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Hsinchu, Taiwan, 5th, August 2024 -Since 2022, ACE Solution has strategically partnered with Teradyne to advance their ETS platform for semiconductor testing. We had the privilege of interviewing Teradyne's marketing director, Aik-Moh Ng, who has led the Teradyne ETS Asia-Pacific team since 2006. The integration of ICs in power management has significantly increased over time. With the rise of electric vehicles, challenges in battery management systems have emerged, necessitating efficient systems to maximize battery usage. Additionally, the growth of AI will facilitate the development of many power management ICs, driving the demand for high-end advanced GPUs, CPUs, and TPUs. These devices require substantial power during startup, consequently increasing the demand for power modules. ACE Solution fully supports Teradyne's ETS test solutions, with the ETS-800 focusing on power management ICs and the ETS-88 and ETS-364 used for testing DC-DC converters and power modules. The ETS-800 is the best choice for meeting the complex testing needs of battery management ICs, reducing load board complexity, and providing optimal test cost efficiency with its high throughput. ACE Solution's solutions significantly reduce test time in areas such as micro-modules, power modules, intelligent stations, and AI servers. Aik-Moh Ng shared, "The four major trends in electric vehicle development are electrification, consumer electronics, autonomous driving, and connected cars, where testing SiC double pulses and power modules is crucial for the electric vehicle inverter market. The Taiwan market focuses on how to test power modules effectively. Achieving full autonomous driving will require many more semiconductors of all types, including more power management ICs, to integrate the information of the surrounding environment for real-time decision-making. ACE Solution's testing solutions, developed on Teradyne's platform, excel in stray inductance control. Based on ETS's software functionality - AWU benchmark, it enables fast switching operations and high-voltage transitions in double-pulse testing, offering greater reliability. Compared to traditional program-based implementations, the ETS-88TH performs excellently in dynamic testing, with relatively easy and effective parameter adjustments, earning high customer trust." In collaboration with Teradyne, ACE Solution develops power management IC (MOSFET/IGBT) testing solutions. Successful implementation cases demonstrate the strong partnership between the two companies, standing out in market share. Aik-Moh Ng stated, "Teradyne is known for its excellent quality platforms, and ACE Solution's close relationship with customers, and superior pre-sales and after-sales technical support services are crucial for the rapid adoption and expansion of the ETS platform." Regarding the development of the Asia-Pacific market, Aik-Moh Ng shared: "Convincing Asia-Pacific customers to prefer European and American brands is a highly challenging task. Therefore, we need to develop new testing solutions that match local requirements. Our collaboration with ACE Solution provides us with opportunities, and in the future, we aim to further expand our presence in Southeast Asia." ACE Solution excels in customer service, with strong business and engineering teams providing reliable support for Teradyne. Teradyne can rely on ACE Solution's sales network and collaborate with engineers to develop programs based on the ETS platform, creating new business opportunities. Looking ahead to the next 5-10 years, Aik-Moh Ng foresees significant innovations and breakthroughs in semiconductor testing technology. The demand for battery management ICs will continue to grow, and with the popularity of AI, GPUs, and CPUs, the demand for power module testing will also increase dramatically. Additionally, the integration of RF and Wi-Fi will continue to improve. Aik-Moh Ng noted, "Teradyne’s focus on automation and AI for test data analysis to better predict future trends and conduct predictive maintenance, ensures equipment runs smoothly and benefits production and supply chain planning. We look forward to the collaboration between Teradyne and ACE Solution, which will lead to innovation in the semiconductor test field and provide customers with better products and services in the future." For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Peter Lee, Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw Website: https://www.acesolution.com.tw/en/ About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to the specific requirements of our customers in the field of electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished team of technical experts who offer unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively. Teradyne Traci Tsuchiguchi Investor Relations Address: 600 Riverpark Drive, North Reading, MA 01864, USA Telephone: +1 978.370.2444 E-mail: investorrelations@teradyne.com Website: https://www.teradyne.com/ About Teradyne Teradyne test technology helps bring high-quality innovations such as smart devices, life-saving medical equipment and data storage systems to market, faster. Its advanced test solutions for semiconductors, electronic systems, wireless devices and more ensure that products perform as they were designed. Its robotics offerings include collaborative and mobile robots that help manufacturers of all sizes increase productivity, improve safety, and lower costs. In 2023, Teradyne had revenue of $2.7 billion and today employs over 6,600 people worldwide. For more information, visit teradyne.com. Teradyne® is a registered trademark of Teradyne, Inc., in the U.S. and other countries.
