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New, ultra-compact UPS offers next-generation power protection for critical infrastructure environments, including AI-ready data centers, semiconductors, commercial, and industrial manufacturing facilities Pioneering high-density design and fault-tolerant architecture maximizes availability and offers up to 99% efficiency while minimizing total cost of ownership Includes enhanced safety and cybersecurity features, remote monitoring capabilities, and services plan for maximum lifespan and exclusive support HONG KONG SAR - Media OutReach Newswire - 7 April 2025 – Schneider Electric, the leader in the digital transformation of energy management and automation, has announced the launch of its new Galaxy VXL – a highly efficient, compact, modular, scalable, and redundant 500-1250 kW (400V) 3-phase uninterruptible power supply (UPS), complete with enhanced cybersecurity, software, and safety features. Galaxy VXL UPS At just 1.2m2 with a power density of up to 1042 kW/m2, Galaxy VXL sets a new benchmark in efficient, sustainable, and advanced UPS technologies. Available immediately in all 400V IEC regions worldwide, Galaxy VXL delivers the highest levels of power performance for AI, colocation, and hyperscale data center environments, as well as large-scale critical infrastructure and electrical systems within commercial buildings and industrial facilities. With its industry-first compact design, high-density power provision, and AI-load tolerant design, Galaxy VXL maximizes uptime and availability for the most energy-intensive infrastructure systems – being capable of powering up to 1.25 MW in one frame, and up to 5 MW with 4 units running in parallel, while increasing both operational and energy efficiencies to help minimize customers' total cost of ownership (TCO). Through its patented operating technologies, Galaxy VXL delivers up to 99% in its high-efficiency eConversion mode, and up to 97.5% efficiency in double conversion mode, providing Class-1 power protection alongside leading levels of energy reduction, while lowering the UPSs' carbon emissions by a factor of two. With a 52% smaller footprint compared with the industry average, its scalable, modular design also enables N+1 levels of redundancy to increase the system level of availability by a factor of 10. Further, through its modular architecture, customers can reduce their capital expenditure (CapEx) by purchasing power modules as they need them, enjoying optimized energy efficiency, and adding more power modules as demands grow. Galaxy VXL is also compatible with both Lithium-ion and VRLA batteries, and with its Live Swap function, allows for greater uptime, availability, and easier serviceability – offering highly resilient, flexible, and predictable runtimes for data center, IT, and critical electrical loads. This is complemented by anywhere remote monitoring via Schneider Electric's EcoStruxure IT software, and enhanced security and ethernet connections, which are certified to the latest IEC 62443-4-2 security standards, providing a completely secure and connected remote management experience. "As dependency on large-scale infrastructure systems grows at an unprecedented rate, it's crucial that customers can access the most sustainable, resilient, and efficient technologies to safeguard their critical systems, while minimizing their energy and environmental impact," said Tarunjeet Sarao, SVP Data Center Systems, Schneider Electric. "Our new Galaxy VXL UPS combines a compact, innovative, and highly efficient design with enhanced safety features, providing world-leading power protection for a wide range of AI, data center, and industrial applications. This ensures the high-density workloads of the future are supported by unparalleled levels of reliability." Key features and benefits Schneider Electric's Galaxy VXL has been designed to offer record breaking power densities, and an AI-ready power architecture for the most energy-intensive