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Growth Supported by Leading-edge Logic, Memory and Advanced Packaging Applications from 2025 through 2027 TOKYO, Dec. 16, 2025 /PRNewswire/ -- Global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to reach a record high of $133 billion in 2025, growing 13.7% year-on-year, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON Japan 2025. Growth in semiconductor manufacturing equipment sales is expected to continue in the two following years of the forecast period, with projections of $145 billion in 2026 and $156 billion in 2027. This growth will be driven primarily by investments related to AI, particularly in leading-edge logic, memory, and the adoption of advanced packaging technologies. Total Semiconductor Equipment Market by Segment "Global semiconductor equipment sales show robust momentum, with both the front-end and back-end segments projected to see three consecutive years of growth, culminating in total sales surpassing $150 billion for the first time in 2027," said Ajit Manocha, SEMI president and CEO. "Investments to support AI demand have been stronger than anticipated since our midyear forecast, leading us to boost the outlook for all segments." Semiconductor Equipment Sales by Segment After registering a record $104 billion in sales last year, the wafer fab equipment (WFE) segment, which includes wafer processing, mask/reticle, and fab facilities equipment, is projected to grow 11.0% to $115.7 billion in 2025. This represents an upward revision from the previously forecast $110.8 billion in the SEMI 2025 Mid-Year Equipment Forecast, reflecting stronger than expected investments in DRAM and high-bandwidth memory (HBM) to support AI computing. Continued capacity build-out in China is also contributing meaningfully to WFE demand. Looking ahead, WFE segment sales are projected to expand 9.0% in 2026 and 7.3% in 2027, reaching $135.2 billion as device makers increase spending on advanced logic and memory technologies. The back-end equipment segment is anticipated to continue its strong recovery that began in 2024. Sales of semiconductor test equipment are projected to surge 48.1% to $11.2 billion in 2025, while assembly and packaging (A&P) equipment sales are projected to rise 19.6% to $6.4 billion. Back-end growth is expected to continue, with test equipment sales growing 12.0% in 2026 and 7.1% in 2027, and A&P sales are forecast to grow 9.2% in 2026 and 6.9% in 2027. This expansion is underpinned by the growing complexity of device architectures, accelerated adoption of advanced and heterogeneous packaging, and stringent performance requirements for AI and HBM semiconductors. These drivers are partly offset by ongoing softness in consumer, automotive and industrial demand, which continues to weigh on some mainstream test and packaging segments. Wafer Fab Equipment Sales by Application WFE sales for foundry and logic applications are expected to show robust 9.8% year-over-year growth to $66.6 billion in 2025, supported by resilient spending for advanced nodes. The segment is forecast to see 5.5% growth in 2026 and 6.9% increase to $75.2 billion in 2027 as chipmakers add capacity for AI accelerators, high-performance computing and premium mobile processors. Investments will increasingly target leading-edge technologies as the industry moves toward high-volume manufacturing at the 2nm gate-all-around (GAA) node. Memory-related capital expenditures are projected to see significant expansion through 2027 powered by increasing demand for HBM to support AI deployment and ongoing technology migration. The NAND equipment market is expected to see growth of 45.4% to $14.0 billion in 2025 and further increase 12.7% to $15.7 billion in 2026 and 7.3% to $16.9 billion in 2027, driven by advancements in 3D NAND stacking and capacity expansion at both leading and mainstream layers. DRAM equipment sales are projected to rise 15.4% to $22.5 billion in 2025, followed by 15.1% and 7.8% year-on-year growth in 2026 and 2027, respectively, as memory suppliers ramp HBM and upgrade to more advanced process nodes to meet AI and data center requirements. Semiconductor Equipment Sales by Region Mainland China, Taiwan and Korea are expected to remain the top three destinations for equipment spending through 2027. China is projected to maintain the leading position over the forecast period as domestic chipmakers continue to invest in both mature and select advanced nodes, even as growth moderates and sales gradually decline from 2026. In Taiwan, robust 2025 spending reflects large-scale leading-edge capacity builds for AI and high-performance computing, while Korea's equipment outlays are supported by substantial investments in