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大陸港澳

傳媒通知：Supermicro 行政總裁 Computex 2023 主題演講

Supermicro 行政總裁發表主題演講，介紹最新的系統創新和儲存解決方案，以實現綠色人工智能（Green AI）和可持續發展美國加州聖何西2023年5月25日 /美通社/ -- 在 2023 年 6 月 1 日 (COMPUTEX 2023)， Supermicro 行政總裁 Charles Liang 將會發表 Computex 行政總裁主題演講，內容關於支援不同動態市場的最新技術和系統創新。梁先生將會講述和展示推動人工智能和雲端計算發展的最新技術發展和機會，並重點介紹關注綠色計算和可持續發展的一站式 IT 解決方案部署策略。 Supermicro 的展位將會重點展示支援最新的伺服器，其支援 Intel 第 4 代 Intel® Xeon® 可擴充處理器、第 4 代 AMD EPYC™ 處理器，以及新一代 NVIDIA H100 GPU 加速器。如要進一步了解 Supermicro 參與 Computex 2023 的詳情，請瀏覽：https://learn-more.supermicro.com/computex 活動內容：Charles Liang 的 Supermicro 主題演講：地點：台北南港展覽館 2 館 7 樓 701 室（或線上）日期：2023 年 6 月 1 日（星期四）(GMT+8) 下午 1:30 至 2:30 活動內容：Mory Lin 論壇演講：為優化智慧聯網 (AIoT) 和電訊開放式無線接入網絡 (Open RAN) 現代工作負載重新定義邊緣計算的效能地點：台北南港展覽館 2 館 1 樓日期：2023 年 5 月 31 日（星期三）(GMT+8) 下午 2:30 至 4:00 活動內容：Supermicro 展位地點：台北南港展覽館 1 館 4 樓 M0320 展位日期：2023 年 5 月 30 日至 2023 年 6 月 2 日關於 Supermicro Supermicro (NASDAQ: SMCI) 是應用優化的一站式 IT 解決方案的全球領導者。Supermicro 在加利福尼亞州聖荷西創立並經營，致力於為企業、雲端、AI 和 5G 電信/邊緣 IT 基礎設施提供市場創新。我們正在轉變為提供伺服器、人工智能、存儲、物聯網、交換系統、軟件和服務的一站式 IT 解決方案提供商，同時帶來先進的大容量主板、電源和機箱產品。這些產品在公司內部設計和製造（美國、台灣和荷蘭），利用全球運營來實現規模和效率，經過優化以改善擁有權總成本 (TCO) 並減少環境影響（綠色計算）。屢獲殊榮的 Server Building Block Solutions® 產品組合允許客戶從廣泛的系統中進行選擇，從而精確地優化其工作負載和應用。這些系統基於我們靈活且可重複使用的構建塊，支持各種各樣的外形尺寸、處理器、內存、繪圖處理器、存儲、網路、電源和冷卻解決方案（冷氣機、自然風冷或液冷）。 Supermicro、Server Building Block Solutions 和 We Keep IT Green 是 Super Micro Computer, Inc. 的商標和/或註冊商標。所有其他品牌、名稱和商標均為其各自所有者的財產。

文章來源 : PR Newswire 美通社 發表時間 : 2023/5/25 瀏覽次數 : 4582 加入收藏 :

