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SHANGHAI, April 20, 2023 /PRNewswire/ -- Driven by 5G, consumer electronics, automotive electronics, and innovative smart applications, new packaging technologies represented by SiP are gradually emerging. The high-reliability components and semiconductor markets are experiencing explosive growth in demand for high-density, miniaturized products. In order to meet these advanced processes, material, and packaging applications and developments, USI (SSE: 601231) develops advanced electronic component Failure Analysis (FA) technology to meet the increasingly complex and diverse needs of SiP miniaturized products. The general failure analysis procedure consists of three key steps: confirming the failure mode, analyzing the failure mechanism, and verifying the failure mechanism and root cause, followed by proposing improvement actions. The importance of failure analysis in the integrated circuit industry chain is increasing. It is necessary to rely on more advanced and precise equipment and technology by rational failure analysis to improve the success rate of failure analysis. To minimize process issues, USI utilizes a high-resolution 3D X-Ray to locate the position of abnormal components and uses laser layer removal and re-ball technology to extract the main chip in the SiP module. Meanwhile, USI uses X-ray photoelectron spectroscopy (XPS) and Fourier-transform infrared spectroscopy (FTIR) to identify the source of organic contaminants on the component's surface, continuously strengthening its capabilities in the SiP module failure analysis field. X-ray inspection does not damage the tested object, so it is considered an essential non-destructive FA technology in analyzing failure points of SiP packaged components. In addition to observing defects inside the SiP package or substrate, it can also inspect the internal structure of various components. USI has introduced high-resolution nano-level 3D X-Ray, which uses a rotating sample to obtain two-dimensional X-ray tomography images of different orientations in space. It combines these images into a three-dimensional X-ray tomography image through computer algorithms. As the chip size and pitch of solder balls continue to shrink, traditional chemical decapsulation and direct chip extraction can cause damage to some chips' redistribution layer (RDL) and insulation layer. USI's R&D personnel have solved the problem of extracting and completing chip testing from the SiP module without damaging the original state of the chip through a series of methods, including finely grinding the back of the chip, laser cutting around the chip, ball mounting with a high-precision laser ball mounting machine, and cross-validating chip performance. Due to chemical composition changes on the surface or micro-region of components or chips caused by pollution oxidation, corrosion, migration, processes, and environment, there are numerous failures. Therefore, in-situ analysis of micro-region composition is crucial. In addition to energy dispersive spectroscopy (EDS) used in conjunction with scanning electron microscopy (SEM), USI has introduced high-sensitivity analysis facilities such as XPS and FTIR. XPS can perform elemental and chemical state analysis and measure longitudinal concentration distributions of elements from the surface to the interior with the help of ion beam sputtering, analyzing the thickness of oxide or pollution layers and the concentration distribution of dopants. FTIR mainly analyzes the composition and content of organic and semiconductor materials that absorb infrared. The infrared spectra with a microscope can perform micro-region analysis with thickness at the micron level, effectively tracking the origin of organic contaminants and determining the problem's root cause. Robbie Tong, the Director of the New Product Development Department of USI, said," With the continuous development of new electronic materials, new types of components, and advanced packaging processes for high-end chips, the technology and capabilities of failure analysis must keep pace with the times. Through the continuous exploration of researchers, the SiP module failure analysis method of USI has gradually become mature and continuously improved various detection and analysis technologies have played a key role in improving product quality and reducing losses from defective products." About USI (SSE: 601231) USI, Universal Scientific Industrial (Shanghai) Co., Ltd., is a global leader in electronic design and manufacturing as well as a leader in the field of SiP (System-in-Package) modules. USI provides D(MS)2 product services: Design, Manufacturing, Miniaturization, Industrial software and hardware Solutions, and material procurement, logistics and maintenance Services. With Asteelflash, USI has 28 sales, production and service locations across four continents of Asia, Europe, Americas and Africa, and offers customer diversified products in the sectors of wireless communication, computer and storage, consumer, industrial, medical and automotive electronics worldwide. USI is a subsidiary of ASE Technology Holding Co., Ltd. (TWSE: 3711, NYSE: ASX). To learn more, please visit www.usiglobal.com and engage with us on LinkedIn and YouTube.
