本網站使用瀏覽器紀錄 (Cookies) 來提供您最好的使用體驗，我們使用的 Cookie 也包括了第三方 Cookie。相關資訊請訪問我們的隱私權與 Cookie 政策。如果您選擇繼續瀏覽或關閉這個提示，便表示您已接受我們的網站使用條款。 關閉
SHENZHEN, China, Sept. 11, 2024 /PRNewswire/ -- The 25th China International Optoelectronic Exposition (CIOE 2024) commenced today with a grand opening at the Shenzhen World Convention and Exhibition Center. As a premier event that encompasses the entire optoelectronics industry chain, CIOE has witnessed the rapid progress of optoelectronic technology and the profound transformation of the industry landscape over the past 25 years. From its humble beginnings as a small-scale exhibition to its current stature as an international event spanning 240,000 sqm, CIOE has grown in scale and influence, fostering technological innovation and industrial upgrading. It has become a world-leading event that covers the entire industry chain, striving to build a holistic platform for technological innovation, academic discourse, market development, and global collaboration. Marking its silver jubilee, it has attracted over 3,700 high-quality exhibitors from more than 30 countries and regions, showcasing the full spectrum of the optoelectronic industry chain - from chips and devices to full system solutions and manufacturing equipment. Attendees can explore the latest technologies in optical communication, optics, lasers, infrared, sensing, and displays. International pavilions from countries like the United States, Canada, Japan, South Korea, Germany, Denmark, and Switzerland will present their latest achievements and innovative products, promoting international technical exchanges and cooperation. With an expected attendance of over 120,000 professionals from advanced manufacturing, consumer electronics, semiconductors, medical, and security sector, CIOE 2024 stands as a platform for networking, trendspotting, and technological progress. This cross-industry communication will invigorate the ongoing innovation and growth in the photonics sector. Serving as a key platform for displaying scientific breakthroughs and fostering partnerships between industry and academia, CIOE 2024 highlights the latest optoelectronic innovations from research institutions, universities, and high-tech firms, nurturing new product development and connecting companies with investors to foster business deals and global partnerships. The CIOE 2024 - University Technology Achievement Display Zone connects academic research with industry demands, speeding up the practical application of scientific findings. Meanwhile, the Optoelectronic Talent Recruitment Zone provides a platform for companies to recruit skilled professionals, bolstering their talent base and bridging the gap between research and workforce needs. CIOE 2024 underscores the pivotal role of optoelectronic technologies in driving innovation across various sectors. According to Yang Xiancheng, founder and executive chairman of CIOE, "The rapid development of high-tech industries hinges on close integration between upstream technologies and downstream product innovations. Optoelectronic technology serves as a vital support, unlocking new possibilities for product development in fields such as materials, chips, sensors, and modules." He also noted that emerging technologies like photonics and quantum computing are significant in the commercialization of these advancements. "Intelligent Manufacturing with Photonics" is a leading technology that drives the development of new productive forces with its unique advantages and diverse applications. At CIOE 2024, key exhibits include optical processing and coating equipment, camera AA equipment, laser equipment, semiconductor equipment, industrial automation, and testing instruments. These innovations enhance production efficiency and quality stability for core products like optoelectronic chips and optical lenses, while also expanding applications into smart manufacturing, consumer electronics, new energy vehicles, and semiconductors. Beyond an exhibition, CIOE is a hub for global optoelectronics innovation. CIOE 2024 concurrently runs over 80 forums, bringing together leading experts, scholars, and industry leaders to discuss the latest advancements, industry trends, and market opportunities in the optoelectronics sector. Through in-depth discussions, these forums highlight new directions for innovation and development in optoelectronics, igniting enthusiasm for the field's potential. This event serves as a significant milestone in advancing the photonics industry toward sustainable growth.
