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June 23, 2025 – Hsinchu, Taiwan – ACE Systemtek has partnered with TeraView to introduce the battery testing solution, BTS TeraCota 3500, a cutting-edge solution that redefines battery cell inspection by offering smarter, safer, and more efficient quality control. As global demand for electric vehicles (EVs) and energy storage systems continues to rise, so do the expectations for battery performance and safety. Mr. Yong Seok (YS) Chang, Vice President of Sales for Asia at TeraView, highlighted the increasing importance of advanced inspection technologies in ensuring battery reliability. "Taiwan's deep technological expertise and collaborative culture create an environment ripe for innovation in the battery sector," said YS Chang. Discussing key production processes such as coating, drying, and calendaring, YS Chang emphasized the critical role of precision. "Porosity and density in electrodes directly affect battery performance and safety parameters that must be tightly controlled, so next-generation inspection technologies are essential." Traditional inspection techniques—including X-ray, beta/gamma radiation, infrared laser triangulation, and ultrasound—often face limitations in identifying internal defects, structural inconsistencies, or metallic impurities. "These methods can require physical contact, pose radiation risks, and need frequent recalibration," YS Chang added. In contrast, the battery testing solution BTS TeraCota 3500 leveraged TeraView’s terahertz (THz) waves to deliver non-destructive, contactless inspection of electrode sheets. "Our system can measure coating thickness, basis weight, density, and conductivity using reflected THz signals—without ionizing radiation or physical contact, and with minimal calibration," YS Chang explained. "This translates into higher accuracy, improved safety, and seamless integration into modern manufacturing lines." YS Chang believes terahertz inspection is becoming indispensable for battery manufacturers striving to remain competitive. "As battery designs become more complex, detecting micro-defects and compositional anomalies that traditional methods might miss is crucial. Terahertz technology offers that critical level of visibility." He also shared successful case studies where the battery testing solution BTS TeraCota 3500 significantly improved product quality and reduced defect rates. "Customer feedback has been overwhelmingly positive, with some clients reporting higher yields and fewer downstream quality issues," said YS Chang. As Taiwan's battery manufacturing sector continues to evolve, the partnership between ACE Systemtek and TeraView is poised to accelerate the adoption of next-generation inspection solutions. "ACE is an ideal partner, with strong market insight and robust technical service capabilities in Taiwan," Chang remarked. "Their understanding of local customer needs will help fast-track the implementation of the BTS TeraCota 3500 across the island." With this strategic collaboration, ACE Systemtek and TeraView are well-positioned to lead the next wave of battery manufacturing innovation. Both companies believe terahertz-based inspection technology will provide a significant competitive advantage. Contact ACE Systemtek ACE Systemtek Co., Ltd Address: 2F-2 No.28 Taiyuan St. Jhubei City HsinChu County 30288 Taiwan Phone: +886-3-5500909 #3407 mail: pr@acesolution.com.tw Website: https://www.acesystek.com/web/index/index.jsp About ACE Systemtek Co., Ltd ACE Systemtek Co., Ltd. (formerly ACE Rentek Co., Ltd.) has rebranded better to reflect our core expertise in system integration solutions while maintaining our business scope, contact details, and location. Our company offers complete integration solutions across wireless and mobile communication, semiconductors, high-speed digital transmission, and optical communication. Services range from hardware instruments, customized jigs, and accessories to isolation boxes, intelligent automation tools (robotic arms, AGVs), and custom automation software for production testing. Committed to quality system integration and flexible service, we provide leasing and purchasing options, including short- and long-term leases and installment payments, to help clients optimize equipment utilization while reducing costs and risks. According to client needs, we deliver equipment and integration services from top brands, including Anritsu, Advantest, Keysight, R&S, and Tektronix, ensuring optimal testing solutions. With branches in Suzhou, Shenzhen, and Hanoi, our regional presence enables rapid local service and support. Leasing services in Taiwan and swift equipment delivery across China and Vietnam ensure efficient service. As technology advances, ACE Systemtek remains a trusted partner in system integration. About Terahertz Terahertz light lies between infra-red and microwaves, and as such has unique properties which enables it to pass through objects and to transmit images and compositional (spectroscopic) information that is ordinarily hidden. Terahertz is non-destructive, safe and fast, making it the ideal inspection and imaging modality for many applications across a range of industries. TeraView has demonstrated the potential of terahertz technology in a number of applications including the detection of faults and quality issues in semiconductors, monitoring the quality of pharmaceutical drugs and high value coatings used in automotive, aerospace and other industries. About TeraView TeraView (https://teraview.com/) is the world’s first and leading company solely focused on the application of terahertz light to provide solutions to customer issues. A spin out from the Toshiba Corporation and Cambridge University, TeraView has developed its proprietary technology across a number of markets. These include fault analysis and quality assurance for semiconductor chips used in mobile computing and communications, as well as non-destructive inspection of high value coatings used in the automotive, pharmaceutical, food and solar industries. With the largest number of systems in the field, as well as applications know-how made available to customers via a team of dedicated engineers using intellectual property and knowledge in peer-reviewed scientific publications, TeraView is uniquely placed to deliver the business benefits of terahertz to customers. Headquartered in Cambridge UK and with an office in Seoul, Korea, sales and customer support are available in Korea as well as throughout the Far East, North America and Europe either directly or through a network of distributors.
