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符合「silicon photonics」新聞搜尋結果，共 37 篇，以下為 1 - 24 篇

ACE Solution x HON. PRECISION at SEMICON Taiwan 2024, ACE Solution President Steve Hsu (left) and HON. PRECISION President Alan Hsieh (right)

Global Business News

ACE Solution and HON. PRECISION Unveil Advanced Compound Semiconductor and Silicon Photonics Technologies at SEMICON Taiwan 2024

Hsinchu, Taiwan, September 9, 2024 -SEMICON Taiwan officially opened on September 6, 2024, with ACE Solution and HON. PRECISION is joining forces to showcase its latest advancements in silicon photonics testing technology, precision measurement, and automated machinery integration. Their exhibition focused on high-density optoelectronic integration testing solutions designed to meet the increasing demands of silicon photonics for high-capacity and high-channel testing. The integrated optoelectronic signal testing system effectively addresses the challenges posed by increased data center traffic and high-speed transmission needs, significantly boosting transmission rates and reducing energy consumption. With semiconductor packaging evolving towards Co-Packaged Optics (CPO), ACE Solution highlighted its silicon photonics solutions developed through deep collaboration with Quantifi, integrating PXI testing modules to offer an efficient, multi-system testing solution supporting 800G and 1.6T high-speed transmission. These integrated solutions meet the research and production needs for high-speed, high-precision, and high-efficiency testing while offering programmable automation for flexible applications. ACE Solution also demonstrated its latest innovations in compound semiconductor testing. The Teradyne ETS-88 testing platform is widely used for SiC, GaN, PMIC, automotive electronics, aerospace, and defense industries. Key features include multi-site CP, second-contact KGD, dynamic/static power device FT, and fully automated high-output module FT. The ETS-364 and ETS-800 platforms are tailored for mixed-signal, digital, and analog testing, offering the industry's highest-spec power IC testing capabilities with support for up to 6000V and 4000A, making them ideal for high-current, high-voltage applications, particularly in EV power and battery management. The TZ-6000 non-destructive wafer and materials inspection system utilizes terahertz (THz) technology, focusing on compound semiconductor testing for GaAs, SiC, and GaN. It offers greater penetration depth and flexibility, handling various sizes and shapes of wafers. Equipped with advanced wafer probes and intelligent software analysis, it can simultaneously measure parameters such as thickness, refractive index, resistivity, dielectric constant, surface/subsurface defects, and full wafer scans, enabling non-destructive wafer quality measurements. The Electro-Optic Terahertz Pulse Reflectometer (EOTPR) is the world's first instrument to use isolation technology to detect IC package faults and monitor package quality, making it ideal for non-destructive defect detection in 3DIC package analysis. With 5-micron pinpoint precision, the EOTPR is widely used in advanced IC packaging fault analysis for devices such as stacked packages (PoP), flip-chip, and TSV in 3D packaging. Major semiconductor companies have extensively deployed EOTPR for advanced IC packaging quality assurance in manufacturing environments. Steve Hsu, President of ACE Solution, stated, "With over 20 years of experience in hardware-software integration, ACE Solution has expanded from wireless communication testing to various testing fields, meeting the needs of our local clients. We are thrilled to collaborate with HON. PRECISION to showcase our achievements in automation and precision testing." Alan Hsieh, President of HON. PRECISION commented, "This exhibition marks a new milestone in our partnership with ACE Solution. We look forward to offering more advanced solutions, fostering greater collaboration and innovation across the industry." For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Peter Lee, Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw Website: https://www.acesolution.com.tw/en/ About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to the specific requirements of our customers in the field of electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished team of technical experts who offer unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively.

