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Single, standardized cable assembly provides common hardware solution that combines power, plus low- and high-speed signals, to simplify server designs Flexible, easy-to-implement interconnectivity solution replaces multiple components and reduces need to manage multiple cables Low-profile design and mechanical structure aligned with Molex's OCP-recommended, NearStack PCIe to optimize space, reduce risk and speed time to market LISLE, IL - Media OutReach - 18 October 2023 - Molex, a global electronics leader and connectivity innovator, has expanded its array of solutions recommended by the Open Compute Project (OCP) with the introduction of the KickStart Connector System. An innovative, all-in-one system, KickStart is the first OCP-compliant solution that combines low-speed and high-speed signals, as well as power circuits, into a single cable assembly. This complete system eliminates the need for multiple components, optimizes space and accelerates upgrades by offering server and device manufacturers a flexible, standardized and easy-to-implement approach for boot-drive peripheral connections. "The KickStart Connector System reinforces our goal to remove complexity and drive increased standardization in modern data centers," said Bill Wilson, new product development manager for Datacom & Specialty Solutions, Molex. "The availability of this OCP-compliant solution reduces risk for customers, alleviates their burden of validating separate solutions and provides a faster, simpler path to critical data center server upgrades." Modular Building Blocks for Next-Gen Data Centers The integrated signal and power system is a standardized Small Form Factor (SFF) TA-1036 cable assembly that complies with OCP's Data Center Modular Hardware System (DC-MHS) specification. Developed in collaboration with members of OCP, KickStart is recommended in OCP's M-PIC specification for cable-optimized, boot-peripheral connectors. As the only OCP-recommended internal I/O connectivity solution for boot-drive applications, KickStart empowers customers to address evolving storage-signal speeds. The system accommodates PCIe Gen 5 signal speeds, with data transfer rates up to 32 Gbps NRZ. Planned support for PCIe Gen 6 will meet demands for ever-increasing bandwidth requirements. Moreover, KickStart is aligned with the form factor and robust mechanical structure of Molex's award-winning, OCP-recommended NearStack PCIe Connector System, which offers the lowest mated profile height of 11.10mm for improved space optimization, increased airflow management and reduced interference with other components. The new connector system also allows for simple, hybrid cable assembly pinout from KickStart connectors to Sliver 1C for Enterprise and Data Center Standard Form Factor (EDSFF) hard-drive docking. Support for hybrid cables further simplifies integration with servers, storage and other peripheral devices while easing hardware upgrades and modularization strategies. Unified Standards Bolster Product Performance, Reduce Supply Chain Constraints Ideally suited for OCP servers, data centers, white box servers and storage systems, KickStart reduces the need for multiple interconnect solutions while expediting product development. Designed to support both current and evolving signal speeds and power requirements, Molex's data-center product development team collaborated with the company's power engineering group to optimize power-contact design, thermal simulation and power dissipation. As with all Molex interconnectivity solutions, KickStart is backed by world-class engineering, volume manufacturing and global supply chain capabilities. Product Availability Samples of the KickStart Connector System are available for evaluation. Open Compute Project Global Summit 2023 Visit Molex at Booth B1 for a complete product showcase of the latest OCP-recommended and OCP-compliant connectivity solutions, including KickStart. See how Molex is paving the way for the next-gen OCP rack standard with a demo featuring Molex IT gear, power-shelf harnesses and Busbar along with 224G solutions with cabled backplane, CX2 Dual Speed, Inception, Mirror Mezz Enhanced and more. Attend informative sessions on industry collaborations and developments driving technology advancements, including: Partnership to Enable Copper for the Next Generation Artificial Intelligence Computing—Joint presentation with Nvidia, October 19, 3:20pm CXL Forum, SJCC - Lower Level - LL20BC Thermal Characterization of High-Power Pluggable IO Transceivers—Joint presentation with Cisco, October 18, 9:40 AM, SJC Concourse Level, 210AE Reliability and Material Compatibility: Evaluation of High-Power Interconnects for Single-Phase Immersion Cooling—October 19, 10:30 AM, SJCC Concourse Level, 220C Hashtag: #MolexThe issuer is solely responsible for the content of this announcement.About MolexMolex is a global electronics leader committed to making the world a better, more-connected place. With a presence in more than 40 countries, Molex enables transformative technology innovation in the automotive, data center, industrial automation, healthcare, 5G, cloud and consumer device industries. Through trusted customer and industry relationships, unrivaled engineering expertise, and product quality and reliability, Molex realizes the infinite potential of Creating Connections for Life. For more information, visit www.molex.com.