SEOUL, South Korea, Sept. 11, 2024 /PRNewswire/ -- SK keyfoundry, an 8-inch pure-play foundry in Korea, announced today the launch of its fourth-generation(Gen4) 0.18㎛ BCD process, which delivers approximately 20% performance improvement over the previous third-generation(Gen3). With this latest addition SK keyfoundry provid solutions for improved mobile and automotive power semiconductor performance. SK keyfoundry's fourth-generation 0.18㎛ BCD process offers power devices up to 40V with various power device gate inputs such as 3.3V, 5V, and 18V, which can be used in a variety of applications such as PMIC for servers and laptops, PMIC for DDR5 memory, mobile chargers, audio amplifiers, and automotive gate drivers to meet customer needs. It also offers MTP (Multi-Time Programmable) for trimming / OTP (One-Time Programmable) memory, SRAM memory, etc. as options to facilitate customer's product design. SK keyfoundry's fourth-generation 0.18㎛ BCD process meets the automotive quality standard AEC-Q100 Grade 1, which ensures IC operation in high-temperature environments of 125℃ for use in automotive power semiconductors, and the thick IMD (Inter Metal Dielectric) option enables automotive product designs that withstand voltages higher than 15,000V. Based on the mass production experience gained from the third-generation 0.18㎛ BCD process and the high level of customer confidence, the company expects the fourth-generation 0.18㎛ BCD process to contribute to longer battery life for mobile devices, stable performance with lower heating, and improved performance by improving the energy efficiency of power semiconductors for automotive applications. "We are pleased to offer our customers a new fourth-generation 0.18㎛ BCD process with improved performance," said Derek D. Lee, CEO of SK keyfoundry. "SK keyfoundry will continue to strengthen its competitiveness in semiconductor process technology for power and work closely with our customers to expand its business into a variety of applications that are expected to see high growth in the future, such as PMICs for AI servers, DDR5 PMIC, automotive Gate driver IC." About SK keyfoundry Headquartered in Korea, SK keyfoundry provides specialty Analog and Mixed-Signal foundry services for semiconductor companies to serve a wide range of applications in the consumer, communications, computing, automotive and industrial industries. With a broad range of technology portfolios and process nodes, SK keyfoundry has the flexibility and capability to meet the ever-evolving needs of semiconductor companies across the globe. Please visit https://www.skkeyfoundry.com for more information.
New SSD delivers 2x performance, over 30% greater power efficiency than previous generation by applying 5th-generation PCIe Mass production to begin in Q2 next year following customer qualification SK hynix to enhance data center SSD portfolio to meet diverse customer needs Company to consolidate position as No. 1 global AI memory provider in NAND solutions such as SSDs following success with HBM SEOUL, South Korea, Sept. 11, 2024 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has developed PEB110 E1.S (PEB110), a high-performance solid-state drive (SSD) for data centers. SK hynix develops PEB110 for data centers With the advent of the AI era, customer demand for high-performance NAND solutions such as SSDs for data centers, as well as ultra-fast DRAM chips including high bandwidth memory (HBM), is growing. In line with this trend, the company has developed and introduced a new product with improved data processing speed and power efficiency by applying the fifth-generation (Gen5) PCIe[1] specifications. SK hynix expects to meet diverse customer needs with a more robust SSD portfolio following successful mass production of PS1010[2] with the introduction of PEB110. The company is currently in the qualification process with a global data center customer and plans to begin mass production of the product in the second quarter of next year, pending qualification. PCle Gen5, applied to the new product, provides twice the bandwidth of the fourth generation (Gen4), enabling PEB110 to achieve data transfer rates of up to 32 gigatransfers per second (GT/s). This enables PEB110 to double the performance of the previous generation and improve power efficiency by more than 30%. SK hynix has also applied the security protocol and data model technology, or SPDM, to PEB110, for the first time for its data-center SSDs to significantly enhance information security features. SPDM, a key security solution specialized in protecting server systems, offers secure authentication and monitoring of servers. With the recent increase in cyberattacks on data centers, the company expects that PEB110 with SPDM will meet the high information security needs of customers. The product will be released in three capacity