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TECNO will unveil its latest advancements, showcasing cutting-edge AI and AR devices, innovative smartphones, imaging technologies, AIoT products, and revolutionary concepts, marking a stride into the future of innovation. HONG KONG, Feb. 6, 2024 /PRNewswire/ -- Innovative technology brand TECNO is delighted to announce it will be taking part in MWC Barcelona 2024. Following its debut at the event in 2023, TECNO will be revealing the endless possibilities of innovation by showcasing its latest breakthroughs and technologies. From a futuristic robotic dog and the industry's first combined AR glasses and Windows gaming handheld set, to innovative concept materials, leading smartphones and AIoT devices, TECNO will be embracing the technologies of tomorrow as it reaches for the future. The brand's stand will be located at 6B11, Hall 6, Fira Gran Via. TECNO will return to MWC Barcelona following a hugely successful debut appearance in 2023 "We're thrilled to be returning to MWC Barcelona with an incredible lineup of innovations and technologies," said Jack Guo, General Manager of TECNO. "This international event is an excellent platform for us to demonstrate how our 'Stop at Nothing' brand essence empowers us to reach for the future and deliver the technologies of the future to our global users." Last year, TECNO made a stunning debut appearance at MWC Barcelona, where it made headlines with the launch of the outstanding PHANTOM V Fold smartphone – a remarkable foldable device that made multiple "Best Of" lists. This year, as well as its existing lineup of products, TECNO will be unveiling futuristic AI and AR technologies, launching the new smartphone POVA 6 Pro 5G, and showcasing imaging innovations, new concepts, and more. Visitors to TECNO's stand at MWC Barcelona 2024 can expect to see: Futuristic TECNO AI and AR Technologies: Bringing the technologies of tomorrow to today, TECNO's forward-looking spirit will be clear to see with its pioneering new AI and AR devices. Dynamic 1 – An intelligent dog that is a remarkable innovation of robotics with AI and realistic features inspired by the German Shepherd. With advanced algorithms and powerful sensors, Dynamic 1 is capable of intuitively understanding commands and performing life-like actions, infusing the joy of pet ownership with a remarkable technological element. Pocket Go – Pocket Go is the industry's first Windows AR gaming set that combines AR glasses and a Windows handheld. The lightweight and portable set brings users a new immersive AR gaming experience. Imaging Innovations: Two major breakthroughs demonstrate TECNO's commitment to revolutionizing the smartphone imaging experience. Industry-leading imaging technology – powered by the industry's pioneering floating-point computing brings the new pinnacle of mobile video imaging to users around the world. Universal Tone – The industry's most advanced AI-powered multi-skin tone imaging technology uses newly collected, unbiased data, and three advanced AI-powered engines to more accurately capture the true beauty of diverse skin tones. Groundbreaking Concepts: Imaginative and high-tech concept devices, materials and technologies shine a light on TECNO's ambition as it reaches for the future. PHANTOM Ultimate – TECNO's first rollable screen concept smartphone, features an innovative double-sided screen that extends from 6.55" to 7.11", leading a revolution in the large-screen user experience. Advanced materials and technologies – Cutting-edge environmentally friendly materials such as the new organosilicon fabric leather, layered fiberglass, 3D stereo optical grating, colored textured glass, and more. Additionally, the latest technologies to improve user experience such as the borderless foldable main screen and satellite communication technology. Visitors will also be able to experience a wide range of TECNO's most advanced smartphones including the PHANTOM series, TECNO's flagship product line with pioneering design and frontier technologies, the CAMON series with its professional camera experience and artistic design, the fashionable Gen Z-focused SPARK series and the immersive gaming and endurance powerhouse POVA series. What's more, TECNO will officially unveil its latest POVA 6 Pro 5G smartphone – a new device built for super endurance and optimized entertainment – on day one of MWC Barcelona 2024. The brand will also release the MEGABOOK T16 Pro 2024 Ultra, the industry's first batch of laptops featuring the latest Intel® Core™ Ultra processors, to provide users with best-in-class AI experience and performance. With its appearance at MWC Barcelona 2024, TECNO is continuing to build its growing reputation as a pioneering brand on the global stage. Attendees are welcome to visit TECNO's stand to discover how it is pulling the future closer and using technology to inspire global users to never stop chasing their dreams.