With this feature, customers can ensure higher-quality software development, reduced time-to-market, and enhanced customer satisfaction NOIDA, India and SAN FRANCISCO, June 6, 2023 /PRNewswire/ -- LambdaTest, an intelligent and unified enterprise test execution cloud platform, has introduced an AI-powered test failure analysis feature in HyperExecute, its blazing-fast, smart test execution and orchestration platform. This path-breaking new feature will enable digital businesses to streamline their troubleshooting and remediation process for test case failures in a single click. With the new feature, HyperExecute users will no longer have to do the time-consuming and cumbersome manual test log analysis. The platform will categorize errors, enabling swift identification of failure types, thereby saving time and increasing developer feedback velocity. After identifying the failure type, LambdaTest will offer a structured approach to address it through precise corrective measures or recommended remedies. This targeted approach empowers users to do a quicker resolution of failure by eliminating unnecessary manual steps and instead optimizing for efficiency. "With the introduction of AI-powered test failure analysis, we are significantly reducing the time required for root cause analysis (RCA). Our overall aim is to enhance the productivity of testing teams by elevating the efficiency and effectiveness of the QA process. With this feature, development teams can now concentrate their efforts on implementing accurate solutions. This is a fundamental shift from a blunt test execution platform to an AI-powered test orchestration co-pilot that assists developer and QA teams in every stage of quality validation. The resulting reduction in turnaround time facilitates faster bug fixes, higher-quality software development, reduced time-to-market, and enhanced end-customer satisfaction," said Mayank Bhola, Co-founder and Head of Product, LambdaTest. Also, LambdaTest has added new features to its test intelligence analytics platform to enable users to have enhanced control over Selenium command logs. Key features include quick issue identification, response statuses over time, endpoint usage analysis, and bug fixes prioritization. For more details, visit: https://www.lambdatest.com/test-intelligence/failure-analysis About LambdaTest LambdaTest is an AI-powered unified enterprise test execution cloud platform that helps businesses drastically reduce time to market through faster test execution, ensuring quality releases and accelerated digital transformation. Over 10,000+ enterprise customers and 2+ million users across 130+ countries rely on LambdaTest for their testing needs. Browser & App Testing Cloud allows users to run both manual and automated tests of web and mobile apps across 3000+ different browsers, real devices, and operating system environments. HyperExecute helps customers run and orchestrate test grids in the cloud for any framework and programming language at blazing-fast speeds to cut down on quality test time, helping developers build software faster. For more information, please visit, https://www.lambdatest.com or contact the LambdaTest press office: press@lambdatest.com
Hsinchu, Taiwan – May 6, 2025 —Compound semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN) are core technologies in automotive semiconductors and power management ICs. These materials are widely applied in electric vehicles, energy storage systems, data centers, 5G, and aerospace, driving a comprehensive upgrade in high-temperature, high-voltage, high-current, high-speed, and high-frequency testing, packaging, and process automation technologies. In collaboration with global automated test leader Teradyne and National Yang-Ming Chiao Tung University, ACE Solution hosted the "Compound Semiconductor Testing Technology and Automation Forum" on April 30. The event brought together experts from industry, academia, and research institutions to explore application trends, testing fixtures, and automation solutions. In his opening remarks, Tony Hsu, Vice President of Marketing at ACE Solution, emphasized the strategic importance of power systems in next-generation technologies: " As electric vehicles (EVs), 5G communications, high-performance computing (HPC), and AI servers continue to develop rapidly, the ability to deliver stable and high-performance power—along with advancements in power buffering, power delivery systems, and battery management—has become a critical challenge for industrial transformation. In response to global shifts and industry needs, ACE Solution remains committed to deepening its expertise in testing and automation. We look forward to working with experts across diverse sectors to drive innovation and accelerate the industry's upgrade." The forum featured a distinguished lineup of speakers who shared insights into the full technology chain, from semiconductor testing to smart manufacturing. Dr. Hsiao Yi-Kai, Team Leader at Foxconn, delivered a presentation titled "SiC in the AI Era: Intelligent Design Accelerates Power Technology Innovation," providing an in-depth look at key silicon carbide (SiC) applications in the AI-driven age. Jason Hsieh, Sales Manager at ACE Solution, shared his perspective on "Compound Semiconductor Trends & High-Power Testing Innovations," highlighting how evolving device architectures shape testing demands. Dr. Harry Kuan, R&D Manager at ACE Solution, addressed "Compound Semiconductor Wafer Testing and Advanced 3D Package Failure Analysis," showcasing advanced diagnostic techniques for next-generation packaging. Edward Weng, Product Marketing Manager at Onsemi, presented a case study on applying DrWBG technology in AI servers, illustrating how compound semiconductors reshape computing infrastructure. Kenny Wang, Business Development Manager at Teradyne Robotics, concluded the event with his talk "Building a Stable, Unmanned Delivery Network with MiR," outlining how robotics and automation are paving the way for smart semiconductor manufacturing. In addition to the insightful presentations, the event also featured three major technology showcases: High-Power Analog and Mixed-Signal Testing Solutions, Wafer Materials, and 3DIC Non-Destructive Testing, and Semiconductor Collaborative Robots Automation, all of which received enthusiastic responses from attendees. ACE Solution has partnered with Teradyne to jointly develop the ETS testing solution to address the challenges of precise testing for high-power components, 3DIC packaging inspection, and improving production efficiency. This collaboration successfully overcomes the limitations of high-power analog and mixed-signal testing. In addition, ACE Solution utilizes terahertz technology for non-destructive inspection of wafer materials and 3DIC packaging, offering a comprehensive suite of capabilities ranging from materials analysis (MA) and failure analysis (FA) to automotive semiconductor validation. For smart manufacturing, ACE Solution also provides automated solutions using UR/MiR collaborative robots, enabling industry partners to transition from R&D to mass production seamlessly. These innovations significantly enhance process efficiency and accuracy while reducing labor demands and overall costs. ACE Solution remains committed to deepening collaborations with strategic partners across the compound semiconductor value chain, joining academia, industry, and government forces to build a globally integrated ecosystem. For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3407 E-mail: pr@acesolution.com.tw Website: https://www.acesolution.com.tw/en/ About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to the specific requirements of our customers in the field of electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished team of technical experts who offer unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively.
