本網站使用瀏覽器紀錄 (Cookies) 來提供您最好的使用體驗，我們使用的 Cookie 也包括了第三方 Cookie。相關資訊請訪問我們的隱私權與 Cookie 政策。如果您選擇繼續瀏覽或關閉這個提示，便表示您已接受我們的網站使用條款。 關閉
SINGAPORE, Nov. 6, 2024 /PRNewswire/ -- The Global Fintech Institute (GFI), with the support of the Monetary Authority of Singapore (MAS), proudly announces the launch of FLEX, a global digital platform, and the Startup Investment Credentials (SIC) framework. These initiatives are designed to bring transparency, trust, and innovation to the global fintech ecosystem. FLEX is the go-to platform for driving collaboration, investment, and talent development in fintech. It is built on three pillars: FLEX.Collaborate: Fostering cross-industry and cross-border partnerships between fintech companies, investors, and industry leaders. FLEX.Match: Connecting fintech startups with investors and institutional lenders to accelerate growth. FLEX.Talent: Supporting talent development by enhancing job prospects and offering continuous training opportunities in the fintech sector. One of the key features, FLEX.Match, includes a database of over 1,000 global fintech companies. This open marketplace offers new opportunities for collaboration, investment, and innovation, further solidifying Singapore's position as a global fintech leader. The platform will focus on financial innovation and inclusion challenges worldwide. To support this matchmaking process, the SIC framework addresses challenges in startup evaluation. Developed with contribution from leading local and international industry players like Singapore Institute of Directors, Digital Lenders Association of India (DLAI), Fintech Australia, Global Impact FinTech Forum (GIFT) and more. SIC provides a standardized, data-driven method for assessing fintech startups. This framework simplifies due diligence, improves transparency, and fosters a stronger, more connected startup ecosystem. Collaboration is essential for creating a transparent and inclusive fintech investment landscape. GFI invites all industry stakeholders—investors, fintech companies, regulators, and associations—to collaborate in shaping and advancing this framework. Quotes: "FLEX and SIC are major steps forward for fintech, providing the tools needed for global collaboration and standardized startup evaluation. With FLEX.Match, fintech companies and investors will have new ways to connect and innovate, positioning Singapore as a global fintech leader," said Prof. David Lee, Co-chairman of Global Fintech Institute. "GFTN supports GFI in its mission to create open financial digital infrastructures like FLEX, which will drive innovation and promote ethical growth in the fintech sector. We look forward to seeing FLEX advance digital trust and attract targeted investors," said Mr. Sopnendu Mohanty, Group CEO Designate of Global Finance and Technology Network (GFTN). Call for collaboration FLEX is an inclusive industry-wide platform and initiative. Organizations interested in spearheading fintech innovation are encouraged to engage with us. We welcome diverse partners, including financial institutions, investors, family offices, corporates, and startups, to participate in this transformative journey. Your involvement can take various forms, such as committing capital, featuring fintech liquidity and investment opportunities, and contributing to the build-out of the community and platform. To download the full whitepaper, visit https://globalfintechinstitute-9495468.hs-sites.com/startup-investment-credentials-sic-whitepaper To understand more about FLEX, visit www.flex.sg About Global Fintech Institute:Global