XR-4 系列充分發揮了 NU4100 視覺處理器無與倫比的效能，實現了多相機的高解析度、低延遲視訊串流，進一步縮小了機器與人類視覺感知之間的差距 以色列賴阿南納2024年2月6日 /美通社/ -- 工業級 VR/XR 軟硬體領域的技術領導者 Varjo 近期發佈新一代的 XR-4 系列頭戴式顯示器。XR-4 系列採用 NU4100 視覺處理器，首次將多傳感器、低延遲直通功能帶入混合實境市場。 The XR-4 Series deploys the Inuitive NU4100 vision-on-chip processor to first bring multi-sensors, low-latency pass-through capability to the mixed reality market XR-4 系列於 2023 年 11 月在 I/ITSEC 大會上隆重亮相，為工業用戶量身打造，瞄準需要最高視覺保真度與最高沉浸度的使用狀況。XR-4 頭戴式顯示器搭載兩個 4K 螢幕，視野範圍比前代產品擴大了 50%。該系列產品具有更明亮的螢幕和更寬廣的色調，增強了整體視覺體驗。XR-4 配備兩個 2000 萬畫素的前鏡頭，可實現「視訊直通混合現實」功能，用戶能夠透過嵌入式鏡頭感知周圍環境，呈現獨特的虛實合一視角。該裝置還搭載內向外追蹤功能和 Varjo 控制器，能夠在虛擬與現實環境中無縫導航。為了提供全面的沈浸式體驗，XR-4 充分發揮 NVIDIA 圖形處理器的強大功能，達到逼真的渲染效果。目前，XR-4 系列已開始接受企業訂單，在培訓與模擬、國防、汽車、醫療等行業的主要客戶中廣受好評。 NU4100 晶片視覺處理器選用了 Inuitive 視覺處理器系列的第三代產品，是機器人、無人機、VR 和邊緣 AI 應用的理想之選，這些應用場景需要多個感測器的聚合、處理、打包和串流。這款視覺處理器專為 XR 頭戴顯示裝置、機器人和其他應用設計，這些應用場景使用六個、八個或更多相機來感知和分析環境，並基於這些輸入做出即時可行的決策。Inuitive NU4100 處理器中整合的先進視覺技術進一步提升了 Varjo XR-4 系列頭戴式顯示器的卓越性能。 Varjo 行政總裁 Timo Toikkanen 表示：「在我們尋找理想夥伴一同開發本平台時，我們看到了 Inuitive 在技術、服務和靈活性的完美結合。事實證明，Inuitive 是一個極具創新精神的合作夥伴，能夠打造出滿足 Varjo 苛刻要求的端到端視覺處理平台。」 Inuitive 行政總裁兼聯合創辦人 Shlomo Gadot 表示：「 NU4X00 視覺處理器系列涵蓋了傳統產品和即將推出的新品，是需要高速、低延遲地從多個感測器串流傳輸視訊的應用的首選處理器， 同時也能保持串流的精確時間戳記和串流同步。我們將持續投資，推進我們的視覺處理器系列，並推動產業和創新向前發展。」 關於 Inuitive Inuitive 顛覆性的晶片視覺處理器推出了多合一晶片，具有廣泛的整合功能、出色的性能、最佳的尺寸和最佳成本效益。這些改變遊戲規則的處理器可同步支援深度感測、定位、定位算法 (SLAM) 以及基於人工智慧的物體偵測和識別，同時大幅縮短系統延遲和回應時間，節省功耗並提高整體效能（高幀速率和相機解析度以及寬視野角）。 Inuitive 與其技術生態圈中，機器感測、軟體開發和商業製造領域的合作夥伴一起，將公司為企業打造且整合傳感器與處理器的模組整合進客戶的機器人、無人機、 AR 、 VR 、 AIoT 和 3D 傳感應用中，提供接近人類的視覺理解、最佳能力與卓越性能。 如欲了解更多資訊，請瀏覽 www.inuitive-tech.com 或在 LinkedIn 上搜尋我們：https://www.linkedin.com/company/inuitive。 關於 Varjo Varjo (發音為 var-yo) 生產革命性的 VR/XR 軟硬體，讓您能夠以極高的清晰度看到和體驗虛擬與擴充內容，就像在真實世界中看到的一樣清晰。我們的虛擬實境和混合實境頭戴式顯示器將您的表現和情感沈浸帶入全新境界，真實再現現實生活中的確切感覺和現實條件，讓您表現得更好，學習得更快。 如欲了解更多資訊，請瀏覽 http://www.varjo.com/ 或在 LinkedIn 上搜尋我們：https://www.linkedin.com/company/varjo。 聯絡方式Inuitive 業務開發副總裁 Gur Dror 行動電話：+972 54 448 8908 電郵：gurd@inuitive-tech.com Varjo電郵：press@varjo.com
The XR-4 Series leverages the unparalleled capabilities of the NU4100 vision processor to achieve high-resolution, low-latency video streaming from multiple cameras, bridging the gap towards human-like visual perception RA'ANANA, Israel, Feb. 5, 2024 /PRNewswire/ -- Varjo, the technology leader in industrial-grade VR/XR hardware and software, recently announced its next-generation XR-4 Series headsets. The XR-4 Series deploys the NU4100 vision-on-chip processor to first bring multi-sensors, low-latency pass-through capability to the mixed reality market. The XR-4 Series deploys the Inuitive NU4100 vision-on-chip processor to first bring multi-sensors, low-latency pass-through capability to the mixed reality market The XR-4 Series, unveiled at the I/ITSEC conference in November 2023, is designed for industrial users, with a goal to cater use cases where highest-level visual fidelity and immersion are critical. Boasting two 4K displays, the XR-4 headset offers a 50% wider field of view compared to its predecessors. It features brighter displays and a broader color palette, enhancing the overall visual experience. Equipped with two 20-megapixel front cameras, the XR-4 facilitates 'video pass-through mixed reality' allowing users to perceive their surroundings through the embedded lenses, offering a unique blend of virtual and real-world perspectives. The device also features inside-out tracking and Varjo's controllers for seamless navigation in both digital and physical environments. To provide a comprehensive