Hsinchu, Taiwan–September 10, 2025–ACE Solution, in collaboration with Taiwan Nano & Micro-Photonics, made a strong presence at SEMICON 2025, one of the world’s most influential semiconductor exhibitions. ACE Solution showcased their latest semiconductor and silicon photonics solutions, featuring five key technologies: Silicon Photonics Sensing Platform, Silicon Photonics and Optical Communication Solutions, Teradyne Compound Semiconductor Test, TZ-6000 Non-Destructive Material and Wafer Inspection, and 3DIC Advanced Packaging Non-Destructive Inspection. Each demonstration received enthusiastic responses and attracted a wide range of industry professionals. ACE Solution highlighted its core strength of “from materials to wafers to packaging,” showcasing its deep expertise in testing and system integration. Quantifi Photonics, with its integrated opto-electrical testing system, enables ultra-high transmission speeds and reduced energy consumption, bridging groundbreaking research with efficient production testing. In the fast-growing automotive and renewable energy industries, the Teradyne Compound Semiconductor Test system drew significant attention. As the industry’s top power IC testing platform, it can achieve up to 6000V and 4000A, supporting testing needs for EV power systems, battery management, as well as Gallium Nitride (GaN) and Silicon Carbide (SiC) power modules, power discrete, and mixed-signal devices. In the field of material and wafer inspection, the TZ-6000 provides non-destructive quality measurement solutions. Leveraging terahertz (THz) technology, it achieves higher penetration depth for semiconductor wafer materials such as silicon, SiC, and GaN, and supports various sizes and shapes to ensure wafer quality. It enables comprehensive quality control for thickness, refractive index, resistivity, dielectric constant, localized surface/subsurface defects, and full-wafer scanning. For 3DIC advanced packaging non-destructive inspection, the Electro-Optical Terahertz Pulse Reflectometer (EOTPR) stood out with its 5-micron precision positioning capability. It is the world’s first instrument to use isolation technology for integrated circuit packaging fault analysis and quality monitoring, making it another highlight of the exhibition. ACE Solution remains committed to a customer-centric approach, focusing on developing advanced testing technologies that deliver higher efficiency and lower power consumption. By addressing the rising demand in high-performance computing, electric vehicles, and AI applications, ACE Solution will continue to develop customized inspection solutions and deepen collaborations with global partners to drive innovation and sustainable growth in the semiconductor industry. For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Peter Lee, Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw Website: https://www.acesolution.com.tw/en/ About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to the specific requirements of our customers in the field of electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished team of technical experts who offer unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively.
