapore's SAC-certified OTM lab, with a total solar reflectivity of just 0.9%, effectively preventing dazzling diffused or mirror reflections. This technology will be seamlessly integrated into Hi-MO X10. China's National Center of Supervision and Inspection on Solar Photovoltaic Product Quality (CPVT) has thoroughly tested the anti-glare performance of LONGi's Hi-MO X6 and conventional TOPCon modules. The tests revealed that the reflectivity of LONGi's BC technology-based Hi-MO X6 dual-glass modules was up to 74.5% lower than conventional TOPCon dual-glass modules, and the maximum brightness in the busbar area was reduced by 99.28%. This innovation arrives at a time when Australian residents are voicing concerns over the effects of reflected sunlight, and commercial and industrial property owners are weighing the benefits of solar power installations. LONGi's Hi-MO X6 modules not only satisfy but excel in meeting these needs, offering an anti-glare solution that ensures both the performance of solar power and the preservation of local living conditions. Hi-MO X6 Anti-Glare solar modules in an airport in China About LONGi Founded in 2000, LONGi is committed to being the world's leading solar technology company, focusing on customer-driven value creation for full scenario energy transformation. Under its mission of 'making the best of solar energy to build a green world', LONGi has dedicated itself to technology innovation and established five business sectors, covering mono silicon wafers cells and modules, commercial & industrial distributed solar solutions, green energy solutions and hydrogen equipment. The company has honed its capabilities to provide green energy and has more recently, also embraced green hydrogen products and solutions to support global zero carbon development. www.longi.com
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