截至2024年12月31日之全年業績摘要： 隨著AI技術相關產業對芯片的需求不斷上升，科通技術的AI芯片訂單需求持續上升，帶動本集團收入同比增長約14.3%至人民幣10,129.1百萬元 本集團錄得毛利約為人民幣889.4百萬元，淨利潤約為人民幣273.5百萬元，本公司權益股東應佔溢利約為人民幣189.9百萬元 硬蛋產業學院繼續為行業提供技術服務及人才培訓，已成功培育超過2,000名芯片應用工程師，進一步推動國家芯片產業發展 香港 - Media OutReach Newswire - 2025年3月31日 - 硬蛋創新（「硬蛋創新」或「本公司」，股份代號：400.HK；及其附屬公司，統稱（「本集團」）），一家創新型科技服務平台集團，主營業務為「科通技術」及「硬蛋科技」，公佈截至2024年12月31日止年度（「2024年」或「年內」）之經審核綜合業績。 2024全年業績財務摘要 受惠於AI算力需求持續強勁，伴隨AI技術相關產業對芯片需求顯著上升。年內，本集團收入達到約人民幣10,129.1百萬元，較2023年同期的約人民幣8,863.4百萬元，增加約14.3%。本集團的毛利約為人民幣889.4百萬元，同比減少約13.6%；經營利潤約為人民幣427.9百萬元，同比減少約8.0%；除稅後淨利約為人民幣273.5百萬元，同比減少約14.5%。來自大客戶的銷量增加影響整體毛利率，加上美元利息成本上升，導致本公司權益股東應佔溢利有所下降。本公司權益股東應佔溢利約人民幣189.0百萬元。 截至2024年12月31日，本集團現金及銀行結餘（包括已抵押存款）為人民幣839.7百萬元，銀行貸款為人民幣1,885.9百萬元；賬面庫存值為人民幣3,510.5百萬元；本集團已發行基本普通股股數為1,394,262,732，每股基本盈利的普通股加權平均數為1,370,327,000。 深耕AI算力供應鏈 科通技術賦能行業創新與高效運營 在全球芯片產業高速發展的戰略機遇期，人工智能、雲計算與物聯網技術的協同演進，疊加人形機器人產業的技術突破，正推動全球算力需求進入指數級增長軌道。這一趨勢不僅催生GPU、ASIC等高性能計算芯片的迭代需求，更帶動高速存儲芯片、智能網絡設備的全產業鏈技術升級，形成從芯片設計、製造到應用終端的完整創新生態。在這一背景下，科通技術作為AI算力供應鏈的核心供應商，深度參與全球算力網絡建設，服務範圍覆蓋算力中心、數據中心、AI服務器、AI交換機網絡產品、光模塊以及眾多的AI應用領域。科通技術與全球領先的芯片原廠緊密合作，已代理超過80家核心芯片公司的產品，涵蓋Nvidia（英偉達），AMD-Xilinx（超威半導體-賽靈思）、Intel（英特爾）等國際知名原廠以及眾多國內知名芯片原廠。 憑藉多年深耕市場，科通技術積累了豐富的應用技術經驗和產業資源，能夠為下游數以萬計的創新客戶提供芯片應用技術解決方案及供應鏈管理服務。通過自主研發的AI技術、大模型和專業知識庫，科通技術能夠在芯片選型、硬件設計、軟件開發、系統集成等方面提供智能化和自動化的解決方案，顯著提升產品性能和可靠性。此外，科通技術運用AI技術和大數據分析，實現供應鏈的智能化管理，有效提升運營效率並降低成本。 同時，科通技術擁有多項自主知識產權，包括智能算法庫、行業專屬大模型、智能硬件設計平台、自適應系統架構、智能開發工具鏈以及大量的創新技術專利，這些技術賦予其在AI芯片應用和智能供應鏈領域具備競爭優勢。通過持續結合先進的AI技術與深厚的行業專業知識，科通技術持續提升服務質量，為客戶創造更大價值，並引領行業技術創新。 硬蛋科技佈局新能源產業 產業學院助推芯片產業數字化轉型 硬蛋科技聚焦新能源產業，致力於發展兩輪車換電及梯次利用（re-utilization）產業、構建鋰電池全生命週期數據溯源、可信資產管理平台，為兩輪車換電、梯次動力、儲能等應用提供定制化解決方案。同時，硬蛋科技重點佈局兩輪車電池雲服務，緊跟新能源智能電池雲市場的新趨勢，搶佔人民幣千億規模的藍海市場，助力集團實現持續盈利增長，並為推進中國兩輪車換電產業產品標準化作出貢獻，為國家「雙碳」(碳達峰與碳中和)目標的實現提供技術支撐和產業推動力。 基於本集團在芯片產業積累的豐富資源與技術優勢，硬蛋科技旗下的硬蛋學堂引進全球領先的芯片應用技術，為行業提供技術服務及人才培訓。硬蛋學堂通過技術培訓，幫助上游AI芯片原廠實現產品和技術的市場推廣，並培養AI技術人才協助下游AI應用企業快速採用最新的AI技術和產品，從而全面提升企業的AI業務能力。同時，硬蛋學堂為企業提供基於本地化部署的AI大模型應用解決方案，幫助企業在多個領域實現AI數字化轉型。目前，硬蛋學堂已成功培育了超過2,000名芯片應用工程師，為行業輸送大量高質素人才。通過人才培訓和技術支持，硬蛋學堂正全力助推深圳成為中國乃至全球芯片應用產業中心，為國家芯片產業發展做出更大貢獻。 前景 硬蛋創新首席執行官康敬偉先生表示：「隨著市場的發展，AI 技術正持續推動各行各業的數字化和智能化轉型，芯片應用、智能硬件和大數據正成為這一變革的關鍵角色。我們將積極把握AI技術驅動的發展機遇，加快拓展AI產業鏈，充分發揮我們的產業優勢，透過『科通技術』不斷研發提升芯片應用方案設計，以滿足高性能芯片和算力供應鏈不斷增長的需求，致力成爲AI算力供應鏈的核心供應商。同時，『硬蛋科技』通過『硬蛋雲』有效整合智能硬件的應用方案與產品，加快推進AI產品的應用落地。我們將持續升級服務平台，全面覆蓋整個AI產業鏈，把握國內智能變革的業務契機，引領公司成爲AI芯片應用產業的先鋒。」 警告聲明 本文中所含資訊未經獨立核實。公司或任何聯屬公司、顧問或代表並未就文中所演示或所含的資料或觀點的公正性、準確性、完整性和正確性做出任何明示或默示的陳述、承諾或保證。任何人不應將之作為依賴的憑據。本文所包含的資料應視為在當時的情況下作考慮，如有變更，不另行通知，公司不作任何承諾更新本文中的資料，以反映該日期之後發生的任何事情發展的介紹。本文的目的並不在於提供，閣下亦不應當依賴於本文而作出關於公司、財務或經營狀況或前景的完整或全面的分析。公司及其聯屬公司、顧問或代表均不因對本文或其內容之任何使用而産生或因本文而導致之任何損失具有義務且不承擔任何責任（過失或其他）。 本文可能包含反映公司目前的意向、信念和對未來如本文所示的相關日期的預期的陳述。該等前瞻性陳述並非對未來業績的保證，乃以若干有關公司經營的假設及並非公司所能控制的因素為基礎，並具有重大風險和不確定性。有鑒於此，實際結果可能與該等前瞻性陳述的描述有重大的差異。公司或其任何聯屬公司，顧問或代表並無任何義務且並不承諾就相關日期後出現的事件或未預期的事件更新相關的前瞻性陳述。 Hashtag: #Ingdan發佈者對本公告的內容承擔全部責任關於硬蛋創新硬蛋創新（股份代號：400.HK）是一家創新型科技服務平台集團，專注於連接上游芯片技術與下游創新企業需求。通過自主研發的人工智能（「AI」）技術、大模型和專業行業知識庫，本集團為客戶提供尖端的芯片應用技術解決方案和高效的供應鏈管理服務。總部設於深圳，在中國主要城市-香港、上海、北京、武漢、成都、南京、杭州及西安設有辦事處或分公司，並在新加坡及日本設有辦事機構。本集團主營業務為科通技術（「科通技術」，服務芯片產業的技術服務平台）和硬蛋科技（「硬蛋科技」，提供人工智能與物聯網（「AIoT」）技術和服務的平台）。 更多詳情可參閱：www.ingdangroup.com
