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MUNICH, April 9, 2024 /PRNewswire/ -- ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing has finalized an agreement with Geringer Halbleitertechnik GmbH & Co. KG, a move poised to bolster its research and development (R&D) and production capabilities. ERS’s new site in Barbing will be a dedicated hub and competency center for its Advanced Packaging Equipment Solutions (APEqS) Business Unit Geringer was founded in 1991 and has established itself as a reputable developer and manufacturer of tailor-made manufacturing machines for the semiconductor industry. ERS has integrated Geringer's entire experienced team and facilities in Barbing, close to Regensburg. The modern and well-equipped production areas will function as a dedicated hub and competency center for ERS's Advanced Packaging Equipment Solutions (APEqS) Business Unit under the name of ERS Barbing. The team's experience and mechanical engineering know-how will support ERS in the development of its industry-renowned Advanced Packaging equipment, including the newly announced Wave3000 and Luminex product line. This strategic deal builds upon the strong foundation of a previous successful collaboration between the two companies. Debbie-Claire Sanchez, VP and Head of APEqS Business Unit at ERS electronic says, "Our previous project with Geringer demonstrated a strong alignment in our values and dedication to delivering high-quality, innovative solutions. The team's expertise, coupled with the new competency center in Barbing, will undoubtedly fuel our innovation roadmap and production efforts, enabling us to stay at the forefront of technological advancements in the industry." "We are thrilled to welcome the team from Geringer to ERS and expand our APEqS Business Unit," says Laurent Giai-Miniet, CEO of ERS electronic. "This move allows us to further strengthen our position in the market and significantly accelerate our response to customer needs." The CEO and founder of Geringer, Michael Geringer adds, "I am proud to have been part of this journey with Geringer, and I am confident that ERS will continue to uphold the values and standards that have defined our company. As I transition into retirement, I wish ERS all the best and am excited to see the great things they will accomplish." About ERS: ERS electronic GmbH, based in the Munich suburb of Germering, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for wafer probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide.
BRAUNSCHWEIG, Germany, Jan. 25, 2024 /PRNewswire/ -- MPI Corporation's Advanced Semiconductor Test (AST) Division, a pioneer in on-wafer testing solutions, today announced a landmark achievement in RF calibration technology. Collaborating with the Physikalisch-Technische Bundesanstalt (PTB) in Germany, the division has successfully achieved full traceability in characterizing a commercially-available calibration substrate up to 110 GHz and set a new industry benchmark. This achievement, spearheaded by Dr. Andrej Rumiantsev, Director of RF Technology at MPI-AST, represents a significant leap for the entire RF product line provided by MPI product line. The fully traceable characterization paves the way for more accurate, reliable, and universally accepted high-frequency measurements, essential for cutting-edge technologies like 5G. "Attaining full traceability in RF calibration at such high frequencies is a testament to our dedication to precision and quality," said Dr. Rumiantsev. "This breakthrough is an outcome of our long-term cooperation with PTB. Is not just an advancement for MPI-AST but a significant stride for the entire microwave measurement community, semiconductor and telecommunications industries." Dr Gia Ngoc Phung (PTB, Germany) passes the TCS-050-100-W Calibration Substrates Certificate to MPI Corporation TCS-050-100-W Calibration Substrates Certificate "Establishing the national standards for RF system calibration at the wafer-level is the goal that PTB had been working towards for several years," said Dr. Uwe Arz, the head of the On-Wafer Scattering Parameters group of PTB, Germany. "We are proud to announce the solution for transferring the traceability chain to the commercial calibration substrate from MPI for the first time in the industry." MPI-AST's latest achievement underscores its role as a leader in the semiconductor test industry, promising to open new avenues in high-frequency testing and solidifying its position as a market leader. For more information, please refer to: World's first calibration certificates for on-wafer measurements - PTB.de Traceable Lumped-Element Calibrations up to 110 GHz on Commercial Calibration Substrates | IEEE Conference Publication | IEEE Xplore About MPI CorporationFounded in 1995 and headquartered in Hsinchu, Taiwan, MPI Corporation is a global technology leader in the testing of Semiconductors, Light Emitting Diodes (LED), Photo Detectors, Lasers, Materials Research, Aerospace, Automotive, Fiber Optic, Electronic Components, and more. MPI's five main business sectors include Probe Card, Photonics Automation, Advanced Semiconductor Test, Thermal Test, and Celadon Systems Divisions. MPI offers a wide-ranging portfolio of products and services, from advanced probe card technologies, mass production and engineering probe systems, testers, material handlers, inspection systems, and thermal air stream systems. Many of these products are accompanied by state-of-the-art Calibration and Test & Measurement software suites. MPI's diverse product portfolio and expertise in leading edge technologies creates a healthy environment for employee growth and retention. With the cross-pollination of technologies and talent, we are committed to delivering long-term value to enhance the competitiveness of our customers. MPI is the first Taipei Exchange (TPEx) listed probe card company in Taiwan. For more information please visit: mpi-corporation.com About PTBPTB, with the main site situated in Braunschweig, is the National Metrology Institute of Germany and measures with the highest accuracy and reliability. PTB uses metrology as the core competence for the benefit of society, trade and industry, and science.