workloads. For the first time, this new UPS provides customers with a 1.25 MW scalable and modular solution with 125 kW/3U power modules in 1.2m2 footprint, while being capable of supporting up to 1.25 MW of critical load in one frame and up to 5 MW with 4 units in parallel in only 4.8m2 space. Key benefits include: Modular, scalable, high-power design: With a power density of 1042 kW/m2, customers can deploy a 1.25 MW modular UPS in a single frame, and add power modules incrementally via pay-as-you-grow flexibility. Smaller footprint: Standing at 1.2m2, Galaxy VXL has a 52% footprint improvement compared with industry average, with full front access and no rear clearance, offering better power and space utilization. Increased efficiency and sustainability: Galaxy VXL provides up to 99% efficiency in eConversion mode and up to 97.5% efficiency in double conversion mode. Its compact footprint means raw material reduction, less packaging, and includes SPoT (Smart Power Test) mode for UPS and Power Module testing, saving electricity. Lower CapEx and OpEx: Improved operational and energy efficiencies provide a catalyst for lower electricity bills, and ease of service/maintenance equates to lower labor cost for a better TCO. Reinforced, resilient design: Galaxy VXL utilizes conformal-coated boards, 100 kA short circuit rating and optional seismic kit for a robust mechanical design. Enhanced cybersecurity and safety: Galaxy VXL is certified to the latest IEC 62443-4-2 security standards and includes Live Swap technology to allow power module replacements, with zero downtime. Perfect for prefabricated data centers: With a smaller physical footprint, higher efficiency, and lower cost, Galaxy VXL provides a resilient backbone for the prefabricated data centers of the future. Scaling up to customer demands for AI systems To meet customer demands for AI systems, Schneider Electric has increased manufacturing and production capacity at a host of its global factories. Additionally, Galaxy VXL will be available at Schneider Electric's Sant Boi, Barcelona and Xiamen, China Factories, where it will be integrated to form the resilient backbone for Schneider Electric's prefabricated, modular range of high-compute workload data center solutions. Schneider Electric's Galaxy VXL is available for order immediately. For more information, visit the website. Related resources: Schneider Electric Announces New Solutions to Address the Energy and Sustainability Challenges Spurred by AI Solving AI's growing pains at the edge with modular data centers Schneider Electric Increases Production Capacity at its Largest Data Center Factory in Europe Hashtag: #EcoStruxure #UPS #Datacenter #AIhttps://www.se.com/hkThe issuer is solely responsible for the content of this announcement.About Schneider ElectricSchneider's purpose is to create Impact by empowering all to make the most of our energy and resources, bridging progress and sustainability for all. At Schneider, we call this Life Is On. Our mission is to be the trusted partner in Sustainability and Efficiency. We are a global industrial technology leader bringing world-leading expertise in electrification, automation and digitization to smart industries, resilient infrastructure, future-proof data centers, intelligent buildings, and intuitive homes. Anchored by our deep domain expertise, we provide integrated end-to-end lifecycle AI enabled Industrial IoT solutions with connected products, automation, software and services, delivering digital twins to enable profitable growth for our customers. We are a people company with an ecosystem of 150,000 colleagues and more than a million partners operating in over 100 countries to ensure proximity to our customers and stakeholders. We embrace diversity and inclusion in everything we do, guided by our meaningful purpose of a sustainable future for all. www.se.com/hk Discover the newest perspectives shaping sustainability, electricity 4.0, and next-generation automation on Schneider Electric Insights.