台灣新竹，2025年09月10日–筑波科技（ACE Solution）攜手台灣奈微光科技（Taiwan Nano & Micro-Photonics）亮相於全球最具影響力半導體展會 — SEMICON 2025，展出最新的半導體及矽光子四大方案：為矽光子感測平台、矽光子與光通訊方案、Teradyne 化合物半導體測試、TZ-6000 非破壞材料和晶圓檢測、3DIC 高階封裝非破壞性檢測。各項設備展示皆獲得熱烈迴響，吸引眾多專業人士駐足。 筑波科技以「從材料到晶圓再到封裝」為核心，充分展現公司在檢測與系統整合領域的深厚實力。Quantifi Photonics藉由混合的光電信號一體化的測試系統架構，極大傳輸速率和降低能耗，實現突破性實驗到推動高效生產測試。 在車用與新能源產業備受關注的議題，Teradyne 化合物半導體測試成為一大焦點，為業界最高規格之功率IC測試平台，最高測試可以達到6000V、4000A，符合電動車的電源、電池管理及氮化鎵 (GaN) 與碳化矽 (SiC) 功率模組、功率分立元件 (Power discrete)、混合訊號 (Mix-signal) 等測試需求。 在材料和晶圓檢測領域，TZ-6000 提供非破壞性的品質測量方案。TZ-6000使用太赫茲（THz）技術，在半導體晶圓材料如矽、SiC 和 GaN 有更高的穿透深度，可適用各種尺寸和形狀來確保晶圓的高品質。針對厚度、折射率、電阻率、介電常數、選定位置表面/ 次表面缺陷和整面晶圓掃描達成品質管控。 在3DIC 高階封裝非破壞性檢測領域，電光太赫茲脈衝反射儀 (EOTPR) 以其 5 微米的高精度定位能力，是全球首款使用隔離技術檢測積體電路封裝故障分析和監測封裝品質的設備，成為展會另一大亮點。 筑波科技秉持以客戶為核心，專注於檢測技術研發，推動更高效率、更低能耗的解決方案，回應高速運算、電動車及人工智慧應用的龐大需求。未來，筑波將持續研發客製化的檢測方案與研發，深化與全球夥伴的合作，共同推動半導體產業的創新與永續發展。 聯絡筑波科技 筑波科技股份有限公司ACE Solution, Co., Ltd. 地址：新竹縣竹北市台元街28號2樓之1 電話：03-5500909 電子郵件：service@acesolution.com.tw 網站：https://www.acesolution.com.tw/en/index/ 關於筑波科技（ACE Solution） 筑波科技（https://www.acesolution.com.tw/en/index/）成立於2000年，位於台灣新竹，在中國蘇州和深圳以及越南設有分公司，可提供服務。我們的使命是提供訂製的測試解決方案，以滿足電氣元件、設備和系統製造商的客戶需求，通過合作夥伴提供技術解決方案。我們專注於射頻、毫米波和太赫茲領域，擁有專業的技術支援團隊，提供專業、創新和多功能的綜合技術和解決方案。
HOUSTON, Dec. 11, 2024 /PRNewswire/ -- Viking Engineering, a 100% employee-owned GATE Energy company, is proud to announce that their laboratory division, Viking Laboratory Services, has successfully achieved ISO 17025 accreditation. ISO 17025 is the international standard for testing and calibration laboratories. It sets out requirements for the competence, impartiality, and consistent operation of laboratories, ensuring the accuracy and reliability of their testing and collaboration results. This significant achievement recognizes Viking Engineering's commitment to providing the highest quality of metallurgical testing services to the oil and gas industry and aims at expanding into other areas including new energies, industrial and chemical plants. Mario Guerra, Director of Failure Analysis, Integrity and Material Testing Services for Viking, stated, "Achieving ISO 17025 accreditation is yet another testament that Viking Laboratory Services is a synonym of materials testing and engineering excellence. ISO 17025 accreditation not only provides assurance to our customers, but also a framework for continuous improvement to all the services we offer. The commitment from the entire team has been tremendous and we are immensely proud of this accomplishment." Jorge Garduño, President of Viking Engineering, stated, "Viking Engineering has been performing failure investigations and root cause analysis work for more than 20 years. Through the years, when specimens were available to examine and test, we would rely on external laboratories to perform material testing under Viking's direction. This sometimes left us with limited visibility of certain aspects of the testing being undertaken but most importantly, it limited our ability to control the testing schedule and prioritize as needed." "We were blessed to have the opportunity to open our own lab and start it from the ground up in early 2020. The Viking Lab now allows us to provide complete failure analysis and material qualification testing to our clients without depending on external labs. The ISO 17025 accreditation is another key metric of how Viking continues to not only grow organically but also become better by always keeping quality at the forefront of everything we do. I am so proud of our team, and I am happy to share this news with our industry friends and comunity." Read more about the Viking ISO 17025 Accreditation Scope and Accreditation here: https://customer.a2la.org/index.cfm?event=directory.detail&labPID=0D27ACB3-5FA8-40B2-9A3F-F6502AE79C93 About Viking Engineering Viking Engineering, a 100% employee-owned company, is the specialty engineering and analysis arm of GATE Energy. Viking supports the design, optimization and integrity of energy facilities and assets. The Viking Laboratory is a full-service metallurgical testing laboratory dedicated to investigating and solving failures. Viking is a strong believer in applying lessons learned from their failure analysis team back to the design phases and into field practices via their quality assurance and engineering teams. For more information on Viking Engineering www.vikingeng.energy About GATE Energy GATE Energy, a 100% employee-owned ESOP, provides predictable project delivery services to the energy sector. They design, build, commission, and start energy facilities and assets without cost and schedule blowouts by using parametric prediction models, providing tight project controls and by actively eliminating operation problems during the project's design phase. For more information on GATE Energy, visit www.gate.energy
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failure analysis
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