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Hsinchu, Taiwan, September 9, 2024 -SEMICON Taiwan officially opened on September 6, 2024, with ACE Solution and HON. PRECISION is joining forces to showcase its latest advancements in silicon photonics testing technology, precision measurement, and automated machinery integration. Their exhibition focused on high-density optoelectronic integration testing solutions designed to meet the increasing demands of silicon photonics for high-capacity and high-channel testing. The integrated optoelectronic signal testing system effectively addresses the challenges posed by increased data center traffic and high-speed transmission needs, significantly boosting transmission rates and reducing energy consumption. With semiconductor packaging evolving towards Co-Packaged Optics (CPO), ACE Solution highlighted its silicon photonics solutions developed through deep collaboration with Quantifi, integrating PXI testing modules to offer an efficient, multi-system testing solution supporting 800G and 1.6T high-speed transmission. These integrated solutions meet the research and production needs for high-speed, high-precision, and high-efficiency testing while offering programmable automation for flexible applications. ACE Solution also demonstrated its latest innovations in compound semiconductor testing. The Teradyne ETS-88 testing platform is widely used for SiC, GaN, PMIC, automotive electronics, aerospace, and defense industries. Key features include multi-site CP, second-contact KGD, dynamic/static power device FT, and fully automated high-output module FT. The ETS-364 and ETS-800 platforms are tailored for mixed-signal, digital, and analog testing, offering the industry's highest-spec power IC testing capabilities with support for up to 6000V and 4000A, making them ideal for high-current, high-voltage applications, particularly in EV power and battery management. The TZ-6000 non-destructive wafer and materials inspection system utilizes terahertz (THz) technology, focusing on compound semiconductor testing for GaAs, SiC, and GaN. It offers greater penetration depth and flexibility, handling various sizes and shapes of wafers. Equipped with advanced wafer probes and intelligent software analysis, it can simultaneously measure parameters such as thickness, refractive index, resistivity, dielectric constant, surface/subsurface defects, and full wafer scans, enabling non-destructive wafer quality measurements. The Electro-Optic Terahertz Pulse Reflectometer (EOTPR) is the world's first instrument to use isolation technology to detect IC package faults and monitor package quality, making it ideal for non-destructive defect detection in 3DIC package analysis. With 5-micron pinpoint precision, the EOTPR is widely used in advanced IC packaging fault analysis for devices such as stacked packages (PoP), flip-chip, and TSV in 3D packaging. Major semiconductor companies have extensively deployed EOTPR for advanced IC packaging quality assurance in manufacturing environments. Steve Hsu, President of ACE Solution, stated, "With over 20 years of experience in hardware-software integration, ACE Solution has expanded from wireless communication testing to various testing fields, meeting the needs of our local clients. We are thrilled to collaborate with HON. PRECISION to showcase our achievements in automation and precision testing." Alan Hsieh, President of HON. PRECISION commented, "This exhibition marks a new milestone in our partnership with ACE Solution. We look forward to offering more advanced solutions, fostering greater collaboration and innovation across the industry." For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Peter Lee, Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw Website: https://www.acesolution.com.tw/en/ About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to the specific requirements of our customers in the field of electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished team of technical experts who offer unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively.