and immersive experience, the XR-4 utilizes the powerful capabilities of NVIDIA GPUs for photorealistic rendering. Currently open for enterprise orders, the XR-4 Series has been well received among key customer industries in training and simulation, defense, automotive, medical, and beyond. The NU4100 vision-on-chip processor is the third generation of Inuitive's vision processors series and is ideal for robotics, drones, VR, and edge-AI applications that demand multiple sensor aggregation, processing, packing, and streaming. It is specifically designed for XR headsets, robots and other applications that sense and analyze the environment using six, eight or more cameras, as they make real-time actionable decisions based on that input. The superior performance of the Varjo XR-4 Series headsets is enhanced by the advanced vision-based technologies integrated into the Inuitive NU4100 processor. "When searching for the ideal partner to develop this platform, Inuitive emerged as the perfect combination of technology, service, and flexibility," stated Timo Toikkanen, Varjo's CEO. "Inuitive proved to be a highly innovative ally for crafting an end-to-end vision processing platform that meets Varjo's demanding requirements." "The NU4X00 vision-on-chip series, covering both legacy and upcoming products, stands as the preferred processor for applications requiring high-speed and low-latency streaming of video from multiple sensors, all while maintaining the streams accurately time-stamped and synchronized", said Shlomo Gadot, Inuitive's CEO and co-founder. "We remain committed to consistently invest in advancing our vision processor roadmap to drive industries and innovations forward." About Inuitive Inuitive's disruptive Vision-on-Chip processors introduce all-in-one chips with a wide range of integrated capabilities, outstanding performance, optimal size, and cost efficiency. These game-changing processors support simultaneous depth sensing, positioning, location algorithms (SLAM), and AI-based object detection and recognition while dramatically shortening both system latency and response time, saving power and improving overall performance (high frame rate and camera resolution, and a wide FOV). Together with its technological ecosystem of partners in the field of machine sensing, software development, and commercial manufacturing, Inuitive integrates its enterprise-ready sensor-and-processor modules into its customers' robotics, drones, AR, VR, AIoT, and 3D sensing applications, providing human-like visual understanding with optimal capabilities and superior performance. For more information, visit www.inuitive-tech.com or find us on LinkedIn at https://www.linkedin.com/company/inuitive. About Varjo Varjo (pronounced var-yo) makes revolutionary VR/XR hardware and software that together allow you to see and experience virtual and augmented content just as clearly as you see the analog world around us. Our virtual and mixed reality headsets take you to another level of performance and emotional immersion – recreating the exact feeling and conditions of real life, allowing you to perform better and learn faster. For more information, visit http://www.varjo.com/ or find us on LinkedIn at https://www.linkedin.com/company/varjo. Contact InformationInuitive Gur Dror, VP Business DevelopmentM. +972 54 448 8908E. gurd@inuitive-tech.com VarjoE. press@varjo.com