Highlights of the Annual Results for the Year Ended December 31, 2024: With rising demand for chips from AI technology-related industries, AI chip orders from Comtech continued to grow, driving the Group's revenue up by 14.3% year-on-year to RMB10,129.1 million. The Group recorded a gross profit of approximately RMB889.4 million and a net profit of approximately RMB273.5 million. Profit attributable to equity shareholders of the Company was approximately RMB189.9 million. Ingdan Academy continued to provide technical services and talent training for the industry and has successfully trained over 2,000 chip application engineers, further advancing the development of China's chip industry. HONG KONG SAR – Media OutReach Newswire - 31 March 2025 - Ingdan, Inc. ("Ingdan" or the "Company," Stock Code: 400.HK; together with its subsidiaries, the "Group"), an innovative technology services platform conglomerate with core businesses in "Comtech" and "Ingdan," announces its audited consolidated results for the year ended December 31, 2024 ("2024" or "the Year"). Financial Highlights for the Full Year of 2024 Benefiting from sustained strong demand for AI computing power and significant growth in chip demand from AI-related industries, the Group's revenue for the Year reached approximately RMB10,129.1 million, representing a year-on-year increase of approximately 14.3% compared to RMB8,863.4 million in 2023. The Group's gross profit was approximately RMB889.4 million, down 13.6% year-on-year; operating profit amounted to approximately RMB427.9 million, down 8.0% year-on-year; and net profit after tax totalled approximately RMB273.5 million, a decrease of 14.5% year-on-year. Increased sales volume to large customers impacted overall gross margins, coupled with higher USD interest costs, leading to a decline in profit attributable to the Company's equity shareholders. Profit attributable to equity shareholders of the Company was approximately RMB189.9 million. As of December 31, 2024, the Group held cash and bank balances (including pledged deposits) of RMB839.7 million, bank loans of RMB1,885.9 million, and inventory value of RMB3,510.5 million. The total number of issued ordinary shares was 1,394,262,732, with a basic weighted average of 1,370,327,000 shares. Empowering Industry Innovation and Operational Efficiency in the AI Computing Power Supply Chain In the current strategic