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HONOR Unveils New Corporate Strategy to Transition to an AI Device Ecosystem Company

Illuminating a three-step roadmap underpinned by openness and collaboration BARCELONA, Spain, March 3, 2025 /PRNewswire/ -- Global technology brand HONOR today announced the HONOR ALPHA PLAN, a new corporate strategy to transform HONOR from a smartphone maker to a global leading AI device ecosystem company. The visionary three-step plan details the bold steps HONOR will take to usher in the new intelligent world, and calls on the industry to co-create an open, value-sharing ecosystem that maximizes human potential, ultimately benefiting all mankind. "It is clear that the AI revolution will reshape the paradigm of the device industry - completely transforming our productivity, our society, and even our culture more than ever before," said James Li, CEO of HONOR. "I am calling on all of us to unite together to address the challenges – as well as the many opportunities – of AI technology. I also call on the industry to be truly open so that we can fully embrace this exciting AI future. Let's do it together." The designation HONOR ALPHA PLAN is chosen for its unique symbolic meaning. Alpha, as the first letter in the Greek alphabet, symbolizes HONOR's relentless pursuit of technological excellence. Additionally, the Chinese word for humans (人) can be found where the stroke connects in the lowercase letter "α," echoing HONOR's commitment to human-centric innovation. The East-meets-West symbolism perfectly encapsulates HONOR's global vision and ambition to create value for consumers worldwide. THE HONOR ALPHA PLAN comprises three steps: The first step begins with the development of an intelligent phone. HONOR will work with partners to open technology boundaries to co-create a new paradigm for AI devices in the agentic AI era. Next, HONOR will open industry boundaries and co-create a new paradigm for AI ecosystem in the physical AI era. Finally, in the AGI era, HONOR will open human potential boundaries and co-create a new paradigm for civilization. The envisioned intelligent phone that is central to the first step will embed human-centric AI that is purpose-built to maximize human potential, including the leading AI technology HONOR showcased during the keynote address. MWC Booth Details Between March 3-6, visitors of MWC Barcelona 2025 may visit the HONOR booth located at Stand 3H10 in Hall 3, Fira Gran Via, to check out the latest innovations from HONOR and its partners. For more information, please visit: www.honor.com/global/events/honor-mwc/ 

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 323 加入收藏 :
AI全開,智領未來 中興通訊秀出「智能加速度」

西班牙巴塞羅那2025年3月3日 /美通社/ -- 2025年世界移動大會(MWC25 巴塞羅那)將於3月3日至6日在西班牙巴塞羅那舉行。中興通訊以「智能加速度」為主題參與此次盛會,攜手行業合作夥伴,推動AI與連接的深度融合,加速智能創新,共繪極效、智能、綠色的未來。 中興通訊展台位於Fira Gran Via 3號展館3F30展位,將通過極效移動網絡、全光世界、AI新價值、智能引擎、探索未來、數智生活六大展區全面展示連接與AI融合的創新解決方案。 AI全开,智领未来!中兴通讯秀出“智能加速度” 極效移動+全光網絡,雙賽道重構網絡生產力 針對運營商客戶的基礎網絡需求,中興通訊將展示如何利用新一代極效移動網絡和全光網絡,以高效低碳的方式打造面向未來的現代化基礎網絡。 在移動網絡方面,中興通訊持續引領UBR創新,推出業界首款TDD+FDD 雙模Massive MIMO AAU,及400M OBW大帶寬AAU,打造極簡、極效、綠色站點。面向室內及農網場景,攜多款新品方案亮相,助力實現流量全景覆蓋。面向5G-A發展新動能,打造ATG民航通信、NTN衛星通信,實現空天地一體泛在連接。以通感一體賦能低空經濟、水域管理商業落地;以萬兆新制播助力AR直播新體驗。 在全光網絡方面,中興通訊致力於推進光網絡向高質量發展。面向全光家庭,通過Wi-Fi 7、FTTR等實現業務增收,通過家庭數字化工具等實現運營降本,通過AI創新智能終端實現場景升維;面向全光城市,通過全光ToB拓展辦公、酒店、校園三大場景,提升客戶ARPU;面向全光基建,推出智能化ODN、Full-Band OTN、AI-Enhanced IP,構建極簡、極速、極效的基礎承載網絡。 