台灣新竹，2024年09月09日，SEMICON 國際半導體展盛大開幕，筑波科技 (ACE Solution) 與鴻勁精密 (Hon. Precision) 攜手參展，展示光電整合矽光子測試技術、精密量測及自動化機台的整合，著重高密度與光電結合測試方案，專為應對高容量與高通道的矽光電子測試需求，提供高度集成的光電信號一體化測試系統，有效應對高速傳輸和數據中心流量增加的挑戰，顯著提升傳輸速率並降低能耗。精密半導體封裝已邁向 CPO (Co-Packaged Optics) 發展，筑波科技此次展示的矽光子解決方案來自與 Quantifi 的深度合作，整合 PXI 測試模組提供高效整合的多機一體測試方案，支援 800G 和 1.6T 的高速傳輸。在光通訊與高速訊號介面傳輸的整合中，滿足研發與生產部門對高速率、高精度、高效率的測試需求，也具備靈活的可程式自動化規劃功能。 筑波科技還展示其在化合物半導體測試最新成果。Teradyne ETS-88 測試方案廣泛應用於 SiC、GaN、PMIC、車用電子、航空航天和國防工業等。該方案具備多工位 CP、二次接觸 KGD、動/靜一體功率器件 FT 和全自動高產出模組 FT 四大特色。ETS-364 和 ETS-800 則專門用於混合信號、數位和類比測試，提供業界最高規格功率 IC 測試平台可支持達 6000V 和 4000A 測試，能應對高電流、高電壓需求，尤其在電動車電源和電池管理等應用中具有優越性能。 TZ-6000 非破壞性晶圓和材料檢測系統利用太赫茲 (Terahertz, THz) 技術，專注於砷化鎵、碳化矽和氮化鎵等化合物半導體測試，提供更高穿透深度。具備高度靈活性，適用各種尺寸和形狀的晶圓，並配備獨有多元晶圓探頭及智能軟體分析功能，能同時測量多個參數，如厚度、折射率、電阻率、介電常數、表面/次表面缺陷及整個晶圓掃描，實現非破壞性晶圓品質測量。 電光太赫茲脈衝反射儀 (EOTPR) 是全球首款使用隔離技術檢測積體電路封裝故障和監測封裝品質的設備，特別適用於 3DIC 積體電路封裝的非破壞性缺陷檢測。該儀器提供 5 微米的定位精度，適合用於手機和電腦應用中複雜且先進積體電路芯片的故障分析，包括堆疊式封裝層迭 (PoP)、覆晶 (Flip-Chip) 和 3D 封裝中的矽通孔 (TSV) 等封裝形式。EOTPR 已在各大半導體公司的先進 IC 封裝故障分析領域得到廣泛應用，在品質保證與檢驗的製造環境大量部署。 筑波科技董事長許深福表示：「筑波科技擁有 20 年的軟硬體整合經驗，從無線通訊測試基礎延伸至各個測試領域，致力於滿足本地客戶的需求。我們非常高興能與鴻勁精密合作，共同展示我們的機構自動化與精密測試的協同技術成果。」鴻勁精密董事長謝旼達表示：「此次展會標誌著鴻勁與筑波科技合作的新里程碑。我們期待未來能夠提供更多先進解決方案，促進行業間的交流與合作。」未來筑波科技將與鴻勁精密持續攜手推動創新，為客戶提供卓越方案。 請追蹤筑波集團LinkedIn，掌握最新消息！ 聯絡筑波科技 筑波科技股份有限公司ACE Solution, Co., Ltd. 地址：新竹縣竹北市台元街28號2樓之1 電話：03-5500909 電子郵件：service@acesolution.com.tw 網站：https://www.acesolution.com.tw/en/index/ 關於筑波科技（ACE Solution） 筑波科技（https://www.acesolution.com.tw/en/index/）成立於2000年，位於台灣新竹，在中國蘇州和深圳以及越南設有分公司，可提供服務。我們的使命是提供訂製的測試解決方案，以滿足電氣元件、設備和系統製造商的客戶需求，通過合作夥伴提供技術解決方案。我們專注於射頻、毫米波和太赫茲領域，擁有專業的技術支援團隊，提供專業、創新和多功能的綜合技術和解決方案。
RICHMOND, British Columbia, Aug. 20, 2024 (GLOBE NEWSWIRE) -- Teledyne FLIR IIS, a Teledyne Technologies [NYSE:TDY] company, is pleased to introduce the Forge®️ 1GigE SWIR (Short Wave Infrared) 1.3 MP camera. The first camera in the Forge 1GigE SWIR series is equipped with a wide-band and high-sensitivity Sony®️ SenSWIR™️ 1.3 MP IMX990 InGaAs sensor. The advanced sensor captures images across both visible light and SWIR light spectrums (VisSWIR) with 5μm pixels, providing an extended spectral range from 400nm to 1700nm. This capability enhances anomaly detection and material analysis, making it ideal for applications such as industrial semiconductor inspection, food and beverage quality control, recycling, security surveillance, environmental monitoring, precision farming, and more. “We’re excited to introduce the Forge SWIR camera series to grow our imaging portfolio from the visible spectrum to SWIR wavelengths,” said Sadiq Panjwani, General Manager at Teledyne IIS. “The series expands on Teledyne’s SWIR line scan expertise to boost a range of 2D area scan applications such as industrial inspection, environmental monitoring, and recycling.” The new camera features a design measuring 40mm x 40mm x 43mm that balances a compact size with superior image quality. Forge 1GigE SWIR includes advanced camera features such as Pixel Correction, Sequencer with ROI (Region of Interest), Logic Block, and Counter which provide reliable and precise control for variety of complex applications. All IIS cameras are supported by Teledyne software development kits (SDK) Spinnaker® 4 and Sapera™ Processing and a powerful Trigger-to-Image Reliability (T2IR) framework. T2IR is a set of programmable functions within the Teledyne SDK that combine hardware and software features that work together at a system level to help improve the reliability and accuracy of inspection systems. For more information about the new Forge 1GigE SWIR camera model, visit the website. See live demonstrations of Forge 1GigE SWIR at this upcoming event: VISION, October 8-10, 