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- SK hynix to showcase technological capabilities, participating in the world's largest consumer electronics show, CES 2025, from January 7-10 - Featuring a wide range of products driving the AI era, from HBM, the core of AI infrastructure, to next-gen memories like PIM - Company to present new possibilities in the AI era through technological innovation and provide irreplaceable value SEOUL, South Korea, Jan. 3, 2025 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it will showcase its innovative AI memory technologies at CES 2025, to be held in Las Vegas from January 7 to 10 (local time). SK hynix Exhibition Hall A large number of C-level executives, including CEO Kwak No-jung, CMO (Chief Marketing Officer) Justin Kim and Chief Development Officer (CDO) Ahn Hyun, will attend the event. "We will broadly introduce solutions optimized for on-device AI and next-generation AI memories, as well as representative AI memory products such as HBM and eSSD at this CES," said Justin Kim. "Through this, we will publicize our technological competitiveness to prepare for the future as a 'Full Stack AI Memory Provider1'." 1Full Stack AI Memory Provider: Refers to an all-round AI memory provider, which provides comprehensive AI-related memory products and technologies SK hynix will also run a joint exhibition booth with SK Telecom, SKC and SK Enmove, under the theme "Innovative AI, Sustainable Tomorrow." The booth will showcase how SK Group's AI infrastructure and services are transforming the world, represented in waves of light. SK hynix, which is the world's first to produce 12-layer HBM products for 5th generation and supply them to customers, will showcase samples of HBM3E 16-layer products, which were officially developed in November last year. This product uses the advanced MR-MUF process to achieve the industry's highest 16-layer configuration while controlling chip warpage and maximizing heat dissipation performance. In addition, the company will display high-capacity, high-performance enterprise SSD products, including the 'D5-P5336' 122TB model developed by its subsidiary Solidigm in November last year. This product, with the largest existing capacity, high power and space efficiency, has been attracting considerable interest from AI data center customers. "As SK hynix succeeded in developing QLC2 (Quadruple Level Cell)-based 61TB products in December, we expect to maximize synergy based on a balanced portfolio between the two companies in the high-capacity eSSD market" said Ahn Hyun, CDO at SK hynix. The company will also showcase on-device AI products such as 'LPCAMM23' and 'ZUFS 4.04,' which improve data processing speed and power efficiency to implement AI in edge devices like PCs and smartphones. The company will also present CXL and PIM (Processing in Memory) technologies, along with modularized versions, CMM(CXL Memory Module)-Ax and AiMX5, designed to be core infrastructures for next-generation data centers. 2QLC: NAND flash is divided into SLC (Single Level Cell), MLC (Multi Level Cell), TLC (Triple Level Cell), QLC (Quadruple Level Cell), and PLC (Penta Level Cell) depending on how much information is stored in one cell. As the amount of information stored increases, more data can be stored in the same area. 3Low Power Compression Attached Memory Module 2 (LPCAMM2): LPDDR5X-based module solution that provides power efficiency and high performance as well as space savings. It has the performance effect of replacing two existing DDR5 SODIMMs with one LPCAMM2. 4Zoned Universal Flash Storage (ZUFS): A NAND Flash product that improves efficiency of data management. The product optimizes data transfer between an operating system and storage devices by storing data with similar characteristics in the same zone of the UFS, a flash memory product for various electronic devices such as digital camera and mobile phone. 5Accelerator-in-Memory based Accelerator (AiMX): SK hynix's accelerator card product that specializes in large language models using GDDR6-AiM chips In particular, CMM-Ax is an groundbreaking product that adds computational functionality to CXL's advantage of expanding high-capacity memory, contributing to improving performance and energy efficiency of the next-generation server platforms6. 6Platform: Refers to a computing system that integrates both hardware and software technologies. It includes all key components necessary for computing, such as the CPU and memory. "The changes in the world triggered by AI are expected to accelerate further this year, and SK hynix will produce 6th generation HBM (HBM4) in the second half of this year to lead the customized HBM market to meet the diverse needs of customers," said Kwak Noh-Jung, CEO at SK hynix. "We will continue to do our best to present new possibilities in the AI era through technological innovation and provide irreplaceable value to our customers." About SK hynix Inc. SK hynix Inc., headquartered in Korea, is the world's top-tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM"), flash memory chips ("NAND flash"), and CMOS Image Sensors ("CIS") for a wide range of distinguished customers globally. The Company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.