面向未來演進,中興通訊致力於通過5G-A和6G一體化發展,以融合連接*感知*智能的分佈式智能網絡服務於萬物智聯的泛在AI世界,並通過關鍵技術創新和業務生態發展共同構建價值服務新高地。 全棧智算+行業創新,共建AI價值繁榮 中興通訊將智算定位為公司的長期主航道,積極推動連接與AI的融合創新,推出一站式端到端AI解決方案,助力客戶數智化轉型,擁抱未來市場機遇。 現場將展示全棧智算基礎設施,涵蓋液冷數據中心、智算服務器、通算服務器、無損高速交換,以及支持DeepSeek滿血版部署的AiCube訓推一體機,可靈活滿足大型數據中心、邊緣數據中心、企業一體化部署等多場景的算力網絡建設需求。同時,業界首發儲備一體能源矩陣解決方案,結合多場景新能源引入及能源智能調度,提升能源使用效率。 不僅如此,中興通訊還依托通專異構、算網融合等技術,發佈AIR RAN、AIR Core等系列方案,構建端到端內生AI網絡,助力運營商重塑經營模式。 面向行業創新,中興通訊提供從芯片、硬件、軟件到集成服務的全棧AI綜合應用解決方案,以應用效果最優為目標,助客戶打造性價比最高的AI應用。數字星雲3.0內置星雲大模型,整合大模型訓練、推理、應用開發全流程工具,幫助行業客戶多快好省用AI,在南京濱江工廠通過星雲工業大模型實現工藝文件生成提速10倍、質檢人力成本降低70%,同時對外賦能,在工業、交通、能源等領域打造創新應用實現AI價值變現。 全系列多形態AI終端,打造全新智能交互體驗 中興通訊堅持「AI for All」的核心產品戰略,持續佈局全系列多形態的AI終端產品。以AI手機作為關鍵入口,打造以AI語音為主的全新多模態交互體驗。自研星雲AI OS框架實現全球頂尖AI能力的系統級整合,深入融合Google Gemini、字節豆包、DeepSeek、中移九天、電信星辰等業界先進大模型,踐行AI普惠,讓更多消費者享受AI帶來的效率價值、情緒價值和功能價值。不僅率先在旗艦機nubia Z70 Ultra上實現了內嵌全尺寸DeepSeek-R1(滿血版671B參數量),還將陸續實現DeepSeek-R1等行業頂尖大模型在全系產品的系統級集成。 中興通訊發佈全球首款二合一5G+AI雲電腦產品以及專為家庭用戶設計的多形態AI終端。努比亞全球首發新一代真全面無孔屏影像旗艦nubia Z70 Ultra,同步推出時尚小折疊nubia Flip 2;發佈首款AI智能耳機nubia LiveFlip,通過星雲AI OS與努比亞AI手機深度互聯,再次升級AI全場景交互體驗。此外,紅魔系列致力於打造全球玩家熱愛的專業電競裝備品牌,發佈全球首款1.5K悟空全面屏電競旗艦紅魔10 Pro、紅魔首款4K 裸眼3D 遊戲本、超感知裸眼3D紅魔平板•3D探索版及多款紅魔電競裝備新品,完善電競生態佈局,為玩家提供全方位專業支持。 AI全开,智领未来!中兴通讯秀出“智能加速度” 展會期間,中興通訊將在展台活動區舉辦AI for All中興終端新品發佈會、無線未來網絡發佈會以及多場客戶聯合發佈活動,為業界呈現系列創新產品;並將參與由GSMA舉辦的4大主題論壇,與全球運營商客戶、行業夥伴、意見領袖就未來網絡演進、AI重塑網絡、專網賦能千行百業等熱點話題分享最新洞見及案例實踐,攜手客戶加速行業智能創新。 人工智能與ICT技術澎湃共興,物理空間與數字世界交匯融合,數智化浪潮托舉起一個由智能驅動、連接無限可能的新紀元。3月3日至3月6日,請與中興通訊共見時代「加速度」,共赴數智「新未來」! 媒體垂詢: 中興通訊品牌部Email: ZTE.press.release@zte.com.cn   

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 782 加入收藏 :
ZTE to highlight "Catalyzing Intelligent Innovation" at MWC Barcelona 2025, harnessing the power of AI

BARCELONA, Spain, March 3, 2025 /PRNewswire/ -- ZTE Corporation (0763.HK / 000063.SZ), a global leading provider of integrated information and communication technology solutions, will participate in MWC Barcelona 2025 from March 3 to 6 under the theme "Catalyzing Intelligent Innovation". In partnership with industry partners, ZTE will promote the deep integration of AI and connectivity, accelerating intelligent innovation and jointly shaping a future that is highly efficient, intelligent and green.  ZTE to highlight "Catalyzing Intelligent Innovation" at MWC Barcelona 2025, harnessing the power of AI ZTE's booth is located at 3F30, Hall 3, Fira Gran Via, where the company will showcase innovative solutions integrating connectivity and AI across six key thematic areas: Ultra-Efficient Mobile Network, All-Optical World, AI-Inspired Value, Engines of Intelligence, Infinite Future, and Smart Life. Ultra-Efficient Mobile Network & All-Optical Network: Dual-Track Reconstruction of Network Productivity In addressing the fundamental network needs of operators, ZTE will demonstrate how to leverage next-generation ultra-efficient mobile networks and all-optical networks to build a modern, future-proof foundational network with efficiency and low carbon emissions. In the field of mobile network, ZTE continues to lead UBR innovation, launching the industry's first TDD+FDD dual-mode Massive MIMO AAU and 400M OBW ultra-wideband AAU, creating ultra-simplified, highly efficient, and green sites. Targeting indoor and agricultural network scenarios, ZTE unveiled several new solutions to enable comprehensive traffic coverage. Focused on new momentum for 5G-A development, ZTE drives innovation in Air to Ground (ATG) and Non-Terrestrial Networks (NTN) satellite communication, to build