文章來源 : 筑波科技股份有限公司 發表時間 : 2024/9/9 瀏覽次數 : 681 加入收藏 :

ACE Solution SEMICON Taiwan 2024 Invitation

Global Business News

Invitation: ACE Solution to Showcase Latest Semiconductor and Silicon Photonics Technologies at SEMICON Taiwan 2024

ACE Solution will participate in SEMICON Taiwan 2024 from September 4th to 6th Location: TaiNEX Hall 1 Booth: K3076 @HON. PRECISION We will showcase the latest achievements in semiconductors and silicon photonics during the exhibition. ACE Solution will introduce the following solutions: 👉 Teradyne ETS Compound Semiconductor Testing: The industry’s highest-spec power IC testing platform accommodates a wide range of IC types, with testing capabilities reaching 6000V and 4000A. This platform addresses the challenges of high-current and high-voltage testing, particularly in electric vehicle power and battery management applications. 👉 TZ-6000 Non-Destructive Wafer and Material Inspection: Utilizing Terahertz (THz) technology, this solution offers superior penetration depth compared to silicon, silicon carbide, and gallium nitride for semiconductor wafers. It provides non-destructive measurements of wafer quality, including thickness, refractive index, resistivity, dielectric constant, surface/subsurface defects at selected locations, and full-wafer scanning. 👉 EOTPR Non-Destructive Testing for 3DIC Advanced Packaging: The Electro-Optical Terahertz Pulse Reflectometry (EOTPR) system delivers 5-micron accuracy for fault analysis in complex and advanced IC packaging, such as Package-on-Package (PoP), Flip-Chip, and Through-Silicon Via (TSV) in 3D packaging. EOTPR is widely adopted in advanced IC packaging fault analysis and is extensively deployed in quality assurance and inspection within manufacturing environments. 👉 Photonic Integrated Silicon Photonics Testing: In collaboration with Hon Precision, ACE Solution offers a highly integrated electro-optical signal testing system architecture. This solution supports high-capacity, high-channel testing to meet the demands of high-speed data transmission and increased data center traffic. Integrating photonics and electronics significantly enhances transmission rates while reducing power consumption, leading to improved testing efficiency. We will also be organizing booth tours during the exhibition. Due to limited availability, spots will be arranged based on actual conditions, so please register early：https://docs.google.com/forms/d/e/1FAIpQLSe5vtgle1wl4dIxliik12YMNnObdqAFD7DwdBYVIxaxMWqlxQ/viewform?fbzx=-6591255857878872603 We welcome partners from all sectors to visit and discuss technical and business cooperation. 📢 Follow ACE Group LinkedIn, to stay updated with the news! For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Peter Lee, Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw Website: https://www.acesolution.com.tw/en/ About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to our customers' specific requirements in electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished technical expert team offering unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge, integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively.

文章來源 : 筑波科技股份有限公司 發表時間 : 2024/8/16 瀏覽次數 : 966 加入收藏 :

Tony Hsu (far left), Vice President of Marketing at ACE Solution, and Alex Zhang (second from left), Technical Sales Manager at Quantifi Photonics

Global Business News

Exclusive Interview with Quantifi Photonics' Alex Zhang: Exploring Global Silicon Photonics Technology and Market Trends