ASIX launches the new generation of driverless USB Ethernet controller solution -- “AX88179B USB 3.2 Gen1 to Gigabit Ethernet Controller”. This solution eliminates the need for annoying driver download and installation steps, enables users to effortlessly achieve a good plug-and-play networking experience. HSINCHU, Taiwan – Oct. 18th, 2023 – With USB interfaces becoming ubiquitous in various smart mobile devices, USB Ethernet controllers provide an ideal solution for customers seeking portable, high-speed, stable, and reliable wired networking. To meet the demands of modern users for simple and convenient network connections, ASIX Electronics Corporation (TWSE:3169) today launches the new generation of driverless USB Ethernet controller solution -- “AX88179B USB 3.2 Gen1 to Gigabit Ethernet Controller”. Users can instantly experience driverless USB Ethernet connectivity by using ASIX’s AX88179B USB 3.2 to Gigabit Ethernet controller solution. ASIX introduces the latest AX88179B USB 3.2 to Gigabit Ethernet controller solution, offering users a seamless way to establish Gigabit Ethernet wired network connections via the convenient USB 3.2 interface. The AX88179B boasts exceptional cross-platform compatibility, supporting inbox network drivers on major operating systems, including Windows 11/10/8.x, Linux/Android/Chrome OS and Nintendo Switch, etc., and also compatible to the native CDC-NCM driver of iOS/iPadOS/macOS and Linux operating systems. The driverless installation feature makes it effortless for users to enjoy a hassle-free plug-and-play networking experience. In addition, AX88179B supports advanced Precision Time Protocol (PTP) feature for those specific applications requiring precise time synchronization capabilities. The AX88179B is a high-integrated, easy-design and cost-efficient USB Ethernet controller solution. It is suitable for various smart home and office network applications, which require establishing Gigabit Ethernet network connectivity through the USB 3.2 interface, such as laptops, USB Ethernet dongles, docking stations, smart mobile device cradles, POS terminals, game consoles, smart cameras, set-top boxes, 5G/LTE router, and embedded systems with USB 3.2 interface. Instantly experience driverless USB Ethernet connectivity, powered by ASIX AX88179B USB 3.2 to Gigabit Ethernet Controller. Please visit ASIX website: https://www.asix.com.tw/ or contact ASIX Electronics Corp. via e-mail: sales@asix.com.tw for more information. ### About ASIX Electronics CorporationASIX Electronics Corporation is a leading IC design company for Industrial/Embedded networking and connectivity solutions. ASIX was founded in May 1995 in Hsinchu Science Park, Taiwan, and has been listed on Taiwan OTC Stock Exchange (TAIEX code 3169) since November 2009. ASIX products include Industrial Ethernet ICs, SuperSpeed USB Ethernet ICs, Non-PCI/SPI Embedded Ethernet ICs, Interface ICs, RS-232/RS-485 UART Transceivers and USB KVM Switch/Wi-Fi/Ethernet SoCs. ASIX has been certified as an ISO 9001 and 14001 suppliers. This achievement represents our continuing commitment to maintain a world-class quality system. For more information, please visit ASIX website: https://www.asix.com.tw/.