the Space-Air-Ground Integrated Network (SAGIN) to achieve ubiquitous connectivity. By integrating sensing and communication, ZTE empowers the low-altitude economy and water management. Additionally, with the introduction of 5G-A new media solution, ZTE enhances brand-new AR live broadcast experience. In the field of all-optical network, ZTE is committed to advancing the high-quality development of optical networks. For all-optical homes, ZTE drives revenue growth through Wi-Fi 7, FTTR, and other solutions, reduces operational costs through digital tools, and enhances scene development with AI-driven smart terminals. For all-optical cities, ZTE expands into office, hotel, and campus scenarios through all-optical ToB, boosting customer ARPU. For all-optical infrastructure, ZTE has launched intelligent ODN, Full-Band OTN, and AI-Enhanced IP solutions to build an ultra-simplified, ultra-fast, and highly efficient foundational network. Looking towards future evolution, ZTE is dedicated to the integrated development of 5G-A and 6G, creating a distributed intelligent network that combines connectivity, sensing, and intelligence to support the ubiquitous AI-driven world of the Internet of Everything. Through key technological innovations and business ecosystem development, ZTE aims to collaboratively build a new high ground for value-driven services. Full-Stack Intelligent Computing + Industry Innovation: Jointly Building AI-Driven Value Prosperity ZTE positions intelligent computing as the company's long-term core focus, actively promoting the integration of connectivity and AI innovation. It has launched an all-in-one, end-to-end AI solution to support customers in their digital transformation and seize future market opportunities. During MWC Barcelona 2025, ZTE will showcase its full-stack intelligent computing infrastructure, including liquid-cooled data centers, intelligent computing servers, general-purpose computing servers, storage, high-speed switches, and the AiCube integrated training and inference unit supporting DeepSeek full-version deployment. This solution is designed to flexibly meet the computing network needs of large data centers, edge data centers, and integrated enterprise deployments across various scenarios. Additionally, ZTE will unveil the industry's first integrated energy storage solution, combining multi-scenario new energy integration with intelligent energy scheduling to enhance energy efficiency. In addition, ZTE leverages technologies such as heterogeneous convergence and computing-network integration to launch a series of solutions, including AIR RAN and AIR Core, to build end-to-end, AI-native networks that help operators reshape their business models. Focused on industry innovation, ZTE offers a full-stack AI integrated application solution, covering chips, hardware, software, and integration services. With a focus on achieving optimal application outcomes, ZTE integrates its own capabilities with industry-leading resources to help customers build the most cost-effective AI applications. The Digital Nebula 3.0, featuring the Nebula large model, integrates a complete suite of tools for model training, inference, and application development. This enables industry customers to leverage AI efficiently, quickly, and cost-effectively. At the Nanjing Binjiang Factory, the Nebula industrial large model has accelerated process document generation by 10 times and reduced quality inspection