versions—2 terabyte (TB), 4 TB, and 8 TB—and supports the OCP[3] version 2.5 specifications for greater compatibility across global data centers. "The new product builds on the company's best-in-class 238-high 4D NAND, boasting the most competitive standards in the industry in terms of cost, performance and quality," said Ahn Hyun, Head of the N-S Committee at SK hynix. "Looking ahead, we are on track to proceed with customer qualification and volume production to solidify our position as the No. 1 global AI memory provider in the ever-growing SSD market for data centers," said Ahn. [1] Peripheral Component Interconnect Express (PCle): A serial-structured, high-speed input/output interface used on the motherboard of digital devices. [2] PS1010: a data center/server-oriented SSD with ultra-high performance and high capacity that is based on PCIe Gen5 E3.S and U.2/3 [3] Open Compute Project (OCP): An international council of leading data center companies from around the world discussing standards for hardware, software, and eSSDs to build ultra-efficient data centers. About SK hynix Inc. SK hynix Inc., headquartered in Korea, is the world's top-tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM"), flash memory chips ("NAND flash"), and CMOS Image Sensors ("CIS") for a wide range of distinguished customers globally. The Company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com. SK hynix develops PEB110 for data centers
With thousands of physical qubits, hundreds of logical qubits, low error rates, and a fully integrated software stack, Quantinuum's roadmap outlines its path to achieve scientific advantage and a tipping point for commercial advantage In collaboration with Microsoft, Quantinuum also demonstrates two industry firsts: 12 logical qubits and an end-to-end scientific workflow using AI, High-Performance Computing (HPC), and logical qubits on what Microsoft has previously described as "the path to a Quantum Supercomputer" BROOMFIELD, Colo. and LONDON, Sept. 10, 2024 /PRNewswire/ -- Today, Quantinuum, the world's largest and leading integrated quantum computing company, unveiled its roadmap to universal, fault-tolerant quantum computing by 2030. The roadmap materially accelerates the path to commercial quantum computing systems with the potential to unlock a trillion-dollar market[1] and enable AI to help solve some of the world's most pressing problems. In parallel, Quantinuum in partnership with Microsoft announced a series of milestones and integrations. Quantinuum's roadmap unveils its fifth-generation quantum computer, Apollo, which will be a fully fault-tolerant and universal quantum computer, capable of executing circuits with millions of gates, delivering scientific advantage and enabling a commercial tipping point. "We are the only company with a clear and demonstrable path that leverages quantum computing to tackle large-scale scientific and commercial applications," said Dr Rajeeb Hazra, CEO of Quantinuum. "With our proven record of driving technological advancement and the unwavering trust of our global customers and partners, we are confident that we possess the industry's most credible roadmap toward achieving universal fault-tolerant quantum computing." Quantinuum's Accelerated Hardware Roadmap The roadmap is built on the foundations of Quantinuum's fully scalable quantum charge-coupled device (QCCD) architecture, including a universal gate set and high-fidelity physical qubits uniquely capable of supporting reliable logical qubits. For four years now, Quantinuum has remained steadfast in providing data along with peer-reviewed papers to show the science and engineering work behind these methodical advances. "Our next system, Quantinuum Helios, will support enough logical qubits to unlock scientific and mathematics advances that will clearly surpass classical computing," Hazra said. "Our roadmap then draws a direct line to hundreds of logical qubits, at which point quantum computing will outperform classical computing to address a broad range of scientific problems in areas like finance, chemistry, and computational biology. We also know, from experience, that utility in the form of applications that are suitable for global enterprises and governments will likely bubble to the surface and increase rapidly over the next 18 months. Our quantum computers are already impossible to simulate classically." Quantinuum also announced another milestone today in collaboration with Microsoft: achieving 12 logical qubits on the newly updated 56-qubit System Model H2 quantum computer, a 3x advance over the four logical qubits the companies announced in April. Microsoft also used the System Model H1 quantum computer to run the first ever chemistry simulation using reliable logical qubits combined with AI and HPC to produce results within chemical accuracy. Finally, Quantinuum and