SAN JOSE, Calif., March 20, 2025 /PRNewswire/ -- LITEON Technology (2301.tw) is making its debut at the GTC 2025 conference, showcasing solutions specifically designed for the NVIDIA GB200 NVL72 and NVIDIA GB300 NVL72 systems. With integrated power, cabinet, and liquid cooling systems, LITEON provides high power density solutions that align with the NVIDIA Blackwell architecture. These solutions help customers accelerate the integration of next-generation AI server cabinets, creating efficient and energy-saving data centers to meet the growing demands of high-performance computing in the AI era. LITEON is unveiling the following solutions for the first time: LITEON Showcases Solutions Supporting Next-Generation NVIDIA AI Data Center Architecture at GTC 2025 55 kW rack-mounted power shelf that meets NVIDIA MGX rack specifications 33 kW RU high-efficiency lithium battery backup unit (BBU) cold plate compatible with NVIDIA GB300 NVL72 new generation of compact liquid-to-air 140 kW sidecar cooling cabinets 120 kW in-rack CDU compatible with the NVIDIA MGX NVL72 architecture Additionally, to address the power consumption required by increasing computing density, LITEON is unveiling a next-generation integrated power solution, co-developed with NVIDIA, making its first appearance at the GTC conference. "LITEON provides comprehensive integrated power management and liquid cooling solutions that not only enhance data center performance and reliability but also meet the needs of various AI application scenarios," said Anson Chiu, the president of LITEON Technology. At the 2025 NVIDIA GTC conference, LITEON Technology, in collaboration with its partners, is showcasing the NVIDIA GB300 NVL72 system. This demonstrates LITEON's capabilities in customized power cabinets and liquid cooling system design and integration. Leveraging its core technology in advanced power management, innovative mechanic design, and core competitive advantages in hardware and software integration, LITEON aims to deliver the best AI computing experience to meet the high-performance AI computing needs of customers' data centers. For more information about LITEON data center power solutions and liquid-cooling solutions, please visit https://liteon-cips.com/.
SHANGHAI, Jan. 13, 2025 /PRNewswire/ -- Eshallgo Inc ("Eshallgo" or the "Company") (NasdaqCM: EHGO), one of the leading Chinese office integrator, agent, and service provider, today announced that on January 10th, 2025, Eshallgo, a company listed on the US stock market, through its subsidiary, Shanghai Yixiuge Enterprise Development (Group) Co., Ltd. (hereinafter referred to as "Yixiuge Group"), entered into a letter with Zhenjiang High-tech Development Group Co., Ltd. (hereinafter referred to as "Zhenjiang High-tech") to jointly establish a nationwide AI Data Center (the "Center") and Supply Chain Center in the field of office solutions, leveraging Zhenjiang High-tech's advantages in local policies, geographical location, and real estate resources. The establishment of the Center will fully utilize the advantages of data analysis to help EHGO better explore potential B-end users and transition from a traditional hardware seller to a company focusing on online sales and services on a new platform. At the same time, leveraging internet big data technology and deep extraction of data value, the Center will fully utilize AI's large data models in the field of office solutions to provide enterprises with a more professional and efficient office service experience. The Company is expected to significantly increase its market share, boost its annual revenue scale, and achieve a 100% growth in the group's overall sales revenue with the help of AI's large data models in the next two years. The cooperation with Zhenjiang High-tech will bring numerous advantages to EHGO. Firstly, it will provide the Company with excellent industrial supporting facilities, office space resources, cost advantages in land resources, as well as abundant talent resources, laying a solid foundation for the construction of the Company's data operation and supply chain center. Secondly, Zhenjiang is located in the heart of the Yangtze River Delta, with significant advantages in transportation convenience and cost, which will help the Company reduce operating costs, optimize the selection of upstream suppliers, further improve its overall operational efficiency, and enhance profitability. The presence of EHGO will also add high-quality international elements to Zhenjiang High-tech Industrial Development Zone, enhance its international reputation, create more job opportunities, and stimulate local economic development. Going forward, the Company will continue to uphold and implement its development philosophy of "Innovation, Collaboration, and Mutual Success," by actively seeking cooperation opportunities with high-quality enterprises to