ABU DHABI, UAE, Jan. 28, 2026 /PRNewswire/ -- G42, Cerebras Systems and the Institute of Foundation Models at Mohamed bin Zayed University of Artificial Intelligence (MBZUAI), today announced the release of K2 Think V2. This latest 70-billion parameter advanced reasoning system reasoning system is now built on the K2-V2 base model, IFM's strongest fully frontier-class open-source foundation model that's purpose built for K2 Think. MBZUAI Launches K2 Think V2: UAE’s Fully Sovereign, Next-Generation Reasoning System This launch marks a major milestone for the UAE's technological sovereignty. While earlier versions of K2 Think were open and widely accessible, K2 Think V2 (70B) is the first to be open from end-to-end; from pre-training data and curation through post-training, reasoning alignment, and evaluation. The result is a reasoning system that is both more transparent and more powerful. By upgrading the base model to K2-V2, K2 Think V2 unlocks a new level of performance, openness, and independence, reinforcing the UAE's leadership in building frontier-grade AI systems that are globally accessible and fully sovereign. Why K2 Think V2 is Different K2 Think V2 marks a step change in open reasoning systems, shifting from a reasoning model layered on top of a foundation to one built directly into it. Inheriting K2-V2's long-context capabilities and full training transparency, it now operates as a fully sovereign system end-to-end. Every stage of K2 Think V2 (70B) is open, inspectable, and independently reproducible, ensuring both scientific credibility and national AI sovereignty. Designed as a purpose-built reasoning system, it solves complex problems step-by-step using long chains of thought across mathematics, science, coding, logic, and simulation. This reasoning-first, fully open foundation translates directly into greater levels of performance. K2 Think V2 delivers leading results on complex reasoning benchmarks, including AIME2025, GPQA-Diamond, HMMT, and IFBench, when compared against other open-source reasoning systems. Key Features, Made Simple Built on K2-V2 K2 Think V2 (70B) is powered by MBZUAI IFM's latest foundation model, designed from the outset to support reasoning, long context, and alignment, raising the ceiling for what the reasoning system can achieve. Longer Memory, Deeper Thought Expanded context length enables sustained, multi-step reasoning over much larger bodies of information. Truly Independent Data Pipeline All training relies on IFM-curated datasets, including the Guru dataset, fully decontaminated from downstream benchmarks to ensure fair and trustworthy evaluation. 360-Open Transparency From pre-training data and intermediate checkpoints to post-training recipes and evaluations, every component is available for inspection, reuse, and extension. For more information on K2 Think V2 (70B) or to explore the data used to build it, please visit the Institute of Foundation Models' official platform. You can also access the system and learn more through the following resources: Web Experience:Access the Web App Official Landing Page:Visit k2think.ai Mobile Apps:Download for iOSDownload for Android In-Depth Details: Read the full blog post here Visual Overview:Watch the Promo Video For more information, please visit https://mbzuai.ac.ae/ About Cerebras Cerebras Systems builds the fastest AI infrastructure in the world. We are a team of pioneering computer architects, computer scientists, AI researchers, and engineers. We make AI blisteringly fast through innovation and invention because we believe that when AI is fast it will change the world. Our flagship technology, the Wafer Scale Engine (WSE) is the world's largest and fastest AI processor. At 56 times larger than the largest GPU, the WSE uses a fraction of the power per unit compute while delivering inference and training more than 20 times faster than the competition. Leading corporations, research institutes and governments on five continents chose Cerebras to run their AI workloads. Cerebras solutions are available on premise and in the cloud. For further information, visit cerebras.ai or follow us on LinkedIn, X and/or Threads. About Mohamed bin Zayed University of Artificial Intelligence Mohamed bin Zayed University of Artificial Intelligence (MBZUAI) is the first university dedicated entirely to the advancement of science through AI. The university empowers the next generation of AI leaders, driving innovation and impactful applications of AI through world-class education and interdisciplinary research. In 2025, MBZUAI launched its first ever undergraduate program, a Bachelor of Science in AI, with two distinct streams: Business and Engineering. About MBZUAI's Institute of Foundation Models The Institute of Foundation Models (IFM) at MBZUAI is dedicated to pioneering academic research at the forefront of global AI innovation, driven by real-world societal needs. With deep scientific roots and world-class talent in Abu Dhabi, Paris, and Silicon Valley, IFM builds some of the world's most powerful foundation models - open, fast, and focused on solving real-world problems. These include the PAN World Model, K2, a 360-open LL, and K2-Think, a leading open-source system for advanced AI reasoning. IFM engineers have contributed to the development of low-resource language LLMs in Arabic (Jais), Hindi (Nanda) and Kazakh (Sherkala).
