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符合「semiconductor testing」新聞搜尋結果， 共 212 篇 ，以下為 1 - 24 篇 訂閱此列表，掌握最新動態
From left to right — Tony Hsu, Marketing VP, ACE Solution; Edward Weng, Product Marketing Manager, Onsemi; Dr. Hsiao Yi-Kai, Team Leader, Foxconn; Jason Hsieh, Sales Manager, ACE Solution; Dr. Harry Kuan, RD Manager, ACE Solution; Kenny Wang, Business Development Manager, Teradyne Robotics; ILung Shen, GM, ACE Systemtek
Global Business News
ACE Solution Successfully Hosts “Compound Semiconductor Testing Technology and Automation Forum” to Enhance Industry Development

Hsinchu, Taiwan – May 6, 2025 —Compound semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN) are core technologies in automotive semiconductors and power management ICs. These materials are widely applied in electric vehicles, energy storage systems, data centers, 5G, and aerospace, driving a comprehensive upgrade in high-temperature, high-voltage, high-current, high-speed, and high-frequency testing, packaging, and process automation technologies. In collaboration with global automated test leader Teradyne and National Yang-Ming Chiao Tung University, ACE Solution hosted the "Compound Semiconductor Testing Technology and Automation Forum" on April 30. The event brought together experts from industry, academia, and research institutions to explore application trends, testing fixtures, and automation solutions.   In his opening remarks, Tony Hsu, Vice President of Marketing at ACE Solution, emphasized the strategic importance of power systems in next-generation technologies: " As electric vehicles (EVs), 5G communications, high-performance computing (HPC), and AI servers continue to develop rapidly, the ability to deliver stable and high-performance power—along with advancements in power buffering, power delivery systems, and battery management—has become a critical challenge for industrial transformation. In response to global shifts and industry needs, ACE Solution remains committed to deepening its expertise in testing and automation. We look forward to working with experts across diverse sectors to drive innovation and accelerate the industry's upgrade."   The forum featured a distinguished lineup of speakers who shared insights into the full technology chain, from semiconductor testing to smart manufacturing. Dr. Hsiao Yi-Kai, Team Leader at Foxconn, delivered a presentation titled "SiC in the AI Era: Intelligent Design Accelerates Power Technology Innovation," providing an in-depth look at key silicon carbide (SiC) applications in the AI-driven age. Jason Hsieh, Sales Manager at ACE Solution, shared his perspective on "Compound Semiconductor Trends & High-Power Testing Innovations," highlighting how evolving device architectures shape testing demands. Dr. Harry Kuan, R&D Manager at ACE Solution, addressed "Compound Semiconductor Wafer Testing and Advanced 3D Package Failure Analysis," showcasing advanced diagnostic techniques for next-generation packaging. Edward Weng, Product Marketing Manager at Onsemi, presented a case study on applying DrWBG technology in AI servers, illustrating how compound semiconductors reshape computing infrastructure. Kenny Wang, Business Development Manager at Teradyne Robotics, concluded the event with his talk "Building a Stable, Unmanned Delivery Network with MiR," outlining how robotics and automation are paving the way for smart semiconductor manufacturing.   In addition to the insightful presentations, the event also featured three major technology showcases: High-Power Analog and Mixed-Signal Testing Solutions, Wafer Materials, and 3DIC Non-Destructive Testing, and Semiconductor Collaborative Robots Automation, all of which received enthusiastic responses from attendees.   ACE Solution has partnered with Teradyne to jointly develop the ETS testing solution to address the challenges of precise testing for high-power components, 3DIC packaging inspection, and improving production efficiency. This collaboration successfully overcomes the limitations of high-power analog and mixed-signal testing. In addition, ACE Solution utilizes terahertz technology for non-destructive inspection of wafer materials and 3DIC packaging, offering a comprehensive suite of capabilities ranging from materials analysis (MA) and failure analysis (FA) to automotive semiconductor validation. For smart manufacturing, ACE Solution also provides automated solutions using UR/MiR collaborative robots, enabling industry partners to transition from R&D to mass production seamlessly. These innovations significantly enhance process efficiency and accuracy while reducing labor demands and overall costs. ACE Solution remains committed to deepening collaborations with strategic partners across the compound semiconductor value chain, joining academia, industry, and government forces to build a globally integrated ecosystem.       For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3407 E-mail: pr@acesolution.com.tw Website: https://www.acesolution.com.tw/en/   About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to the specific requirements of our customers in the field of electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished team of technical experts who offer unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively.

