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符合「semiconductor packaging」新聞搜尋結果, 共 20 篇 ,以下為 1 - 20 篇 訂閱此列表,掌握最新動態
KLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor Packaging

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging platform to support mainstream and advanced IC substrate lithography requirements New Lumina™ inspection and metrology systems further equip IC substrate (including glass core) and panel-based interposer makers to efficiently build advanced products with high quality and yield MILPITAS, Calif., Oct. 16, 2024 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) introduced the industry's widest breadth of process control and process-enabling solutions for IC substrate (ICS) manufacturing. KLA's combined expertise in front-end semiconductors, packaging and IC substrates will help customers achieve breakthroughs in packaging interconnect density for chips targeting high-performance applications. KLA Corporation now offers the industry’s widest breadth of process control and process-enabling solutions for IC substrate manufacturing. As innovation accelerates for panel-based intermediate packaging levels like IC substrates and interposers, customers require new solutions to achieve breakthroughs in packaging interconnect density for chips targeting high-performance applications. Advanced packaging continues to adopt heterogeneous integration methods to bring together multiple semiconductor components for performance, power and cost benefits. To meet evolving interconnect requirements, innovation is accelerating for panel-based intermediate packaging levels like IC substrates and interposers. These technologies are used to efficiently connect chips and printed circuit boards (PCBs). As package dimensions increase, feature sizes decrease and novel materials such as glass are introduced, manufacturers can leverage KLA's solution portfolio to achieve higher yield, accelerate delivery cycles and improve overall profitability. KLA's comprehensive portfolio of direct imaging (DI), defect inspection, shaping, metrology, chemistry process control and intelligent software solutions optimizes the advanced packaging manufacturing workflow. KLA's portfolio includes multiple direct imaging solutions supporting a range of customer lithography requirements. Market adoption of the Corus™ direct imaging platform demonstrates its proven capability at providing a highly flexible and efficient imaging solution. To meet evolving needs for applications like IC substrates and next-gen high-density interconnect (HDI), the capability is being extended with next-generation optics and lasers to optimize dynamic imaging and layer-to-layer accuracy at speed, even for varying panel topographies. For advanced IC substrate applications, direct imaging represents a new category beyond steppers for lithography. KLA is introducing the new Serena™ direct imaging platform for quality, finer line patterning of large-sized, high layer count organic substrates for increased accuracy and yield with the efficiency of a flexible digital solution. Lumina™, KLA's new inspection and metrology system for advanced IC substrates (including glass core) and panel-based interposers, enables high-sensitivity detection and scanning metrology at optimized cost of ownership. The system delivers monitoring paired with AI-based review and classification for an actionable defect Pareto chart without the need for operator input, as well as a seamless integration with KLA's copper shaping solutions. The portfolio is strengthened with proven KLA process control solutions featuring the Orbotech Ultra PerFix™, EcoNet™, Zeta™-6xx, ICOS™ T890, Quali-Fill® Libra® and QualiLab® Elite product lines. KLA's Frontline software solutions span engineering, computer-aided manufacturing (CAM) and production data analytics to centralize and apply intelligence throughout IC substrate manufacturing, building on KLA's longtime leadership in yield management. "With today's portfolio news, KLA is affirming our leadership in semiconductor ecosystem innovation," said Oreste Donzella, executive vice president and chief strategy officer, KLA Corporation. "IC substrates and other panel-level packaging technologies are essential to advancing connectivity within tomorrow's high-performance chips, and KLA is collaboratively engaged with customers in solving complex production challenges to maximize their yield and business success." For more information about KLA's comprehensive portfolio of IC substrate solutions, join us at the upcoming TPCA tradeshow. About KLAKLA Corporation ("KLA") develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging and printed circuit boards. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Investors and others should note that KLA announces material financial information including SEC filings, press releases, public earnings calls and conference webcasts using an investor relations website (ir.kla.com). Additional information may be found at: www.kla.com. Forward-Looking StatementsStatements in this press release other than historical facts, such as statements regarding the expected performance of the IC substrate product portfolio are forward-looking statements, and are subject to the Safe Harbor provisions created by the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on current information and expectations and involve risks and uncertainties. Actual results may differ materially from those projected in such statements due to various factors, including delays in the adoption of new technologies (whether due to cost or performance issues or otherwise), the introduction of competing products by other companies or unanticipated technology challenges or limitations that affect the implementation, performance or use of KLA's products, and other risk factors included in KLA's annual report on Form 10-K for the year ended June 30, 2024 and other filings by KLA with the Securities and Exchange Commission (including, without limitation, the risk factors described therein). KLA assumes no obligation to, and do not currently intend to, update these forward-looking statements.