科技新訊

FOPLP扇出型面板級封裝技術趨勢研討會於中興大學化材大樓國際會議廳圓滿落幕

晶片封裝領域的市場趨勢指向大面積多晶片封裝和細線路技術發展，透過FOPLP（Fan-out Panel Level Packaging）扇出型面板級封裝可提升封裝技術和生產效益。扇出型封裝技術在5G、AIoT和HPC等領域應用廣泛，FOPLP因其面積利用率高、成本降低，具有巨大發展潛力。市場預測其銷售額將在2023年達到2.793億美元。然而，FOPLP製程仍面臨技術挑戰，包括面板尺寸、翹曲控制、製程條件等。持續技術開發和創新是推動FOPLP市場的關鍵。FOPLP封裝技術可提升產品性能、降低成本，追求輕薄短小的同時滿足多功能高I/O的需求。因此，封裝廠、PCB載板廠和面板廠都積極布局FOPLP，以獲得競爭優勢和更高的收益。為打造扇出型面板級封裝(FOPLP)產業生態鏈，促進產學研之間的技術資源共享，達到FOPLP產業創新與發展，由凌嘉科技號召，中興大學材料科學與工程學系、中興大學產學研鏈結中心、晶化科技、亞智科技、迅得機械、鉑識科技共同主辦，工業技術研究院、台灣電子設備協會、金屬工業研究發展中心等產學研單位一同協辦之「FOPLP扇出型面板級封裝技術發展趨勢研討會」，於昨(2023年5月24日)於中興大學化材大樓國際會議廳舉行。匯集扇出型面板級封裝技術 (FOPLP) 相關企業，學術單位，法人單位，以及政府單位近310人共襄盛舉，場面盛況空前。中興大學研發長宋振銘教授首先致詞揭開序幕。宋研發長表示Fan-Out已成為封裝領域重要趨勢，透過RDL重新佈線封裝晶片，增加I/O節點，尺寸更大、成本更低、並可達到封裝異質整合。中興大學致力於培養半導體人才及技術研發，與台積電共同開設半導體相關學程數量為全台大學最多，其中先進封裝學程為首創，並與聯發科合作開設IC設計學程。興大的國家重點產業學院「循環經濟研究學院」也成立半導體綠色科技學程。興大期望與產業界緊密攜手，為台灣半導體人才培育與技術自主做出貢獻。凌嘉科技梁瑞芳總經理代表主辦企業方致詞。凌嘉科技在PVD濺鍍及PLSMA清潔及蝕刻設備領域蓄積二十年的能量，舉行本次研討會。研討會與會人數超過200位，顯示FOPLP商機與發展引人注目。FOPLP發展仍面臨諸多挑戰，如製程材料、翹曲、良率、溫度和設備，以及業務成本、規格和投資回報率等問題。需要材料商、設備商、PCB廠、載板廠和面板廠等多方共同努力，建立競爭力強的生態系統，推進半導體產業的創新與發展。目標是讓台灣在先進封裝領域繼續保持全球領先地位，並發展自有的半導體設備和材料，深耕產業技術。晶化科技總經理陳燈桂博士主講「技術自主之先進封裝膜材& ABF載板增層材料」，指出半導體關鍵材料自給率低是台灣半導體產業面臨的重大議題。目前，超過9成的半導體關鍵材料仍須依賴國外進口。這一現象帶來了三大問題，第一是材料仰賴進口，長期以來無法實現自給；其次，驗證新材料需要耗費大量時間，造成下游廠商更換意願不高；第三，中美日韓貿易競爭引發了對半導體材料技術自主化的關注，原料管制措施也對供應鏈帶來了不確定性。為了解決這些問題並提升國內材料供應鏈的自主性，晶化科技致力於研發與製造半導體關鍵材料。主張在地供應，迅速回應台灣半導體市場成長所需的在地材料，使台灣業者無需透過國際運輸便能取得所需材料，同時降低碳排放，為節能減碳做出貢獻。晶化科技提供多條產品線，包括ABF載板用增層材料、晶圓級/面板級封裝材料、雷射解離膜以及Mini/Micro LED封裝材料，並在演講中詳細介紹了這些材料的發展趨勢和技術難點。凌嘉科技黃一原知識長發表「濺鍍與電漿蝕刻應用於扇出型面板級封裝RDL的解決方案」。扇形封裝面板級技術旨在優化電氣性能、縮短互連距離、降低寄生電感與插入損失、適用於高速與高頻傳輸, 封裝微型化與薄型化, 改善散熱性能以及相對低成本優勢等方面。然而，電漿蝕刻與PVD 鍍膜設備開發在FOPLP也面臨挑戰，包括缺乏標準面板尺寸、多樣化的RDL介電材料與製程技術路線, 低製程溫度、高速蝕刻要求, 大面積均勻性, 附著性, 接觸阻抗, 微塵控制, 面板變形與運送等方面。在RDL製程工藝中，凌嘉科技可於關鍵站點中提供設備解決方案，如製程一開始的電漿清潔、光阻微影製程後的plasma descum、雷射鑽孔後的plasma desmear、電漿蝕刻via/trench、種子層濺鍍及去除等。在種子層濺鍍，凌嘉提供了先進的PVD解決方案。高精度的沉積控制，可實現均勻且可靠的金屬沉積，穩定的Rc管理。設備支持多種金屬材料，並提供即時監控, 分析與履歷追蹤等功能。