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符合「iot」新聞搜尋結果， 共 109 篇 ，以下為 25 - 48 篇 訂閱此列表，掌握最新動態
Global Business News
Bureau Veritas Showcases Three Key Net-Zero Transformation Solutions at Energy Taiwan

TAIPEI, Oct. 29, 2025 /PRNewswire/ -- As one of the world's leading testing, inspection, and certification companies, Bureau Veritas (BV) will participate in Energy Taiwan 2025, organized by SEMI and the Taiwan External Trade Development Council (TAITRA). This year's exhibition, themed "Towards Net-Zero Taiwan," will take place from October 29 to 31 at Taipei Nangang Exhibition Center, Hall 1 (Booth I0430).  During the exhibition, BV will highlight its comprehensive solutions under the three key pillars of net-zero transformation — New Energy, Sustainability, and Cybersecurity — demonstrating BV's strong capabilities in supporting global green transition and sustainable development.  Bureau Veritas Showcases Three Key Net-Zero Transformation Solutions at Energy Taiwan New Energy  BV will demonstrate its capabilities in testing, verification, and inspection within the energy storage sector, supporting enterprises in ensuring system safety and regulatory compliance. Additionally, BV will provide certification and inspection services for hydrogen and nuclear energy, contributing to the development of new energy solutions. In addition, BV will feature its expertise in Battery Chemical Testing and Performance Evaluation, covering material analysis, hazardous substance testing, and safety assessment. These services help companies ensure that their battery products meet international standards and regulatory requirements, supporting safe and sustainable applications in the new energy sector.  Sustainability  BV provides comprehensive ESG and net-zero transition solutions to help enterprises establish sustainable management systems, including:  － Providing carbon verification, reduction pathway, supply chain management and carbon neutrality related services to support corporate sustainability governance.  － Supporting green manufacturing and life-cycle assessment (LCA) to promote carbon reduction across product life cycles.  － Featuring the Consumer Products Services (CPS) Division, which offers chemical testing and packaging transportation testing (ISTA) to help brands achieve product safety and environmental compliance, strengthening sustainability throughout the supply chain.  － Providing international sustainability certification and verification services across transportation, construction, energy, and carbon management sectors, including ISO 14083 (Greenhouse gases — Quantification and reporting of greenhouse gas emissions arising from transport chain operations, LEED, ISCC (International Sustainability and Carbon Certification), and the GHG Protocol. Cybersecurity  As smart manufacturing and IoT applications continue to expand, BV provides comprehensive cybersecurity testing and certification services, including product security testing, penetration testing, and information security & AI management system (such as ISO 27001 & ISO/IEC 42001). These services help enterprises strengthen data protection and ensure safe and reliable system operations.  Through the three core themes of new energy, sustainability, and cybersecurity, BV demonstrates its expertise in testing, inspection, certification, and sustainable development—partnering with enterprises to co-create a net-zero future. BV has been recognized by TIME magazine as one of the World's Best Companies for two consecutive years. Recently, BV was included in the Paris CAC 40 stock index and entering the CDP "A List". By combining global resources with local expertise, we help clients mitigate risks, meet societal expectations, and foster trust among businesses, governments, and consumers. As BV Trust Makers, we warmly invite professionals across industries to engage with us at Energy Taiwan 2025, and explore innovative pathways toward a secure, sustainable, and net-zero future. Bureau Veritas Booth Information Booth number: I0430 Location: Taipei Nangang Exhibition Center, Hall 1 (No. 1, Jingmao 2nd Road, Nangang District, Taipei City 11568, Taiwan) Date: October 29-31, 2025 Time: 10/29 10:00-17:00; 10/30 10:00-17:00; 10/31 10:00-16:00 Exhibition website: https://www.energytaiwan.com.tw/en/index.html 