advanced memory technologies, including HBM. All other regions tracked are expected to see equipment spending increase in 2026 and 2027, supported by government incentives, regionalization efforts and targeted specialty capacity expansions. The SEMI forecast is based on collective input from top equipment suppliers, the SEMI Worldwide Semiconductor Equipment Market Statistics (WWSEMS) data collection program and the industry-recognized SEMI World Fab Forecast database. About SEMI Market Data The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: Monthly SEMI North American Billings Report, an early perspective of equipment market trends Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and more than 22 market segments Bi-annual Total Semiconductor Equipment Forecast – OEM Perspective, an outlook for the semiconductor equipment market For more information on the report or to subscribe, please contact the SEMI Market Intelligence Team at mktstats@semi.org. Details on SEMI market data are available at SEMI Market Data. About SEMI SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members' business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more. Association ContactsSherrie Gutierrez/SEMIPhone: 1.831.889.3800Email: sgutierrez@semi.org Stephanie Quinn/Kiterocket (Media Inquiries)Phone: 1-480-316-8370Email: squinn@kiterocket.com Wafer Fab Equipment Forecast by Application
Driving AI Data Center Transformation with Sustainable High-Speed Optical Technology NEW TAIPEI CITY, Dec. 16, 2025 /PRNewswire/ -- As artificial intelligence (AI) and high-performance computing (HPC) continue to expand rapidly, the demand for high-speed, low-power, and highly reliable optical communication equipment in data centers is steadily rising. SANOC's independently developed product, the EcoFiber100 – 100G Intelligent Optical Transceiver, has been awarded the 2026 Taiwan Excellence Award, demonstrating the company's technological strength in high-speed optical communication, energy-efficient design, and sustainable innovation. Dr. Sam Liao, CEO of SANOC, and Ms. Elise Lee, PR Manager, pose for a photo with Mr. James Huang, Chairman of TAITRA. The Taiwan Excellence Award is regarded as one of Taiwan's most important industrial honors. Evaluation criteria include R&D innovation, product design, quality management, marketing strategy, and domestic manufacturing capability. SANOC's recognition this year not only underscores its deep technical expertise in high-speed optical communications, but also highlights its long-term commitment to energy-efficient and sustainable technologies. Focusing on AI and Data Center Needs — Low Power as the Key Technological Indicator Dr. Yu-Sheng Liao, General Manager of SANOC, stated: "Winning the 2026 Taiwan Excellence Award with EcoFiber100 reflects the achievement of our team's long-term dedication to high-speed optical communication and energy-saving technologies. As AI and cloud services accelerate, data centers increasingly require optical communication solutions that offer high efficiency, low power consumption, and maintainability. Moving forward, SANOC will continue to innovate and uphold sustainability as our core principles, helping customers achieve the best balance between performance and energy usage." Why are low-power optical modules considered the lifeline of next-generation AI data centers? Dr. Liao explains: "If you have read NVIDIA, Meta, or Microsoft's recent annual reports, you may have noticed a recurring concern — the energy ceiling. In AI computing, the true bottleneck is no longer pure computing power, but whether systems can cool down and whether data centers can afford the electricity. Traditional solutions rely on larger heatsinks, stronger fans, or more complex liquid-cooling systems. These not only increase server costs but also make rack expansion significantly more difficult. The bottleneck of AI isn't that we can't build it, but that we can't stack it anymore. This is why low-power optical modules have become essential to sustaining AI infrastructure." From the perspectives of power consumption, thermal control, density, and serviceability, low-power optical modules have evolved from being mere communication components to becoming strategic units in the global AI energy race. Three Key Technical Advantages Designed for High-Density Compute Environments To address the increasingly demanding compute environments in AI and HPC scenarios, EcoFiber100 integrates several critical technologies to enhance stability under high-heat and high-load operation. Key features include: Stable Operation Under High Thermal LoadHigh-efficiency packaging and precise optoelectronic management significantly improve thermal stability during prolonged