Microsoft have completed the integration of Quantinuum's InQuanto™ computational quantum chemistry software package with Azure Quantum Elements, making it available to customers through private preview. "The collaboration between Quantinuum and Microsoft has established a crucial step forward for the industry and demonstrated a critical milestone on the path to hybrid classical-quantum supercomputing capable of transforming scientific discovery," said Dr Krysta Svore – Technical Fellow and VP of Advanced Quantum Development for Microsoft Azure Quantum. "It is now clear that enterprises need to be ready to take advantage of the progress we can see coming in the next business cycle," Hazra said. "Our customers are placing quantum in their strategic plans and finding new ways to align our quantum system with classical computing and generative AI." In 2019, Quantinuum's H-Series devices were among the first to be offered commercially via Microsoft Azure. Today, Quantinuum's H1 and H2 quantum computers, Powered by Honeywell, remain available on Azure and directly to Quantinuum customers and partners. In the past few years, Quantinuum has achieved many significant milestones, including Winning the race to "three 9s" hardware fidelity Demonstrating the scalability of our architecture High-fidelity teleportation of logical qubits Fault-tolerant entangling gates Beyond-break even with logical qubits Lattice surgery Real-time fault-tolerant error correction The performance of complex algorithms like the quantum Fourier transform at the logical level The computing primitives required to demonstrate a magic state distillation protocol A blog post with more details on the Quantinuum quantum hardware roadmap can be viewed here. The Microsoft announcement regarding the 12 logical qubits can viewed here. About Quantinuum Quantinuum, the world's largest integrated quantum computing company, pioneers powerful quantum computers and advanced software solutions. Quantinuum's technology drives breakthroughs in materials discovery, cybersecurity, and next-gen quantum AI. With over 500 employees, including 370+ scientists and engineers, Quantinuum leads the quantum computing revolution across continents. [1] Source: Quantum Technology Monitor, McKinsey 2023
- Mx11 family for hyperscalers and data centers - TAIPEI, Sept. 10, 2024 /PRNewswire/ -- Toshiba Electronic Components Taiwan Corporation (Toshiba) announces the Mx11 family of helium-sealed high-capacity HDDs. The Mx11 family includes the MG11 Series, which provides capacities of up to 24TB[1] using conventional magnetic recording (CMR), and the MA11 Series which offers up to 28TB capacities with shingled magnetic recording (SMR). The new Mx11 family is designed to deliver new levels of density and power efficiency to customers tasked with controlling (or managing) operational costs while meeting the relentless demands of data growth. Built on a common architecture, both products feature a 10-disk, helium-sealed, standard 3.5-inch[2] 7,200rpm design that leverages Toshiba's innovative flux control microwave assisted magnetic recording (FC-MAMR™) technology. Engineered for higher performance and 24/7 reliability, the Mx11 family is designed with a 1GiB[3] buffer, a workload[4] rating of 550TB per year, an MTTF/MTBF[5] of 2.5 million hours, and an AFR of 0.35%. Toshiba Announces CMR 24TB and SMR 28TB Hard Disk Drives. - Mx11 family for hyperscalers and data centers - The MG11 CMR HDD Series enables cloud, data center, and enterprise storage customers to rapidly scale storage density within existing infrastructure. Built with a 1GiB buffer, the new 24TB HDD is faster[6] than its predecessor, with an approximately 9% faster maximum sustained transfer speed of 295MiB/s[7]. With a choice of 6Gbps SATA or 12Gbps SAS interfaces, the MG11 Series fits seamlessly into any data center to support data storage, online backup and archive, and video surveillance applications. In addition to 24TB, the MG11 Series is available in 22TB, 20TB, 18TB, 16TB and 14TB capacities with sanitize instant erase (SIE) and self-encrypting drive (SED) options for enhanced security[8]. The MA11 Series achieves 2.8TB per disk using SMR technology. The MA11 Series host-managed SMR increases drive capacity by overlapping the physical tracks on the disk during write operations. Data centers with software that can optimize the MA11 Series host-managed SMR design will benefit from improved cost efficiencies through higher storage densities. The new MA11 Series is available in 28TB and 27TB capacities with a 6Gbps SATA interface and with SED options for enhanced security. "Backed by 50 years of continuous HDD innovation, the MX11 series delivers new levels of capacity and total cost of ownership (TCO) efficiency enabling customers to optimize operational costs while expanding their data center