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— Industry’s First Double-Sided and Internal Defect Inspection —YOKOHAMA, JAPAN - Media OutReach Newswire - 27 February 2025 - TASMIT Inc. has launched a new inspection system for glass substrates as part of its INSPECTRA® series of semiconductor wafer visual inspection systems, which has gained attention for its high efficiency in advanced semiconductor manufacturing. INSPECTRA® Series The system detects not only pattern defects and foreign particles but also cracks and other defects specific to glass substrates, and is compatible with glass core interposers and rewiring glass carriers, which are used in panel level packaging (PLP) and other applications. Semiconductor manufacturers have previously introduced inspection systems for detecting surface defects on glass substrates, but this is the industry's first system capable of inspecting both the front and back surfaces as well as the internal structure to date. TASMIT aims to supply the large glass substrate inspection system to manufacturers of advanced semiconductors, such as PLP, targeting 1 billion yen in orders in FY2025 and 2 billion yen in FY2030. Currently, in 2.5D packaging, a next-generation semiconductor manufacturing technology, the increasing performance of semiconductors has led to larger semiconductor chips and a higher number of chips per package due to greater integration. As a result, interposers, which serve as intermediate components that electrically connect the chips to the substrate, are also being scaled up. Traditionally, silicon interposers made from 12-inch silicon wafers have been used, but since wafers are circular, the number of chips that can be produced from a single wafer is limited, making it difficult to meet growing demand. As an alternative, glass substrates are gaining attention as they can be manufactured in large substrate sizes and are suitable for high-density packaging, this new system is compatible with industry-standard 650mm square glass substrates. However, as glass is prone to microscopic cracks, semiconductors produced using glass substrates may experience operational stability issues, requiring their removal during processing. Traditionally, surface inspection has relied on optical technology, but due to the design of the inspection equipment, only surface defects could be detected, and no equipment could identify backside or internal defects. Building on the core specifications of the conventional INSPECTRA® series, a new developed glass substrate defect detection and analysis algorithm and an optical inspection mechanism utilizing polarized light have been installed, enabling the industry's first-ever double-sided and internal defect inspection. It also retains the high inspection speed, 40 seconds per panel, of the INSPECTRA® series, which enables 100% inspection and helps prevent defective products from reaching the market.Hashtag: #TASMITThe issuer is solely responsible for the content of this announcement.About TASMIT, Inc.TASMIT, Inc. was established in July 2000 as a subsidiary of Toray Engineering by consolidating the semiconductor inspection equipment business owned by Toray Engineering Group. The company provides high-quality solutions for the semiconductor device manufacturing market through two core products: the "INSPECTRA" optical semiconductor wafer inspection system, and the "NGR electron beam semiconductor wafer pattern verification system, both of which utilize strong semiconductor inspection technology. https://www.toray-eng.com/tasmit/
New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging platform to support mainstream and advanced IC substrate lithography requirements New Lumina™ inspection and metrology systems further equip IC substrate (including glass core) and panel-based interposer makers to efficiently build advanced products with high quality and yield MILPITAS, Calif., Oct. 16, 2024 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) introduced the industry's widest breadth of process control and process-enabling solutions for IC substrate (ICS) manufacturing. KLA's combined expertise in front-end semiconductors, packaging and IC substrates will help customers achieve breakthroughs in packaging interconnect density for chips targeting high-performance applications. KLA Corporation now offers the industry’s widest breadth of process control and process-enabling solutions for IC substrate manufacturing. As innovation accelerates for panel-based intermediate packaging levels like IC substrates and interposers, customers require new solutions to achieve breakthroughs in packaging interconnect density for chips targeting high-performance applications. Advanced packaging continues to adopt heterogeneous integration methods to bring together multiple semiconductor components for performance, power and cost benefits. To meet evolving interconnect requirements, innovation is accelerating for panel-based intermediate packaging levels like IC substrates and interposers. These technologies are used to efficiently connect chips and printed circuit boards (PCBs). As package dimensions increase, feature sizes decrease and novel materials such as glass are introduced, manufacturers can leverage KLA's solution portfolio to achieve higher yield, accelerate delivery cycles and improve overall profitability. KLA's comprehensive portfolio of direct imaging (DI), defect inspection, shaping, metrology, chemistry process control and intelligent software solutions optimizes the advanced packaging manufacturing workflow. KLA's portfolio includes multiple direct imaging solutions supporting a range of customer lithography requirements. Market