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 431 加入收藏 :
Arrow Electronics Supports EMASS in Driving Ultra-Low-Power Edge AI Technology with ECS-DoT SoC
Global Business News
Arrow Electronics Supports EMASS in Driving Ultra-Low-Power Edge AI Technology with ECS-DoT SoC

SINGAPORE - Media OutReach Newswire - 29 October 2025 - Arrow Electronics and EMASS — a global provider of technology solutions, and an edge-AI-focused-semiconductor developer, respectively — have announced a collaboration to accelerate the deployment of ultra-low-power edge AI solutions across wearables, industrial IoT and smart sensing devices, using EMASS's ECS-DoT System on Chip (SoC). By leveraging Arrow's global engineering expertise, product design capabilities, comprehensive supply chain services and integration support, EMASS delivers ready-made, sensor-integrated edge AI solutions that enable technology customers to adopt ultra-low-power AI quickly and efficiently. Arrow Electronics Supports EMASS in Driving Ultra-Low-Power Edge AI Technology with ECS-DoT SoC EMASS — a subsidiary of Nanoveu Ltd (ASX: NVU) — is an advanced semiconductor company specializing in ultra-low-power AI SoC solutions for edge computing. EMASS has introduced the ECS-DoT SoC, which enables real-time, always-on, milliwatt-scale intelligence at the edge, reducing reliance on cloud-based computation and enabling faster performance for next-generation on-device AI applications. "At EMASS, we see a tremendous opportunity to redefine how edge AI empowers devices across industries," said Mark Goranson, Nanoveu's CEO of Semiconductor Technologies. "By collaborating with Arrow, we can bring ECS-DoT technology to new markets faster and help developers create innovative, always-on AI applications that were previously impossible at such low power. This partnership positions us to lead the edge AI ecosystem and accelerate the adoption of real-time, on-device intelligence worldwide." Arrow and EMASS are working closely to expand the edge AI ecosystem by jointly developing enhanced SDKs, developer tools and reference designs. These initiatives will be co-promoted through Arrow's technology network and industry programs to help developers bring ultra-low-power AI concepts to market faster. The collaboration also taps into engineering resources at the NTU-Arrow Invent Lab to accelerate innovation. Developers can now prototype edge AI applications faster with Arrow and EMASS's joint tools and training. "We are excited to collaborate with EMASS in bringing edge AI to market where it matters most; on-device, in real time and with minimal power," said Dr. Raphael Salmi, president of Arrow Electronics' components business for South Asia, Korea and Japan. "With Arrow's global reach, technical expertise and strong distribution network, combined with EMASS' deep relationships with OEMs and system integrators, we are uniquely positioned to broaden EMASS's market reach and capture new opportunities in the AI SoC space." Arrow and EMASS will showcase their joint evaluation boards and reference designs at Singapore Week of Innovation and Technology (SWITCH), taking place October 29–31, 2025. These developer tools are built to accelerate development and deployment of ultra-low-power edge AI solutions across a wide range of applications. Hashtag: #ArrowThe issuer is solely responsible for the content of this announcement.About Arrow Electronics Arrow Electronics (NYSE:ARW) sources and engineers technology solutions for thousands of leading manufacturers and service providers. With global 2024 sales of $28 billion, Arrow's portfolio enables technology across major industries and markets. Learn more at arrow.com.

文章來源 : Media OutReach Limited 發表時間 : 瀏覽次數 : 492 加入收藏 :
Lantronix, Inc.