Hsinchu, Taiwan - June 7, 2024 - In response to the growing demands for high-speed transmission and increased data center traffic, the industry has progressed from megabyte speeds to gigabyte and terabyte transmissions, providing a highly efficient and convenient internet experience. Given the limitations of copper and bandwidth constraints, silicon photonics technology has emerged to enable high-speed transmission. Quantifi Photonics is dedicated to providing efficient testing solutions focused on optical, electrical, and optoelectronic signal testing in the telecommunications industry, particularly in high-speed, high-bandwidth optoelectronic signal testing, supporting data center construction, and the development of related systems. Quantifi Photonics has partnered with ACE Solution to deepen its cooperation in the silicon photonics market, focusing on high-density, optoelectronic testing solutions to meet the demands of high-capacity and high-channel silicon photonic testing. Unlike traditional optoelectronics, by producing different optical waveguides on silicon chips, modulating silicon, trans-impedance amplifiers (TIA), and photodetectors, traditional separate transceivers can be integrated into a single silicon chip, greatly improving transmission rates and reducing energy consumption, thereby enhancing testing efficiency. As the Technical Sales Manager for Quantifi in the Asia-Pacific region, Alex Zhang has extensive experience in the silicon photonics industry, specializing in providing technical solutions to partners and end-users, particularly in silicon photonic testing solutions. Alex shares, "Quantifi's competitive advantage lies in its ability to support both optical and electrical signal testing simultaneously based on the PXI platform. This advantage makes Quantifi's testing solutions more efficient than traditional instruments in high-density, high-channel testing." From a market development perspective, while silicon photonics technology is highly anticipated, many commercial applications are still in the research stage, and the market size still has room for growth compared to the traditional optoelectronics industry. In response to the potential interest from many customers in investing in the silicon photonics field, Quantifi and its partner ACE Solution continue to develop solutions to meet the needs of these customers, driving mass production applications. Alex shares, "Investing in the silicon photonics field requires substantial resources, not only in terms of financial investment but also in collaboration among different industry technology providers." Quantifi Photonics looks forward to collaborating with various industry players to achieve common goals from research and development to demonstration and mass production stages. Additionally, Alex emphasizes the crucial role of partnerships in advancing the silicon photonics market and promoting industry innovation: "ACE Solution has an excellent team of software and hardware engineers, excelling in integrating Quantifi's testing equipment to form a complete silicon photonics testing system. From wafer testing to module level, ACE Solution's ample resources provide strong support for Quantifi." For Quantifi, ACE Solution offers significant advantages in efficiently integrating solutions from different suppliers and, through cross-industry connections and abundant resources, also provides more local collaboration opportunities for Quantifi. For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Peter Lee, Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw Website: https://www.acesolution.com.tw/en/ Quantifi Photonics - HEADQUARTERS Address: 12-14 Parkway Drive, Rosedale, Auckland, New Zealand Telephone: +64-9-478-4849 E-mail: sales@quantifiphotonics.com Website: www.quantifiphotonics.com About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to the specific requirements of our customers in the field of electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished team of technical experts who offer unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively. About Quantifi Photonics Quantifi Photonics designs and manufactures test and measurement equipment for R&D engineers and manufacturers. It provides general purpose photonic test solutions such as lasers, optical spectrum analyzers, and power meters, and specializes in testing Silicon Photonics, Co-Packaged Optics (CPO) and pluggable transceivers. Quantifi Photonics products are used to test Photonic Integrated Circuits (PICs), optical engines and pluggable optical transceivers, and are optimized for high density, high channel count applications in manufacturing environments. The company also offers unique solutions for Coherent Optical Communications, Photon Doppler Velocimetry, and Optical Pulse Analysis. Discover more at www.quantifiphotonics.com.

文章來源 : 筑波科技股份有限公司 發表時間 : 2024/6/7 瀏覽次數 : 370 加入收藏 :

Daniel Henmi, Quantifi and Tony Hsu, ACE Solution

Global Business News

Exploring Global Optical Silicon Photonics Market Trends and Opportunities: Insights from Daniel Henmi, Quantifi Photonics Vice President of Sales

文章來源 : 筑波科技股份有限公司 發表時間 : 2023/7/7 瀏覽次數 : 2909 加入收藏 :

產經商業

7/5筑波科技研討會：Optical Communication & Silicon Photonics Workshop

全球資通訊隨時代廣泛應用、高畫質影像聲音應用新興崛起，頻寬迫切急需，光通訊傳輸介面因應數據倍增且交換機應用更加廣泛，筑波科技提供客戶最先進的光通訊測試及高速介面測試的解決方案。精密半導體封裝已朝向 CPO(Co-Packaged Optics) 得以造就多元矽光子應用的發展，Quantifi 整合PXI測試模組，能提供高效率整合多機一體測試方案，筑波科技亦有實際應用於光通訊與高速訊號介面傳輸整合、可程式自動化規劃…等功能，同時符合研發及生產單位部門在高速率、高精度、高效率的測試需求。熱忱邀請您與筑波科技專業團隊就市場和技術的最新趨勢探討及交流！歡迎光通訊產業領域： Silicon Photonics / Transceiver / HSDI / USB / Type-C/ AOC廠商、工程師與主管至報名網站報名參加。日期Date: 2023年7月5日 (三) PM12:30 – PM4:30 地點Location: 筑波醫電大樓1F 諾貝爾獎堂(新竹縣竹北市生醫二路66號-新竹生醫園區) 線上報名registration: https://register.acesolution.com.tw/20230705_Optical_Workshop 03-5500909 蔡小姐#3800 / 林小姐#3407 service@acesolution.com.tw / acemkt@acesolution.com.tw

文章來源 : 筑波科技股份有限公司 發表時間 : 2023/6/28 瀏覽次數 : 24411 加入收藏 :