凌嘉科技提供可應用於大面積製造(700x700 mm)的基板表面處理技術，包括介電材料減薄、熱解膠殘膠去除、基板表面改質、形貌控制，以及去光阻與種子層的鈦蝕刻技術。微米級盲孔(via)的電漿desmear, 與plasma descum技術可應用至600x600 mm的面板尺寸。這種方法取代了傳統的雷射鑽孔+除膠渣技術，並具有高蝕刻速率、高均勻性、低溫製程以及高選擇性的優勢。可形成光滑的側壁，精確控制盲孔的輪廓和臨界尺寸，實現更精細的特徵尺寸。這項技術有助於降低高頻傳輸損失，提升信號完整性，同時增強互連的整體可靠性。亞智科技研發部協理李裕正博士主講「實現微型化產品的致勝關鍵-Manz RDL創新產線」。濕製程設備在FOPLP（Fan-Out Panel Level Packaging）中面臨的挑戰包括基板的重量和翹曲特性使得其處理變得複雜。特徵圖案的均勻性與低關鍵尺寸誤差、縮短製程時間和超過95%的均勻性是關鍵，而電鍍的均勻性會影響元件的性能。設備製造商需不斷努力改進設備性能和技術，以滿足FOPLP製程的要求，實現高品質、高效率的製造過程。亞智科技提供多種濕製程設備選擇，包括連續式/批次式/混合式，包含顯影、蝕刻、去膜生產線。此外，亞智科技還擁有新穎的垂直銅鍍技術，可整合及規劃整廠RDL濕製程生產線。其濕製程設備在FOPLP中展現出以下特色和表現：具有獨特的無夾具設計，減少化學品消耗，節省維護成本。模組化設計優化了生產和維護效率，並與自動化系統高度整合，包括載入/卸載等。鍍銅均勻性達到整版90%以上，適用於大面積基板和小孔徑（<25μm）填充。此外，其設備能夠適應各種基板，如不鏽鋼、FR4等，並能夠避免通孔或孔徑出現鍍膜空洞缺陷。迅得機械研發部黃正忠經理介紹「FOPLP之自動化應用」，包括自動化線邊倉（WIP）和高空RGV系統。並提供亞智科技搭載FECA系統之電鍍自動上料設備，可五分鐘內即時檢測分析物特異性並控制添加濃度。傳統濕製程控制方法需要四位人力，總時程144小時，搭載FECA系統後，可縮減為1位人力，時間只需0.25小時。有助於降低漏液風險，減輕人員負擔，提高產品的良率。針對FOPLP中的異質材料和非對稱架構導致的翹曲問題，主設備可進行有效的壓制，在傳送和取放料過程中進行風險防護和掉落偵測，以降低因翹曲而導致的掉落風險。迅得機械與Enduser共同開發高運算晶片（HPC）RDL製程奈米壓印(Nanoimprint Lithography)設備。RDL黃光微影製程僅能使用光阻材料進行微結構圖案的定義，因為材料CTE不匹配導致投射式曝光聚焦深度（DOF）問題和曝光異常。此外，異質整合中常見因材料間的介電常數（Dk）太高，導致導線間耦合電容值過高，產生串擾延遲訊號傳播。利用奈米壓印直接製造乾膜材料所需的微奈米結構，可製作2.5D或3D結構，並實現次微米線寬和可控的壓印對位精度，預計未來可進一步提升至≤±3um，並使用low DK和low CTE的乾膜材料取代光阻材料，從而降低成本並提升異質整合產品中性能。鉑識科技執行長黃榆婷博士發表「新型複合奈米雙晶銅於RDL製程之應用」。鉑識科技研發新專利奈米雙晶銅電鍍液，可製造複合奈米雙晶銅 (Hnt-Cu) 和奈米晶銅 (nc-Cu)。這種電鍍液在 RDL/TSV/Interconnect/Pillars等不同製程結構的應用中，通過控制添加劑配方來獲得適當的晶粒結構，以滿足FOWLP所面臨的挑戰，包括低至2 µm線寬的要求、機械可靠性和填孔性能的提升，以及降低製造成本。複合奈米雙晶銅結構對於未來的銅鍵合技術至關重要。Hnt-Cu和nc-Cu兩種銅材料可實現低溫直接銅-銅鍵合技術，促進鍵合形成穩定無孔洞的界面，解決M3D中的電遷移 (EM) 和熱遷移 (TM) 的IC封裝關鍵問題。鉑識科技提供一系列的奈米雙晶銅產品，應用於新興的電子封裝技術，具有高熱穩定性、高機械性能和耐化學特性等需求。其開發的奈米雙晶銅產品品質卓越，適用於未來高端半導體元器件材料，並可根據客戶需求以最高純度標準進行生產。目前正積極與半導體封裝產業的製造商和面板產業合作，驗證產品在新的高端技術上的能力，並致力於為IC封裝產業帶來創新技術，符合未來製程的趨勢。總結來說，隨著深入了解工藝和材料知識以及新的設備、材料和智能製造的推動，FOPLP已從低端封裝技術發展成為高性能和具有成本效益的整合平台。這些先進封裝技術提供了超越摩爾定律的效能、功耗、形狀和成本優勢，將為電子產品的發展帶來更多的潛力。新聞聯絡人: 凌嘉科技 / 張亞雯/ arwen.chang@lincotech.com.tw/ 04-24608771#822