labor costs by 70%. Additionally, ZTE empowers external innovation applications in industries such as manufacturing, transportation, and energy, driving the monetization of AI's value. Creating a Full-Scenario Intelligent Ecosystem with AI-Driven Interactions and a Full Range of AI Devices Adhering to the "AI for All" product strategy, ZTE continues to expand its complete portfolio of AI-powered devices in various forms. By positioning AI smartphones as the primary gateway, ZTE is building a new multi-modal interaction experience centered on AI voice. Within its AI OS framework, ZTE achieves system-level integration of top-tier global AI capabilities. Its multi-modal architecture seamlessly incorporates advanced LLMs such as Google Gemini, ByteDance Doubao, DeepSeek, China Mobile Jiutian, and China Telecom Xingchen. ZTE not only pioneers the integration of the full-scale DeepSeek-R1(featuring 671B parameters) in the flagship smartphone nubia Z70 Ultra, but will also progressively integrates DeepSeek-R1 and other top-tier LLMs across its entire product lineup, making the multiple values of AI accessible to a broader range of consumers. ZTE to highlight "Catalyzing Intelligent Innovation" at MWC Barcelona 2025, harnessing the power of AI nubia will unveil the world's first next-generation true full-screen flagship smartphone featuring the industry-leading photography capabilities - nubia Z70 Ultra, alongside the stylish compact foldable smartphone - nubia Flip 2. Embracing the "Born to Win" concept, nubia continues to drive the development of its gaming smartphone for everyone - nubia Neo 3 series. nubia will introduce its first AI earphones - nubia LiveFlip, which interact seamlessly with nubia AI smartphones via its AI OS, further enhancing the AI-powered full-scenario interaction experience. REDMAGIC, a globally recognized professional gear brand, will launch the world's first 1.5K Wukong true full-screen gaming flagship - REDMAGIC 10 Pro series. The company will debut its first 4K eyewear-free 3D gaming laptop and tablet, as well as a variety of esports accessories, further refining its esports ecosystem and offering comprehensively professional support for gamers. In addition, ZTE will showcase the world's first 2-in-1 5G+AI Cloud Pad along with a range of multi-form AI devices tailored for home users at the event. During MWC Barcelona 2025, ZTE will also host several key activities at its exhibition booth, including the "AI for All" ZTE Devices New Products Launch Event, the AIR DNA for Future Network Launch Event, and multiple joint customer release events, presenting a series of innovative products to the industry. Additionally, ZTE will participate in the major thematic forums organized by GSMA, where it will share the latest insights and case studies on key topics such as the evolution of future networks, AI's role in reshaping networks, and how private networks empower various industries. ZTE will collaborate with global operators, industry partners, and thought leaders to accelerate intelligent innovation across industries. The convergence of AI and ICT technologies is dissolving the boundaries between the physical and digital worlds, ushering in a new era driven by intelligent innovation and seamless connectivity. From March 3 to 6, join ZTE to witness the acceleration of progress and step into the new future of digital intelligence. For more information, please visit the ZTE booth (3F30, Hall 3, Fira Gran Via) at MWC Barcelona 2025 or explore: https://www.zte.com.cn/global/about/exhibition/mwc25.html MEDIA INQUIRIES:ZTE CorporationCommunicationsEmail: ZTE.press.release@zte.com.cn