文章來源 : 筑波科技股份有限公司 發表時間 : 瀏覽次數 : 859 加入收藏 :
Teradyne Marketing Director Aik-Moh Ng (center), ACE Solution Sales Manager Jason Hsieh (left), ACE Solution Sales Manager Eric Syu (right)
Global Business News
ACE Solution and Teradyne Collaborate to Pioneer New Horizons in Semiconductor Testing - Interview with Marketing Director Aik-Moh Ng

Hsinchu, Taiwan, 5th, August 2024 -Since 2022, ACE Solution has strategically partnered with Teradyne to advance their ETS platform for semiconductor testing. We had the privilege of interviewing Teradyne's marketing director, Aik-Moh Ng, who has led the Teradyne ETS Asia-Pacific team since 2006.   The integration of ICs in power management has significantly increased over time. With the rise of electric vehicles, challenges in battery management systems have emerged, necessitating efficient systems to maximize battery usage. Additionally, the growth of AI will facilitate the development of many power management ICs, driving the demand for high-end advanced GPUs, CPUs, and TPUs. These devices require substantial power during startup, consequently increasing the demand for power modules.   ACE Solution fully supports Teradyne's ETS test solutions, with the ETS-800 focusing on power management ICs and the ETS-88 and ETS-364 used for testing DC-DC converters and power modules. The ETS-800 is the best choice for meeting the complex testing needs of battery management ICs, reducing load board complexity, and providing optimal test cost efficiency with its high throughput. ACE Solution's solutions significantly reduce test time in areas such as micro-modules, power modules, intelligent stations, and AI servers.   Aik-Moh Ng shared, "The four major trends in electric vehicle development are electrification, consumer electronics, autonomous driving, and connected cars, where testing SiC double pulses and power modules is crucial for the electric vehicle inverter market. The Taiwan market focuses on how to test power modules effectively. Achieving full autonomous driving will require many more semiconductors of all types, including more power management ICs, to integrate the information of the surrounding environment for real-time decision-making. ACE Solution's testing solutions, developed on Teradyne's platform, excel in stray inductance control. Based on ETS's software functionality - AWU benchmark, it enables fast switching operations and high-voltage transitions in double-pulse testing, offering greater reliability. Compared to traditional program-based implementations, the ETS-88TH performs excellently in dynamic testing, with relatively easy and effective parameter adjustments, earning high customer trust."   In collaboration with Teradyne, ACE Solution develops power management IC (MOSFET/IGBT) testing solutions. Successful implementation cases demonstrate the strong partnership between the two companies, standing out in market share. Aik-Moh Ng stated, "Teradyne is known for its excellent quality platforms, and ACE Solution's close relationship with customers, and superior pre-sales and after-sales technical support services are crucial for the rapid adoption and expansion of the ETS platform."   Regarding the development of the Asia-Pacific market, Aik-Moh Ng shared: "Convincing Asia-Pacific customers to prefer European and American brands is a highly challenging task. Therefore, we need to develop new testing solutions that match local requirements. Our collaboration with ACE Solution provides us with opportunities, and in the future, we aim to further expand our presence in Southeast Asia." ACE Solution excels in customer service, with strong business and engineering teams providing reliable support for Teradyne. Teradyne can rely on ACE Solution's sales network and collaborate with engineers to develop programs based on the ETS platform, creating new business opportunities.   