2024年10月17日,台灣新竹 — 筑波科技宣布與格斯科技及格棋化合物半導體簽訂合作備忘錄,三方將在電池品質測試及半導體晶圓檢測領域深度合作,在精密檢測與材料技術市場邁入新階段。 在此次合作中,筑波科技與格斯科技將聚焦於電池芯及軟包電池的品質參數測試,運用非破壞性、非接觸式的太赫茲脈衝時域光譜技術,對電池芯及軟包電池的品質檢測,確保產品的品質與安全性。雙方致力於提升檢測精度及效率,為市場提供更具競爭力的解決方案。格斯科技專注於新興電池技術,特別是在鈦酸鋰電池(LTO)及高鎳三元鋰電池的研發和製造方面處於領先地位,提供從材料到電池模組設計與組裝的全套客製化服務。 筑波科技與格棋化合物半導體攜手合作碳化矽半導體晶圓的缺陷檢測,採用TZ6000/6500系統,運用非破壞性、非接觸式的太赫茲脈衝時域光譜技術,精確檢測SiC半導體晶圓的缺陷,從而提升晶圓的品質與可靠性。格棋化合物半導體專注於6吋和8吋導電型及半絕緣型碳化矽的長晶技術研發和製造,強調上下游廠商的垂直整合,推動整個產業鏈的進一步擴展與發展。 格斯科技/ 格棋化合物半導體董事長張忠傑表示:「我們非常期待與筑波科技的合作,這將大幅提升我們在電池與半導體產業鏈市場中的技術含量。」筑波科技董事長許深福表示:「筑波致力於系統整合客製化,結合格斯科技/格棋化和物半導體的研發與製造能量,可共創新局面綜效,節省成本、提升產品品質,未來可望著墨儲能產業鏈,鞏固雙方市場差異化領導地位與技術能量。」 筑波科技專注於精密量測儀器的銷售與租賃,涵蓋無線通訊、RF量測、高頻配件、半導體晶圓和電池芯的測試及技術解決方案。此次與格斯科技及格棋化合物半導體的合作,將提升在市場中的競爭力,並為產業提供突破性的檢測技術與服務。 聯絡筑波科技: 筑波科技股份有限公司ACE Solution, Co., Ltd. 李凱傑Peter Lee, 林孟樺Jenny Lin 地址:新竹縣竹北市台元街28號2樓之1 電話:+886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw 網站:https://www.acesolution.com.tw/en/ 關於筑波科技 筑波科技(https://www.acesolution.com.tw/en/index/)成立於2000年,位於台灣新竹,在中國蘇州和深圳以及越南設有分公司,可提供服務。我們的使命是提供訂製的測試解決方案,以滿足電氣元件、設備和系統製造商的客戶需求,通過合作夥伴提供技術解決方案。我們專注於射頻、毫米波和太赫茲領域,擁有專業的技術支援團隊,提供專業、創新和多功能的綜合技術和解決方案。
SHENZHEN, China, Oct. 12, 2024 /PRNewswire/ -- On September 27, the Third GMIF2024 Innovation Summit (Global Memory Innovation Forum) was successfully concluded in Renaissance Shenzhen Bay Hotel. The event was hosted by the Semiconductor Investment Alliance and the Shenzhen Memory Industry Association, co-organized by the Guangdong Integrated Circuit Industry Association and the Shenzhen Semiconductor Industry Association, and organized by JW Insights Consulting (Xiamen) Co., Ltd. and Haitong Securities Co., Ltd. In recognition of outstanding achievements and innovation in the storage industry, the GMIF2024 Annual Awards winners were unveiled at the summit. Following a rigorous selection process, many companies, including Intel, Micron, CXMT, YMTC, GigaDevice, Arm, UNISOC, SIXUNITED, Victory Giant, BIWIN Storage, Solidigm, Western Digital, Rockchip, Allwinner Technology, Weibu Information, Heyan Technology, OKN Technology, Attach Point Intelligent Equipment, iWISEETEC, Tytantest, Hemei Jingyi, Silicon Motion, Maxio, QUANXING, MICROFROM, Konsemi, Silergy, Tongfang, LKAUTO, Maxwell, Skyverse, RORZE, ExTripod Electronics, EPS, InnoGrit, POWEV, KingSpec, LANYI and more, had been honored with the 2024 Annual Awards. The GMIF2024 Annual Awards feature over 38 subcategories across three main categories: Outstanding Industry Award, Outstanding Product Award, and Outstanding Brand Award. The list of winners is as follows: Outstanding SSD Product Breakthrough Award: Micron Technology Micron Technology, a leading global provider of storage and memory solutions, has been dedicated to promoting industry advancement through technological innovation. The latest addition to its data center SSD lineup, the Micron 9550 NVMe™ SSD, achieves industry-leading performance and demonstrates notable advancements in performance and energy efficiency for AI workloads. This breakthrough by Micron Technology illustrates its profound expertise and innovative abilities in storage technology and further emphasizes its leadership in AI storage solutions. Outstanding AI Storage Application Award: Solidigm Solidigm, a leader in AI storage solutions, draws on its rich experience in QLC SSD technology to deliver high-performance and high-capacity storage solutions for AI applications. Through ongoing technological innovation, Solidigm addresses the high requirements for storage density and efficiency in the AI sector, significantly improving data processing capabilities and overall performance for AI applications. Solidigm exhibits robust technical strength and market leadership in the implementation of AI storage solutions, providing vital support for the rapid growth of the AI industry. Outstanding Technology Innovation Award: Western Digital As a premier global data storage solutions provider, Western Digital remains at the cutting edge of technological innovation. Thanks to its vertical integration in NAND flash and hard disk technology, Western Digital has successfully released various high-performance and high-capacity storage products, greatly enhancing the efficiency and performance of data centers and enterprise storage. Its relentless pursuit of technological breakthroughs not only fosters the growth of the storage industry but also offers exceptional storage experiences to customers around the world. Western Digital's commitment to innovation sets a new benchmark in the industry. Outstanding Technology Leadership Award: Intel (China) Ltd. Intel (China) Ltd. exemplifies strong technological leadership through its sustained innovation in the semiconductor and computing sectors. As a frontrunner in the global technology landscape, Intel drives the evolution of computing and storage technologies with its state-of-the-art processor architectures and innovative solutions. The company's technological advancements in pioneering fields like AI and data centers offer global customers high-performance, highly reliable product experiences, further solidifying its leadership status in the industry. Intel sets new standards for development in the industry through its exceptional technological innovation. Outstanding AIoT Platform Contribution Award: Rockchip Electronics Co., Ltd. Rockchip Electronics Co., Ltd. excels in the AIoT platform sector, and leverages its innovative chip designs and robust technological capabilities to further promote the fast development of the AIoT ecosystem. The company provides efficient and stable solutions for smart devices and the Internet of Things through a comprehensive product portfolio and technological breakthroughs, which significantly enhances the overall performance of AIoT platforms. With its continuous innovation and deep commitment to the ecosystem, Rockchip has made