Fintech Institute (GFI) is a not-for-profit think tank and certification body dedicated to advancing fintech education, fostering meaningful collaboration, and promoting professional excellence across regulatory bodies, corporations, and academic institutions. Headquartered in Singapore, GFI tackles key challenges in the fintech landscape through rigorous research, insightful whitepapers, and thought leadership discussions which influence policy and set industry standards. Our Key Thrusts: Professional credentialing of fintech talents Accreditation of fintech education programmes globally International platform for certified fintech companies, investors & talents
2024年10月17日，台灣新竹 — 筑波科技宣布與格斯科技及格棋化合物半導體簽訂合作備忘錄，三方將在電池品質測試及半導體晶圓檢測領域深度合作，在精密檢測與材料技術市場邁入新階段。 在此次合作中，筑波科技與格斯科技將聚焦於電池芯及軟包電池的品質參數測試，運用非破壞性、非接觸式的太赫茲脈衝時域光譜技術，對電池芯及軟包電池的品質檢測，確保產品的品質與安全性。雙方致力於提升檢測精度及效率，為市場提供更具競爭力的解決方案。格斯科技專注於新興電池技術，特別是在鈦酸鋰電池（LTO）及高鎳三元鋰電池的研發和製造方面處於領先地位，提供從材料到電池模組設計與組裝的全套客製化服務。 筑波科技與格棋化合物半導體攜手合作碳化矽半導體晶圓的缺陷檢測，採用TZ6000/6500系統，運用非破壞性、非接觸式的太赫茲脈衝時域光譜技術，精確檢測SiC半導體晶圓的缺陷，從而提升晶圓的品質與可靠性。格棋化合物半導體專注於6吋和8吋導電型及半絕緣型碳化矽的長晶技術研發和製造，強調上下游廠商的垂直整合，推動整個產業鏈的進一步擴展與發展。 格斯科技/ 格棋化合物半導體董事長張忠傑表示：「我們非常期待與筑波科技的合作，這將大幅提升我們在電池與半導體產業鏈市場中的技術含量。」筑波科技董事長許深福表示：「筑波致力於系統整合客製化，結合格斯科技/格棋化和物半導體的研發與製造能量，可共創新局面綜效，節省成本、提升產品品質，未來可望著墨儲能產業鏈，鞏固雙方市場差異化領導地位與技術能量。」 筑波科技專注於精密量測儀器的銷售與租賃，涵蓋無線通訊、RF量測、高頻配件、半導體晶圓和電池芯的測試及技術解決方案。此次與格斯科技及格棋化合物半導體的合作，將提升在市場中的競爭力，並為產業提供突破性的檢測技術與服務。 聯絡筑波科技: 筑波科技股份有限公司ACE Solution, Co., Ltd. 李凱傑Peter Lee, 林孟樺Jenny Lin 地址：新竹縣竹北市台元街28號2樓之1 電話：+886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw 網站：https://www.acesolution.com.tw/en/ 關於筑波科技 筑波科技（https://www.acesolution.com.tw/en/index/）成立於2000年，位於台灣新竹，在中國蘇州和深圳以及越南設有分公司，可提供服務。我們的使命是提供訂製的測試解決方案，以滿足電氣元件、設備和系統製造商的客戶需求，通過合作夥伴提供技術解決方案。我們專注於射頻、毫米波和太赫茲領域，擁有專業的技術支援團隊，提供專業、創新和多功能的綜合技術和解決方案。
HANGZHOU, China, Sept. 24, 2024 /PRNewswire/ -- Westlake University 's spin-off company Moldnano released the world's first silicon carbide (SiC) AR glasses on Tuesday, potentially reshaping the landscape of augmented reality technology just days before Meta's anticipated Orion AR glasses reveal. The concept SiC AR Glasses presented by Moldnano The SiC AR glasses, with a single waveguide weighing only 2.7 grams and having a thickness of 0.55 millimeters, offer a remarkably lightweight and thin profile compared to traditional AR glasses. This breakthrough is achieved through the use of silicon carbide (SiC) material, which boasts an ultra-high refractive index, high thermal conductivity and low density. Min Qiu, chief scientist at Moldnano and chair professor at Westlake University, demonstrated the glasses, highlighting their ability to provide full-color display using a single waveguide layer. Conventional AR glasses require multiple layers of high-refractive-index glass and cover glasses, resulting in bulkier designs. The SiC AR glasses boast a theoretical field of view (FOV) up to 80 degrees for single layer full-color display, surpassing the 40-degree limit of traditional high-refractive-index glass solutions. This expanded FOV promises a more immersive user experience for both entertainment and professional applications. Moldnano's researchers have also addressed the common "rainbow artifacts" issue in AR glasses through precise waveguide structure design. The company claims to have completely eliminated this distracting visual artifact, providing users with a cleaner display. Heat management, a persistent challenge in AR glasses, is tackled through an innovative approach that utilizes the lens itself for heat dissipation. This design allows for