Looking ahead to the next 5-10 years, Aik-Moh Ng foresees significant innovations and breakthroughs in semiconductor testing technology. The demand for battery management ICs will continue to grow, and with the popularity of AI, GPUs, and CPUs, the demand for power module testing will also increase dramatically. Additionally, the integration of RF and Wi-Fi will continue to improve. Aik-Moh Ng noted, "Teradyne’s focus on automation and AI for test data analysis to better predict future trends and conduct predictive maintenance, ensures equipment runs smoothly and benefits production and supply chain planning. We look forward to the collaboration between Teradyne and ACE Solution, which will lead to innovation in the semiconductor test field and provide customers with better products and services in the future."     For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Peter Lee, Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw Website: https://www.acesolution.com.tw/en/     About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to the specific requirements of our customers in the field of electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished team of technical experts who offer unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively.   Teradyne Traci Tsuchiguchi Investor Relations Address: 600 Riverpark Drive, North Reading, MA 01864, USA Telephone: +1 978.370.2444 E-mail: investorrelations@teradyne.com Website: https://www.teradyne.com/     About Teradyne Teradyne test technology helps bring high-quality innovations such as smart devices, life-saving medical equipment and data storage systems to market, faster. Its advanced test solutions for semiconductors, electronic systems, wireless devices and more ensure that products perform as they were designed. Its robotics offerings include collaborative and mobile robots that help manufacturers of all sizes increase productivity, improve safety, and lower costs. In 2023, Teradyne had revenue of $2.7 billion and today employs over 6,600 people worldwide. For more information, visit teradyne.com. Teradyne® is a registered trademark of Teradyne, Inc., in the U.S. and other countries.

文章來源 : 筑波科技股份有限公司 發表時間 : 瀏覽次數 : 1538 加入收藏 :
TZ6000; Dr. Don Arnone, and President Steve Hsu
Global Business News
Collaboration Insights of TZ6000 from TeraView– The Nondestructive Wafer Testing Accomplishment in Semiconductor Industry

Dr. Don Arnone is the CEO of TeraView. In March 2023, he visited ACE Solution (ACE), the Taiwan representative partner that launched the TZ6000, a non-destructive wafer quality measurement tool. It incorporates with TeraView's TeraPulse Lx technologies, particularly for crucial applications such as wafer and substrate defect inspection. TZ6000 characterizes the wafer properties by thickness, refractive index, resistivity, dielectric constant, and surface/subsurface defects scanning graph.   Key Driving Factors for TZ6000 Success and Market Advantages To explore the market for TZ6000, Dr. Don Arnone shares two influencing factors: " One is to transmit product information; the other is to make a demonstration to customer in terms of favorable impression." Since 2023, the proof of concept (POC), the initial sales, will rely on sturdy teamwork. Based on ACE and TeraView professionals, TZ6000 is the thriving base for forward-looking. TeraView possesses competitive advantages of Terahertz instrument experience, while ACE has tremendous expertise for integration solutions such as TZ6000. Under the two leading companies' cross-border cooperation, it will bring an unprecedented solution for customers.   Subsurface Damage (SSD) of semiconductor wafers commonly happens in the surface machining process. At present, wafer inspection relies on VIS/IR/UV optical inspection that can analyze the surface properties of the wafer but not the SSD because of its low penetration depth. Terahertz (THz) waves have the features of high penetration depth in semiconductor wafers for silicon, silicon carbide, and gallium nitride. Therefore, THz-based TZ6000 can meet the market needs for compound semiconductor wafer non-destructive inspection.   