significant contributions to the industry, and has now become a key player in the AIoT platform field. Outstanding Intelligent Terminal Application Award: Allwinner Technology Co., Ltd. Allwinner Technology Co., Ltd. provides high-performance and low-power SoC solutions by relying on its ongoing innovations in smart terminal processors, and now its products have been widely used in smart terminal devices across the globe. Dedicated to refining product performance, Allwinner has taken a big leap in enhancing the computational power and user experience of smart devices, contributing to driving both technological advancement and application expansion in the smart terminal industry. The company's outstanding achievements in this field have garnered it broad industry recognition, establishing it as one of the leaders in the smart terminal sector. Outstanding Intelligent Terminal Award: Weibu Information Inc. Weibu Information Inc. has drawn on its strong innovation capabilities and deep technical expertise to roll out a set of effective and intelligent terminal solutions. The company has enhanced the performance and user experience of smart terminal devices by optimizing its technical architecture, with applications spanning multiple industries. Through its continued innovation, Weibu Information has not only expanded the use of smart terminal devices but also invigorated the industry, earning widespread acclaim from the market and its clients. Outstanding Packaging Equipment Support Award: Shenyang Heyan Technology Co., Ltd. Shenyang Heyan Technology Co., Ltd. continues to make strides in the semiconductor packaging equipment sector, offering robust support for chip packaging technology through its innovative fully automatic grinding and polishing machines and film lamination and stripping machines. With considerable efforts put in the enhancement of equipment's precision and efficiency, Heyan now provides the market with more thinner, more precise chips, making a difference to the progress of domestic semiconductor packaging technology. Outstanding Memory Testing System Gold Award: Suzhou OKN Technology Co., Ltd. Suzhou OKN Technology Co., Ltd. has successfully introduced a series of efficient and reliable testing equipment, backed by its professional expertise and ongoing innovation in memory testing systems. Through years of technical accumulation, the company has continuously refined the accuracy and performance of its testing systems, delivering effective memory testing solutions to its clients. OKN's excellent products and services have garnered widespread trust from customers, and it's now recognized as a crucial contributor in the memory testing field. Outstanding Packaging Equipment Service Award: Dongguan Attach Point Intelligent Equipment Co., Ltd. Reinforced by its strength in innovative R&D of semiconductor packaging equipment, Dongguan Attach Point Intelligent Equipment Co., Ltd. has brought out a variety of high-precision and high-efficiency packaging solutions to the market. The company remains focused on improving equipment performance and service standards to deliver more competitive packaging support to its clients. Supported by outstanding technology and dependable service, APIE has earned significant market recognition and become a key partner in the semiconductor packaging equipment industry. Outstanding Product Award: Shenzhen Hemei Jingyi Semiconductor Technology Co., Ltd. Shenzhen Hemei Jingyi Semiconductor Technology Co., Ltd. takes the full advantage of its excellence in IC packaging substrate design and manufacturing to launch a range of high-quality products that are widely used across multiple industries. The company's commitment to ongoing technological innovation and strict quality assurance has resulted in enhanced product performance and reliability, earning significant customer recognition. Hemei Jingyi's outstanding product performance has made it a prominent supplier in the packaging substrate industry, setting a benchmark for the market. Outstanding Controller Leadership Award: Silicon Motion Technology Corp. The SM2508 from Silicon Motion is a high-performance, low-power PCIe Gen5 SSD controller solution designed specifically for AI laptops requiring high capacity, high performance, and low-power storage solutions. The company's continuous innovation in flash controller technology has driven performance enhancements in solid-state storage devices, solidifying its leadership position in the industry. Outstanding Controller Market Application Award: Maxio Technology (Hangzhou) Co., Ltd. Maxio Technology (Hangzhou) Co., Ltd. has leveraged its deep technological expertise in storage controller chips to launch a range of high-performance solutions that meet the diverse needs of the market. By continuously optimizing product performance and application scenarios, the company has effectively covered both consumer and enterprise markets, and its products has now been acknowledged widely by customers. Endorsed by its outstanding market performance and strong application capabilities, Maxio has become a significant driver in the controller chip market. Outstanding Brand Influence Award: iSoftStone Computing (Tongfang Computer) Tongfang Computer has successfully established an internationally competitive brand image through its continuous efforts in technological innovation and product quality. The company's remarkable performance in high-performance computing and storage solutions covers multiple application sectors and has earned it high acclaim from users globally. By consistently enhancing its brand influence and market performance, Tongfang Computer has become a well-known brand in the storage industry, driving sustainable development in the sector. Outstanding Market Breakthrough Award: Shenzhen Like Automation Equipment Co., Ltd. Shenzhen Like