high-load operations. Low-Power Architecture Enabling High-Density DeploymentPower consumption is reduced to approximately 60% of comparable products, enabling higher server density while lowering total energy usage. Intelligent Monitoring to Reduce Operational RisksIntegrated DDM smart diagnostics provide real-time telemetry on temperature, voltage, and module lifespan, enabling administrators to detect anomalies early. Additionally, EcoFiber100 can be paired with SANOC's self-developed Optical Module Intelligent Monitoring Platform, enabling comprehensive module-level oversight. According to internal estimates, this can improve operational efficiency by over 30% and reduce maintenance risks. Responding to Global Net-Zero Trends: Low-Carbon Design for Sustainable Data Centers In the global pursuit of net-zero emissions—and as AI accelerates energy demand—EcoFiber100 supports sustainable data center transformation through its product design and manufacturing approach: Power consumption reduced to approximately 60% of industry-equivalent modules High-density deployment can reduce cooling energy usage by around 40% Compliant with RoHS and halogen-free standards Incorporation of recyclable materials and lead-free manufacturing processes Future Outlook: Advancing Innovation, Expanding Global Reach, and Fulfilling Sustainability Goals SANOC will continue leveraging its expertise in high-speed optical technology to advance three major development directions: Technological Innovation and Product ExpansionAccelerating development of 400G, 800G, and 1.6T optical transceivers to deepen product capabilities. Global Market and Service Infrastructure EnhancementExpanding service hubs across five continents to provide strengthened technical support and delivery capabilities. Sustainable Manufacturing and Supply Chain DevelopmentPromoting green processes, enhancing carbon-management transparency, and fulfilling long-term sustainability goals. Dr. Liao further emphasized: "Taiwan possesses exceptional engineering capabilities and talent, yet has long been constrained by capital environments, regulatory structures, and international supply chain systems. But the true force driving technological progress has never been capital nor regulation — it is humanity's desire and determination to build a better world. The closer technology aligns with real-world needs, the greater its power to change the world." "With world-class R&D and manufacturing capabilities, Taiwan can play a pivotal role in the green transformation of global data centers. Through high-speed optical communication and sustainable manufacturing, SANOC is not only responding to the decarbonization challenge, but also empowering Made in Taiwan to become a key force in global data-center sustainability. This is what we are committed to — and the way we believe we can change the world."
SYDNEY, Dec. 15, 2025 /PRNewswire/ -- Avnet and AMD have wrapped up the inaugural 'AMD on Wheels' national roadshow, bringing cutting-edge AI and high-performance computing solutions to innovation hubs across Australia. The initiative reaffirmed the partners as definitive industry leaders by demonstrating the critical intersection of AI, sustainability, and commercial acceleration. Demonstrating a commitment to the environment that parallels their focus on energy-efficient computing, the roadshow team travelled over 4000 KM through Sydney, Canberra, Melbourne and Adelaide with pure Electric Vehicles, the ZEEKR 7X and ZEEKR 009. The roadshow shifted focus from individual components to complete, deployable AI and high-performance computing solutions. By showcasing this end-to-end capability, Avnet and AMD reinforced their commitment to providing secure, adaptable, and energy-efficient infrastructure—capabilities that are critical to enabling Australia to capture the broader AI opportunity that analysts estimate could, in an ambitious scenario, add up to around AU$142 billion a year to Australia's GDP by 2030. (Source: Australia's AI Opportunity report, 2025) "Avnet and AMD are strategically invested in advancing Australia's capability in Responsible AI and next-generation computing," said Tan Aik Hoon, Avnet's Regional President for South Asia, Korea and Avnet United. "This roadshow proved why Avnet is the trusted partner for turning bold ideas into real-world success. Beyond distribution, Avnet helps innovators transform advanced AMD hardware into scalable, sustainable solutions that strengthen Australia's competitive edge." The tour highlighted that Australia's next leap in innovation requires strong cross-sector collaboration. The 'Industry Collaboration for AI at Scale' panel, featuring leading industry experts and key figures from academia, addressed