full-color, long-term display without overheating concerns, a significant improvement over traditional cooling methods. The development represents a milestone in micro-nano optics and fills a gap in China's AR industry chain. As Meta prepares to release its Orion AR glasses, Moldnano's announcement intensifies the competition in the rapidly evolving AR hardware market. Industry experts suggest that such advancements could accelerate the integration of AR technology into daily life, with potential applications spanning the education, healthcare, entertainment, and industrial sectors. Moldnano SiC AR Glasses solution
- Integration in Traction Inverters Extends Cruising Range, Improving Performance - KYOTO, Japan, Sept. 5, 2024 /PRNewswire/ -- ROHM Co., Ltd. has announced the adoption of power modules equipped with 4th-generation SiC MOSFET bare chips for traction inverters in three models of the ZEEKR EV brand from Zhejiang Geely Holding Group, one of the top 10 global automakers. Since 2023, these power modules have been mass-produced and shipped from HAIMOSIC (SHANGHAI) Co., Ltd. -- a joint venture between ROHM and Zhenghai Group Co., Ltd. -- to Viridi E-Mobility Technology (Ningbo) Co., Ltd. a Tier 1 manufacturer under Geely. Geely and ROHM have been collaborating since 2018, beginning with technical exchanges, then later forming a strategic partnership focused on SiC power devices in 2021. This led to the integration of ROHM's SiC MOSFETs into the traction inverters of three models: the ZEEKR X, 009, and 001. In each of these EVs, ROHM's power solutions centered on SiC MOSFETs play a key role in extending the cruising range and enhancing overall performance. ROHM is committed to advancing SiC technology, with plans to launch 5th-generation SiC MOSFETs in 2025 while accelerating market introduction of 6th- and 7th-generation devices. Moreover, by offering SiC in various forms, including bare chips, discrete components, and modules, ROHM is able to promote the widespread adoption of SiC technology, contributing to the creation of a sustainable society. Image: https://cdn.kyodonewsprwire.jp/prwfile/release/M106254/202408275466/_prw_PI1fl_X6yAZ1a1.jpg ZEEKR Models Equipped with ROHM's EcoSiC (TM) The ZEEKR X, which features a maximum output exceeding 300kW and a cruising range of over 400km despite being a compact SUV, is attracting attention even outside China due to its exceptional cost performance. The 009 minivan features an intelligent cockpit and large 140kWh battery, achieving an outstanding maximum cruising range of 822km. And for those looking for superior performance, the flagship model, 001, offers a maximum output of over 400kW from dual motors with a range of over 580km along with a four-wheel independent control system. Release: https://www.rohm.com/news-detail?news-title=2024-08-29_news_geely&defaultGroupId=false About ZEEKR: https://kyodonewsprwire.jp/attach/202408275466-O1-7J42jJ8u.pdf About ROHM: https://kyodonewsprwire.jp/attach/202408275466-O2-dfjDjY16.pdf Market background and EcoSiC (TM): https://kyodonewsprwire.jp/attach/202408275466-O3-3Kf8Xrms.pdf Supporting information: https://kyodonewsprwire.jp/attach/202408275466-O4-ovCJAWs9.pdf Logo: https://cdn.kyodonewsprwire.jp/prwfile/release/M106254/202408275466/_prw_PI2fl_ftufK59s.jpg EcoSiC is a trademark or registered trademark of ROHM Co., Ltd. Official website: https://www.rohm.com/
