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符合「wafer defect detection」新聞搜尋結果, 共 3 篇 ,以下為 1 - 3 篇 訂閱此列表,掌握最新動態
WiMi Developed Digital Holography-Based Semiconductor Wafer Defect Detection Technology

BEIJING, Aug. 31, 2023 /PRNewswire/ -- WiMi Hologram Cloud Inc. (NASDAQ: WIMI) ("WiMi" or the "Company"), a leading global Hologram Augmented Reality ("AR") Technology provider, today announced that an innovative detection technique based on digital holography has been developed to meet the needs of semiconductor wafer defect detection. The technique utilizes digital holography to record the amplitude and phase of the wavefront from the target object directly to the individual images acquired by the CCD camera, and can effectively detect defects on wafers as small as a few nanometers by resolving the phase difference of the height difference. Digital holography is a high-resolution imaging technique based on optical principles that records and analyzes wavefront information about a target object. By utilizing deep ultraviolet laser illumination and phase difference analysis, the technique is able to accurately detect defects as small as a few nanometers on structures with high aspect ratios. Compared to traditional defect detection methods, digital holography has the advantages of higher sensitivity, better resolution, and non-destructive testing. Defect detection on semiconductor wafers has always been an integral part of the semiconductor manufacturing process. As the size of semiconductor devices continues to shrink and process complexity, traditional defect detection methods are facing challenges. To address this issue, WiMi's R&D team has successfully introduced digital holography into the defect inspection of semiconductor wafers through their tireless efforts. Digital holography utilizes deep-ultraviolet laser illumination to record the amplitude and phase information of the wavefront of the target object. By dividing the laser beam into reference light and object light and irradiating them onto the CCD camera and the object to be measured respectively, the interference patterns of the reference light and object light are obtained. Then, the amplitude and phase information of the object light can be recovered from the interference pattern by a mathematical reconstruction algorithm. The phase information can accurately reflect the surface topography of the target object. WiMi's successful development of semiconductor wafer defect detection technology through the use of digital holography will bring many benefits to the semiconductor manufacturing industry. First, digital holography can improve manufacturing yields and reduce the production and waste of defective products. Its high sensitivity and resolution make defect detection of high aspect ratio features more accurate and reliable, helping to identify and solve production problems early. Second, digital holography provides phase information of defects, allowing users to visualize and analyze the morphology, size and topology of defects. This is important for understanding the defect generation mechanism and optimizing the manufacturing process. In addition, the technology generates a 3D image of the wafer surface, further providing visualization and in-depth analysis of defects. WiMi's digital holography technology has achieved remarkable results in several experiments and tests. Digital holography has shown unique advantages over other wafer inspection techniques in detecting defects in high aspect ratio structures. The technique has been successfully applied to several benchmark wafers for defect detection and compared with other conventional methods. The experimental results show that digital holography has excellent performance in detecting defects in high aspect ratio features. In particular, for defects with height differences as small as a few nanometers, such as incorrectly etched contacts, digital holography is able to accurately capture them and provide high-quality phase and amplitude images. Digital holography offers the following advantages in semiconductor wafer defect detection. High sensitivity and resolution: Digital holography is capable of detecting defects as small as a few nanometers, and has high sensitivity and resolution for detecting defects in high aspect ratio structures. Non-destructive