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 273 加入收藏 :
EnGenius to Showcase Advanced AI Cloud Surveillance Solution at RetailTech Japan 2025

TOKYO, March 3, 2025 /PRNewswire/ -- EnGenius Networks Japan, the Japanese subsidiary of the global cloud networking solutions provider, today announced its participation in RetailTech Japan 2025, where it will showcase its groundbreaking AI Cloud Surveillance Solution. Revolutionary Surveillance Technology Coming to RetailTech Japan The EnGenius AI Cloud Surveillance Solution represents a significant leap forward in security monitoring technology. By combining edge AI processing with cloud-based intelligence, the system delivers sophisticated scenario recognition capabilities that go far beyond traditional motion detection. "Traditional surveillance systems can only detect motion or object attributes, but our solution understands complex scenarios as they unfold," said Seiichiro Sato, General Manager at EnGenius Networks Japan. "Our system identifies sophisticated situations in real-time - from suspicious behavior patterns to security threats - transforming raw footage into actionable security intelligence." Key Innovations on Display Visitors to the EnGenius booth will experience demonstrations of: Contextual AI Recognition: The system's ability to understand complex scenarios like suspicious activities, potential security threats, and public safety incidents through advanced Large Multimodal Model (LMM) technology. Natural Language Search: The intuitive search capability that allows security personnel to find incidents using conversational queries in multiple languages, dramatically reducing investigation time. NVR-Free Architecture: The innovative approach that eliminates traditional Network Video Recorders through built-in camera storage and cloud management. AI-powered Network Video System (AI-NVS): An alternative solution that brings advanced AI capabilities to any existing ONVIF-compatible cameras through our intelligent AI-NVS. This allows businesses to leverage EnGenius Cloud management and enterprise-grade storage while enhancing their current surveillance infrastructure with AI features. Complete Solution Showcase EnGenius will display its comprehensive surveillance ecosystem at RetailTech Japan: AI-Powered Cameras: ECC100: 5MP AI Cloud Dome Camera ECC120: 5MP AI Cloud Bullet Camera ECC500: 8MP AI Cloud Dome Camera AI-powered Network Video Systems (AI-NVS): Advanced AI capabilities for existing ONVIF cameras Enterprise-grade RAID storage Unified cloud management Event Details: RetailTech Japan 2025 Date: March 4 (Tue) - March 7 (Fri), 2025 Time: 10:00 - 17:00 (16:30 closing on final day) Venue: Tokyo Bigsight Address: 3 Chome-11-1 Ariake, Koto City, Tokyo 135-0063 Booth: #RT3110 About EnGenius Technologies EnGenius Technologies, a cloud-driven connectivity leader, offers innovative solutions for businesses. With 25 years of experience, EnGenius ensures reliable network connectivity through user-friendly designs. The company's secure, cloud-centered ecosystem includes Wireless Access Points, Network Switches, VPN Routers, AI Cameras, AI-powered Network Video Systems, and Power Distribution Units.. For more information, visit https://www.engeniustech.com/jp.