TOKYO, Feb. 28, 2024 /PRNewswire/ -- During the Tokyo Solar & PV Expo held from February 28th to March 1st, 2024, GCL System Integration (GCL SI), a pioneering PV enterprise, showcased its latest innovations including N-type TOPCon rectangular modules, granular polysilicon, and cutting-edge string energy storage solutions. At the event, GCL SI also introduced the concept of "Carbon Chain," leveraging blockchain technology for carbon management to drive sustainability in the renewable energy industry. GCL SI at PV Expo Japan The Japan PV Expo is recognized as the premier solar photovoltaic exhibition in Japan and across Asia, attracting over 1,400 exhibitors and more than 60,000 attendees. Over the years, this exhibition has evolved into a vital platform for advancing Japan's solar energy market and the broader Asian solar industry. GCL SI's showcased N-type TOPCon bifacial monocrystalline modules feature rectangular silicon wafer solar cells with a mass production efficiency exceeding 25%. Enhanced low-light efficiency, optimized temperature coefficients, and an impressive bifacial rate exceeding 80% contribute to significantly improved customer returns on investment compared to traditional products. In addition, the granular silicon products from the GCL group are also showcased at the exhibition, highlighting the advantages of FBR granular silicon over traditional rod silicon. FBR granular silicon offers benefits such as low unit investment, reduced energy costs, and lower carbon emissions. Its high efficiency and low-carbon quality are pivotal in driving the current trend towards N-type solar technology. Amid the escalating concerns surrounding global climate change, the imperative to reduce carbon emissions has become a shared objective across all sectors. Concepts like carbon footprint, traceability, and organizational carbon management are pivotal in fostering sustainable practices. GCL SI, dedicated to the renewable energy sector, introduced the Carbon Chain concept for the first time at the event. By integrating carbon footprint, traceability, and carbon management practices with cutting-edge technologies like blockchain, big data, artificial intelligence, carbon trading, carbon offsetting, and NFTs, GCL SI aims to achieve comprehensive supply chain traceability and lifecycle management of carbon emissions. This initiative seeks to enhance sustainability practices within the company, elevate the green development standards in the PV industry, and drive overall environmental stewardship. Thomas Zhang, Executive President of GCL SI, stated in an exclusive interview with PV Magazine that "the Carbon Chain concept leverages cutting-edge block chain technology and strategic partnerships to create a seamless and transparent carbon platform. It is a testament to our unwavering commitment to sustainability and corporate responsibility. By embracing this pioneering practice, we are not only reducing our own carbon footprint but also empowering others to do the same.". During the PV Expo, GCL SI entered a Cooperation Memorandum with TÜV Rheinland, an industrial certification body, to strengthen collaboration in various areas including products and services, laboratory infrastructure, workforce training, and market partnerships. This strategic alliance aims to propel advancements in the renewable energy sector. By signing the Cooperation Memorandum with TÜV Rheinland, GCL SI is demonstrating its dedication to upholding the highest standards of accountability and transparency in carbon trading. TÜV Rheinland's renowned expertise and credibility in certification and inspection services will enhance the integrity and reliability of the Carbon Chain concept. GCL SI has made significant advancements in recent years. The company has established module capacity bases in Hefei and Funing, China, with a total large-size compatible PV module capacity of 27 GW. Additionally, a 10 GW capacity of N-type TOPCon cells in Wuhu is under construction and is expected to begin production in the fourth quarter of 2023. The current average cell efficiency stands at an impressive 25.75%, positioning GCL SI at the forefront of the industry. With enhanced production and supply capabilities, GCL SI's module shipments regained a spot in the top ten in 2023. Additionally, GCL SI has been recognized as a Tier 1 PV module manufacturer by BNEF. GCL SI and TÜV Rheinland signing a Cooperation Memorandum