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 839 加入收藏 :
Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024

New Report from SEMI, TECHCET and TechSearch International Highlights Growth Drivers through 2028 MILPITAS, Calif., Oct. 1, 2024 /PRNewswire/ -- Powered by strong semiconductor demand across diverse end applications, the global semiconductor packaging materials market is expected to start a growth cycle with a 5.6% compound annual growth rate (CAGR) projected through 2028, SEMI, TECHCET and TechSearch International announced today in their latest Global Semiconductor Packaging Materials Outlook (GSPMO) report. The report highlights AI as an expected growth driver for advanced packaging applications, despite currently low unit volumes due to the newness of the market segment. Global Semiconductor Packaging Materials Outlook through 2028 The GSPMO report provides comprehensive data and forecasts for substrates, leadframes, bonding wire, and additional advanced packaging materials. "After a challenging 2023, which saw a 15.5% decline in the semiconductor packaging materials market, our latest report forecasts a return to growth in 2024," said Lita Shon-Roy, TECHCET President and CEO. "The global packaging materials market is expected to exceed $26 billion by 2025 and continue solid growth through 2028." "Substrates account for a large portion of the revenue for the packaging materials market, and within the category, FC-BGA substrates make up the majority of the revenue growth," said Jan Vardaman, President of TechSearch International. "The CAGR for flip chip BGA/LGA revenue is expected to be 7.6% from 2023 to 2028. Other key growth areas include wafer-level packaging (WLP) dielectrics and flip chip underfill. The laminate substrates segment is expected to grow 7.3% annually in volume, while leadframes and bonding wire are also forecasted to recover, growing by 5.0% and 6.4%, respectively." The GSPMO 2024 report is designed to help companies capitalize on emerging trends, navigate supply chain challenges, and make informed decisions in sourcing high-performance materials. Features of the report include: Technology trends Regional market size and forecast Five-year market forecast to 2028 Market size by product segments in revenue and units Excel workbook file summarizing market information Supplier information and market share For more information on the report or to subscribe, visit SEMI Market Data or contact the SEMI Market Intelligence Team (MIT) at mktstats@semi.org. About SEMISEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members' business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more. Association Contacts Samer Bahou/SEMI CommunicationsPhone: 1.408.943.7870Email: sbahou@semi.org   

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 243 加入收藏 :
DIGITIMES Asia: Kaynes SemiCon secures India's first paying OSAT customer for advanced semiconductor packaging

TAIPEI, Aug. 30, 2024 /PRNewswire/ -- Kaynes SemiCon, a wholly owned subsidiary of Kaynes Technology, has signed a landmark memorandum of understanding (MoU) with Lightspeed Photonics, securing India's first paying customer for outsourced semiconductor assembly and test (OSAT) services, according to CEO Raghu Panicker. Raghu Panicker, CEO, Kaynes SemiCon. Credit: Kaynes SemiCon. According to the news report from the technology-focused media DIGITIMES Asia, the announcement was made during the inauguration of Kaynes Technology's new electronics manufacturing unit in Hyderabad, signifying a major leap forward for India's nascent semiconductor ecosystem. The collaboration will see Kaynes SemiCon provide advanced packaging solutions for Lightspeed Photonics. The MoU also highlights the high volume run at Kaynes Semicon. "This is the first paying OSAT customer in India," Panicker said, emphasizing the importance of the agreement. "We will initially carry out sample runs and low-volume production at our proto line in Mysore/Hyderabad, before scaling up to high-volume manufacturing once our new facility is fully operational." Lightspeed Photonics, a Singapore-based fabless system development company, specializes in integrating optical interconnects with processors to create modular compute-interconnect heterogeneous System-in-Packages (SiP) under its LightSiP brand. This technology aims to enhance server scalability by reducing data latency, footprint, and power consumption while significantly boosting data bandwidth and performance per watt. Strategic investments and advanced packaging The deal is particularly significant as it underscores India's entry into the high-value segment of semiconductor manufacturing—advanced packaging. With the global semiconductor industry increasingly focusing on advanced packaging technologies such as silicon photonics, Kaynes SemiCon's foray into this space positions the company as a key player in the global supply chain. Panicker also revealed that the company has already identified and aligned the necessary equipment for the project, with installation planned at the proto line in Mysore/Hyderabad and eventually at its upcoming facility. "We have engaged with our equipment suppliers and are set to consign the equipment at their facilities. This will allow us to start rolling out packages for Lightspeed Photonics within four to five months," he added. The company expects final approval from the Indian government for its OSAT services to come in soon, allowing it to proceed with its plans. "Approval may come in about a week's time," he stated, underscoring that preparations are already underway to meet the stringent requirements of advanced semiconductor packaging. Separate MoU for capacity building In addition to the MoU with Lightspeed Photonics, Kaynes SemiCon has also signed an agreement with the VLSI Society of India for capacity building. This initiative aims to develop a skilled workforce