High-speed, cable-free, solid-state wireless devices replace traditional mechanical connectors for efficient, durable and seamless, point-to-point communications Next-generation solutions integrate RF transceivers and antennas in one package to simplify and speed product design and development Game-changing technology ideally suited for video displays, self-driving vehicles, industrial robots, consumer electronics and medical devices, especially in harsh environments LISLE, IL , USA - Media OutReach - 27 September 2023 - Molex, a global electronics leader and connectivity innovator, has diversified its robust product portfolio with the introduction of the MX60 series of contactless connectivity solutions. These low-power, high-speed, solid-state devices feature miniaturized mmWave RF transceivers and built-in antennas in one complete package for faster, simpler, device-to-device communications without the use of physical cables or connectors. As a result, MX60 solutions offer greater product design freedom, seamless device pairing and increased communications reliability for video displays, sleek and light consumer electronics, industrial robotics and devices operating in harsh environments. "The distinct product design and development advantages enabled by our MX60 contactless connectivity solutions will set the standard for point-to-point wireless communications in the future," said Stephen Drinan, director of Wireless Connectivity at Molex. "Our MX60 series extends Molex's best-in-class connectivity solutions while leveraging our longstanding expertise in mmWave antenna design, signal integrity and volume manufacturing to ignite a new era of connectivity innovations." Unique Capabilities Propel Seamless Wireless Connectivity The MX60 series is based on unique, wireless chip-to-chip technology and more than 350 filed patent applications Molex acquired in 2021 with the purchase of core technology and intellectual property from Keyssa Inc., a pioneer in high-speed contactless connectivity. The acquired technology operates at data rates from 1-to-5.4 Gbps on the 60 GHz band with no Wi‑Fi or Bluetooth interference. The first models in the MX60 series replace traditional DisplayPort, Gigabit Ethernet and USB SuperSpeed connectors to reduce development time, cost and risk. An integrated retimer optimizes signal integrity at higher data rates. Additionally, a space-saving, contactless solution that provides USB2 and other low-speed interfaces is currently in development. "Every piece of real estate counts when designing smartphones, AR/VR glasses, smartwatches and other consumer devices," said Walter Rivera, senior manager, Wireless Connectivity Product Manager for the Micro Solutions Business Unit at Molex. "By combining USB2 and other low-speed interfaces in one contactless solution, we will offer product developers a critical head-start as they won't have to worry about fitting extra components into ever-shrinking form factors." Ideal for High-Vibration Applications and Harsh Environments The MX60 series also improves the durability of products exposed to harsh environmental conditions, such as dust, moisture and corrosion. The solutions address a wide variety of applications and devices, including smartphones, AR/VR glasses, tablets, self-driving vehicles, video walls, industrial robotics, medical wearables, wireless docking stations and more. These sealed, contact-free solutions provide significant benefits over physical metal-to-metal contacts, which can degrade over time and impact product performance and reliability. In contrast, Molex's contactless connectivity solutions are less prone to risks associated with ingress and repeated motion, including high-vibration and rotational products. The ability to remove diagnostic ports on wirelessly charged devices also can reduce development and production costs while boosting overall product reliability. Product Availability Production samples are available for the following contactless connectivity solutions: MX60 USB SuperSpeed—convenient and cost-effective connectivity designed for high-vibration and harsh environments, including mobile devices and networking applications. MX60 Gigabit Ethernet—robust solutions for wireless infrastructure, industrial automation, medtech and networking applications. MX60 DisplayPort Main and Auxiliary—high-speed replacement for conventional DisplayPort connectors. DisplayPort Auxiliary works in conjunction with other products in the MX60 family to provide a return channel to the DisplayPort interface; can also function as a low-speed link for less demanding applications. Plans are underway to expand the MX60 series further by leveraging Molex's world-class mmWave antenna, high-speed signal integrity and volume manufacturing expertise. Hashtag: #MolexThe issuer is solely responsible for the content of this announcement.About MolexMolex is a global electronics leader committed to making the world a better, more-connected place. With a presence in more than 40 countries, Molex enables transformative technology innovation in the automotive, data center, industrial automation, healthcare, 5G, cloud and consumer device industries. Through trusted customer and industry relationships, unrivaled engineering expertise, and product quality and reliability, Molex realizes the infinite potential of Creating Connections for Life. For more information, visit www.molex.com.