Global Business News
Lantronix Edge AI Technology Powers Sightline’s New AI-Driven Video Processor for Mission-Critical Drone Applications

Strategic Collaboration positions Lantronix for long-term opportunities in the global drone market IRVINE, Calif., Oct. 28, 2025 (GLOBE NEWSWIRE) -- Lantronix Inc. (NASDAQ: LTRX), a global leader in compute and connectivity IoT solutions powering Edge AI applications, today announced that its NDAA/TAA-compliant solution has been selected by Sightline Intelligence, the leader in onboard video and AI vision systems, for integration into Sightline’s latest high-performance video processor for defense and commercial drone platforms.   This collaboration reinforces Lantronix’s growing presence in the rapidly expanding global drone and defense technology markets, which are projected to reach $57.8 billion by 2030, according to Drone Industry Insight’s 2025-2030 Global Drone Market Report. The new solution enables real-time AI-based object detection, classification and tracking, supporting autonomous, mission-critical applications in defense and intelligence, surveillance and reconnaissance (ISR) sectors. “Lantronix’s Edge AI technology equips Sightline with the speed, reliability and security our customers depend on for demanding drone and defense applications,” said Jon Atwood, CEO of Sightline Intelligence. “By joining forces, we’re delivering real-time video intelligence and helping our customers achieve new operational capabilities in mission-critical environments.” “This strategic engagement with Sightline reflects our accelerating momentum in the Edge AI drone market,” said Saleel Awsare, CEO of Lantronix. “It validates our technology leadership and opens doors to long-term opportunities in both the defense and commercial sectors.” Technology Advantage Drives Market Differentiation Built on Lantronix’s Open-Q 7230CS and 5165RB System on Modules (SOMs), both powered by Qualcomm® Dragonwing™ processors, Sightline’s new 4100-OEM and 4100-SOM platforms are engineered for OEMs and system integrators developing next-generation drone and ISR systems. Key advantages include: Edge AI Processing: Enables real-time decisions near the sensor, reducing latency while improving reliability and eliminating dependence on cloud connectivity. AI-Powered Object Detection: Tracks and detects vehicles, drones, people and stationary objects using adaptive, mission-specific models. Precision Tracking of Fast-Moving Targets. Features ultra-low latency video pipelines with telemetry latency as low as ~7 ms and “glass-to-glass” latency around ~110 ms. SWaP-Optimized for UAV Platforms: Offers a compact footprint (2.0” x 1.5” x 0.65”) and 5W power profile, ideal for deployment in size- and power-constrained platforms such as UAVs and gimbals. Designed for Scalable, Mission-Critical Deployments The Lantronix-enabled 4100-OEM delivers full HD performance with H.265 encoding, dual-channel processing and support for 4K/30, MISB/KLV standards and TAK interoperability. With multiple I/O formats, including HDMI, HDSDI and Ethernet streaming, the platform offers flexibility for deployment across a wide range of ISR and defense-grade systems. Investor TakeawayThis design win with Sightline validates Lantronix’s differentiated Edge AI technology and expands its footprint in the defense and UAV industries drone sectors, both of which are high-growth, high-barrier-to-entry markets. As drone adoption accelerates across commercial and military domains, Lantronix is well-positioned to capitalize on opportunities through its hardware and integrated compute solutions. About Lantronix Solutions and Engineering Services Lantronix solutions and Engineering Services combine embedded compute technology, compliance expertise and flexible software support to accelerate customer product development. This scalable platform approach enables rapid time‑to‑market for Sightline and positions Lantronix to support future industrial IoT programs that require TAA and NDAA compliance. Learn more about Lantronix’s Engineering Services, SOM solutions and additional Drone Applications at Lantronix.com. About Lantronix    Lantronix Inc. (Nasdaq: LTRX) is a global leader in Edge AI and Industrial IoT solutions, delivering intelligent computing, secure connectivity, and