Automation Equipment Co., Ltd. has achieved significant market breakthroughs through its continuous innovation in the field of semiconductor packaging and testing intelligent equipment. The company's independently developed fully automatic IC substrate ball bonder machine demonstrates outstanding competitiveness in both technical performance and market performance, filling a gap in the domestic equipment landscape. By continuously enhancing its product technology level and market coverage, LKAUTO has earned high recognition from its customers. Outstanding Equipment Technology Breakthrough Award: Suzhou Maxwell Technologies Co., Ltd. Maxwell Technologies, a provider of complete process solutions for semiconductor wafer grinding and 2.5D/3D advanced packaging in the post-Moore era, has continually invested in R&D and adhered to independent innovation. In recent years, the company has achieved breakthroughs in high-end equipment and core components for wafer thinning, cutting, and bonding/debonding. Maxwell is dedicated to producing high-quality products and delivering exceptional service, aiming to create more value for customers and foster win-win outcomes. Outstanding Semiconductor Metrology Technology Innovation Award: Skyverse Technology Co., Ltd. Skyverse Technology Co., Ltd. has become an industry benchmark thanks to its technological innovations in the field of semiconductor testing and measurement. By continuously investing in R&D and making significant technological breakthroughs, the company has enhanced the accuracy and efficiency of measurements in semiconductor manufacturing processes, fostering technological progress across the industry. Skyverse has garnered high recognition from clients both at home and abroad and has achieved multiple independent innovations in measurement technology, positioning itself as an important force in the development of the industry. Outstanding Controller Contribution Award: InnoGrit Corporation InnoGrit Corporation has leveraged its in-depth expertise and innovation in the storage controller chip sector to successfully introduce multiple high-performance controller chips, catering to a diverse range of applications from SATA to PCIe. Through ongoing technological advancements, InnoGrit not only delivers efficient and reliable storage solutions to clients worldwide but also promotes the development and evolution of storage controller technology, demonstrating formidable technical leadership and making significant contributions to the industry. Outstanding Industry Award: Victory Giant Technology (Huizhou) Co., Ltd. Victory Giant Technology (Huizhou) Co., Ltd., one of the top 100 global printed circuit board manufacturers, has been dedicated to advancing smart manufacturing in China while actively promoting technological innovation in the PCB industry. Adhering to principles of intelligent manufacturing, green development, and innovation leadership, Victory Giant has achieved stable growth bolstered by its outstanding products, technologies, and service advantages, setting an industry benchmark in electronic circuit boards. Its high-quality products and services have earned it wide recognition in the market. Outstanding Testing Equipment Leadership Award: Tytantest Co., Ltd. Tytantest Co., Ltd. has made significant strides in the chip testing equipment sector by introducing several high-performance testing devices through its innovative R&D efforts, greatly enhancing the efficiency and accuracy of chip testing. The company focuses on optimizing product design and performance to provide clients with effective testing solutions. Tytantest is recognized widely in the market for its superior technical expertise and reliable equipment support. Outstanding Industry Service Award: ChangXin Memory Technologies Inc. (CXMT) CXMT has been awarded for its outstanding performance in DRAM technology research, development, and production. As an innovative pioneer in China's high-end memory sector, CXMT has become a backbone of the progress in China's semiconductor industry by independently developing core technologies and launching high-quality products, contributing to the high-level development of the domestic memory industry chain. Outstanding Storage Technology Breakthrough Award: Yangtze Memory Technologies Co., Ltd. (YMTC) Yangtze Memory Technologies Co., Ltd. (YMTC) has made significant strides in the 3D NAND flash technology sector since its establishment in 2016, achieving remarkable breakthroughs from the ground up. Notably, the third-generation QLC flash memory released by YMTC in 2020 garnered widespread acclaim for its industry-leading I/O speed and storage density. The company's ongoing innovation has not only elevated the technological standards of China's semiconductor industry but also spurred competition and innovation within the sector, allowing more cost-effective domestic products to secure a vital position in the global market. Outstanding Industry Contribution Award: GigaDevice Semiconductor Inc. GigaDevice, as a leading global fabless chip supplier, has played a pivotal role in the rapid development of the semiconductor industry through its outstanding product research and development capabilities and technological innovations. Its achievements in memory and microcontroller fields have not only enhanced the international competitiveness of China's chip industry but also provided global customers with high-quality, high-performance solutions. With its ongoing contributions and profound impact, GigaDevice has become a key driving force behind industry advancement. Outstanding Industry Promotion Award: Arm As a leading global provider of semiconductor intellectual property, Arm is dedicated to advancing technological development and innovation within the semiconductor industry. Through its exceptional chip architecture design and