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 217 加入收藏 :
VVDN Launches AI-Powered Wi-Fi 7 Access Point Reference Designs Powered by the Qualcomm Dragonwing NPro A7 Platform at MWC Barcelona

GURUGRAM, India, March 3, 2025 /PRNewswire/ -- VVDN Technologies, a global provider of Software, Product Engineering and Electronics Manufacturing services and Solution, has announced a collaboration with Qualcomm Technologies, Inc. to introduce its next-generation Wi-Fi 7 Access Point Reference Design. Powered by the Qualcomm Dragonwing™ NPro A7 Platform, this AI-driven reference design is built for customizable deployments. This collaboration marks a significant milestone in wireless connectivity. It aims to enhance user experiences with superior performance and intelligence while providing a cost-effective solution for customers seeking the best AI and Wi-Fi experience at an affordable price. The reference design includes a carrier-grade tri-band gateway and a carrier-grade dual-band extender. These solutions are optimized to intelligently manage network traffic, minimize latency, and elevate user experiences across multiple devices. The reference design is the culmination of collaboration between VVDN and Qualcomm Technologies and is crucial for India's rapidly evolving digital infrastructure, offering unmatched speed, intelligence, and reliability. It represents a significant leap forward in wireless networking, setting new benchmarks for AI-driven performance, enterprise-grade scalability, and cost-effective deployment. Ready for mass manufacturing by March 2025, the AI-powered Wi-Fi 7 Access Points will be on display at MWC Barcelona 2025. Visit VVDN Technologies at Hall 2 Booth 2C78 at MWC Barcelona for the launch of this Access Point. VVDN's AI-driven Wi-Fi 7 Access Points, powered by the Dragonwing NPro A7 Platform, are designed for showcasing the advanced capabilities of the platform. They integrate Qualcomm Technologies' state-of-the-art technologies, including the platform's Qualcomm® Networking AI Engine designed for Wi-Fi connectivity and networking optimization. These access points are designed to enhance network efficiency, adapt dynamically to varying usage patterns, and ensure seamless connectivity in diverse environments. This intelligent management capability not only boosts performance but also supports scalability, catering to the evolving demands of smart homes, enterprises, and public spaces. Puneet Agarwal, CEO, VVDN Technologies: "At VVDN Technologies, we are proud to collaborate with Qualcomm Technologies to pioneer the next generation of wireless connectivity solutions. The new innovative AI based Wi-Fi 7 Access Point not only sets new benchmarks in performance but also maintains cost-effectiveness comparable to Wi-Fi 6, ensuring wider accessibility without compromising on quality."  Savi Soin, SVP & President, Qualcomm India said, "Qualcomm Technologies is proud to collaborate with VVDN Technologies to introduce a line of access points, powered by our Dragonwing Networking platforms. These AI-powered Wi-Fi 7 Access Point Reference Designs are designed to enhance network efficiency while ensuring affordability for businesses, OEMs, and service providers." Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm and Qualcomm Dragonwing are trademarks or registered trademarks of Qualcomm Incorporated. About VVDN: Founded in 2007, VVDN is a technology innovation company focusing primarily on Software Services, Product Engineering and Manufacturing Services. VVDN's India HQ is located at Gurgaon, India, and its North America HQ is located in Fremont, CA, USA. VVDN has a presence across the world with offices in US, Canada, Europe, Vietnam, South Korea, and Japan. With 11 advanced R&D Centres, VVDN is fully equipped to design, develop & test the complete hardware, mechanical & software required for a complete product or solution. VVDN's 7 Manufacturing facilities are located at Manesar, Gurgaon, and Pollachi, Tamil Nadu, India, which includes in-house best-in-class SMT Factory, Mold & Tooling Factory, Injection Molding, Die Casting, Powder Coating, Sheet Metal, Product Assembly Factory, and Product Certifications labs. Company offers a comprehensive suite of services from Hardware to Mechanical, Embedded Software to Cloud & Apps, Testing & Validation to Automation as well as Mass Manufacturing to its global customers.