文章來源 : 凌嘉科技 發表時間 : 2023/5/25 瀏覽次數 : 12212 加入收藏 :

Global Business News

BOE attends SID Display Week 2023, presenting trailblazing semiconductor display technologies

LOS ANGELES, May 24, 2023 /PRNewswire/ -- On May 23, SID Display Week 2023, a prestigious event hailed as the "Oscars" in the display industry, opened in Los Angeles, the United States. It was the 60th edition of the SID Display Week and coincided with the 30th anniversary of the founding of BOE, a global leader in the semiconductor display industry. BOE brought a slew of cutting-edge technologies to the significant event, including many new launches under its technology brands of ADS Pro, f-OLED and α-MLED, and brand-new innovative applications such as smart in-vehicle display, glasses-free 3D and the metaverse. During the event, BOE also hosted the inaugural "Define the Future – BOE Innovation Ecosystem Forum" jointly with its partners, providing deep insights into the future of the global semiconductor display industry along with SID. In addition, BOE published nearly 100 papers on technological innovation through the platform of SID, of which a dozen were released at various seminars, and some received the SID Distinguished Paper Award. Its 10-inch 8K LCD display tailored to 3D printing was selected as the "Display Application of the Year". It was one of the many state-of-the-art technologies BOE exhibited at the event, giving a glimpse of an even smarter, more fantastic and more power-efficient future of the semiconductor display industry. ADS Pro offers superfast UHD experience with record-breaking refresh rate At SID Display Week 2023, BOE's self-developed LCD products backed by its ADS Pro solution amazed the audiences with impressive strengths such as UHD, ultrahigh refresh rate, optimal effects from all viewing angles and wide color gamut, pushing the envelope of the display industry. In the exhibition zone, BOE's newly released 110-ich 16K UHD display drew a big crowd. The product adopts BOE's cutting-edge oxide TFT technology and features high charge carrier mobility and an ultrahigh resolution, improving the image finesse by four times on the basis of 8K. It adopts BOE's proprietary image enhancement technology to further boost the charging and drive capabilities, delivering exquisite and breathtaking image effects. The company's laptop display product with the world's highest refresh rate of 600 Hz was particularly eye-catching. It boasts a record-breaking refresh rate and fast response within 1 ms, creating a seamless and fluid gaming experience for users. As a signature high-end product under its ADS Pro brand, BOE's 110-inch UB Cell display features six core strengths, namely, 178-degree viewing angles, ultralow reflectivity, high contrast ratio, high refresh rate, wide color gamut and high brightness, delivering ultimate image quality in strong ambient lighting. With premium display effects comparable to OLED and stunning extra-large display experience, the product is definitely a pacesetter and landmark product in the LCD field. BOE also unveiled its 27-inch eco-friendly display product made of recycled materials. The product features ultralow power consumption while ensuring the QHD resolution, setting a new trend for low-carbon display. f-OLED empowers diverse display scenarios with flexible forms BOE's high-end flexible display technology solution f-OLED empowers a myriad of application scenarios with diverse forms, multiple features and other strengths, opening up new vistas where displays are ubiquitous. At SID Display Week 2023, BOE's unprecedented 17-inch bendable laptop display was a magnet. With up to 6.5 laps and the maximum bend range of 272 mm, the product can unfold from 10 inches up to 17 inches, unlocking more possibilities for portability and flexible switch between different sizes. BOE also launched the industry's first foldable product that can be folded both lengthwise and breadthwise. Based on the company's all-new module structure solution, the product can be unfolded fully, folded in an "X" pattern or folded in a "Y" pattern, greatly expanding the application of smart devices in office, creation, gaming, entertainment and other scenarios. Additionally, BOE exhibited its industry-leading flexible display armed with the LTPO and tandem technologies. It achieves peak brightness of 2,000 nits, reduces power consumption by over 20% and at the same time, increases the service life by three to four times, providing a superior OLED experience for users. α-MLED fulfills quest for excellence with exquisite image quality In the MLED field, BOE's chip-on-glass active matrix (COG AM) LED display system and solution α-MLED earned high acclaim from the audiences with its incredible UHD image quality and rich and natural images. BOE's industry-leading 163-inch 0.9mm LTPS COG MLED is characterized as highlights edge-to-edge display, UHD image quality and eye care. Using GIA design and lateral processing technology, the product achieves edge-to-edge splicing, giving users a more impactful viewing experience. Leveraging BOE's proprietary PAM+PWM mode, the eye-friendly display product delivers stunning, flicker-free image quality, fully meeting consumers' demand for quality and sense of presence in studio, home