HSINCHU, June 17, 2025 /PRNewswire/ -- Professional semiconductor equipment provider Spirox Corporation (TWSE: 3055) has introduced the industry-first SpiroxLTS (Spirox Laser Tomography Scanning) technology. Leveraging a combination of multiple patented nonlinear optical integration technologies, this innovative solution enables non-destructive, contact-free, damage-free direct imaging of laser-modified cross-sections within through glass vias (TGV). SpiroxLTS delivers precise insights into laser modification effectiveness, fully visualizing the continuity and uniformity of modifications within the glass, ensuring that process quality meets stringent design requirements. This breakthrough brings a revolutionary advancement in process parameter control for TGV fabrication and will help TGV manufacturers accelerate their mass production timelines. Spirox SP8000G features the industry’s first Spirox Laser Tomography Scanning (SpiroxLTS) technology, enabling non-destructive and precise analysis of TGV laser modification performance. With the rapid advancement of high-performance computing (HPC), high-frequency communications, AI accelerators, and high-performance servers, TGV technology has emerged as a key process in advanced packaging. TGV offers low dielectric constant, superior thermal stability, and high-density I/O integration, making it an ideal solution for glass core substrates and 2.5D/3D interposer architectures used in cutting-edge packaging. Industry demand for TGV continues to surge, and its growth potential is immense. However, laser modification quality during the front-end processes of TGV has long been difficult to monitor in real time, presenting a major challenge for yield optimization and cost control, especially when transitioning to different types of glass. Derek Chiang, President of Hi-Nano Optoelectronics, a leading TGV laser modification equipment provider, commented that "We highly appreciate and recognize Spirox's industry-first SP8000G laser tomography scan system. It allows us to directly visualize the true distribution of laser modifications inside glass substrates without any destruction. This capability greatly enhances our ability to improve both the performance and quality of our laser modification equipment." Hi-Nano Optoelectronics, as a long-time leader in TGV laser process materials and technology development, highly values the SpiroxLTS technology. They believe it will lay the foundation for data-driven and visualized laser processing, providing a precise platform for both materials R&D and process tuning. The complementary strengths of Hi-Nano Optoelectronics and Spirox demonstrate strong potential for integrated development and mass production applications. SpiroxLTS technology enables visualization of laser-modified layers within glass, a critical capability for advancing the development of high-quality glass core products. While manufacturers relied on destructive inspection methods to indirectly assess laser modification quality during materials development and process optimization, the ability to now obtain direct, non-destructive data significantly shortens development cycles and enhances control over modification uniformity. Ingentec Corporation, one of the few suppliers offering high-quality TGV glass core substrates designed to meet AI application requirements, stated "The ability to visualize laser-modified layers within the glass highlights the superior attributes of Ingentec's glass drilling processes, including roundness, alignment, and sidewall roughness. We are confident that this advancement will contribute to higher production yields and accelerate the mass production of glass core products." According to several leading manufacturers in metallization and build-up processes for TGV packaging substrates, these back-end processes place extremely high demands on via structure and laser modification quality. In the past, the lack of accessible inspection data often created challenges during later phases of production. Validated through practical testing, SpiroxLTS provides a non-destructive inspection that allows manufacturers to implement quality screening as early as the materials verification and process validation phases. This advancement is seen as critical to enabling the stable mass production of TGV substrates used in advanced packaging. Paul Yang, CEO of Spirox, stated that "We are honored that the SP8000G has successfully addressed the long-standing challenge of visualizing TGV laser modifications, and that it has been jointly recognized by leading industry players, including Hi-Nano Optoelectronics, a key laser modification equipment provider; Ingentec Corporation, a Glass Core manufacturer; and Unimicron, a leader in TGV glass substrate technology. In addition to laser modification inspection, SP8000G also enables non-destructive, high-precision inspection of TGV via waist profile, via sidewall roughness, and glass cracking on Cu-plated via walls—capabilities that are currently challenging to achieve with existing TGV inspection solutions. We believe that our SpiroxLTS technology will significantly accelerate the TGV industry's path toward high-volume manufacturing." Paul Yang further stated that SpiroxLTS is already being adopted in high-frequency, high-speed packaging applications, such as glass core and interposer structures. The technology is now applied in materials evaluation, process