adoption of the Corus™ direct imaging platform demonstrates its proven capability at providing a highly flexible and efficient imaging solution. To meet evolving needs for applications like IC substrates and next-gen high-density interconnect (HDI), the capability is being extended with next-generation optics and lasers to optimize dynamic imaging and layer-to-layer accuracy at speed, even for varying panel topographies. For advanced IC substrate applications, direct imaging represents a new category beyond steppers for lithography. KLA is introducing the new Serena™ direct imaging platform for quality, finer line patterning of large-sized, high layer count organic substrates for increased accuracy and yield with the efficiency of a flexible digital solution. Lumina™, KLA's new inspection and metrology system for advanced IC substrates (including glass core) and panel-based interposers, enables high-sensitivity detection and scanning metrology at optimized cost of ownership. The system delivers monitoring paired with AI-based review and classification for an actionable defect Pareto chart without the need for operator input, as well as a seamless integration with KLA's copper shaping solutions. The portfolio is strengthened with proven KLA process control solutions featuring the Orbotech Ultra PerFix™, EcoNet™, Zeta™-6xx, ICOS™ T890, Quali-Fill® Libra® and QualiLab® Elite product lines. KLA's Frontline software solutions span engineering, computer-aided manufacturing (CAM) and production data analytics to centralize and apply intelligence throughout IC substrate manufacturing, building on KLA's longtime leadership in yield management. "With today's portfolio news, KLA is affirming our leadership in semiconductor ecosystem innovation," said Oreste Donzella, executive vice president and chief strategy officer, KLA Corporation. "IC substrates and other panel-level packaging technologies are essential to advancing connectivity within tomorrow's high-performance chips, and KLA is collaboratively engaged with customers in solving complex production challenges to maximize their yield and business success." For more information about KLA's comprehensive portfolio of IC substrate solutions, join us at the upcoming TPCA tradeshow. About KLAKLA Corporation ("KLA") develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging and printed circuit boards. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Investors and others should note that KLA announces material financial information including SEC filings, press releases, public earnings calls and conference webcasts using an investor relations website (ir.kla.com). Additional information may be found at: www.kla.com. Forward-Looking StatementsStatements in this press release other than historical facts, such as statements regarding the expected performance of the IC substrate product portfolio are forward-looking statements, and are subject to the Safe Harbor provisions created by the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on current information and expectations and involve risks and uncertainties. Actual results may differ materially from those projected in such statements due to various factors, including delays in the adoption of new technologies (whether due to cost or performance issues or otherwise), the introduction of competing products by other companies or unanticipated technology challenges or limitations that affect the implementation, performance or use of KLA's products, and other risk factors included in KLA's annual report on Form 10-K for the year ended June 30, 2024 and other filings by KLA with the Securities and Exchange Commission (including, without limitation, the risk factors described therein). KLA assumes no obligation to, and do not currently intend to, update these forward-looking statements.
New Report from SEMI, TECHCET and TechSearch International Highlights Growth Drivers through 2028 MILPITAS, Calif., Oct. 1, 2024 /PRNewswire/ -- Powered by strong semiconductor demand across diverse end applications, the global semiconductor packaging materials market is expected to start a growth cycle with a 5.6% compound annual growth rate (CAGR) projected through 2028, SEMI, TECHCET and TechSearch International announced today in their latest Global Semiconductor Packaging Materials Outlook (GSPMO) report. The report highlights AI as an expected growth driver for advanced packaging applications, despite currently low unit volumes due to the newness of the market segment. Global Semiconductor Packaging Materials Outlook through 2028 The GSPMO report provides comprehensive data and forecasts for substrates, leadframes, bonding wire, and additional advanced packaging materials. "After a challenging 2023, which saw a 15.5% decline in the semiconductor packaging materials market, our latest report forecasts a return to growth in 2024," said Lita Shon-Roy, TECHCET President and CEO. "The global packaging materials market is expected to exceed $26 billion by 2025 and continue solid growth through 2028." "Substrates account for a large portion of the revenue for the packaging materials market, and within the category, FC-BGA substrates make up the majority of the revenue growth," said Jan Vardaman, President of TechSearch International. "The CAGR for flip chip BGA/LGA revenue is expected to be 7.6% from 2023 to 2028. Other key growth areas include wafer-level packaging (WLP) dielectrics and flip chip underfill. The laminate substrates segment is expected to grow 7.3% annually in volume, while leadframes and bonding wire are also forecasted to recover, growing by 5.0% and 6.4%, respectively." The GSPMO 2024 report is designed to help companies capitalize on emerging trends, navigate supply chain challenges, and make informed decisions in sourcing high-performance materials. Features of the report include: Technology trends Regional market size and forecast Five-year market forecast to 2028 Market size by product segments in revenue and units Excel workbook file summarizing market information Supplier information and market share For more information on the report or to subscribe, visit SEMI Market Data or contact the SEMI Market Intelligence Team (MIT) at mktstats@semi.org. About SEMISEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members' business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more. Association Contacts Samer Bahou/SEMI CommunicationsPhone: 1.408.943.7870Email: sbahou@semi.org