extensive ecosystem, Arm not only provides robust technical support for global technological progress but also actively promotes collaborative development and technical exchange across the industry chain. Its ongoing contributions to the construction of the global semiconductor ecosystem have ushered in considerable transformations, facilitating higher levels of technological breakthroughs and advancements within the industry. Outstanding Industry Ecosystem Award: UNISOC (Shanghai) Technologies Co., Ltd. UNISOC, a leading chip design company in China, has become a pivotal force in advancing the semiconductor industry ecosystem. With the backing of innovative chip technology and a broad product portfolio, the company actively promotes collaborative development within the industry chain, driving technological progress in various fields, including smart terminals, the Internet of Things (IoT), and 5G. Through its outstanding technological prowess and capability in ecosystem development, UNISOC has made significant contributions to the sustainable growth of the global technology industry, further enhancing the global competitiveness of China's semiconductor sector. Outstanding Industry Innovation Award: BIWIN Storage Technology Co., Ltd. BIWIN Storage Technology Co., Ltd. has successfully established an "Integrated R&D and Packaging" business model through continuous technological innovation and strong R&D capabilities. The company demonstrates exceptional competitiveness in research on storage medium characteristics, firmware algorithm development, and packaging testing technologies. BIWIN Storage actively invests in IC design, advanced packaging and testing, and test equipment development, continually driving advancements in storage technology. This commitment enables the company to provide efficient and stable storage solutions to the global market, making it a significant force in leading industry innovation and development. Outstanding Packaging Equipment Market Performance Award: Suzhou iWISEETEC Co., Ltd. Suzhou iWISEETEC Co., Ltd. has excelled in the semiconductor packaging equipment sector, leveraging its innovative R&D capabilities and efficient equipment solutions to provide reliable packaging support for customers. The company continually enhances the precision and efficiency of its devices to meet diverse packaging requirements. With stable product performance and high-quality service, iWISEETEC has garnered significant recognition from the market and its clients, establishing itself as a key partner in the packaging equipment field. AI Storage Innovation Breakthrough Award: Shenzhen Quanxing Technology Co., Ltd. Capitalizing on its strategic foresight in the AI storage solutions sector, Shenzhen Quanxing Technology Co., Ltd. has successfully developed several innovative storage products with high performance and large capacity in the AI storage solutions sector, which meet the stringent data storage requirements of AI applications. Through continuous technological breakthroughs, the company provides efficient and reliable storage support for training and inference of large AI models, facilitating the practical application of AI across industries. With its outstanding innovative capabilities, QUANXING has received widespread recognition from the industry, and emerged as a significant force for innovation in the AI storage field. Outstanding Industrial-Grade Storage Service Award: Shenzhen Micro Innovation Industry Co., Ltd. (MICROFROM) With a strong focus on industrial control storage, Shenzhen Micro Innovation Industry Co., Ltd. has developed a series of stable and reliable storage solutions that are widely applied across various industrial environments. The company has made considerable efforts to continuously enhance the performance and reliability of its products, ensuring their stable operations under stringent industrial control settings. MICROFROM's commitment to quality and service has garnered significant trust from its customers, making it a prominent service provider in the industrial control storage industry. Outstanding Product Performance Award: Hefei Kangxinwei Storage Technology Co., Ltd. (KONSEMI) With its technical expertise in storage controller chips and storage modules, Hefei Kangxinwei Storage Technology Co., Ltd. has introduced a range of high-performance products that find extensive applications in consumer and automotive markets. The company's independently developed eMMC products have earned high praise from customers for their rapid read and write speeds, low power consumption, and exceptional reliability, achieving cumulative sales of over 50 million units. Outstanding Market Performance Award: Silergy Corp. Silergy Corp. stands as a leader in the analog chip industry and focuses on independent innovation with a global strategy. It has achieved a sustained annual growth rate of over 30% for several years. Aided by its industry-leading process technologies, the company designs innovative mixed-signal and analog chips, and its products encompass a wide range of fields including DC conversion, power management, LED lighting, and battery management systems. Silergy's developed solutions empower applications across automotive, industrial, consumer electronics, cloud computing, and telecommunications. Outstanding Market Service Award: RORZE Createch Co., Ltd. RORZE Createch Co., Ltd. has demonstrated exceptional innovation and market service in the field of industrial automation equipment. Through continuous breakthroughs in precision control and intelligent manufacturing solutions, the company has significantly improved its clients' production efficiency and product quality. With robust technical support and strong market responsiveness, RORZE has earned widespread recognition from its customers. Outstanding Packaging and Testing Equipment