Infrared laser cleave technology enables ultra-thin-layer transfer from silicon substrates with nanometer precision, revolutionizing 3D integration for advanced packaging and transistor scaling ST. FLORIAN, Austria, Dec. 8, 2023 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®850 NanoCleave™ layer release system—the first product platform to feature EVG's revolutionary NanoCleave technology. The EVG850 NanoCleave system enables nanometer-precision release of bonded, deposited or grown layers from silicon carrier substrates using an infrared (IR) laser coupled with specially formulated inorganic release materials in a proven, high-volume-manufacturing (HVM) capable platform. As a result, the EVG850 NanoCleave eliminates the need for glass carriers—enabling ultra-thin chiplet stacking for advanced packaging, as well as ultra-thin 3D layer stacking for front-end processing, including advanced logic, memory and power device formation, to support future 3D integration roadmaps. View inside the EVG®850 NanoCleave™ layer release system, with the pre-processing module bay and the mechanical release module in the background. Source: EV Group. The first EVG850 NanoCleave systems have already been installed at customer facilities, and nearly two dozen product demonstrations are underway with customers and partners at customer sites and EVG's headquarters. Silicon Carriers Benefit 3D Stacking and Back-end Processing In 3D integration, glass substrates have become an established method for building up device layers through temporary bonding with organic adhesives, using an ultraviolet (UV) wavelength laser to dissolve the adhesives and release the device layers, which are subsequently permanently bonded onto the final product wafer. However, glass substrates are difficult to process with semiconductor fab equipment that have been designed primarily around silicon, and that require costly upgrades to enable glass substrate processing. In addition, organic adhesives are generally limited to processing temperatures below 300 °C, limiting their use to back-end processing. Enabling silicon carriers with inorganic release layers avoids these temperature and glass carrier compatibility issues. In addition, the nanometer precision of IR laser-initiated cleaving allows for processing extremely thin device wafers without changing processes of record. Subsequent stacking of such thin device layers enables higher-bandwidth interconnects and new opportunities to design and segment dies for next-generation, high-performance devices. Next-generation Transistor Nodes Require Thin-layer Transfer ProcessesAt the same time, transistor roadmaps for the sub-3-nm node call for new architectures and design innovations such as buried power rails, backside power delivery networks, complementary field-effect transistors (CFETs) and 2D atomic channels, all of which require layer transfer of extremely thin materials. Silicon carriers and inorganic release layers support process cleanliness, material compatibility and high processing temperature requirements for front-end manufacturing flows. However, until now, silicon carriers had to be completely removed using grinding, polishing and etching processes, which results in micron-range variations across the surface of the working device layer, making this method unsuitable for thin-layer stacking at advanced nodes. "Releasable" Fusion BondingThe EVG850 NanoCleave utilizes an IR laser and inorganic release materials to enable laser cleaving from silicon carriers with nanometer precision in production environments. The innovative process eliminates the need for glass substrates and organic adhesives, enabling front-end process compatibility for ultra-thin-layer transfer and downstream processes. The most demanding front-end processing is supported by the EVG850 NanoCleave's high-temperature compatibility (up to 1000 °C) while the room-temperature IR cleaving step ensures device layer and carrier substrate integrity. The layer transfer process also eliminates the need for expensive solvents associated with carrier wafer grinding, polishing and etching. The EVG850 NanoCleave is based on the same platform as EVG's industry-leading EVG850 series of automated temporary bonding/debonding and silicon-on-insulator (SOI) bonding systems, with a compact design and HVM-proven wafer handling system. According to Dr. Bernd Thallner, corporate R&D project manager at EV Group, "Since EVG's founding more than 40 years ago, our vision has been steadfast in being the first in exploring new techniques and serving next-generation applications of micro- and nanofabrication technologies. Recently, 3D and heterogeneous integration have stepped into the spotlight as key drivers of performance improvements on new semiconductor device generations. This in turn has brought wafer bonding front and center as a critical process for continuing PPACt (power, performance, area, cost and time-to-market) scaling. With our new EVG850 NanoCleave system, EVG has merged the benefits of temporary bonding and fusion bonding into one versatile platform supporting our customers' ability to extend their future roadmaps in both advanced packaging and next-generation scaled transistor design and manufacturing." For more information on the EVG850 NanoCleave layer release system, visit https://www.evgroup.com/products/bonding/temporary-bonding-and-debonding-systems/evg850-nanocleave. About EV Group (EVG)EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com. Contacts: Clemens Schütte David Moreno Director, Marketing and Communications Principal EV Group Open Sky Communications Tel: +43 7712 5311 0 Tel: +1.415.519.3915 E-mail: Marketing@EVGroup.com E-mail: dmoreno@openskypr.com Photo - https://mma.prnasia.com/media2/2295586/EV_Group_new_system.jpg?p=medium600Logo - https://mma.prnasia.com/media2/1278751/4444677/EV_Group_Logo.jpg?p=medium600