Global Business News

IBM Brings the Speed of Light to the Generative AI Era with Optics Breakthrough

New co-packaged optics innovation could replace electrical interconnects in data centers to offer significant improvements in speed and energy efficiency for AI and other computing applications YORKTOWN HEIGHTS, N.Y., Dec. 10, 2024 /PRNewswire/ -- IBM (NYSE: IBM) has unveiled breakthrough research in optics technology that could dramatically improve how data centers train and run generative AI models. Researchers have pioneered a new process for co-packaged optics (CPO), the next generation of optics technology, to enable connectivity within data centers at the speed of light through optics to complement existing short reach electrical wires. By designing and assembling the first publicly announced successful polymer optical waveguide (PWG) to power this technology, IBM researchers have shown how CPO will redefine the way the computing industry transmits high-bandwidth data between chips, circuit boards, and servers. IBM Corporation logo. Today, fiber optic technology carries data at high speeds across long distances, managing nearly all the world's commerce and communications traffic with light instead of electricity. Although data centers use fiber optics for their external communications networks, racks in data centers still predominantly run communications on copper-based electrical wires. These wires connect GPU accelerators that may spend more than half of their time idle, waiting for data from other devices in a large, distributed training process which can incur significant expense and energy. IBM researchers have demonstrated a way to bring optics' speed and capacity inside data centers. In a technical paper, IBM introduces a new CPO prototype module that can enable high-speed optical connectivity. This technology could significantly increase the bandwidth of data center communications, minimizing GPU downtime while drastically accelerating AI processing. This research innovation, as described, would enable: Lower costs for scaling generative AI through a more than 5x power reduction in energy consumption compared to mid-range electrical interconnects1, while extending the length of data center interconnect cables from one to hundreds of meters. Faster AI model training, enabling developers to train a Large Language Model (LLM) up to five times faster with CPO than with conventional electrical wiring. CPO could reduce the time it takes to train a standard LLM from three months to three weeks, with performance gains increasing by using larger models and more GPUs.2 Dramatically increased energy efficiency for data centers, saving the energy equivalent of 5,000 U.S. homes' annual power consumption per AI model trained.3 "As generative AI demands more energy and processing power, the data center must evolve – and co-packaged optics can make these data centers future-proof," said Dario Gil, SVP and Director of Research at IBM. "With this breakthrough, tomorrow's chips will communicate much like how fiber optics cables carry data in and out of data centers, ushering in a new era of faster, more sustainable communications that can handle the AI workloads of the future." Eighty times faster bandwidth than today's chip-to-chip communicationIn recent years, advances in chip technology have densely packed transistors onto a chip; IBM's 2 nanometer node chip technology can contain more than 50 billion transistors. CPO technology aims to scale the interconnection density between accelerators by enabling chipmakers to add optical pathways connecting chips on an electronic module beyond the limits of today's electrical pathways. IBM's paper outlines how these new high bandwidth density optical structures, coupled with transmitting multiple wavelengths per optical channel, have the potential to boost bandwidth between chips as much as 80 times compared to electrical connections. IBM's innovation, as described, would enable chipmakers to add six times as many optical fibers at the edge of a silicon photonics chip, called "beachfront density," compared to the current state-of-the-art CPO technology. Each fiber, about three times the width of a human hair, could span centimeters to hundreds of meters in length and transmit terabits of data per second. The IBM team assembled a high-density PWG at 50 micrometer pitch optical channels, adiabatically coupled to silicon photonics waveguides, using standard assembly packaging processes. The paper additionally indicates that these CPO modules with PWG at 50 micrometer pitch are the first to pass all stress tests required for manufacturing. Components are subjected to high-humidity environments and temperatures ranging from -40°C to 125°C, as well as mechanical durability testing to confirm that optical interconnects can bend without breaking or losing data. Moreover, researchers have demonstrated PWG technology to an 18-micrometer pitch. Stacking four PWGs would allow for up to 128 channels for connectivity at that pitch. IBM's continued leadership in semiconductor R&DCPO technology enables a new pathway to meet AI's increasing performance demands, with the potential to replace off-module communications from electrical to optical. It continues IBM's history of leadership in semiconductor innovation, which also includes the first 2 nm node chip technology, the first implementation of 7 nm and 5 nm process technologies, Nanosheet transistors, vertical transistors (VTFET), single cell DRAM, and chemically amplified photoresists. Researchers completed design, modeling, and simulation work for CPO in Albany, New York, which the U.S. Department of Commerce recently selected as the home of America's first National Semiconductor Technology Center (NSTC), the NSTC EUV Accelerator. Researchers assembled prototypes and tested modules at IBM's facility in Bromont, Quebec, one of North America's largest chip assembly and test sites. Part of the Northeast Semiconductor Corridor between the United States and Canada, IBM's Bromont fab has led the world in chip packaging for decades. About IBMIBM is a leading provider of global hybrid cloud and AI, and consulting expertise. We help clients in more than 175 countries capitalize on insights from their data, streamline business processes, reduce costs and gain the competitive edge in their industries. More than 4,000 government and corporate entities in critical infrastructure areas such as financial services, telecommunications and healthcare rely on IBM's hybrid cloud platform and Red Hat OpenShift to affect their digital transformations quickly, efficiently and securely. IBM's breakthrough innovations in AI, quantum computing, industry-specific cloud solutions and consulting deliver open and flexible options to our clients. All of this is backed by IBM's long-standing commitment to trust, transparency, responsibility, inclusivity and service. Visit www.ibm.com for more information. Media Contacts: Bethany Hill McCarthyIBM Researchbethany@ibm.com Willa HahnIBM Researchwilla.hahn@ibm.com 1 A reduction from five to less than one picojoule per bit. 2 Figures based on training a 70 billion parameter LLM using industry-standard GPUs and interconnects. 3 Figures based on training a large LLM (such as GPT-4) using industry-standard GPUs and interconnects.