testing: Digital holography is a non-contact inspection method that does not physically damage the wafer sample and maintains the integrity and repeatability of the sample. Defect visualization and topology analysis: Digital holography provides phase information of defects, allowing users to visualize and analyze the morphology, size and topology of defects. This is important for understanding the defect generation mechanism and optimizing the manufacturing process. Automation and efficiency: Digital holography can be combined with image processing and machine learning algorithms to automate defect detection and classification. By analyzing large amounts of data, defects can be identified and located quickly and accurately, improving productivity and manufacturing yields. In comparison to other techniques, digital holography offers significant advantages in the detection of defects in high aspect ratio features, such as incorrectly etched contacts. Digital holography is able to accurately capture these defects, thus improving defect detection for high aspect ratio features. In addition to superior detection capabilities, digital holography offers the benefits of automation and efficiency. By combining it with image processing and machine learning algorithms, the technology enables automated defect detection and classification. By analyzing large amounts of data, defects can be quickly and accurately identified and located, resulting in improved productivity and manufacturing yields. Digital holography technology has a broad application prospect in the field of semiconductor wafer defect detection. With the continuous development of semiconductor processes and the increased demand for nanoscale manufacturing, the demand for high-resolution, high-sensitivity defect detection technology is increasing. Digital holography, as a non-contact, high-resolution imaging technology, is expected to become an important tool in semiconductor manufacturing and promote the progress of semiconductor manufacturing. About WIMI Hologram Cloud WIMI Hologram Cloud, Inc. (NASDAQ:WIMI) is a holographic cloud comprehensive technical solution provider that focuses on professional areas including holographic AR automotive HUD software, 3D holographic pulse LiDAR, head-mounted light field holographic equipment, holographic semiconductor, holographic cloud software, holographic car navigation and others. Its services and holographic AR technologies include holographic AR automotive application, 3D holographic pulse LiDAR technology, holographic vision semiconductor technology, holographic software development, holographic AR advertising technology, holographic AR entertainment technology, holographic ARSDK payment, interactive holographic communication and other holographic AR technologies. Safe Harbor Statements This press release contains "forward-looking statements" within the Private Securities Litigation Reform Act of 1995. These forward-looking statements can be identified by terminology such as "will," "expects," "anticipates," "future," "intends," "plans," "believes," "estimates," and similar statements. Statements that are not historical facts, including statements about the Company's beliefs and expectations, are forward-looking statements. Among other things, the business outlook and quotations from management in this press release and the Company's strategic and operational plans contain forward-looking statements. The Company may also make written or oral forward-looking statements in its periodic reports to the US Securities and Exchange Commission ("SEC") on Forms 20-F and 6-K, in its annual report to shareholders, in press releases, and other written materials, and in oral statements made by its officers, directors or employees to third parties. Forward-looking statements involve inherent risks and uncertainties. Several factors could cause actual results to differ materially from those contained in any forward−looking statement, including but not limited to the following: the Company's goals and strategies; the Company's future business development, financial condition, and results of operations; the expected growth of the AR holographic industry; and the Company's expectations regarding demand for and market acceptance of its products and services. Further information regarding these and other risks is included in the Company's annual report on Form 20-F and the current report on Form 6-K and other documents filed with the SEC. All information provided in this press release is as of the date of this press release. The Company does not undertake any obligation to update any forward-looking statement except as required under applicable laws.