SAN JOSE, Calif., Jan. 3, 2025 /PRNewswire/ -- Lexar, a leading global brand of flash memory solutions, is excited to announce their upcoming lineup to be shared at CES 2025 in Las Vegas. One spotlight of the show will be their Professional Workflow series which includes a 6-bay docking station, a portable 2-bay docking station, and a variety of portable SSD and reader modules that work seamlessly with the docks to extend storage capacity, transfer files faster, and provide flexibility for superior organization and backup reliability so that professional creatives can get back to being creative rather than worrying about their hardware. Lexar to Showcase an Extensive Lineup of Products for Photographers, Filmmakers, and Gamers at CES 2025 In addition to the Professional Workflow series, Lexar will show the ARMOR GOLD SD Card. With a stainless-steel construction that is 37x stronger than typical SD cards, it is designed to withstand grueling usage out in the wild while offering up to 210MB/s[1] write speed and Video Speed Class 60 (V60) to seamlessly capture 6K footage. Lexar will also show the Professional DIAMOND CFexpress™ 4.0 Type B Card, which was recognized as a CES Innovation Awards 2025 Honoree, and the Professional GOLD CFexpress™ 4.0 Type B Card. Both cards offer blazing-fast performance suitable for capturing 8K RAW footage with stunning results and they are built rugged to endure temperatures, vibration, dust, shocks, and more in the studio or out in the field. Rounding out its featured offerings for the photography crowd are two pexar digital picture frames, powered by Lexar technology. Both the 15" and the 11" allow users to upload and display their favorite photos and videos and they boast anti-glare touch screens for optimal viewing and easy setup. Plus, they come with 32GB of built-in Lexar storage to hold up to 40,000 photos, and users can expand storage by using a USB flash drive or an SD card. In addition, the 11" picture frame offers a stunning 2K resolution display. For the gaming side, Lexar introduces its PLAY PRO microSD Express Card which promises to be a gamechanger for handheld gaming. Equipped with PCIe technology, the card delivers read speeds up to 900MB/s for rocketing game loads and up to 600MB/s write speeds[1] for accelerated downloads. Lexar will show ARES DDR5 CUDIMM memory which represents the next generation of desktop memory. It boasts speeds up to 9600MT/s[1] and features a Clock Driver IC (CKD) to avoid electronic noise and jitter that can result in errors, lost data, or system freezes. Designed for AI PCs and high-performance systems, it promises faster downloads and improved refresh rates. There will be another SSD product – Lexar Professional NM1090 PRO. Clocking in at blistering 14000MB/s read and 13000MB/s write speeds,[1] this next-generation performance with DRAM cache enables gamers to load games 80% faster than the previous generation. It will be available in capacities from 1TB-4TB. CES attendees can check out more Lexar products at the Las Vegas Convention Center, Central Hall Booth #21842 from January 7-10. Lexar will also be exhibiting at CES Unveiled on January 5 at the Mandalay Bay Convention Center where attendees will get to preview Lexar's featured products, including their CES Innovation Awards honorees – the Professional DIAMOND CFexpress™ 4.0 Type B Card and the SL500 Portable SSD with Magnetic Set. Media KitImages About LexarFor more than 28 years, Lexar has been trusted as a leading global brand of memory solutions. Our award-winning lineup includes memory cards, USB Flash Drives, card readers, solid-state drives, and DRAM. Disclosures[1] Speeds based on internal testing. Actual performance may vary.