for India's semiconductor industry by partnering with educational institutions to provide training in semiconductor manufacturing. The implementation partner for this will be Perceptives Solutions. According to Satya Gupta, President of the VLSI Society, the intention is "to make India a world-class electronics and semiconductor product nation." Bhanupriya K, MD of Perceptives Solutions, also stressed the need to train the students in the area of semiconductor manufacturing processes. Through this MoU, Kaynes SemiCon will open up its OSAT facility for packaging free of cost to Education Institutes aligned with the VLSI Society of India. The dual MoUs reflect Kaynes SemiCon's initiatives to support the growth of India's semiconductor industry, focusing on technological advancement and workforce development. As the first company to secure a paying OSAT customer in India, Kaynes Semicon is positioned to contribute significantly to the future of semiconductor manufacturing in the region. India's semiconductor ambitions Kaynes SemiCon's dual MOUs come at a time when India is aggressively pursuing its ambitions to become a global semiconductor hub. With the government's push towards self-reliance in electronics and a US$10 billion incentive scheme to attract semiconductor manufacturing investments, the country is poised to play a larger role in the global semiconductor supply chain. India has granted approvals for three major semiconductor projects so far, including a wafer fabrication facility and an OSAT plant by Tata Group, as well as a separate OSAT facility by Murugappa Group's CG Power and Industrial Solutions. Meanwhile, reports suggest that CG Power has recently entered into agreements with Japan's Renesas, a leading semiconductor manufacturer, and Thailand's Stars Microelectronics, an OSAT provider, to establish an OSAT facility in India. The company plans to invest INR7,600 crore (US$1 billion) over the next five years in this venture.

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 641 加入收藏 :
Global Semiconductor Packaging Materials Market to Near $30 Billion by 2027

SEMI, TECHCET and TechSearch International Highlight Diverse Growth Drivers in New Report  MILPITAS, Calif., May 23, 2023 /PRNewswire/ -- Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the US$26.1 billion in revenue it logged in 2022, SEMI, TECHCET and TechSearch International announced today in their new Global Semiconductor Packaging Materials Outlook report. High-performance applications, 5G, artificial intelligence (AI) and the adoption of heterogeneous integration and system-in-package (SiP) technologies are increasing demand for advanced packaging solutions. The development of new materials and processes to enable chips with higher transistor density and greater reliability are also contributing to market growth. "The semiconductor packaging materials industry is undergoing significant changes as new technologies and applications are driving demand for more advanced and diverse materials," said Jan Vardaman, President and founder of TechSearch International. "Advances in dielectric materials and underfill are driving strong demand for fan-in and fan-out wafer level packaging (FOWLP), flip chip, and 2.5D/3D packaging. New substrate technologies such as silicon interposers and organic interposers using RDL (Re-Distribution Layer) are also key growth drivers of packaging solutions. At the same time, research on laminate substrates with finer features continues with the development of glass cores for build-up substrates." The Global Semiconductor Packaging Materials Outlook report provides a comprehensive analysis of the current and forecast market for semiconductor packaging materials, covering substrates, leadframes, bonding wires, encapsulation materials, underfill materials, die attach, wafer level package dielectrics, and wafer-level plating chemicals. Features of the report include: Technology trends Regional market size Five-year market forecast to 2027 Market size in revenue and units Excel workbook file summarizing market information Supplier market share Capacity and utilization trends The report is available for purchase from SEMI.  About SEMISEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more. Association ContactMichael Hall/SEMIPhone: 1.408.943.7988Email: mhall@semi.org        

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 3807 加入收藏 :
Launch of TRENG-PLP Coater

Panel Level Coater for Advanced Semiconductor PackagingHONG KONG SAR - Media OutReach Newswire - 9 December 2024 - Toray Engineering Co.,Ltd has developed the "TRENG-PLP Coater", a high-accuracy coating device for panel level packaging (PLP is an advanced semiconductor packaging technology) for which there is growing demand particularly from AI servers and data centers. Sales of the Coater will commence in December 2024. The TRENG-PLP Coater The Coater enables 2.5D packaging—a next-generation semiconductor production technology—to be applied to larger substrates. Specifically, it is capable of creating detailed rewiring layers on glass substrates for use in interposers, which are a key component of integrated circuits. In this way, the Coater facilitates the production of high-performance semiconductors. Toray Engineering has already delivered pilot Coaters to a number of major semiconductor manufacturers to demonstrate its capabilities. Now, the company is preparing to mass-produce the devices, and is targeting orders totaling 3 billion yen by fiscal 2025, and 6 billion yen by fiscal 2030. In recent years, increased demand for generative AI servers has resulted in a proliferation of hyperscale data centers. As semiconductor performance has improved, the market for high-performance semiconductors has expanded rapidly; at the same time, this technological progress has driven demand for larger-scale and more efficient advanced semiconductor