remote management for mission-critical applications. Serving high-growth markets, including smart cities, enterprise IT, and commercial and defense unmanned systems, Lantronix enables customers to optimize operations and accelerate digital transformation. Its comprehensive portfolio of hardware, software, and services powers applications from secure video surveillance and intelligent utility infrastructure to resilient out-of-band network management. By bringing intelligence to the network edge, Lantronix helps organizations achieve efficiency, security, and a competitive edge in today’s AI-driven world. For more information, visit the Lantronix website. About Sightline Intelligence Sightline Intelligence is a global leader in AI-enabled onboard video processing for advanced camera systems used in mission-critical applications. Founded in 2007 as Sightline Applications, the Portland-Ore.-based company has nearly two decades of experience, and its dedicated engineering team continues to push the boundaries of real-time video processing and vision-based AI. It specializes in low SWaP (Size, Weight, and Power) hardware and advanced software that transforms raw video into actionable insights, right at the edge. From tracking fast-moving targets to detecting and classifying threats, our technology is trusted by defense OEMs, integrators, and end-users operating in the world’s most demanding environments. For more information, visit the Sightline Intelligence website. ©2025 Lantronix, Inc. All rights reserved. Lantronix is a registered trademark. Other trademarks and trade names are those of their respective owners. “Safe Harbor” Statement under the Private Securities Litigation Reform Act of 1995: This news release contains forward-looking statements within the meaning of federal securities laws, including, without limitation, statements concerning growth expectations in the global drone market and Lantronix’s positioning to capitalize on opportunities for long-term, high-margin growth in the drone and defense technology markets. These forward-looking statements are based on our current expectations and are subject to substantial risks and uncertainties that could cause our actual results, future business, financial condition, or performance to differ materially from our historical results or those expressed or implied in any forward-looking statement contained in this news release. The potential risks and uncertainties include, but are not limited to, such factors as the effects of negative or worsening regional and worldwide economic conditions or market instability on our business, including effects on purchasing decisions by our customers; our ability to mitigate any disruption in our and our suppliers’ and vendors’ supply chains due to changes in U.S. or foreign government trade policies, including recently increased or future tariffs, a pandemic or other outbreaks, wars and recent conflicts in Europe, Asia and the Middle East, or other factors; future responses to and effects of public health crises; cybersecurity risks; changes in applicable U.S. and foreign government laws and regulations; our ability to successfully implement our acquisitions strategy or integrate acquired companies; difficulties and costs of protecting patents and other proprietary rights; the level of our indebtedness, our ability to service our indebtedness and the restrictions in our debt agreements; and any additional factors included in our Annual Report on Form 10-K for the fiscal year ended June 30, 2025, filed with the Securities and Exchange Commission (the “SEC”) on August 29, 2025, including in the section entitled “Risk Factors” in Item 1A of Part I of that report, as well as in our other public filings with the SEC. Additional risk factors may be identified from time to time in our future filings. In addition, actual results may differ as a result of additional risks and uncertainties about which we are currently unaware or which we do not currently view as material to our business. For these reasons, investors are cautioned not to place undue reliance on any forward-looking statements. The forward-looking statements we make speak only as of the date on which they are made. We expressly disclaim any intent or obligation to update any forward-looking statements after the date hereof to conform such statements to actual results or to changes in our opinions or expectations, except as required by applicable law or the rules of the Nasdaq Stock Market LLC. If we do update or correct any forward-looking statements, investors should not conclude that we will make additional updates or corrections. Lantronix Media Contact:media@lantronix.com949-212-0960 Lantronix Analyst and Investor Contact:investors@lantronix.com