the critical challenge of scaling projects from pilot phase to full deployment. The ecosystem's resilience and capability were demonstrated by local success stories spanning defense, quantum, and space technology: Advanced Navigation – Delivering Space-Ready Precision SystemsAdvanced Navigation leveraged the "Avnet to the Moon" initiative to support its Laser Measurement Unit for Navigational Aid (LUNA), successfully delivering mission-critical components for operation in space and extreme environments. Through technology and supply support from Avnet and AMD, LUNA shows how local innovation can achieve space-grade reliability and strengthen Australia's position in the global space supply chain. Quantum Brilliance – Scaling Quantum from Lab to MarketQuantum Brilliance advanced toward commercial deployment by transitioning to the AVNET+ AMD based ADRS1000 SOM. Despite global shortages, Avnet secured timely delivery, enabling QB to move from prototypes to production. The collaboration highlights how reliable supply chains can accelerate quantum commercialization and maintain Australia's competitive edge in frontier technologies. Liquid Instruments – Bringing Agentic AI to Test & MeasurementLiquid Instruments is advancing test and measurement with Generative Instrumentation and agentic AI on its Moku platform, powered by AMD FPGAs. Launching with Moku:Delta in 2026, these natural-language-driven tools let engineers create and configure instruments in minutes. With support from Avnet and AMD, Moku is enabling faster, smarter experimentation across Australia's research and manufacturing sectors. Silentium Defence – Advancing Passive Radar for Defence, Space Surveillance and Critical InfrastructureSilentium Defence SWaP-optimized passive radar systems, built on AMD technology, demonstrate how long-term collaboration accelerates defence-grade sensing. With Avnet's global supply chain and engineering support, Silentium Defence has moved from early prototypes to production-ready platforms, giving global customers stronger capability in next-generation radar technology. "The next wave of AI innovation in Australia must be built on a foundation of Responsibility and Efficiency," said Steven Fong, Corporate Vice President, Asia Pacific & Japan Embedded Sales at AMD. "We are committed to delivering the energy-efficient computing power that fuels this responsible acceleration, helping partners secure their competitive edge while aligning with national sustainability goals." Avnet and AMD see the roadshow not as an endpoint, but as a blueprint for the future of Australian technology. By strengthening the pipeline between world-class research and commercial deployment, the partners are actively creating the foundational infrastructure—from the most advanced processors to the most secure supply chain—that will guarantee Australia's resilience and long-term technological leadership in the global AI landscape. About Avnet As a leading global technology distributor and solutions provider, Avnet has served customers' evolving needs for more than a century. Through regional and specialised businesses around the world, we support customers and suppliers at every stage of the product lifecycle. We help companies adapt to change and accelerate the design and supply stages of product development. With a unique viewpoint from the center of the technology value chain, Avnet is a trusted partner that solves complex design and supply chain issues so customers can realise revenue faster. Learn more about Avnet at www.avnet.com. Avnet and AMD are registered trademarks of Avnet, Inc. and Advanced Micro Devices, Inc. Other names and brands may be claimed as the property of others. CONTACT: Seraphina WeeCorporate Communications and PR leadAvnet Asia Pte LtdSeraphina.Wee@AVNET.COM
BEIJING, Dec. 12, 2025 /PRNewswire/ -- In recent weeks, Chindata Group has announced two significant partnerships with HEC Group, advancing coordinated development across Shaoguan in Guangdong Province and Ulanqab in Inner Mongolia. Together, the initiatives aim to integrate industrial production, high-density computing infrastructure and renewable energy into coordinated, multi-gigawatt clusters designed specifically for the demands of the AI era. Both projects share a common objective: combining Chindata's hyperscale data center expertise with HEC's capabilities in electronic materials, power-electronics components and liquid-cooling technologies. The collaborations underscore the rising convergence of industrial manufacturing and AI compute infrastructure as demand grows for sustainable, high-density digital infrastructure. Shaoguan: Building an AI-ready, Green Compute Campus Chindata and HEC are expanding their