packaging, which is indispensable for the production of advanced semiconductor devices. Interposers are a key component in advanced semiconductor packaging, and are traditionally made of silicon. However, since interposers are square and silicon wafers are round in shape, cutting square interposers out of 300mm-diameter round silicon wafers inevitably results in waste silicon. Moreover, as semiconductor performance increases, package sizes have been increasing year on year, leading to fears of further decreases in production efficiency. PLP technologies, which use 600mm-square glass substrates, are seen as a potential solution to the above problems. The larger area of the glass substrate means that larger-scale packages can be produced compared to what is possible with silicon wafers, while its square shape means that the entire substrate can be effectively used to create square interposers without resulting in unused substrate. Yet the use of PLP technologies to create circuits is not without its own issues: warping of the glass substrate must be prevented, while the wiring materials and photoresist materials must be of a uniform thickness. To prevent warping, Toray Engineering has developed new technologies for the handling of large glass substrates, drawing on proprietary coating technologies for LCD panels, which are capable of controlling thickness with a high degree of precision. These technologies enable the TRENG-PLP Coater to create high-density rewiring layers on 600mm-square glass substrates. Hashtag: #toray #TRENGThe issuer is solely responsible for the content of this announcement.About Toray EngineeringToray Engineering is a global leader in innovative engineering technologies. Established in 1960, we have been designing and providing plant construction and FA equipment, as well as state-of-the-art manufacturing facilities and equipment such as FPD/semiconductor production equipment, films, and display materials. Under our business brand "TRENG", we contribute to society by creating new value and realizing solutions to bring about a sustainable society. More information is available at http://www.toray-eng.com.

文章來源 : Media OutReach Limited 發表時間 : 瀏覽次數 : 537 加入收藏 :
The GMIF2024 Annual Awards Revealed: Micron, Silicon Motion, Western Digital, and More Companies Make the List

SHENZHEN, China, Oct. 12, 2024 /PRNewswire/ -- On September 27, the Third GMIF2024 Innovation Summit (Global Memory Innovation Forum) was successfully concluded in Renaissance Shenzhen Bay Hotel. The event was hosted by the Semiconductor Investment Alliance and the Shenzhen Memory Industry Association, co-organized by the Guangdong Integrated Circuit Industry Association and the Shenzhen Semiconductor Industry Association, and organized by JW Insights Consulting (Xiamen) Co., Ltd. and Haitong Securities Co., Ltd. In recognition of outstanding achievements and innovation in the storage industry, the GMIF2024 Annual Awards winners were unveiled at the summit. Following a rigorous selection process, many companies, including Intel, Micron, CXMT, YMTC, GigaDevice, Arm, UNISOC, SIXUNITED, Victory Giant, BIWIN Storage, Solidigm, Western Digital, Rockchip, Allwinner Technology, Weibu Information, Heyan Technology, OKN Technology, Attach Point Intelligent Equipment, iWISEETEC, Tytantest, Hemei Jingyi, Silicon Motion, Maxio, QUANXING, MICROFROM, Konsemi, Silergy, Tongfang, LKAUTO, Maxwell, Skyverse, RORZE, ExTripod Electronics, EPS, InnoGrit, POWEV, KingSpec, LANYI and more, had been honored with the 2024 Annual Awards. The GMIF2024 Annual Awards feature over 38 subcategories across three main categories: Outstanding Industry Award, Outstanding Product Award, and Outstanding Brand Award. The list of winners is as follows: Outstanding SSD Product Breakthrough Award: Micron Technology Micron Technology, a leading global provider of storage and memory solutions, has been dedicated to promoting industry advancement through technological innovation. The latest addition to its data center SSD lineup, the Micron 9550 NVMe™ SSD, achieves industry-leading performance and demonstrates notable advancements in performance and energy efficiency for AI workloads. This breakthrough by Micron Technology illustrates its profound expertise and innovative abilities in storage technology and further emphasizes its leadership in AI storage solutions. Outstanding AI Storage Application Award: Solidigm Solidigm, a leader in AI storage solutions, draws on its rich experience in QLC SSD technology to deliver high-performance and high-capacity storage solutions for AI applications. Through ongoing technological innovation, Solidigm addresses the high requirements for storage density and efficiency in the AI sector, significantly improving data processing capabilities and overall performance for AI applications. Solidigm exhibits robust technical strength and market leadership in the implementation of AI storage solutions, providing vital support for the rapid growth of the AI industry. Outstanding Technology Innovation Award: Western Digital As a premier global data storage solutions provider, Western Digital remains at the cutting edge of technological innovation. Thanks to its vertical integration in NAND flash and hard disk technology, Western Digital has successfully released various high-performance and high-capacity storage products, greatly enhancing the efficiency and performance of data centers and enterprise storage. Its relentless pursuit of technological breakthroughs not only fosters the growth of the storage industry but also offers exceptional storage experiences to customers around the world. Western Digital's commitment to innovation sets a new benchmark in the industry. Outstanding Technology Leadership Award: Intel (China) Ltd. Intel (China) Ltd. exemplifies strong technological leadership through its sustained innovation in the semiconductor and computing sectors. As a frontrunner in the global technology landscape, Intel drives the evolution of computing and storage technologies with its state-of-the-art processor architectures and innovative solutions. The company's technological advancements in pioneering fields like AI and data centers offer global customers high-performance, highly reliable product experiences, further solidifying its leadership status in the industry. Intel sets new standards for development in the industry through its exceptional technological innovation. Outstanding AIoT Platform Contribution Award: Rockchip Electronics Co., Ltd.  