文章來源 : Notified 發表時間 : 瀏覽次數 : 528 加入收藏 :
Apollo510 Lite SoCs
其他商業
Ambiq 發佈 Apollo510 Lite 系統單晶片，以雙模藍牙連接技術驅動持續運行的邊緣裝置

全新 Apollo510 Lite 單晶片系統系列實現破格能源效率及人工智能表現，使連接裝置更智能、更持久 德州奧斯汀, Oct. 29, 2025 (GLOBE NEWSWIRE) -- 超低功耗半導體與人工智能 (AI) 解決方案頂尖供應商 Ambiq Micro, Inc.（「Ambiq」）今日宣佈推出 Apollo510 Lite 系統單晶片 (SoC) 系列，其成為 Apollo5 產品系列的最新成員。 為迎合邊緣設備對持續智能不斷增長的需求，此系列具備先進 AI 處理能力、多協定無線連接技術及業內領先的節能效益——推動新世代裝置，包括穿戴式裝置、醫療裝置、工業物聯網 (IoT) 感測器及智能建築。 開創邊緣運算新紀元 Ambiq 行政總裁 Fumihide Esaka 說道：「Apollo510 Lite 系列標誌著 Ambiq 在擴展超低功耗 AI 解決方案產品組合邁出重要一步，將邊緣 AI 普及至更多元化的裝置及應用情境，橫跨穿戴式裝置、醫療保健、工業及智能家居應用。 此里程碑彰顯我們要讓智能技術遍及各處的承諾，同時確保功耗或效能不受影響。」 邊緣 AI 效率躍進新境界 基於 Ambiq 專利的亞閾值功率優化技術 (Subthreshold Power Optimized Technology, SPOT®) 平台，Apollo510 Lite 系列比同類 M4 或 M33 解決方案，效能提升超過 16 倍，AI 能源效率更優化達 30 倍。 是次效能飛躍讓開發人員能夠部署複雜的 AI 工作負載，包括健康分析、感測器融合及語音辨識，同時大幅提升連接裝置的電池續航力。 Apollo510 Lite 系列亮點 高效能運算：最高可達 250 MHz 的 Arm® Cortex®-M55 處理器，配備 turboSPOT® 和 Helium™ 技術，實現高效 AI 加速。 專用協同處理器：48/96 MHz Arm Cortex-M4F 協同處理器，優化處理無線連接及感測器融合任務。 擴充記憶體：2 MB RAM 及 2 MB 非揮發性記憶體，設有專用指令/資料快取記憶體，提升執行速度。 先進連接功能： Bluetooth® 低功耗 5.4 技術，具備 +14 dBm 傳輸功率，強化訊號接收效能。 雙模藍牙（經典版 + 低功耗 (LE)）支援低功耗音訊及向後兼容功能。 內置保安功能：secureSPOT® 3.0 配備 Arm TrustZone® 技術、安全啟動及認證固件更新，確保數據完整。 此系列設有三款型號：Apollo510 Lite（並無藍牙低功耗 (BLE) 無線電）、Apollo510B Lite（支援 BLE 功能）及 Apollo510D Lite（雙模藍牙）。 供應情況 Apollo510 Lite 系列現已提供樣本，預計於 2026 年第一季度開始量產。 歡迎瀏覽 Apollo510 Lite SoC 系列產品頁面，獲取技術詳情、開發工具及訂購資料。 關於 Ambiq Ambiq 總部位於德州奧斯汀，使命是通過提供最低功耗的半導體解決方案，讓人工智能（AI）及其他智能技術遍及每個角落。 Ambiq 幫助客戶在邊緣實現人工智能運算，解決最嚴峻的功耗問題。 Ambiq 的技術創新建基於獲專利的亞閾功率優化技術（SPOT®），在功耗上相比傳統半導體設計實現了多倍提升。 Ambiq 目前驅動了超過 2.8 億部裝置。 欲了解更多資訊，請瀏覽 www.ambiq.com。 前瞻性陳述 本新聞稿中與非歷史事實相關者皆為前瞻性陳述。 您可透過「相信」、「預期」、「可能」、「將」、「應該」、「尋求」、「打算」、「計劃」、「估計」或「預測」等詞語，或與我們的策略、計劃、預測或意圖相關的類似表達識別為前瞻性陳述。 根據其性質，前瞻性陳述並非歷史事實聲明或對未來表現的保證，並且受到風險、不確定性、假設或難以預測或量化的情況變化所影響，包括 Ambiq 向美國證券交易委員會 (Securities and Exchange Commission) 提交文件中「風險因素」章節所述內容。 除因應適用證券法的要求之外，Ambiq 不會承擔對任何前瞻性陳述作公開更新或修訂的責任，無論是由於新資訊、未來事件或其他原因所導致。 公關與媒體 Charlene Wan企業市場營銷及投資者關係副總裁cwan@ambiq.com+1.512.879.2850  投資者關係TeneoChristina Coronioschristina.coronios@teneo.com+1.212.915.4581 請瀏覽以下網址，查閱此公告隨附的相片：https://www.globenewswire.com/NewsRoom/AttachmentNg/1dde6260-281e-4572-9dcb-27c99f7bd952

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Canon announces Think Big Klang Valley to conclude Think Big Series in Malaysia
Global Business News
Canon Envisions a 'Future-Ready Malaysia' at Think Big Klang Valley Series 2025

Forum invites businesses to Lead with Smart Tech towards Innovation, Resilience, and Growth in today’s digital-first economyKUALA LUMPUR, MALAYSIA - Media OutReach Newswire - 29 October 2025 - Canon today announced its upcoming Think Big Klang Valley Series, happening on 12 November 2025 at the Sheraton Petaling Jaya Hotel. Under the theme of 'Future-Ready Malaysia: Innovation, Resilience, Growth', the forum will bring together industry leaders and policymakers to explore how artificial intelligence (AI) and cloud technologies can power productivity, attract investments, and elevate local talent in Malaysia's rapidly digitalising economy. Canon announces Think Big Klang Valley to conclude Think Big Series in Malaysia This thought leadership forum in Kuala Lumpur brings together insights from the Think Big events in 2025 across Malaysia—generated from sessions in Johor Bahru, Penang, and Putrajaya—where business leaders convened to discuss the challenges and opportunities shaping the nation's economic and business landscape. Malaysia's digital economy is projected to contribute 25.5% to the national GDP by 2025, with investments in AI and digital infrastructure surging by 125% in the second quarter of 2025 alone. Building on this momentum, the Malaysia Budget 2026 has also allocated RM5.9 billion to further strengthen AI research, development and innovation via cross-ministerial efforts — signalling a market poised for hyper-growth. "The rapid