partnership with the Shaoguan municipal government to develop a gigawatt-level, zero-carbon compute campus as part of a broader industrial ecosystem. The first phase will be built on an approximately 132,000 m² site in the Qujiang Economic Development Zone. It is planned to provide 150 MW of IT capacity and will form the anchor for a long-term build-out toward multi-gigawatt scale. The initiative also involves expanding regional grid capacity, enhancing renewable-power access, and establishing an upstream electronic-materials production base to support next-generation AI servers and advanced cooling technologies. Together, these developments are expected to give strong momentum to Shaoguan's ambitions to grow a competitive, hyperscale digital-industry cluster. Ulanqab: China's First Direct-Renewable AI Industrial Demonstration Zone Chindata and HEC, in collaboration with the Ulanqab municipal government, are establishing China's first gigawatt-scale, vertically integrated demonstration zone powered directly by dedicated, private-wire green electricity. This initiative follows an Integrated Energy-Compute-Production Model, combining renewable generation, grid infrastructure, AI compute capacity, and energy storage into a tightly coordinated regional ecosystem. The project features a gigawatt-scale, low-carbon AI-ready data center campus that anchors regional energy demand, alongside HEC's world-class electrode-foil production facilities, forming a fully integrated industrial-compute cluster. The regional ecosystem operates as a closed loop in which industrial activity drives compute demand, compute workloads drive energy consumption, and direct renewable access reduces costs and carbon emissions for both manufacturing and digital operations. Together with the Shaoguan project, this collaboration demonstrates the shared strategy of combining hyperscale compute, renewable energy, and industrial capacity, while highlighting Ulanqab's distinctive approach to regional innovation and vertically integrated, low-carbon infrastructure. Unified Vision for Integrated, Low-Carbon AI Infrastructure Chindata CEO Wu Huapeng said the two agreements highlight the accelerating convergence of clean energy and high-performance computing. He noted that Shaoguan's advantages in renewable resources and Ulanqab's exceptional wind-and-solar potential enable the company to replicate and scale a new generation of hyperscale, low-carbon data center campuses. Wu emphasized that Chindata will move quickly to advance project construction, integrate HEC Group's strengths in high-performance electronic components and liquid-cooling technologies, and provide safe, efficient, and climate-responsible computing capacity tailored for a wide range of AI and industrial applications. HEC Group Chairman Zhang Yushuai emphasized the company's core capabilities—including electronic materials, advanced capacitors, fluorinated cooling liquids, liquid-cooling components, and AI-powered manufacturing lines—align naturally with Chindata's AI infrastructure. He noted that both Shaoguan and Ulanqab offer significant potential for building an end-to-end AI-industry ecosystem, covering materials, intelligent manufacturing, AI-assisted R&D, embodied-intelligence robotics, and large-model training and inference. Zhang said HEC Group will work with Chindata to expand vertically integrated AI industry clusters and support local governments in developing next-generation digital and materials industries. Local Government Support Authorities in both Shaoguan and Ulanqab have expressed strong backing for the initiatives, underscoring their alignment with regional priorities in emerging industries, renewable-energy deployment and digital transformation. Local governments have committed to coordinated planning, streamlined administrative processes and supportive policies to ensure smooth project delivery. Advancing Large-Scale Green Compute These two partnerships represent a significant step in advancing high-capacity, energy-efficient computing infrastructure. By combining hyperscale data center development, renewable-energy systems, and industrial-materials manufacturing, Chindata and HEC aim to create replicable models for integrated, low-carbon growth and effective industrial-compute collaboration across multiple regions. About Chindata Group Chindata Group is a leading carrier-neutral hyperscale data center solution provider and a pioneer in AI-ready facilities in China. Guided by its mission to "efficiently convert electrical power into computing power" and driven by innovation, the company focuses on the planning, investment, design, construction, and operation of high-performance, reliable, and low-carbon computing infrastructure.