SHANGHAI, Sept. 20, 2023 /PRNewswire/ -- According to the Digital Isolator Market With COVID-19 Impact Analysis Global Forecast to 2026 of Markets and Markets, the market share of digital isolator products of NOVOSENSE has been increased in three consecutive years. NOVOSENSE's isolation chip is based on capacitive coupling technology, using its patented Adaptive OOK® coding technology, with low EMI radiation and low bit error rate, which can effectively improve the isolation device's ability of common–mode transient immunity (CMTI). All electrical products involve power supply, and the common power supply includes voltage regulated power supply, switching power supply, inverter power supply, variable frequency power supply, and uninterruptible power supply. Most power supplies require isolation devices to ensure equipment and personal safety. Because of the different isolation technology used, the isolation effect is also different. Therefore, the choice of isolation products should promote the advantages and avoid the disadvantages, so as to achieve the best system performance as far as possible. NOVOSENSE has a wide range of isolation products, including digital isolators, isolated drivers, isolated voltage/current amplifiers, isolated CAN transceivers. In terms of drivers, whether it is MOS, IGBT or SiC, NOVOSENSE has corresponding isolation products. In terms of sampling, it has both analog output isolated operational amplifier and digital output isolated ADC, which can meet the requirements of sampling rate and sampling accuracy in different application scenarios. In terms of interfaces, NOVOSENSE has a wealth of isolated I2C interfaces, and RS485 or CAN interface products, which can provide a one-stop solution for customers' power supply design.
Contactless connectors slated to deliver increased reliability, durability and design advantages over physical, metal-to-metal contacts Vehicle-to-everything (V2X) antennas enable seamless communications between vehicles and infrastructure Power required for connected homes will drive innovations in energy management Hyperscale data centers built on 224G system architecture will enable unprecedented connectivity in the face of AI-driven data-processing requirements. LISLE, IL - Media OutReach - 14 September 2023 - Molex, a global electronics leader and connectivity innovator, has released a new industry report that highlights opportunities and obstacles facing product design engineers as the future of connectivity continues to unfold. The report, "Predicting the Connectivity of Tomorrow: Innovations Driving the Connected World," offers compelling insights into the transformative powers of next-generation connectivity, which is poised to unlock ground-breaking product innovations. "From factory floors and hyperscale data centers to self-driving vehicles and smart, energy-efficient homes, connectivity innovations are shaping our technology future," said Joe Nelligan, CEO of Molex. "Every step forward requires cross-disciplinary engineering, world-class manufacturing and constant collaboration with customers to push the boundaries of high-speed, high-power connectors. We're excited to serve as a catalyst in this global push to lead the evolution of connectivity while accelerating the evolution of life-changing solutions." Leading-edge connectivity is the cornerstone of new products and solutions found in every industry and application area. To help product designers and engineers prepare for what lies ahead, Molex subject matter experts took a closer look at innovations on the rise, including: Next-generation, contactless connectivity Vehicle-to-everything (V2X) communications Connected, energy-independent homes Centralized, hyperscale hubs of connectivity Timely observations shed light on the trajectory of these important innovations, as well as their ever-increasing impact on automobiles, consumer devices, factories, medical wearables, smartphones, smart homes, data centers and more. Additionally, Molex experts offer perspectives on the critical role that connectivity plays in driving the creation of new business models, such as Transportation-as-a-Service, which challenges conventional vehicle ownership. Paving the Way for Contactless Connectivity Contactless connectors use miniaturized radio frequency (RF) transceivers and receivers to enable devices to communicate and exchange data without requiring physical contact between them. They also support much higher data rates than previously possible with existing wireless protocols, such as Bluetooth and Wi-Fi. Distinct reliability and durability advantages over physical, metal-to-metal contacts make contactless connectors ideal for video displays, harsh environments, sleek and light consumer electronics, as well as industrial robotics. The pace of development in this area is gaining momentum as companies realize opportunities for streamlined product designs, reduced costs and seamless device pairing. Navigating the Road Ahead for V2X Antennas Ongoing developments in antennas, sensors