growth phase of the global semiconductor industry, the synergistic evolution of AI, cloud computing, and IoT technologies, combined with breakthroughs in humanoid robotics, is driving exponential growth in global computing power demand. This trend is not only spurring iterative demand for high-performance computing chips such as GPUs and ASICs but also accelerating technological upgrades across the entire industry chain, including high-speed storage chips and intelligent networking equipment, forming an integrated ecosystem from chip design and manufacturing to end applications. Against this backdrop, Comtech, as a core supplier in the AI computing power supply chain, is deeply involved in global computing network development, serving data centers, AI servers, AI switches, optical modules, and diverse AI applications. Comtech collaborates closely with leading global chip manufacturers, acting as an authorized distributor for over 80 core suppliers, including NVIDIA, AMD-Xilinx, Intel, and many leading domestic chipmakers. With years of market expertise, Comtech has accumulated extensive technical experience and industrial resources, enabling it to provide chip application solutions and supply chain management services to tens of thousands of downstream clients. Leveraging proprietary AI technologies, large language models (LLMs), and specialized knowledge bases, Comtech delivers intelligent and automated solutions in chip selection, hardware design, software development, and system integration, significantly enhancing product performance and reliability. Additionally, by applying AI and big data analytics to optimize supply chain management, Comtech improves operational efficiency while reducing costs. Comtech also holds multiple proprietary intellectual properties, including intelligent algorithm libraries, industry-specific LLMs, smart hardware design platforms, adaptive system architectures, and innovative patents, granting it multiple competitive advantages in AI chip applications and intelligent supply chains. By integrating advanced AI technologies with deep industry expertise, Comtech continues to elevate service quality, creating greater value for customers while leading technological innovation in the sector. Expanding into the New Energy Industry, and Driving Digital Transformation of the Chip Industry Through Ingdan Academy Ingdan focuses on the new energy sector, developing solutions for two-wheeler battery swapping, re-utilization, and lifecycle management. Its smart battery management platform enables real-time monitoring, improves battery efficiency, and supports traceability from production to recycling. Strategically targeting the two-wheeler battery cloud service market, Ingdan aims to capture opportunities