TZ6000 Accomplishment Insights from ACE and TeraView From Dr. Don Arnone's viewpoint, there are three takeaways for TZ6000 task achievement. ACE works enthusiastically and hard to reach our milestones and follows customer requirements. In addition, team flexibility brings the capability to address the challenge of market adoption. These factors are also key to take the TZ6000 from the project phase through to final commercialization. TeraView's TeraPulse Lx System is the pioneer product for terahertz analysis. Specifically, it meets material inspection in imaging or spectroscopy applications for the compound semiconductor industry. The modular architecture and patented laser-gated photoconductive emitters and detectors are flexible and expandable. The system also boasts an industry-leading 3,200 ps time-delay line as standard. With a lightweight, compact core unit that allows easy transport, the TeraPulse Lx System incorporates the TeraPulse Lx modules to meet market demands.   Steve Hsu, President of ACE, says it's a precious chance to collaborate with TeraView. ACE takes the lead in electrical precision tests, integrating service and solution. Through the TeraPulase Lx module and TZ6000 system incorporation, it frames a unique THz-TDS probe for simultaneous measurement of multiple parameters of wafer characterization. In the wafer manufacturing and R&D process, TZ6000 possesses user-friendly and graphically illustrated software for quality inspection. "TeraView and ACE have very complimentary skills and experience. Our partnership is a representative case of international cooperation. I'm proud of this unique accomplishment and enjoying working with President Steve's team.", Dr. Don Arnone says with trust. Starting the TZ6000 business in Taiwan, ACE has confidence in creating a great business via technology integration in the long run.     About ACE Solution Founded in 2000, ACE Solution (https://www.acesolution.com.tw/en/index/) locates in Hsinchu City, Taiwan, with branch offices in Suzhou and Shenzhen, China. Our mission is to provide customized test solutions to meet customer needs in electrical components, devices, and system manufacturing and provide technology solutions through our partners. We focus on RF, mmWave, and terahertz with the expert technical support team. ACE Solution offers professional, innovative, and multi-functional integrated techniques and solutions.   About TeraView Founded in 2001, TeraView (https://teraview.com/) is the world’s first and leading company solely focused on applying terahertz light to solve customer issues. A spin-out from the Toshiba Corporation and Cambridge University, TeraView has developed its proprietary technology across many markets. These include fault analysis and quality assurance for semiconductor chips used in mobile computing and communications and non-destructive inspection of high-value coatings used in the automotive, pharmaceutical, food, and solar industries.     Contact ACE Solution, Co., Ltd. Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 E-mail: thzlab@acebiotek.com Website: https://www.acesolution.com.tw/en/index/ https://www.acebiotek.com/en/thz-service/apply

文章來源 : 筑波科技股份有限公司 發表時間 : 瀏覽次數 : 3730 加入收藏 :
講師左起筑波科技 許棟材 行銷副總、Onsemi 安森美 翁紹洋 產品暨市場行銷經理、鴻海研究院 蕭逸楷博士/ 組長、筑波科技 謝易錚 業務經理、筑波科技 官暉舜博士/ 研發經理、Teradyne Robotics 王永廸 商務發展經理、筑波系統 申義龍 總經理
產經商業
筑波科技成功舉辦化合物半導體檢測技術與自動化論壇 攜手推動產業發展

(台灣新竹，2025年05月06日)，化合物半導體材料如碳化矽 (SiC) 與氮化鎵 (GaN) 為車用半導體與電源管理 IC 領域的核心技術，應用於電動車、儲能系統、資料中心、5G 與航太等領域，帶動高溫、高壓、大電流、高速與高頻測試、封裝與製程自動化技術全面升級。筑波科技攜手全球自動化測試領導品牌美商 Teradyne、國立陽明交通大學，於4月30日舉辦「化合物半導體檢測技術與自動化論壇」，匯聚產學研界專家，共探應用趨勢、治具與自動化解決方案。   本次論壇由筑波科技行銷副總許棟材開場致詞：「隨著電動車 (EV)、5G 通訊、高效能運算 (HPC) 及 AI Server 等應用快速發展，如何穩定供應高效能電力，並強化電源緩衝、供電系統與電池管理，已成為產業升級的關鍵挑戰。在全球局勢變動下，筑波科技將持續深耕檢測與自動化技術，期盼來自不同產業領域的專家攜手，推動產業創新轉型」。活動邀請多位重量級講者進行專題分享，內容涵蓋檢測到智慧製造的完整技術鏈。鴻海研究院蕭逸楷博士以「AI時代的碳化矽：智慧設計加速功率技術革新」為題，剖析碳化矽材料新世代關鍵應用；筑波科技謝易錚業務經理則解析化合物半導體市場趨勢，分享高功率類比與混合訊號測試技術創新；筑波科技研發經理官暉舜博士深入探討材料與晶圓檢測的挑戰及其解決方案；Onsemi 安森美翁紹洋經理則分享 DrWBG application for AI server 實例；Teradyne Robotics 王永廸經理壓軸介紹運用 MiR 協作型機器人打造高穩定、無人化的智慧配送網絡，展現半導體智慧製造的未來藍圖。     除了精彩的演講，現場亦展示三大技術體驗，分別為高功率類比與混合訊號測試解決方案、晶圓材料與3DIC非破壞性檢測技術，及半導體協作機器人 (UR/ MiR) 自動化方案，獲得廣泛迴響。   因應高功率元件精準測試、3DIC封裝檢測及生產效率提升的挑戰，筑波科技攜手美商Teradyne共同開發ETS測試解決方案，有效突破高功率類比與混合訊號測試瓶頸。此外，運用太赫茲技術非破壞性晶圓材料與3DIC封裝檢測，涵蓋從材料分析 (MA)、失效分析 (FA) 到車用半導體驗證的完整技術。針對智慧製造亦提供 UR/ MiR 協作型機器人自動化解決方案，協助業界夥伴從研發到量產無縫接軌，大幅提升製程效率與準確度，並有效降低人力與成本負擔。筑波科技將持續提供與策略夥伴合作，佈局化合物半導體產業鏈，攜手產官學界共創全球化佈局。     聯絡筑波科技 筑波科技股份有限公司ACE Solution, Co., Ltd. 地址：新竹縣竹北市台元街28號2樓之1 電話：03-5500909 電子郵件：service@acesolution.com.tw 網站：https://www.acesolution.com.tw/en/index/   關於筑波科技（ACE Solution） 筑波科技（https://www.acesolution.com.tw/en/index/）成立於2000年，位於台灣新竹，在中國蘇州和深圳以及越南設有分公司，可提供服務。我們的使命是提供訂製的測試解決方案，以滿足電氣元件、設備和系統製造商的客戶需求，通過合作夥伴提供技術解決方案。我們專注於射頻、毫米波和太赫茲領域，擁有專業的技術支援團隊，提供專業、創新和多功能的綜合技術和解決方案。