Rockchip Electronics Co., Ltd. excels in the AIoT platform sector, and leverages its innovative chip designs and robust technological capabilities to further promote the fast development of the AIoT ecosystem. The company provides efficient and stable solutions for smart devices and the Internet of Things through a comprehensive product portfolio and technological breakthroughs, which significantly enhances the overall performance of AIoT platforms. With its continuous innovation and deep commitment to the ecosystem, Rockchip has made significant contributions to the industry, and has now become a key player in the AIoT platform field. Outstanding Intelligent Terminal Application Award: Allwinner Technology Co., Ltd. Allwinner Technology Co., Ltd. provides high-performance and low-power SoC solutions by relying on its ongoing innovations in smart terminal processors, and now its products have been widely used in smart terminal devices across the globe. Dedicated to refining product performance, Allwinner has taken a big leap in enhancing the computational power and user experience of smart devices, contributing to driving both technological advancement and application expansion in the smart terminal industry. The company's outstanding achievements in this field have garnered it broad industry recognition, establishing it as one of the leaders in the smart terminal sector. Outstanding Intelligent Terminal Award: Weibu Information Inc. Weibu Information Inc. has drawn on its strong innovation capabilities and deep technical expertise to roll out a set of effective and intelligent terminal solutions. The company has enhanced the performance and user experience of smart terminal devices by optimizing its technical architecture, with applications spanning multiple industries. Through its continued innovation, Weibu Information has not only expanded the use of smart terminal devices but also invigorated the industry, earning widespread acclaim from the market and its clients. Outstanding Packaging Equipment Support Award: Shenyang Heyan Technology Co., Ltd. Shenyang Heyan Technology Co., Ltd. continues to make strides in the semiconductor packaging equipment sector, offering robust support for chip packaging technology through its innovative fully automatic grinding and polishing machines and film lamination and stripping machines. With considerable efforts put in the enhancement of equipment's precision and efficiency, Heyan now provides the market with more thinner, more precise chips, making a difference to the progress of domestic semiconductor packaging technology. Outstanding Memory Testing System Gold Award: Suzhou OKN Technology Co., Ltd. Suzhou OKN Technology Co., Ltd. has successfully introduced a series of efficient and reliable testing equipment, backed by its professional expertise and ongoing innovation in memory testing systems. Through years of technical accumulation, the company has continuously refined the accuracy and performance of its testing systems, delivering effective memory testing solutions to its clients. OKN's excellent products and services have garnered widespread trust from customers, and it's now recognized as a crucial contributor in the memory testing field. Outstanding Packaging Equipment Service Award: Dongguan Attach Point Intelligent Equipment Co., Ltd.  Reinforced by its strength in innovative R&D of semiconductor packaging equipment, Dongguan Attach Point Intelligent Equipment Co., Ltd. has brought out a variety of high-precision and high-efficiency packaging solutions to the market. The company remains focused on improving equipment performance and service standards to deliver more competitive packaging support to its clients. Supported by outstanding technology and dependable service, APIE has earned significant market recognition and become a key partner in the semiconductor packaging equipment industry. Outstanding Product Award: Shenzhen Hemei Jingyi Semiconductor Technology Co., Ltd. Shenzhen Hemei Jingyi Semiconductor Technology Co., Ltd. takes the full advantage of its excellence in IC packaging substrate design and manufacturing to launch a range of high-quality products that are widely used across multiple industries. The company's commitment to ongoing technological innovation and strict quality assurance has resulted in enhanced product performance and reliability, earning significant customer recognition. Hemei Jingyi's outstanding product performance has made it a prominent supplier in the packaging substrate industry, setting a benchmark for the market. Outstanding Controller Leadership Award: Silicon Motion Technology Corp. The SM2508 from Silicon Motion is a high-performance, low-power PCIe Gen5 SSD controller solution designed specifically for AI laptops requiring high capacity, high performance, and low-power storage solutions. The company's continuous innovation in flash controller technology has driven performance enhancements in solid-state storage devices, solidifying its leadership position in the industry. Outstanding Controller Market Application Award: Maxio Technology (Hangzhou) Co., Ltd. Maxio Technology (Hangzhou) Co., Ltd. has leveraged its deep technological expertise in storage controller chips to launch a range of high-performance solutions that