rise of AI and cloud technologies is shaping how organisations across Asia operate and compete, with Malaysia rapidly emerging as one of the regional leaders in this transformation," said Norihiro (Nick) Katagiri, Senior Vice President, Regional Digital Printing and Business Solution Operations, Canon Singapore. "Think Big Malaysia serves as a critical platform to equip business leaders with the practical blueprint to harness the full power of AI and cloud technologies in the workplace, while empowering long-term growth and resilience in a digital-first economy." Next-Gen Solutions and Innovative Insights for Future-Ready Economies The Klang Valley Series of Think Big Malaysia is set to deliver expert insights through a fireside session and panel discussion. These sessions will guide business leaders on maximising the opportunities presented by Malaysia's growing digital infrastructure. Executives will also gain strategic direction for leveraging integrated solutions to mitigate market challenges and secure long-term competitive advantage. The event's speaker lineup will feature notable government representatives and key industry leaders from Malaysia's digital and finance sectors, including the Minister of Digital for Malaysia, YB Gobind Singh Deo, and the Chief Economist of Affin Bank Berhad, Alan Tan. Complementing the leadership discussions, Canon will host a dedicated solutions showcase to highlight smart technologies aimed at helping businesses accelerate digital transformation, streamline workflows, and create greater value. These solutions include: imageFORCE: Canon's next-generation multi-function device (MFD) series which integrates intelligent automation and advanced security for seamless digital workflows. It features AI-assisted smart maintenance, utilising machine learning to predict component lifespan and ensure maximum uptime. Antelope®: An AI-powered document management solution which transforms raw documents—including printed and handwritten text—into actionable insights by accurately capturing data, generating quick summaries, and extracting key terms for faster workflow. VisualAI: An AI-driven operational platform which delivers real-time visibility across people, material, and processes. Through the analysis of on-ground activities and seamless integration with backend systems and IoT devices, the solution creates a safer, more productive and efficient workspace. "Malaysia's growing strength and leadership in AI and cloud infrastructure reflect a powerful national commitment to building a digital-first economy. As the country attracts major investments and accelerates smart technology adoption across industries, businesses here have an incredible opportunity to reinvent the way they work," said Masato Yoshiie, President and CEO, Canon Marketing Malaysia. "We are dedicated to helping companies turn these advancements into practical value—delivering smart, integrated solutions that maximise business efficiency, enhance collaboration, and support them in building a future-ready Malaysia." For more information on Think Big Malaysia, please visit: https://bcbs.asia.canon/en/discover/events/think-big/future-ready-malaysia-innovation-resilience-growth About Think Big Leadership Business Series The Think Big Leadership Business Series, an initiative by Canon, is designed to inspire and empower business leaders with forward-looking strategies and actionable insights. First launched in Singapore in 2010, the platform helps organisations navigate today's fast-evolving business landscape by demonstrating how innovation and technology can drive sustainable growth. Hashtag: #CanonThe issuer is solely responsible for the content of this announcement.About Canon Singapore Pte. Ltd.Canon is a global leader in photographic and digital imaging solutions. Canon Singapore Pte. Ltd. is the headquarters for South & Southeast Asia driving sales, marketing and service strategies. Besides handling the domestic market, the company covers 22 other countries and regions. The parent company Canon Inc. has a global network of more than 300 companies and employs about 170,000 people worldwide. Canon is guided by its kyosei philosophy that focuses on living and working together for the common good. More information is available at https://asia.canon.