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VVDN Launches AI-Powered Wi-Fi 7 Access Point Reference Designs Powered by the Qualcomm Dragonwing NPro A7 Platform at MWC Barcelona

GURUGRAM, India, March 3, 2025 /PRNewswire/ -- VVDN Technologies, a global provider of Software, Product Engineering and Electronics Manufacturing services and Solution, has announced a collaboration with Qualcomm Technologies, Inc. to introduce its next-generation Wi-Fi 7 Access Point Reference Design. Powered by the Qualcomm Dragonwing™ NPro A7 Platform, this AI-driven reference design is built for customizable deployments. This collaboration marks a significant milestone in wireless connectivity. It aims to enhance user experiences with superior performance and intelligence while providing a cost-effective solution for customers seeking the best AI and Wi-Fi experience at an affordable price. The reference design includes a carrier-grade tri-band gateway and a carrier-grade dual-band extender. These solutions are optimized to intelligently manage network traffic, minimize latency, and elevate user experiences across multiple devices. The reference design is the culmination of collaboration between VVDN and Qualcomm Technologies and is crucial for India's rapidly evolving digital infrastructure, offering unmatched speed, intelligence, and reliability. It represents a significant leap forward in wireless networking, setting new benchmarks for AI-driven performance, enterprise-grade scalability, and cost-effective deployment. Ready for mass manufacturing by March 2025, the AI-powered Wi-Fi 7 Access Points will be on display at MWC Barcelona 2025. Visit VVDN Technologies at Hall 2 Booth 2C78 at MWC Barcelona for the launch of this Access Point. VVDN's AI-driven Wi-Fi 7 Access Points, powered by the Dragonwing NPro A7 Platform, are designed for showcasing the advanced capabilities of the platform. They integrate Qualcomm Technologies' state-of-the-art technologies, including the platform's Qualcomm® Networking AI Engine designed for Wi-Fi connectivity and networking optimization. These access points are designed to enhance network efficiency, adapt dynamically to varying usage patterns, and ensure seamless connectivity in diverse environments. This intelligent management capability not only boosts performance but also supports scalability, catering to the evolving demands of smart homes, enterprises, and public spaces. Puneet Agarwal, CEO, VVDN Technologies: "At VVDN Technologies, we are proud to collaborate with Qualcomm Technologies to pioneer the next generation of wireless connectivity solutions. The new innovative AI based Wi-Fi 7 Access Point not only sets new benchmarks in performance but also maintains cost-effectiveness comparable to Wi-Fi 6, ensuring wider accessibility without compromising on quality."  Savi Soin, SVP & President, Qualcomm India said, "Qualcomm Technologies is proud to collaborate with VVDN Technologies to introduce a line of access points, powered by our Dragonwing Networking platforms. These AI-powered Wi-Fi 7 Access Point Reference Designs are designed to enhance network efficiency while ensuring affordability for businesses, OEMs, and service providers." Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm and Qualcomm Dragonwing are trademarks or registered trademarks of Qualcomm Incorporated. About VVDN: Founded in 2007, VVDN is a technology innovation company focusing primarily on Software Services, Product Engineering and Manufacturing Services. VVDN's India HQ is located at Gurgaon, India, and its North America HQ is located in Fremont, CA, USA. VVDN has a presence across the world with offices in US, Canada, Europe, Vietnam, South Korea, and Japan. With 11 advanced R&D Centres, VVDN is fully equipped to design, develop & test the complete hardware, mechanical & software required for a complete product or solution. VVDN's 7 Manufacturing facilities are located at Manesar, Gurgaon, and Pollachi, Tamil Nadu, India, which includes in-house best-in-class SMT Factory, Mold & Tooling Factory, Injection Molding, Die Casting, Powder Coating, Sheet Metal, Product Assembly Factory, and Product Certifications labs. Company offers a comprehensive suite of services from Hardware to Mechanical, Embedded Software to Cloud & Apps, Testing & Validation to Automation as well as Mass Manufacturing to its global customers. Logo: https://mma.prnasia.com/media2/1531036/3360584/VVDN_Technologies_Logo.jpg?p=medium600  

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