in the RMB100-billion "blue ocean" market, contributing to industry standardization and China's "Dual Carbon" (peak carbon emissions and carbon neutrality) goals. Building on the Group's semiconductor resources, Ingdan Academy introduces cutting-edge chip application technologies to provide technical services and talent training. The Academy collaborates with upstream AI chip manufacturers to promote products and cultivate AI professionals, empowering downstream enterprises to adopt advanced AI solutions. To date, Ingdan Academy has trained over 2,000 chip application engineers, supplying the industry with high-quality talent. Through continuous training and technical support, the Academy is positioning Shenzhen as a global hub for chip applications, and driving national semiconductor industry growth. Outlook Mr. Jeffrey Kang, CEO of Ingdan, Inc., said, "As AI technologies propel digital and intelligent transformations across industries, chip applications, smart hardware, and big data are becoming pivotal. We are actively capturing opportunities in the new AI-driven era, and expanding our presence in the AI industrial chain. Comtech will continue to innovate chip application solutions to meet growing demand for high-performance computing power, solidifying its role as a core supplier in the AI computing power ecosystem. Meanwhile, Ingdan will integrate smart hardware solutions via the 'Ingdan Cloud' to accelerate AI product deployment. By upgrading our service platforms and covering the entire AI value chain, we aim to lead the industry as a pioneer in AI chip applications." Caution Statement The information contained in this document has not been independently verified. No representation, warranty or undertaking, express or implied, is made by the Company or any of its affiliates, advisers or representatives as to, and no reliance should be placed on, the fairness, accuracy, completeness or correctness of such information or opinions presented or contained herein. The information contained in this document should be considered in the context of the circumstances prevailing at the time, is subject to change without notice and the Company makes no undertaking to update the information in this document to reflect any developments that occur after the date of the presentation. It is not the Company's intention to provide, and you may not rely on these materials as providing, a complete or comprehensive analysis of the Company, or its financial or trading position or prospects. Neither of the Company nor any of its affiliates, advisers or representatives accept any responsibility or have any liability whatsoever (in negligence or otherwise) for any loss howsoever arising from any use of this document or its contents or