- Industry-leading* Power Density Achieved by Integrating 4th Generation SiC MOSFETs in Compact Package - KYOTO, Japan, June 11, 2024 /PRNewswire/ -- ROHM Co., Ltd. has developed four models as part of the TRCDRIVE pack (TM) series with 2-in-1 SiC molded modules (two of 750V-rated: BSTxxxD08P4A1x4, two of 1,200V-rated: BSTxxxD12P4A1x1) optimized for xEV (electric vehicles) traction inverters. TRCDRIVE pack (TM) supports up to 300kW and features high-power-density and a unique terminal configuration, helping solve the key challenges of traction inverters in terms of miniaturization, higher efficiency, and fewer person-hours. As the electrification of cars rapidly advances towards achieving a decarbonized society, the development of electric powertrain systems that are more efficient, compact, and lightweight is currently progressing. However, for SiC power devices that are attracting attention as key components, achieving low loss in a small size has been a difficult challenge. ROHM solves these issues inside powertrains with its TRCDRIVE pack (TM). A trademark brand for ROHM SiC molded type modules developed specifically for traction inverter drive applications, TRCDRIVE pack (TM) reduces size by utilizing a unique structure that maximizes heat dissipation area. On top, ROHM's 4th Generation SiC MOSFETs with low ON resistance are built in, resulting in an industry-leading power density level 1.5 times higher than that of general SiC molded modules while greatly contributing to the miniaturization of inverters for xEVs. The modules are also equipped with control signal terminals using press fit pins enabling easy connection by simply pushing the gate driver board from the top, reducing installation time considerably. In addition, low inductance (5.7nH) is achieved by maximizing the current path and utilizing a two-layer bus-bar structure for the main wiring, contributing to lower losses during switching. TRCDRIVE pack (TM) image: https://cdn.kyodonewsprwire.jp/prwfile/release/M106254/202406041753/_prw_PI1fl_w5DAh6xu.jpg Despite developing modules, ROHM has established a mass production system similar to discrete products, making it possible to increase production capacity 30 times compared to conventional SiC case-type modules. Release: https://www.rohm.com/news-detail?news-title=2024-06-11_news_trcdrive-pack&defaultGroupId=false Product image: https://cdn.kyodonewsprwire.jp/prwfile/release/M106254/202406041753/_prw_PI2fl_MuIp6XyE.jpg *ROHM's June 11, 2024 study TRCDRIVE pack (TM) is the trademark or registered trademarks of ROHM Co., Ltd. About ROHM: https://kyodonewsprwire.jp/attach/202406041753-O1-8a0140NZ.pdf Logo: https://cdn.kyodonewsprwire.jp/prwfile/release/M106254/202406041753/_prw_PI3fl_54i0YolV.jpg Official website: https://www.rohm.com/
萬物電氣化推動了碳化矽 （SiC）技術在交通、電網和重型商用車等中高壓應用領域的廣泛採用。為了幫助開發人員部署SiC解決方案並快速推進開發流程，Microchip Technology Inc.今日推出採用Augmented Switching™ 專利技術的3.3 kV XIFM 隨插即用mSiC™柵極驅動器。該驅動器採用預配置模組設置，開箱即用，可大幅縮短設計和評估時間。 為了加快產品上市時間，這款隨插即用的解決方案已經完成了柵極驅動器電路設計、測試和驗證等複雜的開發工作。XIFM 數位柵極驅動器是一種結構緊湊的解決方案，具備數位控制、整合電源和可提高抗噪能力的堅固光纖介面。該柵極驅動器具有預配置的“開/關”柵極驅動曲線，可量身定製以優化模組效能。 它具有10.2 kV初級到次級強化隔離，內置監控和保護功能，包括溫度和直流鏈路監控、欠壓鎖定 (UVLO)、過壓鎖定 (OVLO)、短路/過流保護 (DESAT) 和負溫度係數 (NTC)。這款柵極驅動器還符合鐵路應用的重要規範EN 50155標準。 Microchip碳化矽業務部副總裁Clayton Pillion表示：「隨著碳化矽市場的不斷發展和對更高電壓極限的不斷突破，Microchip推出3.3 kV隨插即用mSiC柵極驅動器等交鑰匙解決方案，使電源系統開發商更容易採用寬頻隙技術。與傳統類比解決方案相比，該解決方案透過預配置柵極驅動電路，可將設計週期縮短 50%。」 Microchip在SiC元件和電源解決方案的開發、設計、製造和支援等方面擁有20多年的豐富經驗，能夠協助客戶輕鬆、快速、放心地採用SiC。Microchip 的 mSiC™ 產品包括具有標準、修改和客製化選項的 SiC MOSFET、二極體和柵極驅動器。如需瞭解有關Microchip SiC產品組合的更多資訊，請點擊此處。 供貨 3.3 kV XIFM隨插即用mSiC柵極驅動器現已上市。如需瞭解更多資訊或購買，請聯繫Microchip業務代表、全球授權經銷商或參閱Microchip採購和客戶服務網站 www.microchipdirect.com。
A12 藝術空間
sic
請先登入後才能發佈新聞。
還不是會員嗎？立即 加入台灣產經新聞網會員 ，使用免費新聞發佈服務。 （服務項目） （投稿規範）