2024 | Booth 8B10 | Messe Stuttgart | Stuttgart, Germany About Teledyne FLIR IISTeledyne FLIR IIS (Integrated Imaging Solutions), a Teledyne Technologies company, designs, develops, manufactures, markets, and distributes industrial-grade technologies that enhance productivity and development. The company provides innovative sensing solutions through machine vision, spherical imaging, and stereo-imaging technologies. Teledyne FLIR IIS offers a diversified portfolio that serves a wide variety of applications in industrial, medical, geospatial, and advanced robotics markets. For more information, visit the homepage. Media Contact:Farhad Kazifarhad.kazi@teledyne.com A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/ad874232-36d5-4827-8025-62043f44fcfa
ACE Solution will participate in SEMICON Taiwan 2024 from September 4th to 6th Location: TaiNEX Hall 1 Booth: K3076 @HON. PRECISION We will showcase the latest achievements in semiconductors and silicon photonics during the exhibition. ACE Solution will introduce the following solutions: 👉 Teradyne ETS Compound Semiconductor Testing: The industry’s highest-spec power IC testing platform accommodates a wide range of IC types, with testing capabilities reaching 6000V and 4000A. This platform addresses the challenges of high-current and high-voltage testing, particularly in electric vehicle power and battery management applications. 👉 TZ-6000 Non-Destructive Wafer and Material Inspection: Utilizing Terahertz (THz) technology, this solution offers superior penetration depth compared to silicon, silicon carbide, and gallium nitride for semiconductor wafers. It provides non-destructive measurements of wafer quality, including thickness, refractive index, resistivity, dielectric constant, surface/subsurface defects at selected locations, and full-wafer scanning. 👉 EOTPR Non-Destructive Testing for 3DIC Advanced Packaging: The Electro-Optical Terahertz Pulse Reflectometry (EOTPR) system delivers 5-micron accuracy for fault analysis in complex and advanced IC packaging, such as Package-on-Package (PoP), Flip-Chip, and Through-Silicon Via (TSV) in 3D packaging. EOTPR is widely adopted in advanced IC packaging fault analysis and is extensively deployed in quality assurance and inspection within manufacturing environments. 👉 Photonic Integrated Silicon Photonics Testing: In collaboration with Hon Precision, ACE Solution offers a highly integrated electro-optical signal testing system architecture. This solution supports high-capacity, high-channel testing to meet the demands of high-speed data transmission and increased data center traffic. Integrating photonics and electronics significantly enhances transmission rates while reducing power consumption, leading to improved testing efficiency. We will also be organizing booth tours during the exhibition. Due to limited availability, spots will be arranged based on actual conditions, so please register early：https://docs.google.com/forms/d/e/1FAIpQLSe5vtgle1wl4dIxliik12YMNnObdqAFD7DwdBYVIxaxMWqlxQ/viewform?fbzx=-6591255857878872603 We welcome partners from all sectors to visit and discuss technical and business cooperation. 📢 Follow ACE Group LinkedIn, to stay updated with the news! For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Peter Lee, Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw Website: https://www.acesolution.com.tw/en/ About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to our customers' specific requirements in electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished technical expert team offering unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge, integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively.