Integrated with eYs3D's Proprietary XINK-ll Edge Spatial Computing Platform and the Sense and React™ Human-Machine Interaction Development Interface, These Innovations Provide Robust Support for Human-Machine Interfaces in Next-Generation AI Applications. LAS VEGAS and TAIPEI, Jan. 2, 2025 /PRNewswire/ -- With the rapid rise of AI image sensing and edge computing technologies, the market for robots and intelligent unmanned vehicles is experiencing explosive growth. Etron Technology (TPEx: 5351.TW) subsidiary eYs3D Microelectronics has launched the new eSP936 multi-sensor image controller IC. The eSP936 supports the synchronous processing of data from up to seven visual sensors, providing high image recognition accuracy. Paired with the Sense and React™ human-machine interaction developer interface, it enables intelligent control through human-machine interaction, becoming a key driver for the implementation of smart applications. The eSP936 can be integrated with multi-modal visual language models (VLM), combining multiple visual sensors with real-time AI edge computing capabilities. It is suitable for smart application scenarios such as unmanned vehicles like automated guided vehicles, autonomous mobile robots, and drones. The eSP936 can process multiple 2D images at high speeds and generate 3D depth maps, enhancing precise environmental recognition. Embedded AI chips further enable dynamic navigation in complex environments. Additionally, industrial and service robots can achieve more precise intelligent perception in complex scenarios, combining real-time computing and automated operations for high-efficiency performance. In immersive human-machine interaction systems, the eSP936 can be integrated with AI SoC platforms to enhance the Sense and React interaction experience, widely applicable in Drones, USV (Unmanned Surface Vehicle), video conferencing, augmented education, and extended reality (XR) fields. Key technology highlights of the eSP936: support for synchronized processing of data from up to seven visual sensors, built-in DRAM chip, and wide-angle image de-warping technology, enabling high-precision environmental perception and multi-view 3D depth map generation. It also features high-performance data compression capabilities to reduce latency, providing developers with a flexible and efficient platform. The MIPI+USB simultaneous processing technology ensures high-quality 2D image and 3D depth map output, improving image recognition accuracy. We hope to create more opportunities for applications where customers can leverage the single-chip eSP936 IC to maximize the potential of AI Agency! Source:eYs3D Microelectronics Unveils XINK-II, eSP936, YX9670, YX9170 Latest YX9170 Spatial Awareness Solution for Autonomous Vehicles Debuting at CES 2025, eYs3D Microelectronics proudly unveils its cutting-edge spatial awareness solution, YX9170. Powered by the eYs3D multi-sensor image control chip eSP936 and the XINK-ll edge spatial computing platform, this solution leverages advanced multi-sensor fusion and AI-driven technologies to deliver breakthroughs in spatial perception and recognition. It provides robust support for the development of intelligent systems such as industrial and service robots and autonomous vehicles, emerging as a critical driver for smart system innovation. The core strength of the YX9170 solution lies in its comprehensive sensor fusion capabilities. It integrates dual-depth sensors, supporting high-definition images up to 1280x720 resolution, and synchronizes four RGB cameras for enhanced perception range and recognition accuracy. With support for multiple stereo lens baseline integrations, it overcomes the limitations of traditional stereo vision measurement techniques. This innovation surpasses previous challenges in multi-camera image processing and computational architecture integration, forming a holistic AI-based spatial awareness system. A highlight of the YX9170 solution is its intelligent sensing features. The embedded AI algorithms enable real-time multi-object recognition from synchronized images, achieving a 30% reduction in system computational load and latency. Through YX9170 and XINK-ll's highly flexible and adaptable software solutions, customers can swiftly design tailored spatial awareness solutions with integrated multi-sensor fusion, showcasing eYs3D Microelectronics' unparalleled technical prowess. Latest YX9670 Navigation Solution for Autonomous Vehicles eYs3D introduces its groundbreaking YX9670 navigation solution for autonomous vehicles. Equipped with the eYs3D multi-sensor image control chip eSP936 and the XINK-ll edge spatial computing platform, this innovative solution revolutionizes environmental awareness and navigation capabilities through advanced multi-sensor fusion and AI-driven technology. The core advantage of the YX9670 solution lies in its comprehensive sensor fusion capabilities. It integrates a dual-depth sensor system supporting high-definition images up to 1280x720 resolution and synchronizes four RGB cameras to deliver a 278-degree panoramic field of view. Additionally, a monochrome camera provides a 145-degree overhead view, with an embedded high-efficiency AHRS (Attitude and Heading Reference System) for vessel coordination and posture recognition. The system also incorporates a thermal imaging sensor, creating a highly advanced perception system. The YX9670 solution's embedded AI algorithms enable real-time panoramic object recognition, navigation direction analysis, and multi-target tracking. Even in complex or harsh environments, the system maintains high detection and recognition efficiency, showcasing its exceptional technical capabilities. Already successfully deployed in autonomous