Service Award: ExTripod Electronics Technology Limited ExTripod Electronics Technology Limited has emerged as a leader in the semiconductor packaging and testing equipment sector through continuous innovation and outstanding performance. Specializing in advanced packaging and power semiconductor fields, the company provides efficient and reliable packaging and testing equipment and solutions, offering comprehensive technical support to OSAT, IDM, and Fabless customers. ExTripod Electronics has gained strong customer trust by driving technological advancements and optimizing services, making significant contributions to the industry's development. Outstanding Packaging Substrate BT Materials Service Award: Guangdong EPS Technology Co., Ltd. Guangdong EPS Technology Co., Ltd. has achieved remarkable success in providing advanced BT substrate materials and solutions for the IC packaging and Mini & Micro LED display industries. Through continuous technological innovation and efficient services, the company has successfully satisfied the demand for high-end packaging materials, driving the localization of semiconductor packaging materials. EPS has not only reached international standards in technology but also earned strong industry recognition for its excellent customer support and market responsiveness. Outstanding Domestic Storage Brand Influence Award: Powev Electronic Technology Co., Ltd. As a leading provider of high-end domestic storage solutions, POWEV has always adhered to offering customers high-performance, stable, and reliable storage products with excellent value, helping them navigate diverse market demands. POWEV's achievements are not only reflected in its technological breakthroughs but also in elevating the influence of domestic storage brands, setting trends in the localization of the market. Outstanding Industrial-Grade Storage Solution Award: Shenzhen KingSpec Electronics Technology Co., Ltd. Shenzhen KingSpec Electronics Technology Co., Ltd. has distinguished itself in the industrial control sector with its stable and reliable storage solutions. Underpinned by deep technical expertise and continuous innovation, the company has introduced a range of high-quality storage products capable of withstanding harsh industrial environments. These innovations not only offer high performance and stability but also demonstrate exceptional reliability under extreme conditions, making them widely applicable in fields such as industrial automation and the Internet of Things (IoT), delivering significant value and earning strong market recognition. Outstanding High-Precision Testing Service Award: Dongguan Lanyi Electronic Technology Co., Ltd. Dongguan Lanyi Electronic Technology Co., Ltd. has established itself as an industry leader through its innovative advancements in high-precision test probes and test sockets. With continuous investment in research and development, Lanyi Electronic has mastered several proprietary core technologies, offering customers high-precision, highly reliable testing solutions. This dedication to quality and innovation has earned the company widespread trust and recognition from clients and the market alike. Outstanding Terminal Industry Award: Shanghai Sixunited Intelligent Technology Co., Ltd. SIXUNITED is committed to driving global innovation and technological transformation, creating an exciting digital lifestyle through information technology. The company has made significant strides in the smart terminal industry, particularly with its contributions to AI computing power products. These advancements highlight SIXUNITED's comprehensive presence and strong capabilities in the intelligent computing sector, earning widespread recognition within the industry. ABOUT GMIF GMIF (Global Memory Innovation Forum) is the most important annual event of Shenzhen Memory Industry Association (SMIA). The forum aims to build a globally-focused, professional platform for the storage industry to collectively explore new technologies, applications, collaborations, and emerging opportunities. The Third GMIF2024 Innovation Summit had been successfully concluded on September 27, 2024 at Renaissance Shenzhen Bay Hotel. Under the theme of "AI Leads Memory's New Momentum", the summit aims to foster communication and interaction among both upstream and downstream enterprises in the storage industry. By promoting collaboration and complementary growth among industry partners, the GMIF seeks to help participating companies expand their product and brand reach and contribute to a thriving, win-win ecosystem in the global storage sector. For more information about GMIF, please visit https://www.gmif.com.cn/. Media Contact:Ms. Gu, +86 15064010336, wenjing.gu@gmif.com.cn
Hsinchu, Taiwan, September 9, 2024 -SEMICON Taiwan officially opened on September 6, 2024, with ACE Solution and HON. PRECISION is joining forces to showcase its latest advancements in silicon photonics testing technology, precision measurement, and automated machinery integration. Their exhibition focused on high-density optoelectronic integration testing solutions designed to meet the increasing demands of silicon photonics for high-capacity and high-channel testing. The integrated optoelectronic signal testing system effectively addresses the challenges posed by increased data center traffic and high-speed transmission needs, significantly boosting transmission rates and reducing energy consumption. With semiconductor packaging evolving towards Co-Packaged Optics (CPO), ACE Solution highlighted its silicon photonics solutions developed through deep collaboration with Quantifi, integrating PXI testing modules to offer an efficient, multi-system testing solution supporting 800G and 1.6T high-speed transmission. These integrated solutions meet the research and production needs for high-speed, high-precision, and