entertainment and other scenarios. BOE also presented its 31.5-inch COG AM backlit MLED display product with 4,000 zones. The product sports peak brightness of 2,500 nits, 100% DCI-P3 and Adobe RGB, as well as vibrant and natural display effects with a million-level contrast ratio. It also supports high refresh rates of 144 Hz/240 Hz, well satisfying the requirements for high quality in design and gaming scenarios. Currently, BOE's COG AM MLED products have been mass-produced and widely used in the products of top Chinese and foreign brands such as Lenovo, KONKA and Skyworth. BOE has also efficiently integrated the MLED business ecosystem to amp up innovation along the entire industry chain. Immersive interaction enabled by innovative technology, unlocking infinite possibilities for smart cockpit, glasses-free 3D and the metaverse With smart display being baked into daily life at a faster pace, BOE is striving to bring displays with more diverse features and forms to a wider range of scenarios and empower more immersive, interactive applications with innovative technologies. At SID Display Week 2023, a lot of visitors were attracted to get hands-on and interact with BOE's exhibits. Through the fusion of world-leading display and AIoT technologies, BOE's first-of-its-kind smart cockpit has a 42.2-inch display and a 6.94-inch Camera Monitor System (CMS). The exterior, display, printed circuit board and software of the cockpit were all developed by BOE independently. The display features an ultrahigh resolution of 10K, a million-level contrast ratio and a 110% color gamut, delivering vibrant colors and a superb viewing experience. The under-display camera in the instrument panel comes with smart features that are both personalized and safe. Leveraging AI technology based on deep learning, it can accurately detect drowsiness, fatigue and other dangerous driver behaviors, and give warnings against such behaviors on the display. The peek-proof passenger display uses BOE's Smart View Control (SVC) solution, and the peek prevention switch can be controlled by both the driver and passenger as needed, making it easier to switch between privacy protection and sharing. Furthermore, the smart cockpit adopts the under-display vibration control technology, which enables more accurate operations and timely feedback and rids the driver of the need to look at the screen for a long time, thus creating a smarter, safer and more considerate travel experience. In the field of in-vehicle display, BOE also introduced a 15-inch slidable central display that fits well into the interior of the cockpit and can automatically go up or down in multiple modes, which is the first of its kind in the industry. BOE's 12.3-inch hidden Mini LED dual-display increases the screen brightness by 50% and has a realistic wood texture that blends well with the interior, affording the cockpit a hint of beauty and a high-tech touch. BOE's futuristic display technologies and products gave the audiences not only a visual feast but also incredibly immersive, interactive experiences. The 32-inch nude optical field 3D display released by BOE for the first time has a large display information capacity, which can achieve retinal 3D display resolution, ultra-wide depth of field space and smooth motion parallax, bringing the audience immersive 3D experience. BOE's first-of-its-kind 8K glasses-free 3D display features a 4K resolution per eye, and uses the company's self-developed eye tracking technology to create amazing 3D effects. BOE's AR/VR products geared up for the metaverse also gained traction. The world's leading 1.3-inch 4K4K Micro OLED VR display products with a resolution of more than 4000, delivers a crystal-clear and highly immersive gaming and viewing experience. The first-of-its-kind field sequential color (FSC) 4K VR product boasts an ultrahigh resolution of up to 2,117 PPI and reduces power consumption by roughly 50%, giving users a strong sense of presence. In addition to showcasing its best-in-class display technologies and smart interactive experiences, BOE hosted the "Defining Future – BOE Innovation Ecosystem Forum" in a bid to explore new pathways to the innovation-driven development of the global industry ecosystem jointly with SID and global partners. Notably, BOE's 10-inch 8K LCD display customized for a customer for the purpose of 3D printing was honored the "Display Application of the Year." Using the LTPS LCD panel, the product achieves high-precision 3D printing at a speed five times that of regular printers, reflecting BOE's remarkable strength in empowering a broad range of fields with its innovative display technologies. From "everything as display" to the "internet of displays," the 30-year-old display maker has maintained its respect for technology and dedication to innovation and rolled out a range of innovative technologies and products, keeping China's display industry at the forefront in the world. Standing at a new starting point, BOE will stick to the "internet of displays" strategy and further deepen the integration of display technology and IoT applications to serve the high-quality development of the display industry in the IoT era, thus opening a new chapter of smart living and making a difference in people's lives.