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 527 加入收藏 :
ACE Solution and Teradyne Collaborate to Pioneer New Horizons in Semiconductor Testing - Interview with Marketing Director Aik-Moh Ng

Hsinchu, Taiwan, 5th, August 2024 -Since 2022, ACE Solution has strategically partnered with Teradyne to advance their ETS platform for semiconductor testing. We had the privilege of interviewing Teradyne's marketing director, Aik-Moh Ng, who has led the Teradyne ETS Asia-Pacific team since 2006.   The integration of ICs in power management has significantly increased over time. With the rise of electric vehicles, challenges in battery management systems have emerged, necessitating efficient systems to maximize battery usage. Additionally, the growth of AI will facilitate the development of many power management ICs, driving the demand for high-end advanced GPUs, CPUs, and TPUs. These devices require substantial power during startup, consequently increasing the demand for power modules.   ACE Solution fully supports Teradyne's ETS test solutions, with the ETS-800 focusing on power management ICs and the ETS-88 and ETS-364 used for testing DC-DC converters and power modules. The ETS-800 is the best choice for meeting the complex testing needs of battery management ICs, reducing load board complexity, and providing optimal test cost efficiency with its high throughput. ACE Solution's solutions significantly reduce test time in areas such as micro-modules, power modules, intelligent stations, and AI servers.   Aik-Moh Ng shared, "The four major trends in electric vehicle development are electrification, consumer electronics, autonomous driving, and connected cars, where testing SiC double pulses and power modules is crucial for the electric vehicle inverter market. The Taiwan market focuses on how to test power modules effectively. Achieving full autonomous driving will require many more semiconductors of all types, including more power management ICs, to integrate the information of the surrounding environment for real-time decision-making. ACE Solution's testing solutions, developed on Teradyne's platform, excel in stray inductance control. Based on ETS's software functionality - AWU benchmark, it enables fast switching operations and high-voltage transitions in double-pulse testing, offering greater reliability. Compared to traditional program-based implementations, the ETS-88TH performs excellently in dynamic testing, with relatively easy and effective parameter adjustments, earning high customer trust."   In collaboration with Teradyne, ACE Solution develops power management IC (MOSFET/IGBT) testing solutions. Successful implementation cases demonstrate the strong partnership between the two companies, standing out in market share. Aik-Moh Ng stated, "Teradyne is known for its excellent quality platforms, and ACE Solution's close relationship with customers, and superior pre-sales and after-sales technical support services are crucial for the rapid adoption and expansion of the ETS platform."   Regarding the development of the Asia-Pacific market, Aik-Moh Ng shared: "Convincing Asia-Pacific customers to prefer European and American brands is a highly challenging task. Therefore, we need to develop new testing solutions that match local requirements. Our collaboration with ACE Solution provides us with opportunities, and in the future, we aim to further expand our presence in Southeast Asia." ACE Solution excels in customer service, with strong business and engineering teams providing reliable support for Teradyne. Teradyne can rely on ACE Solution's sales network and collaborate with engineers to develop programs based on the ETS platform, creating new business opportunities.   