meet the diverse needs of the market. By continuously optimizing product performance and application scenarios, the company has effectively covered both consumer and enterprise markets, and its products has now been acknowledged widely by customers. Endorsed by its outstanding market performance and strong application capabilities, Maxio has become a significant driver in the controller chip market. Outstanding Brand Influence Award: iSoftStone Computing (Tongfang Computer) Tongfang Computer has successfully established an internationally competitive brand image through its continuous efforts in technological innovation and product quality. The company's remarkable performance in high-performance computing and storage solutions covers multiple application sectors and has earned it high acclaim from users globally. By consistently enhancing its brand influence and market performance, Tongfang Computer has become a well-known brand in the storage industry, driving sustainable development in the sector. Outstanding Market Breakthrough Award: Shenzhen Like Automation Equipment Co., Ltd. Shenzhen Like Automation Equipment Co., Ltd. has achieved significant market breakthroughs through its continuous innovation in the field of semiconductor packaging and testing intelligent equipment. The company's independently developed fully automatic IC substrate ball bonder machine demonstrates outstanding competitiveness in both technical performance and market performance, filling a gap in the domestic equipment landscape. By continuously enhancing its product technology level and market coverage, LKAUTO has earned high recognition from its customers. Outstanding Equipment Technology Breakthrough Award: Suzhou Maxwell Technologies Co., Ltd. Maxwell Technologies, a provider of complete process solutions for semiconductor wafer grinding and 2.5D/3D advanced packaging in the post-Moore era, has continually invested in R&D and adhered to independent innovation. In recent years, the company has achieved breakthroughs in high-end equipment and core components for wafer thinning, cutting, and bonding/debonding. Maxwell is dedicated to producing high-quality products and delivering exceptional service, aiming to create more value for customers and foster win-win outcomes. Outstanding Semiconductor Metrology Technology Innovation Award: Skyverse Technology Co., Ltd. Skyverse Technology Co., Ltd. has become an industry benchmark thanks to its technological innovations in the field of semiconductor testing and measurement. By continuously investing in R&D and making significant technological breakthroughs, the company has enhanced the accuracy and efficiency of measurements in semiconductor manufacturing processes, fostering technological progress across the industry. Skyverse has garnered high recognition from clients both at home and abroad and has achieved multiple independent innovations in measurement technology, positioning itself as an important force in the development of the industry. Outstanding Controller Contribution Award: InnoGrit Corporation InnoGrit Corporation has leveraged its in-depth expertise and innovation in the storage controller chip sector to successfully introduce multiple high-performance controller chips, catering to a diverse range of applications from SATA to PCIe. Through ongoing technological advancements, InnoGrit not only delivers efficient and reliable storage solutions to clients worldwide but also promotes the development and evolution of storage controller technology, demonstrating formidable technical leadership and making significant contributions to the industry. Outstanding Industry Award: Victory Giant Technology (Huizhou) Co., Ltd. Victory Giant Technology (Huizhou) Co., Ltd., one of the top 100 global printed circuit board manufacturers, has been dedicated to advancing smart manufacturing in China while actively promoting technological innovation in the PCB industry. Adhering to principles of intelligent manufacturing, green development, and innovation leadership, Victory Giant has achieved stable growth bolstered by its outstanding products, technologies, and service advantages, setting an industry benchmark in electronic circuit boards. Its high-quality products and services have earned it wide recognition in the market. Outstanding Testing Equipment Leadership Award: Tytantest Co., Ltd. Tytantest Co., Ltd. has made significant strides in the chip testing equipment sector by introducing several high-performance testing devices through its innovative R&D efforts, greatly enhancing the efficiency and accuracy of chip testing. The company focuses on optimizing product design and performance to provide clients with effective testing solutions. Tytantest is recognized widely in the market for its superior technical expertise and reliable equipment support. Outstanding Industry Service Award: ChangXin Memory Technologies Inc. (CXMT) CXMT has been awarded for its outstanding performance in DRAM technology research, development, and production. As an innovative pioneer in China's high-end memory sector, CXMT has become a backbone of the progress in China's semiconductor industry by independently developing core technologies and launching high-quality products, contributing to the high-level development of the domestic memory industry chain. Outstanding Storage Technology Breakthrough Award: Yangtze Memory Technologies Co., Ltd. (YMTC) Yangtze Memory Technologies Co., Ltd. (YMTC) has made significant strides in the 3D NAND flash technology sector since its establishment in 2016, achieving remarkable breakthroughs from the ground up. Notably, the third-generation QLC flash memory released by YMTC in 2020 garnered widespread acclaim for its industry-leading I/O speed and storage density. The company's ongoing innovation has not only elevated the technological standards of China's semiconductor industry but