文章來源 : PR Newswire 美通社 發表時間 : 2023/5/24 瀏覽次數 : 1012 加入收藏 :

Global Business News

Media Alert: Computex 2023 Keynote with Supermicro CEO

Supermicro CEO Delivers Keynote Address on the Latest System Innovations and Storage Solutions for Green AI and Sustainability SAN JOSE, Calif., May 24, 2023 /PRNewswire/ -- On June 1, 2023 (COMPUTEX 2023), Supermicro's president and CEO Charles Liang will deliver a Computex CEO Keynote on the latest technology and system innovations supporting varied dynamic markets. Mr. Liang will talk about and showcase the latest technological developments and opportunities propelling the growth of artificial intelligence and cloud computing, as well as highlight strategies for deploying Total IT Solutions with a focus on green computing and sustainability. Supermicro's booth will highlight the latest servers supporting Intel's 4th Gen Intel® Xeon® Scalable processors, 4th Gen AMD EPYC™ processors, and the new generation of NVIDIA H100 GPU Accelerators. To learn more about Supermicro's presence at Computex 2023, please visit: https://learn-more.supermicro.com/computex What: Supermicro Keynote Address with Charles Liang: Where: Room 701, 7F, Hall 2, Nangang Exhibition Center (or online) When: June 1, 2023, (Thursday) (GMT+8) 1:30 PM – 2:30 PM What: Forum Presentation with Mory Lin – Redefined Performance at The Edge Computing for AIoT and Telecom Open RAN Modern Workload Optimization Where: 1F, Hall 2, Nangang Exhibition Center, Taipei When: May 31, 2023 (Wednesday) (GMT+8) 2:30 PM – 4:00 PM What: Supermicro Booth Where: Taipei Nangang Exhibition Center, Hall 1, 4F Booth M0320 When: May 30, 2023, thru June 2, 2023 About Supermicro Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first to market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are transforming into a Total IT Solutions provider with server, AI, storage, IoT, and switch systems, software, and services while delivering advanced high-volume motherboard, power, and chassis products. The products are designed and manufactured in-house (in the US, Taiwan, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power and cooling solutions (air-conditioned, free air cooling or liquid cooling). Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc. All other brands, names, and trademarks are the property of their respective owners.

文章來源 : PR Newswire 美通社 發表時間 : 2023/5/24 瀏覽次數 : 722 加入收藏 :

Global Business News

World's First Mini-PC with Solid-State Active Cooling Debuts at ZOTAC COMPUTEX 2023