jointly promote the development of the China's office service industry and create greater value for shareholders and society. About Eshallgo Inc Eshallgo Inc is one of the leading office solution providers in China with a global vision. We specialize in two distinct market sectors: office supply sale and leasing, and after-sale maintenance & repair. We have created an extensive geographical presence, which expands throughout 20 provinces in China. Our mission is to become an office integrator and service provider, offer competitive overall office solutions and services, expand our service market beyond office equipment, and continue to create maximum value for customers. For more information, visit the Company's website at http://ir.eshallgo.com/. Forward-Looking Statements All statements other than statements of historical fact in this announcement are forward-looking statements. These forward-looking statements involve known and unknown risks and uncertainties and are based on current expectations and projections about future events and financial trends that the Company believes may affect its financial condition, results of operations, business strategy and financial needs. Investors can identify these forward-looking statements by words or phrases such as "may," "will," "expect," "anticipate," "aim," "estimate," "intend," "plan," "believe," "potential," "continue," "is/are likely to" or other similar expressions. The Company undertakes no obligation to update forward-looking statements to reflect subsequent occurring events or circumstances, or changes in its expectations, except as may be required by law. Although the Company believes that the expectations expressed in these forward-looking statements are reasonable, it cannot assure you that such expectations will turn out to be correct, and the Company cautions investors that actual results may differ materially from the anticipated results and encourages investors to review other factors that may affect its future results in the Company's registration statement and in its other filings with the SEC. For more information, please contact: Investor Relations:Sherry ZhengWeitian Group LLCPhone: 718-213-7386Email: shunyu.zheng@weitian-ir.com
BEIJING, Oct. 25, 2024 /PRNewswire/ --Chindata Group officially unveiled its latest innovation, the AI Data Center Total Solution 2.0, at the 2024 China Computing Power Conference. Designed to meet the growing demands of artificial intelligence (AI) workloads, the solution addresses critical challenges such as high-density cabinets, hyperscale facilities, and heterogeneous computing environments. The launch took place during the Data Center Technology Innovation and Transformation Forum, co-hosted by Chindata Group and the China Academy of Information and Communications Technology (CAICT). Held at the same conference, the forum brought together industry leaders from CAICT, China Telecom, Intel, Baidu, Alibaba Cloud, Inspur, Seagate Technology, and others to explore the latest advancements in intelligent computing and IT infrastructure for the AI era. Addressing Evolving Demands in AI Workloads The sharp rise in power consumption among GPUs and servers has led to data center clusters scaling beyond hundreds of megawatts. These trends present new challenges for traditional data center operations. As a leading data center operator, Chindata Group has developed a proactive strategy to address the increasing demand for computing power. The AI Data Center Total Solution 2.0 incorporates advanced prefabrication and modular building models, the innovative "X-Power" power system, the "X-Cooling" cooling solutions, and an AI-driven comprehensive operation and maintenance platform. This state-of-the-art solution is designed to support the accelerated growth of artificial intelligence and ensure high-quality and flexible business operations for customers. Key Features of AI Data Center Total Solution 2.0 1. Flexible Prefabrication and Modular Construction: Prefabrication and modular construction models are capable of being arranged and manufactured in various stages, which allows for the agile deployment of business operations while accommodating a wide range of hardware configurations, including CPUs and different types of AI accelerators. This modularity improves IT performance per square unit and addresses the growing high-density requirements of AI technologies. This solution delivers a fast, efficient response to the need for high computing power in the era of large models and general artificial intelligence (AGI). Utilizing this construction methodology, a hyperscale project can be completed and handed over to the client within 6 months in China, and within 8 months across the rest of the Asia-Pacific region. 