文章來源 : 筑波科技股份有限公司 發表時間 : 瀏覽次數 : 3588 加入收藏 :
Global Business News
FPT announces the establishment of an Advanced Semiconductor Testing and Packaging plant, accelerating the integration of Vietnam's Semiconductor value chain

FPT Signs Key International Agreements to Advance Vietnam's Mastery of Semiconductor Technology HANOI, Vietnam, Jan. 29, 2026 /PRNewswire/ -- On January 28, 2026, in Hanoi, FPT Corporation officially announced the establishment of the FPT Advanced Semiconductor Testing and Packaging Plant, aiming to strengthen connectivity across the semiconductor value chain and to realize Vietnam's major national orientations on mastering core and sovereign technologies, in line with Resolution No. 57-NQ/TW, Decision No. 1131/QĐ-TTg and Decision No. 1018/QĐ-TTg, thereby enabling Vietnam to move deeper into the global semiconductor supply chain. This is the first semiconductor testing and packaging plant in Vietnam fully owned and operated by Vietnamese entities, contributing to the completion of the national semiconductor ecosystem with a full spectrum of activities spanning research, design, manufacturing, training, testing and packaging, and commercialization—positioning Vietnam more prominently in the global semiconductor value chain. FPT Announces the Establishment of an Advanced Semiconductor Testing & Packaging Plant The announcement ceremony was attended by representatives from the Ministry of Science and Technology, leaders of Viettel Group, leaders of FPT Corporation, representatives from enterprises, research institutes and universities, members of the Au Lac AI Alliance, the Low-Altitude Economy Alliance, and major semiconductor enterprises and partners from Vietnam, Japan, South Korea, Taiwan region, and other countries. The announcement of the establishment of the FPT Advanced Semiconductor Testing and Packaging Plant underscores FPT's strong commitment to implementing the Politburo's Resolution No. 57-NQ/TW on breakthroughs in science, technology, innovation, and national digital transformation; the Prime Minister's Decision No. 1131/QĐ-TTg on strategic technologies; and Decision No. 1018/QĐ-TTg approving the national strategy for semiconductor industry development, which sets the target for Vietnam to have 10 advanced testing and packaging facilities by 2030. This initiative also represents a strategic move to harness the collective strength of the national semiconductor alliance, jointly developing and mastering core technology capabilities, and completing an integrated semiconductor ecosystem spanning research, design, manufacturing, testing, packaging, and commercialization—thereby enabling Vietnam to move further up the global semiconductor value chain. In addition, the plant will provide hands-on training and practical learning opportunities for semiconductor students within Vietnam, contributing to the enhancement of human resource quality in the semiconductor sector and supporting the national goal of developing 50,000 semiconductor professionals by 2030, including at least 35,000 professionals in manufacturing, packaging, testing, and other key stages of the semiconductor industry. Speaking at the event, Mr. Truong Gia Binh, Chairman of FPT Corporation, stated: "If Vietnam is to become a prosperous nation, there is no other path than mastering semiconductor technology. If we count Vietnamese professionals around the world, we are a significant force in the semiconductor industry. Our biggest challenge is to connect and build our own ecosystem. With today's event, we take another step toward completing Vietnam's semiconductor ecosystem. FPT has grown through hardship, so we always pursue practical solutions: products must be market-ready. We will closely collaborate with Viettel and domestic partners—wherever chips are manufactured, FPT will