infrastructure" said Noriaki Katakura, Division President, Storage Products Division, Toshiba Electronics Components Taiwan Corporation. Sample shipments of the MG11 Series will start this month, and the MA11 Series in the fourth calendar quarter of this year. For more information on the new products, please visit:https://toshiba.semicon-storage.com/ap-en/storage/product/data-center-enterprise/cloud-scale-capacity/articles/mg11.html For more information on Toshiba's full line of HDD storage products, please visit: https://toshiba.semicon-storage.com/ap-en/product/storage-products.html To receive more about our storage solutions, please follow @ToshibaStorage.Asia on Instagram. [1] Definition of capacity: One terabyte (TB) = one trillion bytes, but actually available storage capacity may vary, depending on operating environment and formatting. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system and/or pre-installed software applications, or media content. Actual formatted capacity may vary. [2] "3.5-inch" mean the form factor of HDDs. They do not indicate drive's physical size. [3] A gibibyte (GiB) is 230, or 1,073,741,824 bytes, A mebibyte (MiB) is 220, or 1,048,576 bytes. [4] Workload is a measure of data throughput in a year, and it is defined as the amount of data written, read or verified by commands from the host system. [5] MTTF/MTBF (mean time to failure/mean time between failure) is not a guarantee or estimate of the product life; rather it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. The actual product life of the product may vary. [6] Comparison between the SATA interface 512e model "MG11ACA24TE" and the previous generation "MG10AFA22TE." [7] Read and write speeds may vary depending on the host device, read and write conditions, and file size. [8] The HDDs which have any optional security function may not be available in the countries where the use of such HDDs is prohibited or limited due to export control and local regulations. * Information in this document, including product prices and specifications, content of services and contact information, is current and believed to be accurate as of the date of the announcement, but is subject to change without prior notice. * FC-MAMR™ is a trademark of Toshiba Devices & Storage Corporation. * Other company names, product names, and service names may be trademarks of their respective companies. About Toshiba Electronic Components Taiwan Corporation (TET)Toshiba Electronic Components Taiwan Corporation is responsible for the sales and marketing promotion and support of Toshiba hard disk drives and Toshiba External HDDs in Taiwan, China and Southeast Asian countries. TET is the best partner to Enterprise server, storage and notebook computers, and its mission is to offer the best service and products embodying the highest quality and most leading-edge technology. For more information, visit us at: http://toshiba.semicon-storage.com/ap-en/product/storage-products.html About Toshiba Electronics Asia (Singapore)Toshiba Electronics Asia (Singapore) ("TEA") is under Toshiba Electronic Devices & Storage Corporation, a subsidiary of Toshiba Corporation. TEA was founded in 1990, and is responsible for the sales, marketing and services for Toshiba's wide range of storage solutions in Asia Pacific, which includes the Canvio Portable External Hard Drives and Internal Hard Drives. TEA is the best partner to consumers and enterprises, and its mission is to offer the best services and products that embody the highest quality and cutting-edge technology. To find out more about TEA, visit: https://toshiba.semicon-storage.com/ap-en/storage.html
TECNO MEGA MINI Gaming G1, the world's smallest water-cooling gaming mini PC, and TECNO Pocket Go, the industry's first Windows AR gaming set, claimed the prestigious global awards. BERLIN, Sept. 7, 2024 /PRNewswire/ -- The 2024 IFA Berlin International Consumer Electronics Show, one of the largest consumer electronics exhibitions in the world, officially kicked off yesterday. Among the event's highlights was the announcement of the Global Product Technology Innovation Award 2024, run with support from IFA Management GmbH. Overall, TECNO claimed two prestigious gold awards: The TECNO MEGA MINI Gaming G1 was awarded the Design and Technology Integration Innovation Gold Award and the TECNO Pocket Go was awarded the AR Immersive PC Gaming Experience Innovation Gold Award, highlighting its cutting-edge innovations on a global stage. The two award-winning devices are on display at the TECNO booth (H6.2A-113) at IFA Berlin 2024. As a global technology leader with operations in over 70 markets, TECNO remains dedicated to revolutionizing the digital experience, particularly in emerging markets. The brand excels at integrating contemporary design with cutting-edge technology across its extensive range of AIoT products. The