文章來源 : Media OutReach Limited 發表時間 : 瀏覽次數 : 231 加入收藏 :
Global Business News
Supermicro Expands Collaboration with NVIDIA and Strengthens Compliance, Data Integrity, and Quality of U.S.-Based Manufacturing of AI Infrastructure Solutions Optimized for Government Applications

Deepening collaboration with NVIDIA to bring NVIDIA Vera Rubin NVL144 and NVIDIA Vera Rubin CPX platforms to market in 2026 to provide more than 3x AI attention acceleration vs. Blackwell Ultra Powered by Data Center Building Block Solutions®, Supermicro introduces a compact 2OU NVIDIA HGX B300 8-GPU system with OCP-based rack-scale design supporting up to 144 GPUs in a single rack Supermicro's San Jose, CA manufacturing ensures solutions are developed, constructed, and validated in the USA, are TAA-compliant, and are Buy American Act-capable Supporting a full-stack NVIDIA AI Factory for Government reference design with expansion of AI solution portfolio, including deskside AI supercomputer, Super AI Station based on NVIDIA GB300 and the new rack-scale NVIDIA GB200 NVL4 HPC solutions SAN JOSE, Calif., and WASHINGTON, Oct. 29, 2025 /PRNewswire/ -- Super Micro Computer, Inc. (SMCI), a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, is showcasing its advanced AI infrastructure solutions at NVIDIA GTC in Washington, D.C. this week, highlighting systems tailored to meet the stringent requirements of federal customers. Supermicro announced its plans to deliver next-generation NVIDIA AI platforms, including the NVIDIA Vera Rubin NVL144 and NVIDIA Vera Rubin NVL144 CPX in 2026. Additionally, Supermicro introduces U.S.-manufactured, TAA (Trade Agreements Act)-compliant systems, including the high-density 2OU NVIDIA HGX B300 8-GPU system with up to 144 GPUs per rack and an expanded portfolio featuring a Super AI Station based on NVIDIA GB300 and the new rack-scale NVIDIA GB200 NVL4 HPC solutions. GTC DC "Our expanded collaboration with NVIDIA and our focus on U.S.-based manufacturing position Supermicro as a trusted partner for federal AI deployments. With our corporate headquarters, manufacturing, and R&D all based in San Jose, California, in the heart of Silicon Valley, we have an unparalleled ability and capacity to deliver first-to-market solutions are developed, constructed, validated (and manufactured) for American federal customers," said Charles Liang, president and CEO, Supermicro. "The result of many years of working hand-in-hand with our close partner NVIDIA—also based in Silicon Valley—Supermicro has cemented its position as a pioneer of American AI infrastructure development." For more information, please visit https://www.supermicro.com/en/accelerators/nvidia and https://www.supermicro.com/en/featured/rtx-pro-6000-systems. Supermicro is expanding its latest solutions based on NVIDIA HGX B300 and B200, NVIDIA GB300 and GB200, and NVIDIA RTX PRO™ 6000 Blackwell Server Edition GPUs that provide unprecedented compute performance, efficiency, and scalability for key federal government workloads such as cybersecurity & risk detection, engineering & design, healthcare & life sciences, data analytics & fusion platforms, modeling & simulation, and secure virtualized infrastructure. Supermicro's focus on U.S.-based manufacturing is a cornerstone of its business focus. All government-optimized systems are developed, constructed, and rigorously validated at its global headquarters in San Jose, California, ensuring full compliance with the TAA and eligibility under the Buy American Act. This domestic production capability enhances supply chain security and meets federal requirements for trusted, high-quality technology solutions. Through its collaboration with NVIDIA, Supermicro is set to introduce the NVIDIA Vera Rubin NVL144 and NVIDIA Rubin CPX platforms in 2026. These platforms will deliver exceptional AI training and inference performance of their predecessors, empowering organizations to handle complex AI workloads with exceptional efficiency. Supermicro is also unveiling its most compact system, a 2OU NVIDIA HGX B300 8-GPU server, featuring an OCP-based rack-scale design powered by Supermicro Data Center Building Block Solutions®. This architecture supports up to 144 GPUs in a single rack, delivering outstanding performance and scalability for large-scale AI and HPC deployments in government data centers. Supermicro is expanding its government-focused portfolio by optimizing for NVIDIA AI Factory for Government reference design. The NVIDIA AI Factory for Government is a full-stack, end-to-end reference design that provides guidance for deploying and managing multiple AI workloads on-premises and in the hybrid cloud while meeting the compliance needs