ST. FLORIAN, Austria and HONG KONG, May 23, 2023 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Dymek Company, an advanced equipment distributor for the semiconductor, biomedical, data storage, photovoltaic and aerospace industries, today announced that they have established a new joint venture company in Malaysia. The new company, called EV Group Malaysia Dymek Sdn. Bhd., will be charged with managing EVG's customer support operations in Malaysia. Hermann Waltl, executive sales and customer support director and member of the executive board at EVG, will serve as director of the new joint venture, and Sean Lim from Dymek will serve as managing director of the new joint venture. EV Group Malaysia Dymek is located at 70-3-31, D'Piazza Mall, Jalan Mahsuri, 11900 Bayan Lepas, Penang, Malaysia. Working closely with EVG's headquarters, EV Group Malaysia Dymek will be responsible for numerous key regional customer support activities, including equipment installation, technical service and support, spare parts management and supply, and process development support. The company will be fully operational in July 2023. "Malaysia has been an important center for semiconductor and microelectronics packaging, test and assembly for several decades. As global investments from leading chip manufacturers and outsourced semiconductor assembly and test companies in the region continue to ramp up, it is vital that EVG strengthen its customer support infrastructure here as well," stated Hermann Waltl. "Dymek has been a key strategic partner for EVG in several countries in Asia already for many years, and we look forward to partnering with them to enhance our customer support in Malaysia as well." "This strategic move by EV Group to establish a more direct presence in Malaysia will be well-received by the semiconductor and microelectronics industries of Southeast Asia. Companies here already recognize EVG as a market and technology leader in semiconductor process equipment, and now knowing they can receive local support from local engineers will only further increase their confidence and trust in EVG," stated Stanley Lam, managing director, Asia Pacific, at Dymek Company. "We are pleased to be working closely with EVG to grow and enhance their customer support infrastructure in Malaysia and across Southeast Asia." See EVG at SEMICON Southeast AsiaEVG is a sponsor and program speaker at SEMICON Southeast Asia, taking place May 23-25 at the Setia SPICE Convention Centre in Penang, Malaysia. Attendees interested in learning more about EVG's latest developments in heterogeneous integration are welcome to attend the Advanced Packaging Forum on Wednesday, May 24 at 15:00 to see Dr. Thorsten Matthias, regional sales director Asia-Pacific for EVG, present on state of the art and upcoming requirements in wafer-to-wafer and die-to-wafer hybrid bonding. About Dymek CompanyDymek Company Ltd was established in 1989 and is an advanced equipment distributor to leading manufacturers and innovative R&D facilities in the Aerospace, Biomedical, Semiconductor, Data Storage, and Photovoltaic industries. In the early 2000s, Dymek expanded from our headquarters in Hong Kong throughout Southeast Asia and China in order to meet the diverse needs of our customers. In today's globalized marketplace, it is standard for our customers to have integrated supply chains that link countries across Asia Pacific, and our expert staff is prepared to meet them wherever they are and connect them with industry-leading equipment from around the world. More information about Dymek is available at www.dymek.com. About EV Group (EVG)EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com. Dymek Contact:Dow WangMarketing ManagerDymek Company LtdTel: +60 4 641 5536E-mail: marketing@dymek.com EV Group Contacts: Clemens Schütte David Moreno Director, Marketing and Communications Principal EV Group Open Sky Communications Tel: +43 7712 5311 0 Tel: +1.415.519.3915 E-mail: Marketing@EVGroup.com E-mail: dmoreno@openskypr.com
A12 藝術空間
wafer inspection
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