ramp-up, and mass production monitoring, positioning itself as a key enabler for driving TGV process scalability. About Spirox Spirox (TWSE: 3055) is a leading brand in testing, packaging, inspection, and verification across the Greater China region, providing comprehensive solutions to the semiconductor and electronics manufacturing industries. Our portfolio spans both distribution and own products, covering a wide range of fields including packaging & testing, optical inspection, laser processing, and materials analysis. Spirox is committed to delivering cutting-edge technologies and high value-added services to its customers. Founded in 1987 and headquartered in Hsinchu, Taiwan, Spirox operates additional offices and service centers in Shanghai, Suzhou, Shenzhen. For more information, please visit www.spirox.com. About Hi-Nano Optoelectronics Hi-Nano Optoelectronics Co., Ltd. specializes in the development of laser precision micromachining technologies and equipment. The company is highly skilled in processing hard and brittle materials commonly used in the semiconductor and optoelectronics industries, including silicon, silicon carbide, silicon nitride, ceramics, zirconia, optical glass, sapphire, diamond, and specialty metals. Hi-Nano provides micron-level precision cutting, micro-hole drilling, and microstructure fabrication solutions. Its services support a wide range of industries, including semiconductors, optoelectronics, AR/VR, automotive, and medical sectors. In addition to serving Taiwan province's hi-tech industry, Hi-Nano's laser systems are also supplied to leading international companies in the U.S., U.K., Japan, and other countries. Hi-Nano also offers contract manufacturing and custom technology development services. For more information, please visit www.hinanomms.com. About Ingentec Corporation Ingentec Corporation is one of the few companies in Taiwan that possesses core technologies for laser modification of high-thickness glass substrates. Ingentec focuses on the development and mass production of glass core products. Ingentec has pioneered its proprietary LADY (Laser Arrow Decomposition Yield) process, which integrates laser modification, etching, and post-cleaning of thick glass substrates. This process enables high-precision glass drilling with roundness, alignment, smooth and uniform sidewalls, and supports high-density via designs. It also allows for customized modification structures and via geometries based on application requirements. Ingentec plays a key midstream role in the TGV manufacturing ecosystem, providing the supply chain with stable and high-quality glass materials and process support to help customers accelerate the adoption of advanced packaging technologies. For more information, please visit www.ingenteccorp.com. About Unimicron Unimicron, one of Taiwan's first adopters of Through Glass Via (TGV) substrate technology, has been actively developing this capability for over a decade. In the initial phase, Unimicron utilized Japanese and Korean glass suppliers to perform laser modification and via drilling. Its own TGV production lines are expected to reach maturity in the second half of 2025, at which point Unimicron will integrate TGV processing with its existing ABF substrate manufacturing capabilities. Unimicron aims to achieve vertically integrated mass production starting in 2028, laying a critical foundation for the future of advanced packaging development. For more information, please visit www.unimicron.com. Spirox SP8000G enables observation of the modified beam profile and inspection of uniformity across vertical depth variations prior to etching Spirox SP8000G provides morphology and dimensional inspection after etching
Hsinchu, Taiwan – May 6, 2025 —Compound semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN) are core technologies in automotive semiconductors and power management ICs. These materials are widely applied in electric vehicles, energy storage systems, data centers, 5G, and aerospace, driving a comprehensive upgrade in high-temperature, high-voltage, high-current, high-speed, and high-frequency testing, packaging, and process automation technologies. In collaboration with global automated test leader Teradyne and National Yang-Ming Chiao Tung University, ACE Solution hosted the "Compound Semiconductor Testing Technology and Automation Forum" on April 30. The event brought together experts from industry, academia, and research institutions to explore application trends, testing fixtures, and automation solutions. In his opening remarks, Tony Hsu, Vice President of Marketing at ACE Solution, emphasized the strategic importance of power systems in next-generation technologies: " As electric vehicles (EVs), 5G communications, high-performance computing (HPC), and AI servers continue to develop rapidly, the ability to deliver stable and high-performance power—along with advancements in power buffering, power delivery systems, and battery management—has become a critical challenge for industrial transformation. In response to global shifts and industry needs, ACE Solution remains committed to deepening its expertise in testing and automation. We look forward to working with experts across diverse sectors to drive innovation and accelerate the industry's upgrade." The forum featured a distinguished lineup of speakers who shared insights into the full technology chain, from