of high-assurance organizations. The portfolio now includes the Super AI Station based on NVIDIA GB300, and the rack-scale NVIDIA GB200 NVL4 HPC solutions, both optimized for federal environments with enhanced security, reliability, and scalability to meet stringent government standards. Support for New Accelerated Networking Further highlighting Supermicro's first-to-market development with new NVIDIA technologies, today it also announced support for the newly-announced NVIDIA BlueField-4 DPU and NVIDIA ConnectX-9 SuperNIC in gigascale AI factories. When available, these new accelerated infrastructure technologies will be readily integrated into new Supermicro AI systems to provide faster cluster-scale AI networking, storage access and data processing offload for the next generation of NVIDIA AI infrastructure. Supermicro's modular hardware design will enable the rapid integration of new technologies such as the NVIDIA BlueField-4 and NVIDIA ConnectX-9 into existing systems designs with minimal re-engineering, speeding up time-to-market and reducing development costs. New Super AI Station brings AI server power to the desktop Continuing its record of first-to-market implementation of new NVIDIA technologies, Supermicro announces the new liquid-cooled ARS-511GD-NB-LCC Super AI Station. By bringing the high-end server grade GB300 Superchip into a deskside form factor, this platform is the first of its kind, unleashing unparalleled performance, and resulting in more than 5x AI PFLOPS of computing power, compared to traditional PCIe based GPU workstations. This new Super AI Station is a complete solution for AI model training, fine-tuning, applications and algorithms prototyping and development, that can be deployed on-prem for unmatched latency and full data security, supporting models up to 1 trillion parameters. This self-contained platform is ideal for government agencies, startups, deep-tech and research labs who may not have access to traditional server infrastructure for AI development purposes and are unable to leverage cluster-scale or cloud AI services due to availability, cost, privacy, and latency concerns. The Super AI Station can be used in a desktop or rack-mounted environment and is delivered as a fully integrated, all-in-one solution including: NVIDIA GB300 Grace Blackwell Ultra Desktop Superchip Up to 784GB of coherent memory Integrated NVIDIA ConnectX-8 SuperNIC Closed-loop direct-to-chip liquid cooling for CPU, GPU, ConnectX-8, and memory Up to 20 PFLOPS AI performance Bundled with NVIDIA AI software stack Option to configure an additional PCIe GPU for rendering and graphics acceleration 5U desktop tower form factor with optional rack-mounting 1600W power supply compatible with standard power outlets Rack-Scale GB200 NVL4 GPU Accelerated HPC and AI Solution Now Available Supermicro is also announcing general availability of its ARS-121GL-NB2B-LCC NVL4 rack-scale platform for GPU-accelerated HPC and AI science workloads such as molecular simulation, weather modeling, fluid dynamics, and genomics. Delivering revolutionary performance through four NVIDIA NVLink™-connected Blackwell GPUs unified with two NVIDIA Grace™ CPUs over NVLink-C2C, up to 32 nodes per rack can be connected via NVIDIA ConnectX-8 networking for up to 800G per GPU. The solution is scalable at the system and rack level depending on workload requirements and can be liquid cooled by either in-rack or in-row CDUs. 4 B200 GPUs and 2 Grace Superchips per node with direct-to-chip liquid cooling 4 ports of 800G NVIDIA Quantum InfiniBand networking per node with 800G dedicated to each B200 GPU (alternative NIC options available) Up to 128 GPUs in a 48U NVIDIA MGX rack for unmatched data center rack density Power via busbar for seamless scaling These Supermicro systems are ideal for developing and deploying AI using NVIDIA AI Enterprise software and NVIDIA Nemotron open AI models. About Super Micro Computer, Inc. Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first to market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are a Total IT Solutions provider with server, AI, storage, IoT, switch systems, software, and support services. Supermicro's motherboard, power, and chassis design expertise further enables our development and production, enabling next generation innovation from cloud to edge for our global customers. Our products are designed and manufactured in-house (in the US, Asia, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling). Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc. All other brands, names, and trademarks are the property of their respective owners.  

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