Citi Taiwan’s Commercial Bank and Deloitte Taiwan recently co-hosted the ‘2026 Global Economic Outlook Forum’. Experts from Citi were invited to analyze the global economic landscape in 2026 and Taiwan’s economic prospects alongside Taiwanese enterprises. The forum also highlighted investment opportunities and development potential for Taiwanese businesses in Central and Eastern Europe (CEE). Citi maintains a positive view of Taiwan’s future economic outlook, expecting overall conditions to remain on a growth trajectory driven by vigorous tech export performance and industrial upgrading. According to statistics from the Ministry of Finance1, Taiwan's exports in September delivered an impressive performance, reaching US$54.25 billion, up 33.8% year-on-year. This growth, benefiting from strong demand for advanced technologies such as artificial intelligence (AI) and high-performance computing, marked the 23rd consecutive month of positive growth. Electronic components along with information & communications technology (ICT) and audiovisual products served as primary growth drivers, registering annual growth rates of 25.6% and 86.9%, respectively. The ministry forecasts that exports will continue their upward trend into the fourth quarter of 2025, with full-year export performance hitting a historic high. This robust momentum in exports and the technology sector in 2025 will lay a solid foundation for Taiwan’s economic development in 2026. Looking ahead to Taiwan’s economic development in 2026, Adrienne Lui, Citi’s Economist, stated that Taiwan's competitiveness in the AI and semiconductor supply chains gives it considerable advantages in responding to changes and adjusting its global positioning. She emphasized that regardless of how the situation evolves, considering factors such as proximity to the U.S. market, production costs, and regional trade frameworks, markets such as ASEAN, Mexico, and the European Union will remain critical for Taiwanese enterprises as they adapt to the new trade system and adjust their global positioning. As global supply chains undergo restructuring and geopolitical conditions continue to evolve, companies are reassessing their cross-regional deployment strategies. In addition to strengthening their presence in Asian markets, determining how to further expand production and sales bases connected to Europe has become a key strategic issue. Supported by energy transition initiatives, industrial reshoring, and supply chain diversification, Europe and the CEE region are steadily emerging as hotspots amid a new wave of global investment. Citi’s Global Network Banking Head for the Czech Republic, Elisa Chen, noted: “Across Europe, governments are actively advancing nuclear and renewable energy development. Countries such as the Czech Republic, Hungary, and Romania have already commenced construction of next-generation nuclear power facilities. Although Germany’s economic growth has temporarily softened, it is expected to maintain approximately 1% to 2% growth between 2026 and 2027. Beyond its established manufacturing base, the CEE region also benefits from zero tariffs in the EU market and relatively limited exposure to U.S. trade tariffs, making it an attractive option for companies seeking to diversify risk and maintain operational flexibility amid global supply chain reconfiguration.” Michelle Yu, Head of Citi Taiwan Commercial Banking, stated: “In the face of rapidly evolving political and economic dynamics, strengthening global supply chain resilience has become a top priority for enterprises. To address the needs of different industry supply chains, Citi not only provides the most up-to-date local market intelligence and in-depth analysis but also leverages our multinational teams of experts to help clients develop business strategies and navigate the challenges of cross-border investment and operations.” Munir Nanji, Citi’s Central Europe Head, emphasized: “Citi has a unique global network, covering 16 markets across CEE and a highly skilled, professional workforce. As more companies continue to establish operations in CEE, Citi supports Taiwanese corporate clients by offering comprehensive financial services through close collaboration between our Europe and Asia teams, helping them execute their cross-border investment and expansion strategies.” Amid rising geopolitical risks and ongoing shifts in economic policy, Citi continues to leverage its extensive global network to provide companies with cross-border financial solutions, including risk management and hedging strategies. With deep experience navigating diverse market conditions and a diversified business footprint, Citi helps companies maintain sustainable operations in a volatile economic environment. Through its presence in more than 90 markets and financial services spanning over 180 markets, Citi delivers comprehensive support to clients with cross-border needs, enabling them to adapt their global strategies with agility and capitalize on opportunities amid an ever-changing international landscape. Citi has operated in Taiwan for more than 60 years, consistently serving corporate and institutional clients and earning broad recognition from international financial publications, including: Best International Bank for Sustainable Finance from The Asset for 22 consecutive years; Best International Bank from FinanceAsia for the 28th time; Best International Corporate and Institutional Adviser from The Asset for 10 years; Best International M&A Adviser and Best Subcustodian in Taiwan from The Asset for eight successive years; Best International Investment Bank from Euromoney for four consecutive years; and Best Commercial Bank from The Asset for two years running.