vessel navigation, the YX9670 solution provides safe and efficient navigation support for logistics vessels, environmental monitoring ships, and specialized unmanned marine applications. With its cutting-edge sensing technology and AI computational power, the solution not only meets current needs but also paves the way for a new era of intelligent navigation and human-machine interaction interfaces. XINK-ll Edge Spatial Computing Platform and Sense and React™ Human-Machine Interaction Developer Toolkit eYs3D Microelectronics will debut its XINK-ll Edge Spatial Computing Platform at CES 2025. This innovative "Platform as a Service (PaaS)" development solution is equipped with the eYs3D AI chip eCV5546, featuring ARM Cortex-A and Cortex-M CPU cores, along with an NPU (Neural Processing Unit). The platform supports the integration of AHRS, thermal imaging, and millimeter-wave radar sensors while incorporating AI convolutional neural network (CNN) technology to significantly enhance object recognition and detection capabilities for edge AI devices. Notably, ARM IoT Capital has provided not only funding but also exceptional performance enhancements for the XINK-ll platform. ARM CPUs with Neon instruction set support SIMD processing capabilities, accelerating vector and matrix operations for better computer vision and signal processing performance. Additionally, the low-power ARM Cortex-M4 processor serves as an MCU for system control, motor operation, and timeline synchronization. With a next-generation AI accelerator, the platform delivers superior performance compared to its peers, offering programmable development capabilities that supports various AI models. In the rapidly evolving AI landscape, XINK-ll is well-positioned to meet future computational demands. XINK-ll supports a wide range of AI development and acceleration frameworks, including ONNX, TensorFlow, TensorFlow Lite, PyTorch…etc., providing complete development kits and services to help developers more efficiently develop NPU (Neural Processing Unit) applications. eYs3D Microelectronics also introduces the Sense and React™ Human-Machine Interaction Developer Interface, which integrates LLM (Large Language Models) and CNN sensing technology. This advanced technology leverages environmental sensing and uses LLM to trigger action commands and language prompts. It enables machines to issue commands or interact naturally with users through conversational language, marking a new era in human-machine interface technology. Sense and React™ offers environmental awareness and cognition, action triggering with language prompts, and adaptability with flexibility. Through CNN sensing technology, the system efficiently perceives the surrounding environment, capturing subtle changes and dynamics for more accurate judgments and decisions. By employing LLM technology, the system generates action commands and language prompts based on sensor data, enhancing user convenience and delivering a more intelligent experience. CES is a globally influential technology event, and Etron Technology Group focuses on the theme of "Innovation in Action, AI Implementation, and Connecting MemorAiLink to Shape the Future." Etron Technology Group demonstrates its commitment to developing innovative products with IC solutions that embody "Pervasive Intelligence" and "Heterogeneous Integration." These products empower electronic devices with AI capabilities such as cognition, vision, neural networks, and privacy, enriching AI applications while advancing the vision of future living. Etron Technology Group's booth (Booth Number: 15741, Central Hall, LVCC) is open for visits and collaboration, aiming for a win-win partnership!www.etron.com About eYs3D Microelectronics eYs3D Microelectronics Corp.is a pioneer in 3D sensing technologies, and aims to develop semiconductor oriented technologies and products related to 3D vision-simulating computer vision technologies integrated with computer intelligence. With its strong foundation and experience in memory design and computer vision, as well as close co-operation with its parent company, Etron Technology, Inc., and ARM Holdings Plc., eYs3D strives to develop new technologies to take advantage of computer vision chips and subsystems. It targets blue-ocean markets such as smart products, intelligence of things (IoT), and industrial and consumer level automation, to become a leading brand in the market of computer vision processing. For more information, visit www.eys3d.com About Etron Technology, Inc. Etron Technology, Inc. (TPEx: 5351.TW) is a world-class fabless and heterogeneous integration IC design company that specializes in application-driven buffer memory, known-good die memory (KGDM), long-retention time DRAM (RPC DRAM), and other artificial intelligence and machine learning induced DRAM products. Etron also develops system-in-packages, including high-speed transfer interface chips of USB Type-C, and 3D depth sensing computer vision and panoramic image capturing chips. www.etron.com For further information, please contact: Corporate Spokesperson:Ms. Justine TsaiCorporate Deputy Spokesperson:Mr. Eason ChengTel: +886-3-578-2345 #8670Email: pr@etron.com.tw