筑波科技將於2024年9月4日至9月6日參加SEMICON Taiwan 2024。 展會地點：台北南港展覽館一館 攤位：K3076 @鴻勁精密 展覽期間，筑波科技將展示我們在半導體及矽光子領域的最新成果，並介紹以下先進方案： 👉 Teradyne ETS 化合物半導體測試：為業界最高規格之功率IC測試平台，廣納不同IC類型，最高測試可以達到6000V、4000A，可解決因應高電流、高電壓測試需求的挑戰，特別是在電動車的電源、電池管理等應用。 👉 TZ-6000 非破壞性晶圓和材料檢測：太赫茲 (THz) 技術針對半導體晶圓能比矽、碳化矽和氮化鎵有更高的穿透深度。針對厚度、折射率、電阻率、介電常數、選定位置表面/次表面缺陷和整個晶圓掃描達成非破壞性晶圓品質測量。 👉 EOTPR 3DIC高階封裝非破壞性檢測：電光太赫茲脈衝反射儀 (EOTPR) 提供 5 微米的定位精准度以解決在手機和電腦應用中複雜且先進積體電路晶片封裝的故障分析，其應用的封裝形式如堆疊式封裝層迭 (PoP)、覆晶(Flip-Chip)和 3D 封裝中的矽通孔 (TSV)。目前 EOTPR已經廣泛的被先進 IC 封裝故障分析業界所使用，並且這項技術已在品質保證與檢驗的製造環境中大量部署。 👉 光電整合矽光子測試：筑波科技與鴻勁精密合作，提供光電整合，提供集成度高，混合的光電信號一體化的測試系統架構技術。滿足高容量、高通道的測試，滿足產品在高速傳輸需求及數據中心流量提升之需求。光電結合，極大提升傳輸速率和降低能號達到測試效率。 我們將安排Booth Tour，名額有限，將依實際狀況安排，請及早報名：https://docs.google.com/forms/d/e/1FAIpQLSe5vtgle1wl4dIxliik12YMNnObdqAFD7DwdBYVIxaxMWqlxQ/viewform?fbzx=-6591255857878872603 歡迎各界夥伴蒞臨攤位，與我們討論技術及商業合作。 📢 請追蹤筑波集團LinkedIn，掌握最新消息！ 聯絡筑波科技 筑波科技股份有限公司ACE Solution, Co., Ltd. 地址：新竹縣竹北市台元街28號2樓之1 電話：03-5500909 電子郵件：service@acesolution.com.tw 網站：https://www.acesolution.com.tw/en/index/ 關於筑波科技（ACE Solution） 筑波科技（https://www.acesolution.com.tw/en/index/）成立於2000年，位於台灣新竹，在中國蘇州和深圳以及越南設有分公司，可提供服務。我們的使命是提供訂製的測試解決方案，以滿足電氣元件、設備和系統製造商的客戶需求，通過合作夥伴提供技術解決方案。我們專注於射頻、毫米波和太赫茲領域，擁有專業的技術支援團隊，提供專業、創新和多功能的綜合技術和解決方案。
ANYANG-SI, South Korea, July 5, 2024 /PRNewswire/ -- Leading South Korean camera manufacturer Vieworks is to exhibit at Vision China Shanghai 2024 from July 8th to 10th (Booth E1.1600). Vieworks will be showcasing industrial cameras, industrial lenses, machine vision accessories, and X-ray flat panel detectors. VEO Focus Autofocus System Renowned for their ultra high resolution cameras, Vieworks will introduce VP-288MX2, thermoelectric Pelter cooled area scan camera with a remarkable 288 megapixel resolution. Vieworks' area scan cameras are suitable for demanding applications including flat panel inspection, printed circuit board inspection, and semiconductor inspection. Vieworks will also showcase VTS Series, the latest addition to their TDI (time delayed integration) line scan camera lineup. Equipped with BSI (back-side illuminated) sensors, VTS Series cameras offer enhanced quantum efficiency (QE) and signal-to-noise ratio (SNR). BSI sensors allow for greater sensitivity and ensure superior image quality in visible, UV, and NIR imaging, making VTS Series cameras particularly suitable for low-light environments. Vieworks' TDI line scan cameras—VT Series, VTS Series, and VTC Series—are available in M42, M58, M72, and M95 mounts from 2k to 23k resolution. Along with industrial cameras, VEO Series lenses will be displayed at the booth. VEO Series is a family of industrial lenses codeveloped with Schneider Kreuznach, precisely optimized for Vieworks' cameras. A live demo of VEO 10.0x lens with Vieworks camera and autofocus module will be operated. Industrial X-ray flat panel detectors will also be showcased. Vieworks will introduce their latest innovation in industrial X-ray imaging—bendable detectors. Unlike flat panel detectors, bendable detectors allow for non-destructive inspection of pipes and other objects that require flexibility. Diverse demonstrations on Vieworks' cameras and lenses will be showcased at the booth. Demos include display panel inspection with ultra high resolution 288 megapixel camera and printed circuit board inspection using 9k TDI line scan camera with HDR (high dynamic range) function. For TDI line scan, there will be a demonstration on how Vieworks' backside-illuminated VTS Series compares with frontside-illuminated TDI line scan. About Vieworks Co., Ltd. With industry-leading technology, Vieworks provides machine vision solutions encompassing industrial cameras, industrial lenses, and accessories. As your vision partner, Vieworks offers innovative vision and insight for your vision system. For more information, please visit vision.vieworks.com
A12 藝術空間
semiconductor inspection
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