semiconductor testing to smart manufacturing. Dr. Hsiao Yi-Kai, Team Leader at Foxconn, delivered a presentation titled "SiC in the AI Era: Intelligent Design Accelerates Power Technology Innovation," providing an in-depth look at key silicon carbide (SiC) applications in the AI-driven age. Jason Hsieh, Sales Manager at ACE Solution, shared his perspective on "Compound Semiconductor Trends & High-Power Testing Innovations," highlighting how evolving device architectures shape testing demands. Dr. Harry Kuan, R&D Manager at ACE Solution, addressed "Compound Semiconductor Wafer Testing and Advanced 3D Package Failure Analysis," showcasing advanced diagnostic techniques for next-generation packaging. Edward Weng, Product Marketing Manager at Onsemi, presented a case study on applying DrWBG technology in AI servers, illustrating how compound semiconductors reshape computing infrastructure. Kenny Wang, Business Development Manager at Teradyne Robotics, concluded the event with his talk "Building a Stable, Unmanned Delivery Network with MiR," outlining how robotics and automation are paving the way for smart semiconductor manufacturing. In addition to the insightful presentations, the event also featured three major technology showcases: High-Power Analog and Mixed-Signal Testing Solutions, Wafer Materials, and 3DIC Non-Destructive Testing, and Semiconductor Collaborative Robots Automation, all of which received enthusiastic responses from attendees. ACE Solution has partnered with Teradyne to jointly develop the ETS testing solution to address the challenges of precise testing for high-power components, 3DIC packaging inspection, and improving production efficiency. This collaboration successfully overcomes the limitations of high-power analog and mixed-signal testing. In addition, ACE Solution utilizes terahertz technology for non-destructive inspection of wafer materials and 3DIC packaging, offering a comprehensive suite of capabilities ranging from materials analysis (MA) and failure analysis (FA) to automotive semiconductor validation. For smart manufacturing, ACE Solution also provides automated solutions using UR/MiR collaborative robots, enabling industry partners to transition from R&D to mass production seamlessly. These innovations significantly enhance process efficiency and accuracy while reducing labor demands and overall costs. ACE Solution remains committed to deepening collaborations with strategic partners across the compound semiconductor value chain, joining academia, industry, and government forces to build a globally integrated ecosystem. For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3407 E-mail: pr@acesolution.com.tw Website: https://www.acesolution.com.tw/en/ About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to the specific requirements of our customers in the field of electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished team of technical experts who offer unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively.
Enabling automated, non-destructive inspection ensures consistent quality and maximizes value TOKYO, April 10, 2025 /PRNewswire/ -- Fujitsu Limited and Sonofai Inc., Ishida Tec Co., Ltd., and Tokai University today announced the launch of an automated inspection device that determines the fat content of frozen albacore tuna in a non-destructive manner. The device, which deploys Fujitsu's AI technology, is being launched by Sonofai Inc., a Japanese startup dedicated to preserving artisanal techniques through digital innovation. Ishida Tec Co., Ltd., a manufacturer of food processing equipment, and Tokai University, which is driving innovation in the food processing industry also contributed to the collaboration. Sonofai will launch the newly developed inspection device SONOFAI T-01 in June 2025, initially targeting the seafood processing industry and fisheries cooperatives in Japan, before expanding globally. This effort comes against the backdrop of a sustained increase in demand for high-quality tuna around the world, with the Japan Fisheries Research and Education Agency noting a 25% rise in the last 20 years. The SONOFAI T-01 leverages Fujitsu's ultrasound analysis AI technology, a core engine of the Fujitsu Kozuchi AI service, and is the first device of its kind that can determine the fat content of frozen tuna in a non-destructive manner. This enables automated, highly accurate fat content assessment without the need for human visual inspection. Conventional methods of assessment rely on skilled workers visually inspecting thawed cross-sections of the tail, which is a labor-intensive, time-consuming process, and prone to inconsistencies due to variations in individual judgment and a shortage of skilled personnel. The device allows for a complete inspection of the tuna in 12 seconds and can be operated by one person, offering potential labor and operational efficiency savings of up to 80%. By enabling rapid screening of large quantities of frozen tuna, the device reduces the burden on skilled workers, significantly improves the efficiency of the selection process, and contributes to reducing costs and addressing labor shortages. It also allows for greater accuracy and reduces the opportunity cost of mislabeling the high-value, fatty "bintoro" portions of the fish. For full release click here
A12 藝術空間
non-destructive inspection
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