Pioneering hardware, AI edge computing solutions, and Sony Animation partnership to be showcased on May 30, 2023 HONG KONG, May 24, 2023 /PRNewswire/ -- ZOTAC Technology, a pioneering global manufacturer of innovative hardware solutions, will return to COMPUTEX 2023 to showcase its continual push for innovation. At this year's exhibition, ZOTAC will unveil a series of ZBOX Mini PC products with unprecedented technologies alongside a showcase of various business-to-business solutions that ZOTAC has to offer. Additionally, the booth will highlight ZOTAC's collaboration with Sony Animation's Spider-Man™: Across the Spider-Verse, showcasing state-of-the-art graphics cards alongside movie-inspired PC builds. World's First Mini-PC with Solid-State Active Cooling Debuts at ZOTAC COMPUTEX 2023 ZBOX PI430AJ WITH AIRJET® THE WORLD'S FIRST SOLID-STATE ACTIVE-COOLED MINI-PCZOTAC's COMPUTEX 2023 booth will showcase a live demonstration of the world's smallest Mini PC equipped with the revolutionary AirJet® solid-state active-cooling solution. This groundbreaking mini-PC will be the first product of its kind in the world to feature the revolutionary technology by Frore System. The two AirJet® Minis inside the PI430AJ can remove a significant amount of heat with its rapid airflow. That, coupled with the AirJet® Minis' small size and silent operation makes them ideal solutions for raising thermal limits and boosting performance without compromising form-factor. Taking advantage of the newfound possibilities enabled by AirJet®, the ZBOX PI430AJ boasts superb performance when compared to PCs of similar form-factor, with an Intel® Core™ i3 processor, 8GB LPDDR5 memory, M.2 SSD storage slot and more — all within a tiny, pocket sized PC. ZBOX E SERIES WITH GEFORCE RTX 40 SERIES GPUsWith the release of next-generation GeForce RTX 40-series GPUs powered by the cutting-edge NVIDIA Ada Lovelace architecture, the ZOTAC enthusiast ZBOX lineup is also getting an exciting update: the all-new MAGNUS ONE, which has been upgraded with the newest generation Intel® Core™ socketed processor and a GeForce RTX™ 4070 desktop graphics card; and the MAGNUS EN series, also has been upgraded with the GeForce RTX™ 4070 laptop graphics card. Both machines have distinct form factors that deliver greater performance to gamers and content creators alike, while taking up little desktop space. At the booth, ZOTAC will also showcase a special, MAGNUS ONE in a white colorway, to give visitors a whole new perspective of this capable little machine. ZOTAC SOLUTIONS – PAVING THE WAY FOR AIZOTAC caters to the increasing demands of AI applications in edge computing contexts, by offering a full range of hardware that emphasizes round-the-clock performance, longevity, scalability and modularity. At COMPUTEX 2023, ZOTAC's booth will showcase the company's latest computing solutions with a focus on AI applications. ARM-BASED NVIDIA JETSON™ SolutionsZOTAC embedded solutions powered by NVIDIA Jetson™ are cost-effective, small form-factor units optimized for power-efficiency and 24/7 operation. Powered by the world's leading platform for AI edge computing, these ARM-based solutions are compatible with many sensors, SDK, services and products, speeding up development and deployment of AIoT applications, as well as providing a cost-effective solution for digital signage, such as menu boards and billboards. ZBOX PRO MINI PCThe ZOTAC ZBOX PRO line are embedded solutions based on more conventional mini PCs which already feature rich expansion capabilities, discrete design and high performance, with the added benefit of more robust exteriors and integrated hardware watchdogs not available in off-the-shelf hardware. This makes the ZBOX PRO line an ideal choice for a diverse range of projects which requires specialized hardware with extended lifecycles. NVIDIA Embedded GPU ProductsZOTAC also has a comprehensive selection of NVIDIA Embedded MXM GPU modules on offer. These modules deliver the right graphical performance to the user, even in the most demanding of industrial conditions. ZOTAC's embedded modules also have extended product availability, serving the long-term development needs and life-cycles of a vast array of systems across diverse sectors such as AI, healthcare, manufacturing, visual communications, and beyond. Accompanying the ZOTAC B2B Solutions showcase will be a series of practical case study demonstrations, underscoring ZOTAC's readiness to tackle the challenges of tomorrow. ZOTAC GAMING X SPIDER-MAN™: ACROSS THE SPIDER-VERSE – A HERO'S SHOWCASETo celebrate the imminent release of Sony Animation's highly anticipated Spider-Man™: Across the Spider-Verse, ZOTAC's booth will have a takeover by the beloved superheroes as a part of the ZOTAC "POWER THE HERO IN YOU" campaign. Discover exclusive Spider-Man™: Across the Spider-Verse inspired Graphics Card bundles and two masterfully designed custom PC builds featuring ZOTAC GAMING GPUs. Experience ZOTAC Pushing Limits and Expanding Possibilities in-person at Booth No. M1120, 4/F, NANGANG Exhibition Hall, from May 30, 2023 to June 2, 2023. For more information, please visit ZOTAC's event page. ABOUT ZOTAC TECHNOLOGY LIMITEDZOTAC Technology Limited, a global pioneer in computer hardware and electronics since 2006, delivers cutting-edge products emphasizing quality, performance, and reliability across graphics cards, mini PCs, and accessories, earning recognition and accolades throughout the industry through the dedication to rigorous standards and the relentless pursuit of excellence. In 2017, a sub-brand, ZOTAC GAMING, was launched with a focus on elevating the gaming experience for gamers around the world. ABOUT FRORE SYSTEMSFrore Systems is the developer of breakthrough thermal technology for electronic and consumer devices. The company's active cooling chips, AirJet®️ Mini and AirJet®️ Pro, are integrated into devices to remove heat silently, resulting in major performance gains. Frore Systems is headquartered in San Jose, CA with an office and manufacturing facility in Taiwan. MARVEL and all related character names: © & ™ 2023 MARVEL ZBOX PI430AJ WITH AIRJET® THE WORLD’S FIRST SOLID-STATE ACTIVE-COOLED MINI-PC MAGNUS ONE ERP74070C (left) , MAGNUS ONE White Edition (center), MAGNUS EN EN374070C (right) (Final Products may differ from image)