華碩智慧物聯網(ASUS IoT)今推出領先業界的超精巧邊緣電腦及嵌入式主機板，包括：C7146ES-IM-AA / C5143ES-IM-AA單板電腦(SBC)、EBS-S500W邊緣電腦與PE2200U無風扇嵌入式電腦，不僅搭載全新Intel® Core™ Ultra處理器，亦結合AI-ready CPU、GPU和NPU強化功能，以及卓越的電源效率，可滿足智慧零售、流量分析、醫療影像、公用事業管理和邊緣AI等廣泛應用，加速產業數位轉型。 華碩物聯網事業部暨NUC事業部總經理趙國維表示，「ASUS IoT很自豪向市場揭示我們最新、最頂尖的解決方案，其能淋漓釋放次世代人工智慧、邊緣運算效能，同時在與Intel密切合作下，將大幅提升開發進程，支援每台裝置執行更多媒體串流，再加上出色的使用壽命，確保產品發揮長久價值。」 AI-ready震撼性能！ 全新Intel® Core™ Ultra處理器，AI效能較前代高出1.5倍，最多可搭載14顆核心、20個執行緒，運作功率達15瓦[1]，搭配Intel 4製程，能為用戶帶來卓越的單位功率效能，成為新一代邊緣/物聯網平台的理想首選；此外，DDR5-5600記憶體亦有助實現IT/OT無縫整合，以及可靠的低延遲表現；強大的AI與自動化功能，則可簡化ASUS IoT解決方案運作，增進企業生產力。 Intel® Core™ Ultra處理器另內建Intel Arc™ GPU，可減少對獨立GPU的需求，並支援高達50個HDR視訊串流，除呈現鉅細靡遺的視覺效果，還能加快常見的AV1編解碼器執行速度，提供優於H.265的壓縮效率。 C7146ES-IM-AA、C5143ES-IM-AA 3.5吋單板電腦 C7146ES-IM-AA和C5143ES-IM-AA均支援高達64 GB的雙通道DDR5-5600MHz記憶體，且可透過HDMI®2.0、DisplayPort™ 1.4、USB-C和LVDS等多元介面，成就優異的四顯示器組態/eDP，特別適合視訊、智慧零售、無人搬運車(AGV)與自主移動機器人(AMR)等應用場域。 EBS-S500W邊緣電腦 BS-S500W擁有豐富的連線及擴充選項，包括：USB 3.2、USB 2.0、USB-C和COM連接埠，同時內建可因應未來需求的M.2插槽，以支援LTE/5G和WiFi/BT等功能。 PE2200U無風扇嵌入式電腦 提高電源效率的PE2200U，採用堅固的設計架構，並具備-20至60°C寬溫範圍，以及各式連接選項，如：可擴充至四組的雙LAN、兩個PoE連接埠、七個USB插槽、四個COM連接埠與M.2插槽，使用更彈性靈活。 [1] MTL-H搭載的動態架構，最多可結合6顆採用Intel®超執行緒技術的效能核心，以及多達8顆效率核心，且效能會因使用、組態和其他因素而異，如需瞭解更多資訊，請參考intel.com/processorclaims：Intel® Core™ Ultra處理器,Edge。
Revolutionizing Data Center Connectivity: FIT Unveils 224G Data Rates at DesignCon 2024 - A Leap Forward in AI and Machine Learning Era HONG KONG, Jan. 31, 2024 /PRNewswire/ -- Foxconn Interconnect Technology (FIT), a frontrunner in the data center connectivity industry, proudly announces the launch of its 224G data rates for high-speed I/O and near-chip connectivity at this year's DesignCon. This groundbreaking development in 224G signifies a strategic step forward, preparing FIT and its key customers for the burgeoning data rates propelled by advancements in AI and machine learning. The 224G standard demands exceptional levels of signal integrity, mechanical robustness, and manufacturing precision. Terry Little, Development Engineering Manager and System Architect at FIT, states, "Connectors with 224G interfaces require innovative design approaches, extending beyond conventional development norms. This necessitates creative thinking in electrical contact design, tighter mechanical and manufacturing tolerances, and more stringent assembly processes." FIT is dedicated to offering these specialized capabilities to the industry, providing crucial thermal and mechanical design guidance for QSFP-DD1600 and OSFP MSAs. Alex An, Senior Director of Business Development at FIT, emphasizes, "Our amalgamation of industry experience near the chip, extensive manufacturing knowledge, and expertise in high-volume automation creates the perfect synergy to significantly contribute to high-speed MSAs or consortiums. These components are essential in driving AI, hyperscale, and enterprise solutions. FIT stands out in its ability to pioneer and scale copper connectivity solutions originating from the chip, including co-packaged solutions, near-chip connectors, and 224G internal cabling to IO." FIT is swiftly progressing in the development of near- or on-chip connectivity. With the expansion of the back-end network, there's a pressing need to move beyond traditional board layers. Alex adds, "The challenge extends beyond high speed – managing power is also a critical hurdle. As a provider of connector solutions, our focus is on integrating high power density into mission-critical components without sacrificing other architectural aspects. Collaborating with our clients to solve these pivotal challenges remains a primary focus of our