文章來源 : PR Newswire 美通社 發表時間 : 2024/12/10 瀏覽次數 : 380 加入收藏 :

2024壓軸登場！筑波科技化合物半導體與矽光子技術研討會，引領智慧製造未來

發表時間 : 2024/11/19

敬邀：11/14筑波科技化合物半導體與矽光子技術研討會

發表時間 : 2024/10/21

21st TAITA Annual Conference Explores Taiwan's AI Era Strategies in the Global Tech Supply Chain

發表時間 : 2024/10/14

筑波科技與鴻勁精密亮相 SEMICON Taiwan 2024 展示先進化合物半導體與矽光子技術

發表時間 : 2024/9/9

Kulicke & Soffa 參展SEMICON Taiwan 2024

發表時間 : 2024/9/4

DIGITIMES Asia: Kaynes SemiCon secures India's first paying OSAT customer for advanced semiconductor packaging

發表時間 : 2024/8/30

敬邀：筑波科技參與SEMICON Taiwan 2024 展示最新半導體及矽光子技術

發表時間 : 2024/8/16

2024 MWC Shanghai | H3C Fully Demonstrates New Achievements in Intelligent Computing, Accelerating the Construction of a New Intelligent Era

發表時間 : 2024/6/29

專訪Quantifi Photonics Alex Zhang: 探索全球矽光子技術與市場趨勢

發表時間 : 2024/6/7

筑波科技攜手業界領袖共襄光電數位產業高階主管交流會

發表時間 : 2024/5/27

筑波科技x美商泰瑞達共創卓越-4/17化合物半導體材料與測試技術研討會

發表時間 : 2024/4/18

敬邀：4/17筑波科技化合物半導體材料與測試技術研討會

發表時間 : 2024/4/1

Eoptolink Demonstrates Industry 1st 200G/lane LPOs with 100G/lane 800G LPOs Entering Mass Production

發表時間 : 2024/3/21

MPI Corporation's Advanced Semiconductor Test Division Joins Forces with Keysight Technologies as a Keysight Solutions Partner

發表時間 : 2024/3/14

New Research Initiatives Use Photonics to Address Wireless and Bandwidth Limitations

發表時間 : 2023/12/7

Baraja announces availability of integrated components for new-to-world Doppler RMCW Spectrum-Scan™ LiDAR

發表時間 : 2023/11/29

筑波科技與泰瑞達合作成功舉辦2023年壓軸化合物半導體應用交流會

發表時間 : 2023/11/13

SEMICON Taiwan 2023盛大開展台、美、日、歐產官學代表齊聚 20場高含金量論壇、超過25位兆、億級產業巨擘登台開講引領產業創新、永續升級

發表時間 : 2023/9/13

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