participate in testing and packaging—so that Vietnamese technology chips can soon be applied in real life". Lieutenant General Tao Duc Thang, Member of the Party Central Committee, Chairman and CEO of Viettel, emphasized: "FPT's investment in a semiconductor testing and packaging plant holds strategic significance in completing the 'Make in Vietnam' semiconductor ecosystem, fully aligned with the spirit of Resolution No. 57-NQ/TW on breakthroughs in science, technology, innovation and national digital transformation. The testing and packaging plant, together with Viettel's chip fabrication plant scheduled to break ground in January 2026, will serve as a "hands-on" environment for training, developing, and retaining semiconductor engineers domestically, thereby helping curb brain drain and build a core workforce for this strategic industry. Viettel consistently believes that semiconductor industry development must be based on close cooperation between the state-owned and private sectors, in accordance with Resolution No. 79-NQ/TW on state-owned economic development and Resolution No. 68-NQ/TW on private sector development". Dr. Nguyen Bich Yen, Honorary Chairwoman of the Institute of Semiconductor and Advanced Materials – Vietnam National University, Hanoi; Chairwoman of VSAP Lab and IEEE member, commented: "Vietnam is no longer merely talking about semiconductors—Vietnam is taking synchronized and serious action. Pioneer enterprises are driving progress through concrete commitments and collaboration to build a Vietnamese semiconductor value chain. Key components—from materials, design, packaging, testing and manufacturing to digital infrastructure and human resources—are gradually taking shape. In this picture, FPT stands out as a major pillar, not only enhancing technological capacity but also serving as a connector, leader and trust-builder for the entire ecosystem". The FPT Advanced Semiconductor Testing and Packaging Plant is expected to emerge as a leading advanced testing and packaging facility in the region. In Phase 1 (2026–2027), the plant will be located at Yen Phong II-C Industrial Park, Yen Phong and Tam Giang Communes, Bac Ninh Province, with a total floor area of 1,600 square meters. The facility will be equipped with 06 functional testing lines (ATE testers and handlers) and 01 dedicated reliability and durability testing area, including Burn-in, Reliability Test, and Failure Analysis Test. All equipment systems comply with international quality management standards ISO 9001, ISO 14001, and IATF 16949, as well as specialized semiconductor technical standards such as JEDEC, AEC-Q100, and AEC-Q101, ensuring product quality, stability, and reliability throughout the entire product lifecycle. With the capability to flexibly deliver both rapid testing and in-depth customized testing tailored to individual customer requirements, the system enables customers to optimize costs without the need to distribute quality inspection processes across multiple locations. Notably, a key competitive advantage of FPT lies in its Make-in-Vietnam testing software development, developed and fine-tuned to meet the specific requirements of different products. The completion of the six functional testing lines and the dedicated reliability and durability testing area is scheduled to coincide with celebrations marking the anniversary of the Liberation of the South and National Reunification later this year. In Phase 2 (2028–2030), FPT plans to expand the plant's total area to approximately 6,000 square meters, with 18 newly installed functional testing lines, 3 reliability and endurance testing zones, expanded both conventional packaging lines (QFN, QFP, DFN, etc.), additional CSP (Chip Scale Package), WLP (Wafer Level Package) lines, along with advanced IC packaging lines, collectively ramping the plant's total output to billions of units per year. These investments are expected to raise the plant's capacity to billions of products annually. In parallel, FPT will strengthen its testing capabilities for high-end chips serving IoT, automotive applications, and AI-on-the-edge SoC (System-on-Chip) solutions, further completing