efforts." Aligned with its '3+3 strategy', FIT is concentrating its resources on key markets such as Electric Vehicles (EVs), Audio, and 5G AIoT to foster margin growth. The company is enthusiastic about showcasing its latest innovations at DesignCon 2024, underscoring its commitment to its customers and their growth in these vital sectors. For more information about FIT and its innovative solutions, please visit booth 619 at DesignCon 2024. About FIT (Foxconn Interconnect Technology) Hon Teng (HK.6088) FIT is a market leader of interconnect solutions for mobile devices, digital computer and consumer electronics, communication infrastructure, automotive, industry and medical applications and connected smart devices. For more information about FIT, please see: www.fit-foxconn.com. Email: fit-ir@fit-foxconn.com sales-usa@fit-foxconn.com
TAIPEI, Jan. 31, 2024 /PRNewswire/ -- DFI, the world's leading brand in embedded motherboards and industrial computers, is targeting the AI application market by launching the embedded system module (SOM) MTH968 equipped with the latest Intel® Core™ Ultra processor. It is the first product integrated with an NPU (Neural Processor Unit) processor, representing the official integration of AI with industrial PCs (IPCs). With the expansion into AI IPC, DFI expects to inject new momentum into the AI edge computing market. According to the STL Partners report, the potential market value of global edge computing will increase from US$9 billion in 2020 to US$462 billion in 2030, representing a compound annual growth rate (CAGR) of 49%. Therefore, the development of products that utilize the core capabilities of chips to rapidly execute AI edge computing in devices has become a key focus for many major technology companies. DFI's MTH968 adopts the COM Express (COM.0 R3.1) Type 6 module standard and is equipped with an Intel Meteor Lake processor, marking the debut of integrated CPU, GPU, and NPU on a single chip. Two "low-power, high-efficiency cores (LP E-core)" are built in, reducing power consumption by 30% to 50%, optimizing the CPU by 10%, and improving GPU performance by up to 114% compared to previous generation Intel processors. The built-in NPU of Meteor Lake enhances the performance of the MTH968 in critical AI tasks. Based on new AI computing architecture, the device can more efficiently process advanced AI edge computing, complex graphics computing, and other applications, while saving data on cloud costs. The MTH968 has highly customizable integration capabilities and a fanless wide temperature design(operating from -40°C to 85°C), and utilizes DDR5 and NVMe SSD to optimize high-efficiency computing performance, reduce latency, and enhance storage speed. The MTH968 can be widely used in AIoT fields such as industrial automation, smart transportation, and smart agriculture. As 5G, edge computing, and remote control tech advance, IPCs directly handle complex tasks through AI edge computing. DFI's MTH968 excels in high-performance computing with account energy efficiency, enhancing computing and customizable flexibility, thereby accelerating industrial AI application upgrades. Key features: Equipped with Intel® Core™ Ultra processor (Meteor Lake) Supports dual-channel DDR5 and NVMe SSD Fanless and wide temperature design: -40°C to 85°C Compact size: 95mm * 95mm Com Express Type 6 For more information: LinkedIn or contact us. Contact eva.chen@dfi.com evelyn.chang@dfi.com
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