TAIPEI, Aug. 30, 2024 /PRNewswire/ -- Kaynes SemiCon, a wholly owned subsidiary of Kaynes Technology, has signed a landmark memorandum of understanding (MoU) with Lightspeed Photonics, securing India's first paying customer for outsourced semiconductor assembly and test (OSAT) services, according to CEO Raghu Panicker. Raghu Panicker, CEO, Kaynes SemiCon. Credit: Kaynes SemiCon. According to the news report from the technology-focused media DIGITIMES Asia, the announcement was made during the inauguration of Kaynes Technology's new electronics manufacturing unit in Hyderabad, signifying a major leap forward for India's nascent semiconductor ecosystem. The collaboration will see Kaynes SemiCon provide advanced packaging solutions for Lightspeed Photonics. The MoU also highlights the high volume run at Kaynes Semicon. "This is the first paying OSAT customer in India," Panicker said, emphasizing the importance of the agreement. "We will initially carry out sample runs and low-volume production at our proto line in Mysore/Hyderabad, before scaling up to high-volume manufacturing once our new facility is fully operational." Lightspeed Photonics, a Singapore-based fabless system development company, specializes in integrating optical interconnects with processors to create modular compute-interconnect heterogeneous System-in-Packages (SiP) under its LightSiP brand. This technology aims to enhance server scalability by reducing data latency, footprint, and power consumption while significantly boosting data bandwidth and performance per watt. Strategic investments and advanced packaging The deal is particularly significant as it underscores India's entry into the high-value segment of semiconductor manufacturing—advanced packaging. With the global semiconductor industry increasingly focusing on advanced packaging technologies such as silicon photonics, Kaynes SemiCon's foray into this space positions the company as a key player in the global supply chain. Panicker also revealed that the company has already identified and aligned the necessary equipment for the project, with installation planned at the proto line in Mysore/Hyderabad and eventually at its upcoming facility. "We have engaged with our equipment suppliers and are set to consign the equipment at their facilities. This will allow us to start rolling out packages for Lightspeed Photonics within four to five months," he added. The company expects final approval from the Indian government for its OSAT services to come in soon, allowing it to proceed with its plans. "Approval may come in about a week's time," he stated, underscoring that preparations are already underway to meet the stringent requirements of advanced semiconductor packaging. Separate MoU for capacity building In addition to the MoU with Lightspeed Photonics, Kaynes SemiCon has also signed an agreement with the VLSI Society of India for capacity building. This initiative aims to develop a skilled workforce for India's semiconductor industry by partnering with educational institutions to provide training in semiconductor manufacturing. The implementation partner for this will be Perceptives Solutions. According to Satya Gupta, President of the VLSI Society, the intention is "to make India a world-class electronics and semiconductor product nation." Bhanupriya K, MD of Perceptives Solutions, also stressed the need to train the students in the area of semiconductor manufacturing processes. Through this MoU, Kaynes SemiCon will open up its OSAT facility for packaging free of cost to Education Institutes aligned with the VLSI Society of India. The dual MoUs reflect Kaynes SemiCon's initiatives to support the growth of India's semiconductor industry, focusing on technological advancement and workforce development. As the first company to secure a paying OSAT customer in India, Kaynes Semicon is positioned to contribute significantly to the future of semiconductor manufacturing in the region. India's semiconductor ambitions Kaynes SemiCon's dual MOUs come at a time when India is aggressively pursuing its ambitions to become a global semiconductor hub. With the government's push towards self-reliance in electronics and a US$10 billion incentive scheme to attract semiconductor manufacturing investments, the country is poised to play a larger role in the global semiconductor supply chain. India has granted approvals for three major semiconductor projects so far, including a wafer fabrication facility and an OSAT plant by Tata Group, as well as a separate OSAT facility by Murugappa Group's CG Power and Industrial Solutions. Meanwhile, reports suggest that CG Power has recently entered into agreements with Japan's Renesas, a leading semiconductor manufacturer, and Thailand's Stars Microelectronics, an OSAT provider, to establish an OSAT facility in India. The company plans to invest INR7,600 crore (US$1 billion) over the next five years in this venture.