and connectors are among the most relevant enablers of evolving vehicle-to-everything (V2X) capabilities. Backed by a decade-long roadmap of 5G V2X projects and established industry leadership in shark-fin antenna development, Molex has set a steady pace of innovation in support of self-driving vehicles. Close collaboration with automakers and suppliers is essential to defining optimal antenna placement and performance. Additionally, advancements in non-conductive materials will allow future connected vehicles to incorporate seamless designs without sacrificing connectivity to satellites, Wi-Fi networks and other systems. Powering Connected, Energy-Efficient Homes of the Future Tomorrow's connected homes will combine Internet of Things (IoT) functionality with battery storage systems to ensure greater control and visibility over energy production and usage. Innovations in energy management, such as mini-inverters for solar panels and smart battery management systems, will improve energy-usage efficiency and control. These storage systems are expected to play a crucial role in the intelligent monitoring and routing of power where it's needed most. Molex's continued focus in this area led to the development of the Volfinity Cell Contacting System, which was selected by BMW last Spring for its next-gen electric vehicle (EV) class. Forming Connected, Hyperscale Hubs Hyperscale data centers built on 224G system architectures will enable Artificial Intelligence (AI) to help consumers optimize energy consumption while empowering businesses to keep pace with relentless requirements for real-time data processing. The rapid adoption of generative AI is forcing hyperscale data centers to evolve, prompting Molex to pioneer 224 Gbps-PAM4 architecture. Molex's first-to-market 224G product portfolio offers unparalleled flexibility and scalability, along with superior signal integrity and robust mechanical composition. Hashtag: #MolexThe issuer is solely responsible for the content of this announcement.About MolexMolex is a global electronics leader committed to making the world a better, more-connected place. With a presence in more than 40 countries, Molex enables transformative technology innovation in the automotive, data center, industrial automation, healthcare, 5G, cloud and consumer device industries. Through trusted customer and industry relationships, unrivaled engineering expertise, and product quality and reliability, Molex realizes the infinite potential of Creating Connections for Life. For more information, visit www.molex.com.
SHENZHEN, China, Sept. 6, 2023 /PRNewswire/ -- Berxel Photonics ("Berxel"), pioneer in VCSEL semiconductor R&D and manufacturer of high speed optical communications VCSELs and 3D depth camera, announces today a live demo of its 106 Gbps VCSEL powered 800G transceiver at China International Optoelectronic Exposition (CIOE) Booth12D71 in Shenzhen, from September 6 – 8 2023. Berxel Photonics 106 Gbps PAM4 Eye Diagram As global chips shortage and high price persists, cost effective and power efficient 106 Gbps VCSEL is a proven solution for commercial high-speed 4 x 100G and 8 x 100G short reach transceivers and active optical cable (AOC) applications. Berxel's 106 Gbps VCSEL powered 800G transceiver has successfully reached 100 meters OM4 transmission distance, with lower than 1E-8 Bit-error rates (BER) at 0°C – 70°C module case temperature, complying to IEEE standards. In addition, Berxel demonstrated 60-100 meters transmission over low-cost legacy OM2 and OM3 MMF fibers with low BER. Berxel's 106 Gbps PAM4 per lane has been sample-tested by leading module integrators. Leveraging our design, testing capabilities, 6" process foundry and global supply chain for 4x 53 Gbps volume delivery, Berxel is uniquely positioned to provide the most scalable and cost-effective solution to the future 800 Gbps SR8 and AOC demands from all types of data center. In 2024, Berxel will apply innovative High Contrast Grating technology on 106 Gbps VCSEL to enable 3-5 times longer transmission distance. AvailabilityBerxel's 106 Gbps VCSEL is available now for customers' sampling. The 53 Gbps PAM4 per lane VCSEL array is in mass production phase for commercial use. Please contact us for the 106 Gbps VCSEL live demonstration at CIOE, September 6-8 2023 in Shenzhen. About Berxel Photonics Berxel Photonics is a leading optoelectronic semiconductor company. The founding team has more than 20 years of expertise in Vertical Cavity Surface Emitting Laser (VCSEL) device and epitaxy designs, fabrication processes, high speed and reliability characterizations. Committed to providing cutting-edge high performance VCSEL chips for data centers' high speed optical communications, and high precision 3D cameras solving common painpoints of multi-path reflection noises, empowering Robotics and AIoT applications globally. www.berxel.com For enquiries, please contact:Alita WongSenior DirectorBerxel Photonics Co Ltd.alita@berxel.com 1-650 843 9168
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