also spurred competition and innovation within the sector, allowing more cost-effective domestic products to secure a vital position in the global market. Outstanding Industry Contribution Award: GigaDevice Semiconductor Inc. GigaDevice, as a leading global fabless chip supplier, has played a pivotal role in the rapid development of the semiconductor industry through its outstanding product research and development capabilities and technological innovations. Its achievements in memory and microcontroller fields have not only enhanced the international competitiveness of China's chip industry but also provided global customers with high-quality, high-performance solutions. With its ongoing contributions and profound impact, GigaDevice has become a key driving force behind industry advancement. Outstanding Industry Promotion Award: Arm As a leading global provider of semiconductor intellectual property, Arm is dedicated to advancing technological development and innovation within the semiconductor industry. Through its exceptional chip architecture design and extensive ecosystem, Arm not only provides robust technical support for global technological progress but also actively promotes collaborative development and technical exchange across the industry chain. Its ongoing contributions to the construction of the global semiconductor ecosystem have ushered in considerable transformations, facilitating higher levels of technological breakthroughs and advancements within the industry. Outstanding Industry Ecosystem Award: UNISOC (Shanghai) Technologies Co., Ltd. UNISOC, a leading chip design company in China, has become a pivotal force in advancing the semiconductor industry ecosystem. With the backing of innovative chip technology and a broad product portfolio, the company actively promotes collaborative development within the industry chain, driving technological progress in various fields, including smart terminals, the Internet of Things (IoT), and 5G. Through its outstanding technological prowess and capability in ecosystem development, UNISOC has made significant contributions to the sustainable growth of the global technology industry, further enhancing the global competitiveness of China's semiconductor sector. Outstanding Industry Innovation Award: BIWIN Storage Technology Co., Ltd. BIWIN Storage Technology Co., Ltd. has successfully established an "Integrated R&D and Packaging" business model through continuous technological innovation and strong R&D capabilities. The company demonstrates exceptional competitiveness in research on storage medium characteristics, firmware algorithm development, and packaging testing technologies. BIWIN Storage actively invests in IC design, advanced packaging and testing, and test equipment development, continually driving advancements in storage technology. This commitment enables the company to provide efficient and stable storage solutions to the global market, making it a significant force in leading industry innovation and development. Outstanding Packaging Equipment Market Performance Award: Suzhou iWISEETEC Co., Ltd. Suzhou iWISEETEC Co., Ltd. has excelled in the semiconductor packaging equipment sector, leveraging its innovative R&D capabilities and efficient equipment solutions to provide reliable packaging support for customers. The company continually enhances the precision and efficiency of its devices to meet diverse packaging requirements. With stable product performance and high-quality service, iWISEETEC has garnered significant recognition from the market and its clients, establishing itself as a key partner in the packaging equipment field. AI Storage Innovation Breakthrough Award: Shenzhen Quanxing Technology Co., Ltd. Capitalizing on its strategic foresight in the AI storage solutions sector, Shenzhen Quanxing Technology Co., Ltd. has successfully developed several innovative storage products with high performance and large capacity in the AI storage solutions sector, which meet the stringent data storage requirements of AI applications. Through continuous technological breakthroughs, the company provides efficient and reliable storage support for training and inference of large AI models, facilitating the practical application of AI across industries. With its outstanding innovative capabilities, QUANXING has received widespread recognition from the industry, and emerged as a significant force for innovation in the AI storage field. Outstanding Industrial-Grade Storage Service Award: Shenzhen Micro Innovation Industry Co., Ltd. (MICROFROM) With a strong focus on industrial control storage, Shenzhen Micro Innovation Industry Co., Ltd. has developed a series of stable and reliable storage solutions that are widely applied across various industrial environments. The company has made considerable efforts to continuously enhance the performance and reliability of its products, ensuring their stable operations under stringent industrial control settings. MICROFROM's commitment to quality and service has garnered significant trust from its customers, making it a prominent service provider in the industrial control storage industry. Outstanding Product Performance Award: Hefei Kangxinwei Storage Technology Co., Ltd. (KONSEMI) With its technical expertise in storage controller chips and storage modules, Hefei Kangxinwei Storage Technology Co., Ltd. has introduced a range of high-performance products that find extensive applications in consumer and automotive markets. The company's independently developed eMMC products have earned high praise from customers for their rapid read and write speeds, low power consumption, and exceptional reliability, achieving cumulative sales of over 50 million units. Outstanding Market Performance Award: Silergy Corp. Silergy Corp. stands as a leader in the analog chip industry and focuses on independent innovation with a global strategy. It