otherwise arising in connection with this document. This document may contain statements that reflect the Company's current intent, beliefs, and expectations about the future as of the respective dates indicated herein. These forward-looking statements do not guarantee future performance and are based on a number of assumptions about the Company's operations and factors beyond the Company's control and are subject to significant risks and uncertainties, and accordingly, actual results may differ materially from those described in these forward-looking statements. Neither the Company nor any of its affiliates, advisers or representatives has any obligation, nor do they undertake, to update these forward-looking statements for any events or developments including the occurrence of unanticipated events that occur subsequent to such dates. Hashtag: #IngdanThe issuer is solely responsible for the content of this announcement.About Ingdan, Inc.Ingdan, Inc. (stock code: 400.HK) is an innovative technology services platform conglomerate, connecting upstream chip technology with the needs of downstream innovation enterprises. Through proprietary artificial intelligence (AI) technology, large language models ("LLMs"), and specialized industry knowledge bases, the Group provides our customers with cutting-edge of chip application technology solutions, and efficient supply chain management services. Headquartered in Shenzhen, the Group operates offices and branches across major cities in China, including Hong Kong, Shanghai, Beijing, Wuhan, Chengdu, Nanjing, Hangzhou, and Xi'an, as well as overseas branches in Singapore and Japan. The Group's core businesses are Comtech, a technology services platform for the chip industry, and Ingdan, a platform providing Artificial Intelligence of Things ("AIoT") technology and services. For further information, please refer to the Company's website at www.ingdangroup.com
台北2025年3月31日 /美通社/ -- 隨著 AI PC 時代加速發展，全球電腦領導品牌技嘉科技（GIGABYTE）宣布旗艦級 AI 電競筆電 AORUS MASTER 18 與 AORUS MASTER 16 正式開賣。AORUS MASTER 系列專為釋放人工智慧強大的效能而打造，內建獨家革命性 AI 助理 GiMATE，為玩家提供更加智慧化與個人化的 AI 體驗。搭載 Intel® Core™ Ultra 9 275HX 處理器與最高配置 NVIDIA® GeForce RTX™ 5090 筆電 GPU，這款 AI PC 不僅具備卓越的遊戲性能，更能滿足 AI 運算需求。為確保極致效能，AORUS MASTER 系列採用 WINDFORCE INFINITY EX 散熱技術，提供先進的散熱方案，打造 AI 電競筆電的終極體驗。 技嘉 AORUS AI 電競筆電 MASTER 18 與 MASTER 16 正式上市 AORUS MASTER 系列 AI 電競筆電的核心技術之一 GiMATE，是技嘉獨家開發的 AI 助理，透過先進的大型語言模型（LLM），讓筆電控制直覺化，如同對話般簡單。Press and Speak 功能讓用戶輕鬆調整電源模式、散熱設定與音效配置等，提升使用體驗。AORUS MASTER 系列搭載 Intel® Core™ Ultra 9 275HX 處理器，內建 NPU AI 引擎，結合 NVIDIA® GeForce RTX™ 50 系列筆電 GPU，採用 NVIDIA Blackwell 架構，提供更高階的 AI 體驗與影像渲染技術，可實現嶄新的使用體驗及提升次世代的繪圖精準度。此外，NVIDIA NIM 微服務提供先進的 AI 模型，讓開發者和使用者能在 NIM 支援的GIGABYTE AI 系統上，以最佳效能輕鬆構建 AI 助理、代理和專業工作流程。 