WILMINGTON, Del., Jan. 2, 2025 /PRNewswire/ -- Pimax, a manufacturer of leading VR hardware, released in an online keynote presentation the design and specs of an upcoming headset, the Pimax Dream Air. The small and light headset packs 27 million pixels, head, hand and eye-tracking, integrated spatial audio, a Display Port connection, and a self-adjusting backstrap. Pimax Dream Air & Specs The Dream Air is a PCVR headset, and borrows a lot of components from the previously announced Crystal Super, including the micro-OLED panels and pancake lenses — but packs this into a small form factor headset, to satisfy different use cases. It breaks with previous Pimax headsets, with a new design language, signalling the small form factor era for Pimax. Key Features: Integrated Eye-Tracking & Auto-IPD: Ensures optimal clarity and interaction. Inside-Out Tracking: Powered by Pimax's proprietary SLAM algorithm for seamless setup without base stations. Ringless Controllers & Hand Tracking: Enhances usability for gaming and other VR applications. Spatial Audio & Lightweight Design: Provides premium sound and a form factor that weighs less than half a Coca-Cola bottle. Type-C DisplayPort Cable: Ensures uncompressed visuals with ultra-light cabling. Future-Ready: Compatible with modular accessories like prescription lenses and a planned Lighthouse faceplate for users preferring external tracking systems. Innovating Across Use CasesPimax acknowledges the diverse needs of VR users. While the Crystal Super excels as the ultimate PCVR headset for seated simulation experiences like flight and racing, the Dream Air is tailored for active VR users. Its portability and lightweight design cater to applications such as VRChat, room-scale VR, and entertainment on the go. Expanding VR Beyond the PCPimax is also developing Cobb, a standalone device powered by a Snapdragon XR2 chip and battery. Cobb enables the Dream Air to operate independently for streaming movies, running light applications, or gaming, offering even greater versatility. Pricing & AvailabilityThe price of Pimax Dream Air starts from $1,895, which includes a pair of ringless controllers. A special pre-order price of $1,199 is available, with two payment options for the balance: One-Time Payment of $696 USD (12% discount). Or, 24 Monthly Payments of $32.99 USD through Prime membership. Shipping is expected to begin in May 2025. Image & FootageHigh-res:https://drive.google.com/drive/folders/1laQ4gftTmU_jkRvyazb-5UlpQumtC63X?usp=sharing
SHENZHEN, China, Jan. 2, 2025 /PRNewswire/ -- MicroAlgo Inc. (the "Company" or "MicroAlgo") (NASDAQ: MLGO), today announced the development of an innovative hybrid algorithm that combines the advantages of classical and quantum computing to optimize Multi-Query Optimization (MQO) problems. Quantum computing is a technology that uses the principles of quantum mechanics to process information. Compared to traditional classical computers, quantum computers exhibit the potential to outperform classical computers in handling certain types of problems, such as search, optimization, and simulating quantum systems. However, the realization of quantum computers faces technical challenges, particularly in constructing quantum computers with a sufficient number of qubits and low error rates. The Multi-Query Optimization (MQO) problem is a class of data-intensive problems that are NP-hard, and it has applications in many fields such as database query optimization, machine learning algorithms, and network routing. The core of the MQO problem lies in how to effectively handle multiple query requests to minimize the overall computational cost or time. Although quantum computers theoretically have tremendous potential, current quantum computers are far from being fully practical. The limited number of qubits and high error rates restrict their ability to solve large-scale problems. To address these issues, MicroAlgo has proposed a hybrid algorithm that combines the stability of classical computers with the efficiency of quantum computers. MicroAlgo's hybrid algorithm design is based on the following key points: Efficient Use of Qubits: Through carefully designed quantum circuits, the algorithm ensures efficient utilization of qubits, achieving a qubit efficiency close to 99%. Reduction of Error Rates: By integrating error correction mechanisms from classical algorithms, the error rate during the quantum computation process is significantly reduced. Scalability of the Algorithm: The algorithm design by MicroAlgo takes scalability into account, enabling it to adapt to problems of varying sizes. Compatibility with Existing Technologies: MicroAlgo's algorithm is compatible with existing gate-based quantum computers, meaning it can run on current hardware. MicroAlgo's hybrid algorithm first transforms the MQO problem into a form that can be handled by quantum computing. Quantum circuits are designed to perform the necessary quantum operations, including quantum state preparation, application of quantum gates, and quantum measurement. Then, during the quantum computation process, classical computers are used to assist the quantum computation, such as in qubit error correction and post-processing of the results. Through experiments and simulations, the algorithm's performance is continuously optimized to ensure optimal performance with limited qubit resources. MicroAlgo has conducted detailed experimental evaluations of the algorithm, including testing its performance on problems of various scales. The experimental results show that, despite the current limitations in qubit numbers, our algorithm is still able to handle smaller-scale problems and demonstrate a qubit efficiency close to 99%. Compared to quantum computers based on quantum annealing, MicroAlgo's algorithm shows a significant improvement in efficiency. In exploring the vast field of quantum computing, MicroAlgo's hybrid algorithm represents an innovative solution that combines the stability of classical computing with the efficiency of quantum computing to address the challenges of Multi-Query Optimization (MQO). Through carefully designed quantum circuits and algorithmic optimizations, the algorithm not only improves qubit utilization efficiency but also significantly reduces error