has achieved a sustained annual growth rate of over 30% for several years. Aided by its industry-leading process technologies, the company designs innovative mixed-signal and analog chips, and its products encompass a wide range of fields including DC conversion, power management, LED lighting, and battery management systems. Silergy's developed solutions empower applications across automotive, industrial, consumer electronics, cloud computing, and telecommunications. Outstanding Market Service Award: RORZE Createch Co., Ltd. RORZE Createch Co., Ltd. has demonstrated exceptional innovation and market service in the field of industrial automation equipment. Through continuous breakthroughs in precision control and intelligent manufacturing solutions, the company has significantly improved its clients' production efficiency and product quality. With robust technical support and strong market responsiveness, RORZE has earned widespread recognition from its customers. Outstanding Packaging and Testing Equipment Service Award: ExTripod Electronics Technology Limited ExTripod Electronics Technology Limited has emerged as a leader in the semiconductor packaging and testing equipment sector through continuous innovation and outstanding performance. Specializing in advanced packaging and power semiconductor fields, the company provides efficient and reliable packaging and testing equipment and solutions, offering comprehensive technical support to OSAT, IDM, and Fabless customers. ExTripod Electronics has gained strong customer trust by driving technological advancements and optimizing services, making significant contributions to the industry's development. Outstanding Packaging Substrate BT Materials Service Award: Guangdong EPS Technology Co., Ltd. Guangdong EPS Technology Co., Ltd. has achieved remarkable success in providing advanced BT substrate materials and solutions for the IC packaging and Mini & Micro LED display industries. Through continuous technological innovation and efficient services, the company has successfully satisfied the demand for high-end packaging materials, driving the localization of semiconductor packaging materials. EPS has not only reached international standards in technology but also earned strong industry recognition for its excellent customer support and market responsiveness. Outstanding Domestic Storage Brand Influence Award: Powev Electronic Technology Co., Ltd. As a leading provider of high-end domestic storage solutions, POWEV has always adhered to offering customers high-performance, stable, and reliable storage products with excellent value, helping them navigate diverse market demands. POWEV's achievements are not only reflected in its technological breakthroughs but also in elevating the influence of domestic storage brands, setting trends in the localization of the market. Outstanding Industrial-Grade Storage Solution Award: Shenzhen KingSpec Electronics Technology Co., Ltd. Shenzhen KingSpec Electronics Technology Co., Ltd. has distinguished itself in the industrial control sector with its stable and reliable storage solutions. Underpinned by deep technical expertise and continuous innovation, the company has introduced a range of high-quality storage products capable of withstanding harsh industrial environments. These innovations not only offer high performance and stability but also demonstrate exceptional reliability under extreme conditions, making them widely applicable in fields such as industrial automation and the Internet of Things (IoT), delivering significant value and earning strong market recognition. Outstanding High-Precision Testing Service Award: Dongguan Lanyi Electronic Technology Co., Ltd. Dongguan Lanyi Electronic Technology Co., Ltd. has established itself as an industry leader through its innovative advancements in high-precision test probes and test sockets. With continuous investment in research and development, Lanyi Electronic has mastered several proprietary core technologies, offering customers high-precision, highly reliable testing solutions. This dedication to quality and innovation has earned the company widespread trust and recognition from clients and the market alike. Outstanding Terminal Industry Award: Shanghai Sixunited Intelligent Technology Co., Ltd. SIXUNITED is committed to driving global innovation and technological transformation, creating an exciting digital lifestyle through information technology. The company has made significant strides in the smart terminal industry, particularly with its contributions to AI computing power products. These advancements highlight SIXUNITED's comprehensive presence and strong capabilities in the intelligent computing sector, earning widespread recognition within the industry. ABOUT GMIF GMIF (Global Memory Innovation Forum) is the most important annual event of Shenzhen Memory Industry Association (SMIA). The forum aims to build a globally-focused, professional platform for the storage industry to collectively explore new technologies, applications, collaborations, and emerging opportunities. The Third GMIF2024 Innovation Summit had been successfully concluded on September 27, 2024 at Renaissance Shenzhen Bay Hotel. Under the theme of "AI Leads Memory's New Momentum", the summit aims to foster communication and interaction among both upstream and downstream enterprises in the storage industry. By promoting collaboration and complementary growth among industry partners, the GMIF seeks to help participating companies expand their product and brand reach and contribute to a thriving, win-win ecosystem in the global storage sector. For more information about GMIF, please visit https://www.gmif.com.cn/. Media Contact:Ms. Gu, +86 15064010336, wenjing.gu@gmif.com.cn

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2025 年 2 月 19 日 (星期三) 農曆正月廿二日
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