SEMI, TECHCET and TechSearch International Highlight Diverse Growth Drivers in New Report MILPITAS, Calif., May 23, 2023 /PRNewswire/ -- Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the US$26.1 billion in revenue it logged in 2022, SEMI, TECHCET and TechSearch International announced today in their new Global Semiconductor Packaging Materials Outlook report. High-performance applications, 5G, artificial intelligence (AI) and the adoption of heterogeneous integration and system-in-package (SiP) technologies are increasing demand for advanced packaging solutions. The development of new materials and processes to enable chips with higher transistor density and greater reliability are also contributing to market growth. "The semiconductor packaging materials industry is undergoing significant changes as new technologies and applications are driving demand for more advanced and diverse materials," said Jan Vardaman, President and founder of TechSearch International. "Advances in dielectric materials and underfill are driving strong demand for fan-in and fan-out wafer level packaging (FOWLP), flip chip, and 2.5D/3D packaging. New substrate technologies such as silicon interposers and organic interposers using RDL (Re-Distribution Layer) are also key growth drivers of packaging solutions. At the same time, research on laminate substrates with finer features continues with the development of glass cores for build-up substrates." The Global Semiconductor Packaging Materials Outlook report provides a comprehensive analysis of the current and forecast market for semiconductor packaging materials, covering substrates, leadframes, bonding wires, encapsulation materials, underfill materials, die attach, wafer level package dielectrics, and wafer-level plating chemicals. Features of the report include: Technology trends Regional market size Five-year market forecast to 2027 Market size in revenue and units Excel workbook file summarizing market information Supplier market share Capacity and utilization trends The report is available for purchase from SEMI. About SEMISEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more. Association ContactMichael Hall/SEMIPhone: 1.408.943.7988Email: mhall@semi.org
SHENZHEN, China, March 12, 2025 /PRNewswire/ -- On March 12, MemoryS 2025 opened in Shenzhen, where Longsys(301308.SZ) unveild multiple new products. Chairman Hua-Bo Cai delivered a keynote speech, "Memory Business • Comprehensive Innovation," sharing insights into the company's innovations in memory business models and integrated service capabilities. In-house Memory Controllers, Performance Breakthroughs Longsys continues to expand its in-house memory controller lineup, launching UFS 4.1/3.1/2.2 and USB controllers in 2025 to enhance storage performance and competitiveness. The UFS 4.1, powered by the WM7400 controller, supports TLC and QLC NAND Flash, achieving sequential read speeds up to 4,350MB/s, optimizing AI terminal applications. The eMMC Ultra adopts an ultra-protocol design and integrates the in-house WM6000 controller, breaking through the performance limitations of eMMC 5.1. With overall performance approaching UFS 2.2 levels, it delivers a more cost-efficient storage solution for smart devices. Automotive Storage: Dual-Drive Strategy Longsys has built a comprehensive automotive-grade storage portfolio, including UFS, eMMC, LPDDR4x, and SPI NAND Flash, all meeting AEC-Q100 reliability standards. Through the Product Technology Manufacturing(PTM) business model, the company offers customized solutions and has established partnerships with 20+ automakers and 50+ Tier 1 suppliers. Enterprise Storage: AI-Optimized Solutions Longsys has introduced PCIe/SATA eSSDs, MRDIMMs, and RDIMMs, offering a one-stop AI-localized storage deployment solution. Its dedicated data center production line ensures high reliability and consistency for AI servers and high-performance computing applications. Global Expansion and Brand Development Longsys is accelerating its global footprint. The Zilia factory in Brazil is now operational, establishing localized storage manufacturing in the Americas. Meanwhile, its Lexar brand has expanded across 70+ countries, with the European and American markets contributing over 67% of sales, demonstrating strong growth. PTM Business Model: Reshaping the Memory Industry Longsys' PTM (Product Technology Manufacturing) business model provides a comprehensive storage foundry service, covering chip design, packaging, testing, and production. The model has been widely adopted in automotive, server, industrial, and consumer electronics. The Suzhou Longforce serves as the PTM testing and packaging hub, focusing on high-end semiconductor packaging and supporting Zilia's manufacturing. The open-source memory business model and comprehensive innovation services showcased at MemoryS 2025 reflect Longsys' strategic transformation into a branded semiconductor memory enterprise. Moving forward, Longsys will remain committed to the semiconductor storage sector, focusing on customer-driven innovation, business model upgrades, and accelerated commercialization of new products. Additionally, the company will continue to strengthen its brand presence and global expansion, driving new possibilities for the memory industry. About Longsys Founded in 1999, Longsys(301308.SZ) is a globally leading branded semiconductor memory enterprise, integrating R&D, design, packaging and testing, manufacturing, and sales services. Longsys upholds the corporate vision of "Everything for memory." With memory technology innovation at its core, Longsys provides high-end, flexible, and efficient full-stack customized services to global customers. For more information please visit https://www.longsys.com/, and follow Longsys on LinkedIn, Facebook and Twitter.
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