2. X-Power Modular Power System: The upgraded "X-Power" system integrates over ten traditional components of power distribution into six primary modules: substations, generators, medium voltage units, low voltage units, batteries, and IT support equipments. These modules can be deployed in phases according to specific needs, allowing for flexible and scalable expansion. By reducing complexity, this system enhances power efficiency and accelerates the delivery of hyperscale facilities while maintaining the highest quality standards. The X-Power system is capable of supporting server cabinets with power densities of up to 132kW, providing robust power capacity for the most demanding AI and high-performance computing. 3. X-Cooling Solutions: The "X-Cooling" solutions offer comprehensive cooling systems that combine air cooling, liquid cooling, and hybrid cooling methods to address the high-density demands of AI-ready data centers. With capabilities ranging from cabinet power densities of 8kW to 150kW, and achieving a PUE as low as 1.10 with immersive liquid cooling, this solution integrates multiple cooling technologies and products, adapting to architectural, environmental, and geographical constraints. As traditional air cooling methods reach their limits in high-density environments, there is an increasing demand for liquid cooling in hyperscale data centers. In response, Chindata has initiated the development of industry standards for cold plate liquid cooling systems in China, leveraging the experience gained from developing and deploying X-Cooling solutions. These standards will ensure quality control throughout the lifecycle of the systems. 4. AI-Driven Operations and Maintenance: Chindata's integrated monitoring platform, combined with its data center operational management system, enables more automated and standardized management processes. By incorporating AI-driven solutions, the platform optimizes the control of critical systems, particularly the cooling systems, ensuring maximum efficiency and reliability. Chindata continues to refine its operation and maintenance protocols to meet the evolving demands of AI data centers. Industry Leadership in AI Infrastructure Zhang Binghua, Chief Technology Officer at Chindata Group, commented on the launch: "The rise of AI is fundamentally transforming the landscape of data center technologies. Chindata has always been committed to leading technological innovation, focusing on modularity, integration, and advanced prefabrication. With the AI Data Center Total Solution 2.0, we are well-positioned to meet the diverse computing needs of the AI era, ensuring the efficient translation of electrical energy into computational power." About Chindata Group Chindata Group is a leading carrier-neutral hyperscale data center solutions provider in the Asia-Pacific region, pioneering next-generation hyperscale data centers in China, India, and Southeast Asia. The company offers end-to-end services across the facility lifecycle, including planning, investment, design, construction, and operation. With a robust international development team, Chindata is expanding its data center clusters in Malaysia, India, and Thailand, and seeking further business opportunities in emerging markets across Asia-Pacific. For media inquiries, please contact: media@Chindatagroup.com
HONG KONG, Oct. 17, 2024 /PRNewswire/ -- FIT Hon Teng (6088-HK), a subsidiary of Hon Hai Precision Industry (2317-TW), will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit. Hosted by the Open Compute Project (OCP), this prestigious event brings together global leaders in hardware infrastructure design, addressing the evolving demands of modern data centers. At the summit, FIT will introduce solutions that tackle critical challenges in AI-driven data centers, including signal degradation, heat dissipation, and large-scale manufacturing scalability. FIT's AI rack connectivity innovations are designed to enhance signal integrity and optimize data transmission, all while incorporating advanced cooling technologies for high-density AI workloads. Key product highlights include: 224G+ sockets for XPU/GPU connectivity Co-packaged copper and optical architectures Power cables for ORV3 Active Optical Cables (AOC) OSFP1600 and QSFP-DD port configurations These solutions underscore FIT's commitment to driving innovation in the AI data center space, building on Foxconn's extensive industrial internet expertise to offer cutting-edge AI connectivity solutions to global data center customers. In addition to its AI connectivity offerings, FIT will present its immersion-cooled IT platform solutions at the summit. Terry Little, Development Engineering Manager at FIT, will lead a session titled "Optimizing Signal Integrity in Immersion-Cooled IT Platforms." The session will delve into the effects of dielectric fluids on high-speed signal lines, the challenges of high-speed testing in such environments, and innovative connector fixture strategies. These solutions are critical for ensuring reliable performance in harsh, high-density computing environments, such as AI data centers. By addressing key issues such as performance, efficiency, and scalability, FIT continues to play a pivotal role in supporting the growth of AI infrastructure across industries, further solidifying its leadership in AI data center solutions. About Foxconn Interconnect Technology (FIT Hon Teng) Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company's website at www.fit-foxconn.com Media Contact: Product and Service Inquiries:Email: fit-ir@fit-foxconn.com Europe and America Contact: sales-usa@fit-foxconn.com