high-efficiency testing while offering programmable automation for flexible applications. ACE Solution also demonstrated its latest innovations in compound semiconductor testing. The Teradyne ETS-88 testing platform is widely used for SiC, GaN, PMIC, automotive electronics, aerospace, and defense industries. Key features include multi-site CP, second-contact KGD, dynamic/static power device FT, and fully automated high-output module FT. The ETS-364 and ETS-800 platforms are tailored for mixed-signal, digital, and analog testing, offering the industry's highest-spec power IC testing capabilities with support for up to 6000V and 4000A, making them ideal for high-current, high-voltage applications, particularly in EV power and battery management. The TZ-6000 non-destructive wafer and materials inspection system utilizes terahertz (THz) technology, focusing on compound semiconductor testing for GaAs, SiC, and GaN. It offers greater penetration depth and flexibility, handling various sizes and shapes of wafers. Equipped with advanced wafer probes and intelligent software analysis, it can simultaneously measure parameters such as thickness, refractive index, resistivity, dielectric constant, surface/subsurface defects, and full wafer scans, enabling non-destructive wafer quality measurements. The Electro-Optic Terahertz Pulse Reflectometer (EOTPR) is the world's first instrument to use isolation technology to detect IC package faults and monitor package quality, making it ideal for non-destructive defect detection in 3DIC package analysis. With 5-micron pinpoint precision, the EOTPR is widely used in advanced IC packaging fault analysis for devices such as stacked packages (PoP), flip-chip, and TSV in 3D packaging. Major semiconductor companies have extensively deployed EOTPR for advanced IC packaging quality assurance in manufacturing environments. Steve Hsu, President of ACE Solution, stated, "With over 20 years of experience in hardware-software integration, ACE Solution has expanded from wireless communication testing to various testing fields, meeting the needs of our local clients. We are thrilled to collaborate with HON. PRECISION to showcase our achievements in automation and precision testing." Alan Hsieh, President of HON. PRECISION commented, "This exhibition marks a new milestone in our partnership with ACE Solution. We look forward to offering more advanced solutions, fostering greater collaboration and innovation across the industry." For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Peter Lee, Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw Website: https://www.acesolution.com.tw/en/ About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to the specific requirements of our customers in the field of electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished team of technical experts who offer unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively.
ACE Solution will participate in SEMICON Taiwan 2024 from September 4th to 6th Location: TaiNEX Hall 1 Booth: K3076 @HON. PRECISION We will showcase the latest achievements in semiconductors and silicon photonics during the exhibition. ACE Solution will introduce the following solutions: 👉 Teradyne ETS Compound Semiconductor Testing: The industry’s highest-spec power IC testing platform accommodates a wide range of IC types, with testing capabilities reaching 6000V and 4000A. This platform addresses the challenges of high-current and high-voltage testing, particularly in electric vehicle power and battery management applications. 👉 TZ-6000 Non-Destructive Wafer and Material Inspection: Utilizing Terahertz (THz) technology, this solution offers superior penetration depth compared to silicon, silicon carbide, and gallium nitride for semiconductor wafers. It provides non-destructive measurements of wafer quality, including thickness, refractive index, resistivity, dielectric constant, surface/subsurface defects at selected locations, and full-wafer scanning. 👉 EOTPR Non-Destructive Testing for 3DIC Advanced Packaging: The Electro-Optical Terahertz Pulse Reflectometry (EOTPR) system delivers 5-micron accuracy for fault analysis in complex and advanced IC packaging, such as Package-on-Package (PoP), Flip-Chip, and Through-Silicon Via (TSV) in 3D packaging. EOTPR is widely adopted in advanced IC packaging fault analysis and is extensively deployed in quality assurance and inspection within manufacturing environments. 👉 Photonic Integrated Silicon Photonics Testing: In collaboration with Hon Precision, ACE Solution offers a highly integrated electro-optical signal testing system architecture. This solution supports high-capacity, high-channel testing to meet the demands of high-speed data transmission and increased data center traffic. Integrating photonics and electronics significantly enhances transmission rates while reducing power consumption, leading to improved testing efficiency. We will also be organizing booth tours during the exhibition. Due to limited availability, spots will be arranged based on actual conditions, so please register early:https://docs.google.com/forms/d/e/1FAIpQLSe5vtgle1wl4dIxliik12YMNnObdqAFD7DwdBYVIxaxMWqlxQ/viewform?fbzx=-6591255857878872603 We welcome partners from all sectors to visit and discuss technical and business cooperation. 📢 Follow ACE Group LinkedIn, to stay updated with the news! For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Peter Lee, Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw Website: https://www.acesolution.com.tw/en/ About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to our customers' specific requirements in electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished technical expert team offering unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge, integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively.