在散熱方面，AORUS MASTER 系列搭載 WINDFORCE INFINITY EX 散熱技術，透過全覆蓋導熱板（Vapor Chamber）與全新高效 Frost Fan 設計，內建 158 片非對稱超薄扇葉，搭配 3D VortX 風道設計，有效優化氣流循環，提升散熱效率。透過 0dB 靜音模式與 Icy Touch 低溫鍵盤區，讓玩家在筆電高效運行時，仍能保持舒適的操作體驗。AORUS MASTER 18 更搭載四風扇與內吹設計，大幅提升冷空氣進風與排熱效率，實現最高 270W 散熱功率，確保效能穩定輸出，為遊戲與 AI 運算提供最佳環境。 AORUS MASTER 系列同時提供頂級的視覺與音效體驗。AORUS MASTER 18 採用 mini-LED 面板，而 AORUS MASTER 16 則搭載 OLED 顯示技術，結合 Dolby Vision® HDR 技術，展現驚豔的對比與色彩表現。此外，此系列筆電皆導入支援分頻技術的雙振膜喇叭（dual-force speakers），能有效降低震動與失真，搭配 Dolby Atmos® 全景聲的加持，營造最契合使用狀態的音效和精確的定位，並提供環繞音效，帶來更具臨場感的沉浸式聽覺體驗。 歡迎前往選購或了解更多技嘉 AORUS MASTER AI 電競筆電資訊：https://bit.ly/AORUS_MASTER_AI_PC_TW
TAIPEI, March 31, 2025 /PRNewswire/ -- As the AI PC era accelerates, GIGABYTE announces its flagship AI gaming laptops, the AORUS MASTER 18 and AORUS MASTER 16 are now available. Engineered to harness the power of artificial intelligence, the AORUS MASTER series features the groundbreaking AI agent, GiMATE, designed to enhance users' AI experience and customization. Powered by Intel® Core™ Ultra 9 Processor 275HX and up to NVIDIA® GeForce RTX™ 5090 Laptop GPU, these AI PCs deliver exceptional gaming and AI-driven computing experiences. To ensure peak performance, WINDFORCE INFINITY EX cooling technology provides advanced thermal management, making the AORUS MASTER series the ultimate AI-powered gaming laptops. GIGABYTE AORUS AI PCs: MASTER 18 and 16 Are Now Available At the heart of the AORUS MASTER series is GiMATE, GIGABYTE's exclusive AI agent. GiMATE leverages an advanced large language model (LLM), making hardware control on the laptop as intuitive as a conversation. The Press and Speak function allows users to adjust power modes, cooling settings, and audio profiles effortlessly. Additionally, the AORUS MASTER series is powered by Intel® Core™ Ultra 9 Processor 275HX, boasting an integrated NPU AI engine, and NVIDIA® GeForce RTX™ 50 Series Laptop GPUs powered by NVIDIA Blackwell, enabling new experiences and next-level graphics fidelity. Plus, with access to NVIDIA NIM Microservices, the laptops offer AI models that let enthusiasts and developers build AI assistants, agents, and workflows with peak performance on NIM-ready GIGABYTE AI systems. The AORUS MASTER series redefines cooling solutions with up to 270-watt thermal power with the advanced WINDFORCE INFINITY EX cooling technology, ensuring best-in-class thermal efficiency. This system significantly enhances heat dissipation by featuring a vapor chamber and a Frost Fan design consisting of 158 asymmetric ultra-thin fan blades. An advanced airflow system with 3D VortX circulation and quad fans on AORUS MASTER 18 further optimizes cooling, delivering zero-noise operation with 0dB ambient mode and Icy Touch technology for a more comfortable gaming experience. The AORUS MASTER series also offers an unparalleled