Innovation: New full suite of leading-edge AI solutions based on the NVIDIA GB200 Grace Blackwell Superchip, through a strengthened partnership with Wistron and ecosystem partners Sustainability and energy efficiency: Embracing dielectric direct-to-chip liquid cooling with up to 2.5 kW TDP SAN JOSE, Calif. and TAIPEI, Oct. 15, 2024 /PRNewswire/ -- Wiwynn (TWSE:6669), a leading cloud IT infrastructure provider for hyperscale data centers, is unveiling a full suite of AI data center solutions and state-of-the-art liquid cooling technologies, on display at the upcoming Open Compute Project (OCP) Global Summit 2024 on October 15-17 at San Jose Convention Center (Booth #B11). Visit Wiwynn OCP 2024 Page As one of the first in line with NVIDIA GB200 NVL72-readiness, Wiwynn showcases the liquid-cooled, rack-level AI system, developed in close collaboration with Wistron Corporation. "The high power demands of AI are pushing the limits of data centers, and as the technology grows more complex, it's essential to enhance both performance and sustainability," noted William Lin, President of Wiwynn. "We're excited to showcase Wiwynn's complete AI and advanced cooling solutions at OCP Global Summit 2024. This year, we're demonstrating how our technology creates unprecedented performance and efficiency to empower data centers worldwide and unlock new possibilities in the AI era." AI solutions harnessing NVIDIA accelerated computing To drive innovation in data centers, Wiwynn has strengthened its cooperation with Wistron Corporation, delivering complete AI acceleration platforms leveraging state-of-the-art chips — including the NVIDIA GB200 Grace Blackwell Superchip. NVIDIA GB200 NVL72 Rack Solution: One of the first NVIDIA GB200 NVL72 platform-based solutions available on the market. Supercharges training and inference for trillion-parameter-scale AI models while providing 25x lower total cost of ownership (TCO) compared with the previous generation of GPUs. The liquid-cooled rack connects 72 NVIDIA Blackwell GPUs and 36 NVIDIA Grace CPUs through fifth-generation NVIDIA NVLink™ and NVLink Switch technologies, enabling powerful AI acceleration in a single rack. Wiwynn is also offering updated AI solutions on the NVIDIA HGX™ platform, including: GS1400A: The NVIDIA MGX™ 4U server leverages eight NVIDIA H200 Tensor Core GPUs interconnected with NVLink and NVSwitch to bring accelerated computing into any data center with modular server designs. The compact GS1300N: Can be equipped with eight NVIDIA Hopper or Blackwell architecture GPUs within 3U-height and achieves over 90% heat dissipation with Wiwynn's DLC technology. State-of-the-art liquid cooling At the Summit, Wiwynn will introduce: Leading-edge two-phase liquid cooling techs that push chip thermal limits: Through a partnership with ZutaCore®, a leading provider of DLC and waterless liquid cooling solutions, this pushes the single-chip power limit by delivering up to 2.5 kW thermal design power (TDP). Deep dive at OCP Future Technologies Symposium presentation. Demonstrating a validated two-phase immersion cooling solution that achieves 2.8kW TDP, meeting future demands. Open IP SuperFluid Cooling Technology: Partnering with Intel, Wiwynn is solving a major roadblock for DLC by replacing water with a novel dielectric fluid, protecting electric circuits from damage and loss from water leakage, reducing the risk of data center outage, while achieving over 1.5kW TPD cooling capacity with a single-phase solution. For rapidly diversifying data centers, Wiwynn is focusing on developing the cooling technology for the future and offers optimized solutions for data centers. Get more information on Wiwynn's Facebook, LinkedIn, and website www.wiwynn.com. About Wiwynn Wiwynn is an innovative cloud IT infrastructure provider of high-quality computing and storage products, plus rack solutions for leading data centers. We are committed to the vision of "unleash the power of digitalization; ignite the innovation of sustainability". The Company aggressively invest in next-generation technologies to provide the best TCO (Total Cost of Ownership), workload and energy-optimized IT solutions from cloud to edge.
AI Data Center
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