the semiconductor value chain. At the event, Mr. Bui Hoang Phuong, Deputy Minister of Science and Technology, affirmed: "Vietnam has advantages in human resources and has attracted numerous chip design companies to invest and employ Vietnamese engineers, laying the foundation for domestic chip design enterprises. In the global supply chain, Vietnam plays an increasingly important role in packaging and testing, although these stages are still largely dominated by foreign companies. FPT's investment in an advanced testing and packaging plant completes a critical missing link, helping to close Vietnam's semiconductor ecosystem. This concrete project demonstrates FPT's commitment to turning aspirations into action—bringing Vietnamese intelligence to the world and positioning Vietnam more clearly on the global semiconductor map." Notably, FPT signed a series of cooperation agreements with leading semiconductor technology partners in Vietnam and internationally. Partnering with major domestic and global corporations represents a strategic approach for FPT to master semiconductor technologies in the long term. Specifically, FPT and Viettel entered into a comprehensive partnership to build sovereign semiconductor capabilities through end-to-end value chain integration, covering training, design, fabrication, testing, packaging, and commercialization. The collaboration focuses on the joint development of AI-on-the-edge SoC chips on 28–32nm process nodes, serving ecosystems of cameras, drones, unmanned aerial vehicles (UAVs), and smart devices. This strategic alliance between two of Vietnam's leading technology groups aims to complete a closed-loop national semiconductor ecosystem. Together with Viettel's groundbreaking ceremony for Vietnam's first semiconductor fabrication plant, FPT's announcement of the establishment of the FPT Advanced Semiconductor Testing and Packaging Plant represents a strong and concrete action, reaffirming Vietnam's determination to master key stages of the national semiconductor value chain. In parallel, FPT also signed agreements with prominent international semiconductor partners, including Restar—to advance R&D in semiconductor testing and packaging technologies and to commercialize chips tested and packaged by FPT; Winpac—to promote semiconductor commercial cooperation and explore potential joint investment in FPT's testing and packaging facilities in Vietnam; and VSAP LAB—to pursue comprehensive cooperation from research to mass production, optimizing advanced packaging and testing capabilities while jointly developing highly specialized semiconductor talent. At the event, FPT also announced plans to research and develop AI-on-the-edge System-on-Chip (SoC) solutions, aiming to fully master the smart device ecosystem encompassing cameras, drones, and unmanned aerial vehicles (UAVs). FPT is a pioneering Vietnamese enterprise in the development of "Make in Vietnam" chips, with more than a decade of engagement in the semiconductor industry. To date, FPT has built a comprehensive semiconductor ecosystem spanning chip design, packaging, testing, and workforce development, with the ambition of positioning Vietnam as a key semiconductor hub in the region. FPT focuses on the research and development of core chip product lines, including power ICs, power management ICs (PMICs), and AI-on-the-edge SoC chips. In parallel, FPT is accelerating high-quality workforce development, targeting the training of 10,000 semiconductor engineers by 2030 through a multi-tier education system and international collaboration. A flagship initiative is the "2+2" program, under which students study two years at FPT University, followed by two years of specialized training in Taiwan region or South Korea, and subsequently undertake internships at leading companies. In 2025, FPT inaugurated the High-Tech and Semiconductor Center in Da Nang and the Vietnam Semiconductor Incubation and Development Center (V.S.I.C) in Hanoi. Notably, in December 2025, FPT became the first Vietnamese enterprise to export commercial semiconductor chips to Japan, reaffirming its growing position in the global semiconductor value chain.