visual and audio experience. Equipped with Dolby Vision® HDR technology, the AORUS MASTER 18's mini-LED panel and AORUS MASTER 16's OLED display deliver stunning contrast and vibrant colors. Meanwhile, the series features dual-force speakers that effectively reduce vibrations and distortion and Dolby Atmos® technology which adapts sound to various usage conditions and surround sound enhances spatial immersion, creating a truly cinematic audio experience. To get the most powerful AI PCs, please visit: where-to-buy
【臺北訊】專業物聯網及人工智慧邊緣運算平臺研發製造大廠—研揚科技(股票代碼: 6579)， 日前參加台科大50周年校慶，並於電子系所舉辦的研發成果展中展出「AI機器手姿態辨識」，獲得與會貴賓及台科大同學們的熱烈關注與詢問。這是款透過CPU/GPU高效運算，即時監控互動來賓手指的變化，來進行動作預測或是模擬手勢的一組邊緣AI動態展示。現場回響非常熱烈! 研揚科技一直以來，皆與台科大有密切的產學合作。從2009年捐贈研揚大樓與2016年捐贈醫揚大樓，到這次的50周年校慶成果展及研揚集團一年2000萬投入台科大產創學院的研發基金 (研揚1000萬，醫揚500萬及慧友500萬)，希望可以利用產業的力量支持台科大師生進行學術研究與應用開發。台科大電子系主任 林淵翔博士表示，與研揚的合作方式除了企業有研發需求的時候，可以直接告知台科大，台科大會媒合相關人員及系所投入資源開發；或是台科大老師有好的應用專案想法，也可以直接提案給企業，兩者皆可行。讓兩邊的資源都可以得到最大的使用與分配。 研揚科技與台科大之前在台科大校區內成立一個「研發中心」，積極與台科大合作，讓師生們研發可實際落地的專案，不管是軟體或是硬體，亦或是應用解決方案，都能有場域經驗來輔佐，加速台灣AI轉型。未來研揚也會積極加速並擴充「研發中心」的設備與優化環境，讓台科大師生及產業間的研發創新可以在「研發中心」裡得以實現。 「我是第二屆的『傑出校友』獎，這次非常榮幸可以在台科大50周年校慶的重要時刻，被頒發『傑出貢獻獎』，這是非常大的榮耀，能夠在『創新研發』領域中受到肯定。研揚不僅專注邊緣AI產品的研發製造，同時也積極與台科大合作，透過共同培育優秀的研發人才，讓台科大的畢業生可以日後被產業所重用，也讓母校未來可以以我們為榮!」研揚科技董事長 莊永順表示。 「2025年台科大將會擴大與研揚科技合作，研揚科技是專業的邊緣AI硬體廠商，之前與研揚的合作大部分是屬於Driver的研發，之後希望可以協助研揚開發AI的應用。透過加深加廣的合作，讓台科大的學生在畢業前就可以提早知道產業的需求，同時也先熟悉業界專案研發的流程，在畢業後可以很快速地融入產業工作環境，無縫接軌!」台科大電子工程系主任 林淵翔博士說道。 研揚歡迎各界有能力、有抱負的人才及應屆畢業生的加入，研揚的人力資源政策著重「尊重包容，創造理想工作環境」、「專注傾聽，重視員工意見」、「培育發展，共創未來」、及「公平公開，高績效高報酬」，希望更多有志青年一同來為夢想打拚。更多的研揚產品及徵才資訊，請上研揚官網查詢。 關於研揚科技 研揚科技集團（研揚）是台灣專業物聯智能解決方案研發製造大廠，成立於1992年。研發製造並行銷全球IoT及AI邊緣運算解決方案，另有嵌入式電腦主板及系統、工業液晶顯示器、強固型平板電腦、工控機、網路安全設備以及相關配件等，提供OEM/ODM客戶及系統整合商完整且專業之軟硬體解決方案。同時，研揚科技有專屬團隊提供客製化服務，協助您從研發初期發想到產品製作、量產到售後服務，提供一貫之專業諮詢與服務，為您量身打造高品質產品。研揚科技目前提供多款AI邊緣運算產品及智慧城市、智慧零售及智慧製造等系統整合和解決方案。研揚是NVIDIA的菁英級夥伴(Elite partner)。欲瞭解更多詳細資訊請參考研揚科技官方網站
台北2025年3月28日 /美通社/ -- 3月12日，由先進微系統與構裝技術聯盟(AMPA) 主辦、英特爾(Intel) 與異質整合系統級封裝開發聯盟（Hi-CHIP）協辦的2025超流體先進散熱技術論壇在臺北盛大召開。本屆論壇彙聚了Intel 10餘家生態系統合作夥伴，500餘名行業人士。高斯寶電氣受邀出席並發表主題演講，展示了公司在AI伺服器電源領域高效能散熱的突破性成果，引發行業關注。 隨著人工智慧、5G通信及高性能計算設備的算力需求激增，運算晶片已邁向千瓦級，熱管理技術已成為行業發展的關鍵。Intel的Super Fluid液體冷卻技術於2023年首次提出，已為NVIDIA GB300提供了浸沒液冷超流體散熱解決方案。而高斯寶電氣作為Intel生態合作夥伴之一，於2024年3月份共同建立了先進散熱技術聯合實驗室，致力於浸沒式液冷技術的研究。 本次論壇上，高斯寶電氣資源開發部部長周文飛先生就聯合實驗室的最新成果《浸沒式液冷電源解決方案》做主題演講，首家推出了浸沒式液冷電源解決方案和納米鍍膜工藝，為AI 應用提供先進的伺服器電源。 Gospower Immersion Cooling Al Power Solutions 高斯寶高防護鍍膜方案採用晶片級納米防護工藝，有效相容各種液體冷卻液，防水等級可達到 IPX8 ，適用於浸沒、海島高鹽霧、粉塵等惡劣環境。最高效率可達98%，關鍵器件散熱效率提升30%以上，可有效滿足高算力伺服器電源高負荷運算、高能效、安全可靠的需求。 會上，高斯寶電氣帶來了浸沒式液冷電源極限場景測試。將高防護伺服器電源浸沒在純淨水中後，模擬含水冷卻液洩露造成絕緣失效場景，伺服器電源依然保持正常運轉。 高斯寶電氣具備完整的 AI 伺服器電源產品線，且所聚焦伺服器電源技術路線與行業需求高度吻合。未來，高斯寶將繼續致力於創新和研發，為客戶提供更優質的產品和解決方案，助力 AI 行業的發展。
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