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Hsinchu, Taiwan – May 6, 2025 —Compound semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN) are core technologies in automotive semiconductors and power management ICs. These materials are widely applied in electric vehicles, energy storage systems, data centers, 5G, and aerospace, driving a comprehensive upgrade in high-temperature, high-voltage, high-current, high-speed, and high-frequency testing, packaging, and process automation technologies. In collaboration with global automated test leader Teradyne and National Yang-Ming Chiao Tung University, ACE Solution hosted the "Compound Semiconductor Testing Technology and Automation Forum" on April 30. The event brought together experts from industry, academia, and research institutions to explore application trends, testing fixtures, and automation solutions. In his opening remarks, Tony Hsu, Vice President of Marketing at ACE Solution, emphasized the strategic importance of power systems in next-generation technologies: " As electric vehicles (EVs), 5G communications, high-performance computing (HPC), and AI servers continue to develop rapidly, the ability to deliver stable and high-performance power—along with advancements in power buffering, power delivery systems, and battery management—has become a critical challenge for industrial transformation. In response to global shifts and industry needs, ACE Solution remains committed to deepening its expertise in testing and automation. We look forward to working with experts across diverse sectors to drive innovation and accelerate the industry's upgrade." The forum featured a distinguished lineup of speakers who shared insights into the full technology chain, from semiconductor testing to smart manufacturing. Dr. Hsiao Yi-Kai, Team Leader at Foxconn, delivered a presentation titled "SiC in the AI Era: Intelligent Design Accelerates Power Technology Innovation," providing an in-depth look at key silicon carbide (SiC) applications in the AI-driven age. Jason Hsieh, Sales Manager at ACE Solution, shared his perspective on "Compound Semiconductor Trends & High-Power Testing Innovations," highlighting how evolving device architectures shape testing demands. Dr. Harry Kuan, R&D Manager at ACE Solution, addressed "Compound Semiconductor Wafer Testing and Advanced 3D Package Failure Analysis," showcasing advanced diagnostic techniques for next-generation packaging. Edward Weng, Product Marketing Manager at Onsemi, presented a case study on applying DrWBG technology in AI servers, illustrating how compound semiconductors reshape computing infrastructure. Kenny Wang, Business Development Manager at Teradyne Robotics, concluded the event with his talk "Building a Stable, Unmanned Delivery Network with MiR," outlining how robotics and automation are paving the way for smart semiconductor manufacturing. In addition to the insightful presentations, the event also featured three major technology showcases: High-Power Analog and Mixed-Signal Testing Solutions, Wafer Materials, and 3DIC Non-Destructive Testing, and Semiconductor Collaborative Robots Automation, all of which received enthusiastic responses from attendees. ACE Solution has partnered with Teradyne to jointly develop the ETS testing solution to address the challenges of precise testing for high-power components, 3DIC packaging inspection, and improving production efficiency. This collaboration successfully overcomes the limitations of high-power analog and mixed-signal testing. In addition, ACE Solution utilizes terahertz technology for non-destructive inspection of wafer materials and 3DIC packaging, offering a comprehensive suite of capabilities ranging from materials analysis (MA) and failure analysis (FA) to automotive semiconductor validation. For smart manufacturing, ACE Solution also provides automated solutions using UR/MiR collaborative robots, enabling industry partners to transition from R&D to mass production seamlessly. These innovations significantly enhance process efficiency and accuracy while reducing labor demands and overall costs. ACE Solution remains committed to deepening collaborations with strategic partners across the compound semiconductor value chain, joining academia, industry, and government forces to build a globally integrated ecosystem. For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3407 E-mail: pr@acesolution.com.tw Website: https://www.acesolution.com.tw/en/ About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to the specific requirements of our customers in the field of electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished team of technical experts who offer unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively.
在電動車與新能源市場需求下，化合物半導體材料如碳化矽 (SiC) 和氮化鎵 (GaN) 具高頻率、耐高壓、優異的散熱性能和高效能轉換，成為車用半導體及電源管理IC的關鍵技術。在晶圓製造、檢測分析如材料分析 (MA)、故障分析 (FA) 及車用半導體測試，有效掌握從研發到量產的製程。 面對高效能運算和AI趨勢，矽光子和先進封裝技術，包括3DIC及矽光子技術，顯著提升頻寬互連能力。矽光子在高速通信和資料傳輸中展現出替代傳統電子元件的潛力，帶來高效能、低耗能的資料處理，提高系統整合密度和效率。特別是在AI、電動車（EV）及高速通信，矽光子和化合物半導體技術結合自動化為提升性能和效率提供重要支持。 筑波科技與美商Teradyne合作，推廣ETS解決功率器件和功率模塊測試，並利用太赫茲檢測分析技術，應對非破壞性Wafer材料測試及3DIC高階封裝的測試挑戰。誠摯邀請業界先進至報名網站，共同蒞臨參與。 日期：2024年11月14日(四) 12:30-17:00 地點：筑波醫電大樓1F 諾貝爾講堂(新竹縣竹北市生醫二路66號) 報名：https://register.acesolution.com.tw/20241114_WBGSemiconductor_Seminar VIP貴賓/講師陣容/主題： 講師陣容： l 國立陽明交大 光電工程研究所/ SEMI Taiwan 郭浩中 教授：Recent Progress of SiPh for AI Data Center l 筑波科技 邱世耀 工程部專案經理：利用ETS測試系統應對高功率類比與混合訊號測試挑戰 l 日本九州大學 系統資訊科學研究生院 資訊電子學系 加藤 和利 教授：Compound Semiconductor Photomixer for Terahertz Wave Application l 合晶科技 徐文浩 新產品技術處資深處長：如何創新氮化鎵基板材料來引領多元應用市場 l 筑波科技 徐舜範 總經理：UR (協作型機器手臂) 與 MiR (自主載具車) 的協作解決方案：智能自動化的應用 l 筑波科技 吳煜坤 系統整合專案經理：以PXIE介面提升矽光子光電整合測試效率：相干光技術驗證與多通道解決方案 l 筑波科技 許永周 專案經理：化合物半導體材料Wafer與3DIC測試的挑戰與應用 聯絡筑波科技 筑波科技股份有限公司ACE Solution, Co., Ltd. 地址：新竹縣竹北市台元街28號2樓之1 電話：03-5500909 電子郵件：service@acesolution.com.tw 網站：https://www.acesolution.com.tw/en/index/ 關於筑波科技（ACE Solution） 筑波科技（https://www.acesolution.com.tw/en/index/）成立於2000年，位於台灣新竹，在中國蘇州和深圳以及越南設有分公司，可提供服務。我們的使命是提供訂製的測試解決方案，以滿足電氣元件、設備和系統製造商的客戶需求，通過合作夥伴提供技術解決方案。我們專注於射頻、毫米波和太赫茲領域，擁有專業的技術支援團隊，提供專業、創新和多功能的綜合技術和解決方案。
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