SHANGHAI, Dec. 10, 2025 /PRNewswire/ -- USI's MCC has developed a new packaging approach that integrates Vacuum Printing Encapsulation (VPE) with high–aspect ratio copper pillar mass-transfer technology, the company said. After three years of development, the process is now being used in capsule endoscope modules and high-thermal-efficiency power management unit (PMU) modules for mobile devices, expanding the company's presence in system-in-package (SiP) miniaturization competence. In addition, MCC also integrated advanced wire-bonding and board-level selective encapsulation techniques for RF power amplifier modules used in telecom base stations, signaling USI's ambition to strengthen its position in hybrid system-in-package. The rapid rise of AI-driven applications is accelerating the intelligent upgrade of consumer electronics, pushing module design complexity to new heights. As development timelines become increasingly critical to new product launches, traditional molding technologies face limitations such as transfer molding and compression molding. Their reliance on costly BT substrates and customized molds often extends development cycles to more than 12 weeks, creating risks of delayed time-to-market. VPE process can cut development time by up to 90% and reduce module development costs by roughly 30% by enabling manufacturers to replace BT substrates by lower-cost FR4 PCBs. The room-temperature, low-pressure VPE method is especially suited for components sensitive to heat or mold pressure, such as MEMS, high-aspect-ratio copper pillars, and high-loop wire bonding, this approach enhances design flexibility for early-stage and low-volume, high-mix products, accelerating the market adoption of high-reliability miniaturization technologies. "VPE also supports heterogeneous integration for high performance computing and high power modules," said Li-Cheng Shen, AVP of the MCC in USI. He added that three Wi-Fi modules developed with VPE have passed X-ray, SAT, FCT, MSL3 and TCT testing, with performance comparable to conventionally molded products. MCC offers a full development platform that includes design capabilities, mass-production-grade equipment, a dedicated SiP laboratory and an NPI production line. The center supports customers from early-stage concept design through to production ramp-up, with a focus on manufacturability of complex SiP architectures. The company said it will continue to expand test vehicle verification and equipment capability and capacity improvement as part of its strategy to support next-generation miniaturization module development amid rising demands for AI-enabled electronics. About USI (SSE: 601231) USI, Universal Scientific Industrial (Shanghai) Co., Ltd., is a global leader in electronic design and manufacturing as well as a leader in the field of SiP (System-in-Package) technology. Our production and service locations span four continents: Asia, Europe, the Americas, and Africa, offering customer diversified electronic products with D(MS)2 services: Design, Manufacturing, Miniaturization, Industrial software, and hardware Solutions, as well as material procurement, logistics and maintenance Services. USI is a subsidiary of ASE Technology Holding Co., Ltd. (TWSE: 3711, NYSE: ASX). To learn more, please visit www.usiglobal.com and engage with us on LinkedIn and YouTube.
A12 藝術空間
high-performance computing
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