台灣新竹,2024年08月05日——自2022年以來,筑波科技 (ACE Solution) 與美商泰瑞達 (Teradyne) 展開策略合作,共同推動半導體測試的 ETS 平台。我們特別專訪 Teradyne 的行銷總監Aik-Moh Ng,他自2006年以來一直領導 Teradyne ETS 亞太地區團隊。 隨著市場發展,電源管理中集成電路的整合明顯提升。電動車的崛起同時帶來電池管理系統的挑戰,需要高效的系統來最大化電池使用。此外,AI 技術將促進許多電源管理 IC 的發展,推動高端先進 GPU、CPU 和 TPU 的需求。這些設備在啟動時需要大量電力,因此增加對電源模組的需求。 筑波科技全力支持 Teradyne 的 ETS 測試解決方案,ETS-800 專注於電源管理 IC,ETS-88 和 ETS-364 用於測試 DC-DC 轉換器和電源模組。ETS-800 是滿足電池管理 IC 複雜測試需求的最佳選擇,減少負載板複雜性,兼備高產出並同時提供最佳測試成本效率。筑波科技的解決方案顯著減少了微模組、電源模組、智能站和 AI 伺服器等領域的測試時間。 Aik-Moh Ng表示:「電動車發展的四大趨勢是電氣化、消費電子、自動駕駛和互聯汽車,其中測試 SiC 雙脈衝和電源模組對於電動車逆變器市場至關重要。台灣市場關注如何有效地測試電源模組。要實現完全自動駕駛,將需要更多類型的半導體,包括更多的電源管理 IC,以整合周圍環境的信息進行及時決策。筑波科技基於 Teradyne 平台開發的測試解決方案,在雜散電感控制方面表現出色。基於 ETS 軟件功能 - AWU 基準,它能在雙脈衝測試中實現快速切換操作和高電壓過渡,提供更高的可靠性。與傳統的程序實現相比,ETS-88TH 在動態測試中表現極度優異,參數調整相對簡單有效,贏得了客戶的高度信任。」 與 Teradyne 合作,ACE Solution 開發電源管理 IC(MOSFET/IGBT)測試解決方案。成功的實施案例展示了兩家公司之間的緊密的合作關係,在市場份額上脫穎而出。吳一墨指出:「Teradyne 以其優秀的品質平台著稱,ACE Solution 與客戶的緊密關係,以及卓越的售前和售後技術支持服務,是 ETS 平台快速採用和擴展的關鍵。」 關於亞太市場的發展,Aik-Moh Ng分享:「說服亞太地區的客戶接納歐美品牌是一項極具挑戰性的任務。因此,我們需要開發符合當地需求的新測試解決方案。與筑波科技的合作為我們提供機會,未來我們將進一步擴大在東南亞的影響力。」筑波科技在客戶服務方面表現出色,擁有強大的業務和工程團隊,為 Teradyne 提供可靠的支持。Teradyne 可以依賴筑波科技的銷售網絡,並與工程師合作,基於 ETS 平台開發方案,創造新的商機。 展望未來5-10年,Aik-Moh Ng預測半導體測試技術將有顯著的創新和突破。電池管理 IC 的需求將繼續增長,隨著 AI、GPU 和 CPU 的普及,電源模組測試的需求也將大幅增加。此外,RF 和 Wi-Fi 的集成將不斷改善。Aik-Moh Ng指出:「Teradyne 專注於自動化和 AI 進行測試數據分析,以更好地預測未來趨勢並進行預防性維護,確保設備穩定運行,有利於生產和供應鏈計劃。我們期待 Teradyne 與筑波科技的合作,將在半導體測試領域帶來創新,並為客戶提供更優質的產品和服務。」 聯絡筑波科技 筑波科技股份有限公司ACE Solution, Co., Ltd. 地址:新竹縣竹北市台元街28號2樓之1 電話:03-5500909 電子郵件:service@acesolution.com.tw 網站:https://www.acesolution.com.tw/en/index/ 關於筑波科技(ACE Solution) 筑波科技(https://www.acesolution.com.tw/en/index/)成立於2000年,位於台灣新竹,在中國蘇州和深圳設有分公司。我們的使命是提供訂製的測試解決方案,以滿足電氣元件、設備和系統製造商的客戶需求,通過合作夥伴提供技術解決方案。我們專注於射頻、毫米波和太赫茲領域,擁有專業的技術支援團隊,提供專業、創新和多功能的綜合技術和解決方案。 聯絡美商泰瑞達 Traci Tsuchiguchi Investor Relations 地址: 600 Riverpark Drive, North Reading, MA 01864, USA 電話: +1 978.370.2444 電子郵件: investorrelations@teradyne.com 網站: https://www.teradyne.com/ 關於美商泰瑞達 泰瑞達的測試技術幫助將高品質的創新產品,如智能設備、急救醫療設備和數據存儲系統更快推向市場。其先進的半導體、電子系統、無線設備等測試解決方案確保產品依照客戶設計展現其性能。泰瑞達的機器人產品包括協作機器人和移動機器人,幫助各規模的製造商提高生產力、改善安全性和降低成本。2023年,泰瑞達收入達27億美元,現有全球員工超過6600人。欲了解更多信息,請訪問 teradyne.com。泰瑞達® 是泰瑞達公司的註冊商標,適用於美國和其他國家。
A12 藝術空間
semiconductor testing
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