Looking ahead to the next 5-10 years, Aik-Moh Ng foresees significant innovations and breakthroughs in semiconductor testing technology. The demand for battery management ICs will continue to grow, and with the popularity of AI, GPUs, and CPUs, the demand for power module testing will also increase dramatically. Additionally, the integration of RF and Wi-Fi will continue to improve. Aik-Moh Ng noted, "Teradyne’s focus on automation and AI for test data analysis to better predict future trends and conduct predictive maintenance, ensures equipment runs smoothly and benefits production and supply chain planning. We look forward to the collaboration between Teradyne and ACE Solution, which will lead to innovation in the semiconductor test field and provide customers with better products and services in the future."     For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Peter Lee, Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw Website: https://www.acesolution.com.tw/en/     About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to the specific requirements of our customers in the field of electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished team of technical experts who offer unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively.   Teradyne Traci Tsuchiguchi Investor Relations Address: 600 Riverpark Drive, North Reading, MA 01864, USA Telephone: +1 978.370.2444 E-mail: investorrelations@teradyne.com Website: https://www.teradyne.com/     About Teradyne Teradyne test technology helps bring high-quality innovations such as smart devices, life-saving medical equipment and data storage systems to market, faster. Its advanced test solutions for semiconductors, electronic systems, wireless devices and more ensure that products perform as they were designed. Its robotics offerings include collaborative and mobile robots that help manufacturers of all sizes increase productivity, improve safety, and lower costs. In 2023, Teradyne had revenue of $2.7 billion and today employs over 6,600 people worldwide. For more information, visit teradyne.com. Teradyne® is a registered trademark of Teradyne, Inc., in the U.S. and other countries.

文章來源 : 筑波科技股份有限公司 發表時間 : 瀏覽次數 : 604 加入收藏 :
筑波科技與美商泰瑞達攜手共創半導體測試新局面-專訪市場總監Aik-Moh Ng

台灣新竹,2024年08月05日——自2022年以來,筑波科技 (ACE Solution) 與美商泰瑞達 (Teradyne) 展開策略合作,共同推動半導體測試的 ETS 平台。我們特別專訪 Teradyne 的行銷總監Aik-Moh Ng,他自2006年以來一直領導 Teradyne ETS 亞太地區團隊。   隨著市場發展,電源管理中集成電路的整合明顯提升。電動車的崛起同時帶來電池管理系統的挑戰,需要高效的系統來最大化電池使用。此外,AI 技術將促進許多電源管理 IC 的發展,推動高端先進 GPU、CPU 和 TPU 的需求。這些設備在啟動時需要大量電力,因此增加對電源模組的需求。   筑波科技全力支持 Teradyne 的 ETS 測試解決方案,ETS-800 專注於電源管理 IC,ETS-88 和 ETS-364 用於測試 DC-DC 轉換器和電源模組。ETS-800 是滿足電池管理 IC 複雜測試需求的最佳選擇,減少負載板複雜性,兼備高產出並同時提供最佳測試成本效率。筑波科技的解決方案顯著減少了微模組、電源模組、智能站和 AI 伺服器等領域的測試時間。   Aik-Moh Ng表示:「電動車發展的四大趨勢是電氣化、消費電子、自動駕駛和互聯汽車,其中測試 SiC 雙脈衝和電源模組對於電動車逆變器市場至關重要。台灣市場關注如何有效地測試電源模組。要實現完全自動駕駛,將需要更多類型的半導體,包括更多的電源管理 IC,以整合周圍環境的信息進行及時決策。筑波科技基於 Teradyne 平台開發的測試解決方案,在雜散電感控制方面表現出色。基於 ETS 軟件功能 - AWU 基準,它能在雙脈衝測試中實現快速切換操作和高電壓過渡,提供更高的可靠性。與傳統的程序實現相比,ETS-88TH 在動態測試中表現極度優異,參數調整相對簡單有效,贏得了客戶的高度信任。」   與 Teradyne 合作,ACE Solution 開發電源管理 IC(MOSFET/IGBT)測試解決方案。成功的實施案例展示了兩家公司之間的緊密的合作關係,在市場份額上脫穎而出。吳一墨指出:「Teradyne 以其優秀的品質平台著稱,ACE Solution 與客戶的緊密關係,以及卓越的售前和售後技術支持服務,是 ETS 平台快速採用和擴展的關鍵。」   關於亞太市場的發展,Aik-Moh Ng分享:「說服亞太地區的客戶接納歐美品牌是一項極具挑戰性的任務。因此,我們需要開發符合當地需求的新測試解決方案。與筑波科技的合作為我們提供機會,未來我們將進一步擴大在東南亞的影響力。」筑波科技在客戶服務方面表現出色,擁有強大的業務和工程團隊,為 Teradyne 提供可靠的支持。Teradyne 可以依賴筑波科技的銷售網絡,並與工程師合作,基於 ETS 平台開發方案,創造新的商機。   展望未來5-10年,Aik-Moh Ng預測半導體測試技術將有顯著的創新和突破。電池管理 IC 的需求將繼續增長,隨著 AI、GPU 和 CPU 的普及,電源模組測試的需求也將大幅增加。此外,RF 和 Wi-Fi 的集成將不斷改善。Aik-Moh Ng指出:「Teradyne 專注於自動化和 AI 進行測試數據分析,以更好地預測未來趨勢並進行預防性維護,確保設備穩定運行,有利於生產和供應鏈計劃。我們期待 Teradyne 與筑波科技的合作,將在半導體測試領域帶來創新,並為客戶提供更優質的產品和服務。」   聯絡筑波科技  筑波科技股份有限公司ACE Solution, Co., Ltd. 地址:新竹縣竹北市台元街28號2樓之1 電話:03-5500909 電子郵件:service@acesolution.com.tw 網站:https://www.acesolution.com.tw/en/index/     關於筑波科技(ACE Solution) 筑波科技(https://www.acesolution.com.tw/en/index/)成立於2000年,位於台灣新竹,在中國蘇州和深圳設有分公司。我們的使命是提供訂製的測試解決方案,以滿足電氣元件、設備和系統製造商的客戶需求,通過合作夥伴提供技術解決方案。我們專注於射頻、毫米波和太赫茲領域,擁有專業的技術支援團隊,提供專業、創新和多功能的綜合技術和解決方案。   聯絡美商泰瑞達  Traci Tsuchiguchi Investor Relations 地址: 600 Riverpark Drive, North Reading, MA 01864, USA 電話: +1 978.370.2444 電子郵件: investorrelations@teradyne.com 網站: https://www.teradyne.com/     關於美商泰瑞達 泰瑞達的測試技術幫助將高品質的創新產品,如智能設備、急救醫療設備和數據存儲系統更快推向市場。其先進的半導體、電子系統、無線設備等測試解決方案確保產品依照客戶設計展現其性能。泰瑞達的機器人產品包括協作機器人和移動機器人,幫助各規模的製造商提高生產力、改善安全性和降低成本。2023年,泰瑞達收入達27億美元,現有全球員工超過6600人。欲了解更多信息,請訪問 teradyne.com。泰瑞達® 是泰瑞達公司的註冊商標,適用於美國和其他國家。

文章來源 : 筑波科技股份有限公司 發表時間 : 瀏覽次數 : 2568 加入收藏 :
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