rates, enabling it to run on existing quantum hardware while maintaining scalability for large-scale problems. This achievement marks a significant step forward in the practical realization of quantum computing. With the ongoing advancements in quantum technology, there is every reason to believe that MicroAlgo's hybrid algorithm will play an even more important role in the future. As quantum computer hardware improves and the number of qubits increases, the algorithm will be able to tackle larger-scale problems, unlocking greater potential in fields such as chemistry, physics, and machine learning. MicroAlgo's hybrid algorithm is not only a major breakthrough in existing technology but also a powerful outlook on the future applications of quantum computing. We firmly believe that, through continuous research and innovation, quantum computing will gradually transition from theory to practice, becoming a powerful driver of technological progress and societal development. We look forward to a future where quantum computing will bring even more surprises and possibilities, opening a new era of computing. About MicroAlgo Inc. MicroAlgo Inc. (the "MicroAlgo"), a Cayman Islands exempted company, is dedicated to the development and application of bespoke central processing algorithms. MicroAlgo provides comprehensive solutions to customers by integrating central processing algorithms with software or hardware, or both, thereby helping them to increase the number of customers, improve end-user satisfaction, achieve direct cost savings, reduce power consumption, and achieve technical goals. The range of MicroAlgo's services includes algorithm optimization, accelerating computing power without the need for hardware upgrades, lightweight data processing, and data intelligence services. MicroAlgo's ability to efficiently deliver software and hardware optimization to customers through bespoke central processing algorithms serves as a driving force for MicroAlgo's long-term development. Forward-Looking Statements This press release contains statements that may constitute "forward-looking statements." Forward-looking statements are subject to numerous conditions, many of which are beyond the control of MicroAlgo, including those set forth in the Risk Factors section of MicroAlgo's periodic reports on Forms 10-K and 8-K filed with the SEC. Copies are available on the SEC's website, www.sec.gov. Words such as "expect," "estimate," "project," "budget," "forecast," "anticipate," "intend," "plan," "may," "will," "could," "should," "believes," "predicts," "potential," "continue," and similar expressions are intended to identify such forward-looking statements. These forward-looking statements include, without limitation, MicroAlgo's expectations with respect to future performance and anticipated financial impacts of the business transaction. MicroAlgo undertakes no obligation to update these statements for revisions or changes after the date of this release, except as may be required by law.
NEW YORK, Jan. 2, 2025 /PRNewswire/ -- PieX AI, a global leader in multimodal AI hardware for smart health, is set to proudly launch the world's first pendant featuring personalized, on-device AI at CES 2025. This innovative product aims to revolutionize mental health management by seamlessly integrating technology with emotional well-being. A Focus on Mental Health PieX's mission is to enhance users' mental health through advanced applications such as AI life coaching, guided breathing exercises, and comprehensive health monitoring. The PieX pendant is a holistic tool that applies physiological and psychological to support emotional well-being. By empowering users to recognize and embrace their feelings, PieX promotes users to build a positive mindset, ultimately enhancing their mental energy and well-being. Proprietary Sensing and AI Technology The PieX pendant is built upon our proprietary Sensing Technology and foundation models featuring both Personalized AI and On-device AI. The sensing technology provides 24/7 accurate emotion tracking results to build a personalized emotion database for each user, making the AI know users better. Moreover, the AI running on users' own phones ensures that users' emotional data and auto-journaled information are processed and stored locally, eliminating the need for cloud storage. This feature provides an ultimate solution to enhance user privacy and data security in the LLM era. Sensing Tech: The pendant's sensing capability not only accurately measures indicators of stress, such as the wearer's HRV (heart rate variability), but also precisely assesses the user's emotional state through their speech tone during conversation. By combining these two aspects, it provides users with a comprehensive emotional tracking insight. Moreover, the pendant's sensing ability also offers users the capacity to perceive their environment and events, correlating emotional states with daily occurrences, thus helping users better cope with various emotional changes. AI Tech: Leveraging the exceptional sensing capabilities of the pendant, our device will provide a personalized AI that understands the user best. It can automatically offer options for meditation and breathing exercises based on the user's emotional changes and preferences, enabling users to take a more proactive approach to their mental health. Additionally, all emotional sensing and data processing analysis occur solely on the user's personal device, with no need for cloud uploads. Even large language models run locally, ensuring that sensitive information never leaves the user's devices. PieX AI at CES: Booth #63001-02,Level 1,Hall G, Venetian Expo.
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