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 447 加入收藏 :
筑波科技與格斯科技/格棋化合物半導體MOU簽約代表張忠傑董事長(左)、許深福董事長(右)
產經商業
筑波科技攜手格斯科技與格棋化合物半導體，共創電池與SiC晶圓檢測新紀元

2024年10月17日，台灣新竹 — 筑波科技宣布與格斯科技及格棋化合物半導體簽訂合作備忘錄，三方將在電池品質測試及半導體晶圓檢測領域深度合作，在精密檢測與材料技術市場邁入新階段。   在此次合作中，筑波科技與格斯科技將聚焦於電池芯及軟包電池的品質參數測試，運用非破壞性、非接觸式的太赫茲脈衝時域光譜技術，對電池芯及軟包電池的品質檢測，確保產品的品質與安全性。雙方致力於提升檢測精度及效率，為市場提供更具競爭力的解決方案。格斯科技專注於新興電池技術，特別是在鈦酸鋰電池（LTO）及高鎳三元鋰電池的研發和製造方面處於領先地位，提供從材料到電池模組設計與組裝的全套客製化服務。   筑波科技與格棋化合物半導體攜手合作碳化矽半導體晶圓的缺陷檢測，採用TZ6000/6500系統，運用非破壞性、非接觸式的太赫茲脈衝時域光譜技術，精確檢測SiC半導體晶圓的缺陷，從而提升晶圓的品質與可靠性。格棋化合物半導體專注於6吋和8吋導電型及半絕緣型碳化矽的長晶技術研發和製造，強調上下游廠商的垂直整合，推動整個產業鏈的進一步擴展與發展。   格斯科技/ 格棋化合物半導體董事長張忠傑表示：「我們非常期待與筑波科技的合作，這將大幅提升我們在電池與半導體產業鏈市場中的技術含量。」筑波科技董事長許深福表示：「筑波致力於系統整合客製化，結合格斯科技/格棋化和物半導體的研發與製造能量，可共創新局面綜效，節省成本、提升產品品質，未來可望著墨儲能產業鏈，鞏固雙方市場差異化領導地位與技術能量。」   筑波科技專注於精密量測儀器的銷售與租賃，涵蓋無線通訊、RF量測、高頻配件、半導體晶圓和電池芯的測試及技術解決方案。此次與格斯科技及格棋化合物半導體的合作，將提升在市場中的競爭力，並為產業提供突破性的檢測技術與服務。     聯絡筑波科技: 筑波科技股份有限公司ACE Solution, Co., Ltd. 李凱傑Peter Lee, 林孟樺Jenny Lin 地址：新竹縣竹北市台元街28號2樓之1 電話：+886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw 網站：https://www.acesolution.com.tw/en/     關於筑波科技 筑波科技（https://www.acesolution.com.tw/en/index/）成立於2000年，位於台灣新竹，在中國蘇州和深圳以及越南設有分公司，可提供服務。我們的使命是提供訂製的測試解決方案，以滿足電氣元件、設備和系統製造商的客戶需求，通過合作夥伴提供技術解決方案。我們專注於射頻、毫米波和太赫茲領域，擁有專業的技術支援團隊，提供專業、創新和多功能的綜合技術和解決方案。  

文章來源 : 筑波科技股份有限公司 發表時間 : 瀏覽次數 : 5327 加入收藏 :
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