文章來源 : PR Newswire 美通社 發表時間 : 2023/5/23 瀏覽次數 : 1232 加入收藏 :

Global Business News

Aetina to Showcase Its New AI Solutions for Different Vertical Markets at Computex 2023

NEW TAIPEI CITY, Taiwan, May 19, 2023 /PRNewswire/ -- Aetina, a leading AI solution provider, will showcase its latest computing systems, platforms, hardware, and software tools for use in AIoT during Computex 2023 at booth I0810 with its parent company—Innodisk. The solutions, ideal for the development and deployment of AI applications for different verticals, involve state-of-the-art GPUs, ASIC-based AI accelerators and AI computers; computing systems and platforms built with NVIDIA Jetson Orin system-on-modules (SoMs); high-performance x86 AI inference platforms; cloud management platforms for edge devices; and live demos of AI-powered applications that are applicable to various industries. Aetina to Showcase Its New AI Solutions for Different Vertical Markets at Computex 2023 GPU, ASIC-Based Hardware, Systems, and Platforms for Video Analytics, AI Acceleration and Edge Computing Aetina offers NVIDIA Ampere architecture-based GPUs in the Mobile PCI Express Module (MXM) form factor, AI accelerators, and computing systems built with application-specific integrated circuit (ASIC) chips. The GPUs are ideal for real-time inference processes and can enhance the computing capabilities of existing systems; the ASIC-based hardware and systems, on the other hand, are designed for multiple, simultaneous video analytics tasks. Systems and Platforms Powered by NVIDIA Jetson Orin SoMs At Computex 2023, Aetina will showcase its latest Jetson series systems and platforms that support NVIDIA Jetson AGX Orin, Orin NX, and Orin Nano SoMs. These systems and platforms are designed in different form factors, including the recently released fanless embedded computer models. The form factors enable smoother system integration processes for AI application creators due to their size, power efficiency, and operating temperature range. In addition to its standard models, Aetina provides customization services for SoM carrier boards, development kits, and chassis with on-demand I/O requirements and thermal designs that fit into harsh environments. New High-Performance x86 AI Inference Platform Aetina's new AI inference platform is a high-performance x86 embedded computer that features a high-level CPU and supports up to two M.2 AI accelerators built with ASIC chips, as well as up to two passively cooled graphics cards for AI performance upgrades. The inference platform's innovative chassis design greatly simplifies computer maintenance, requiring minimal effort from users to clean, replace cooling fans, and add or remove graphics cards, storage devices from the motherboard. Cloud Management Platform AI system owners can efficiently manage their edge devices with EdgeEye, a software tool developed by Aetina to help users monitor the running status of edge devices in their system networks. Using any web browser and smart device, EdgeEye users can quickly find malfunctioning edge systems in different locations and proceed with proper repair or maintenance work in a timely manner. Solution Demos Aetina's solution demos feature a range of applications, including smart EV chargers, multi-video analytics, and AI intrusion detection. These demos utilize Aetina's computing systems and platforms, as well as AI technologies provided by partners from its AI ecosystem network. With its partners' AI hardware and software, Aetina aims to deliver integrated solutions that enable developers to create AI applications suitable for different vertical markets.

文章來源 : PR Newswire 美通社 發表時間 : 2023/5/19 瀏覽次數 : 3689 加入收藏 :

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