two award-winning products from TECNO, showcased at IFA 2024, epitomize the brand's innovation in AIoT. Offering global users an immersive interactive gaming experience with superb performance, these products underscore TECNO's steadfast commitment to the fusion of high-end technology with sophisticated design. The "Global Product Technology Innovation Award" is one of the most authoritative platforms for international exchange, showcasing, and collaboration at the IFA each year. With the significance amplified in the show's 100th year anniversary, the annual global award, conducted by International Data Group (IDG) and the German Chamber of Commerce and Industry (DIHK) with support from IFA Management GmbH, is a celebration of cutting-edge technological advancement. TECNO MEGA MINI Gaming G1: The World's Smallest Water-Cooling Gaming MINI PC with Discrete Graphics Card TECNO MEGA MINI Gaming G1 is celebrated as the "world's smallest" water-cooled gaming PC with a discrete graphics card. More than just a gaming rig, it's a comprehensive solution that blends powerful performance, advanced cooling, and extensive connectivity in an ultra-compact form. TECNO MEGA MINI Gaming G1 The MEGA MINI Gaming G1 features cutting-edge performance with a compact design. It is powered by the Intel® Core™ i9-13900H processor, delivering 14 cores, 20 threads, and turbo speeds up to 5.4 GHz, setting a new standard in compact gaming. The NVIDIA GeForce RTX™ 4060 GPU based on Ada Lovelace architecture ensures breathtaking graphics and fluid gameplay, enhanced by NVIDIA DLSS 3 technology for AI-driven performance boosts. Despite its compact size of just 255*150*150mm, it packs a robust cooling system with a 6888 mm² pure copper heatsink and dual fans, maintaining optimal performance while minimizing noise. Users can switch seamlessly between Beast, Smart, and Eco modes to suit their needs. Connectivity is another standout feature of the MEGA MINI Gaming G1. With 15 diverse ports, users can easily connect all their gaming peripherals and accessories. Thunderbolt 4 support offers lightning-fast data transfer speeds and versatile multi-display capabilities, while Wi-Fi 6E and Ethernet guarantee reliable connections. The device is powered by a compact yet mighty 330W GaN adapter, delivering stable output in a sleek, RGB-lit design. Besides the standard edition, TECNO also unveiled a new collaboration edition of The TECNO MEGA MINI GAMING G1 with Geekom, a top-tier brand in the Mini PC industry, now available on Kickstarter (https://bit.ly/KSMEGA). This device is also on display at the IFA exhibition, where visitors can experience it at the TECNO booth. TECNO Pocket Go: The industry's first Windows AR gaming set The TECNO Pocket Go pioneers a "new gaming wonderland" in handheld PC form within the AR industry. Seamlessly integrated with the Windows gaming ecosystem and featuring advanced head-tracking technology, it delivers an unparalleled 6D immersive experience. TECNO Pocket Go The AR Pocket Vision boasts a 0.71-inch Micro-OLED screen that replicates a 215-inch TV experience from 6 meters away, delivering strong cinematic visuals. With up to 600° diopter adjustments for eye comfort and privacy protection, gaming can be enjoyed anywhere. Powered by the AMD® Ryzen™ 7 8840HS, the handheld of the device offers exceptional speed and seamless multitasking with 8 cores, 16 threads, and turbo speeds up to 5.1 GHz. Its PC-grade cooling system, featuring a large fan and three copper pipes, ensures optimal performance at 35W, while a 50Wh replaceable battery supports extended gaming. Furthermore, the VisionTrack feature of the TECNO Pocket Go offers a fully immersive experience, both visually and sensorially. The AR Pocket Vision features a six-axis gyroscope and AI algorithms for precise head-tracking, enhancing real-time data collection during gameplay. N'BASS® acoustic materials and a proprietary vibration algorithm translate in-game sounds into nuanced vibrations through the handheld, while the Hall Effect Joysticks and Triggers provide precise control, enriching both visual and tactile sensations. With the TECNO Pocket Go, users will unlock a futuristic gaming experience that seamlessly connects to TECNO's broader ecosystem of AR products. Availability The new Geekom collaboration edition of the TECNO MEGA MINI Gaming G1 will make its stunning debut at IFA Berlin 2024, where it will be presented at TECNO's booth – located at H6.2A-113. This new model is now available on Kickstarter, for more information please follow the link: https://bit.ly/KSMEGA . TECNO Pocket Go will also start crowdfunding on Kickstarter from late September. For more information about Pocket Go, please check the details on TECNO's website: https://tecno-pocketgo.com/
A12 藝術空間
Computer Hardware
請先登入後才能發佈新聞。
還不是會員嗎？立即 加入台灣產經新聞網會員 ，使用免費新聞發佈服務。 （服務項目） （投稿規範）
