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Teledyne DALSA AxCIS Contact Image Sensor The new AxCIS is a high-speed, high-resolution line scan solution for space limited systems WATERLOO, Ontario, Nov. 30, 2023 (GLOBE NEWSWIRE) -- Teledyne DALSA is pleased to announce that its AxCIS™ family of high-speed and high-resolution fully integrated line scan imaging modules are in production. These easy-to-use Contact Image Sensors (CIS) combine sensors, lenses, and lights all-in-one, offering a lower cost inspection system for many demanding machine vision applications. Powered by Teledyne’s multiline CMOS image sensors, AxCIS delivers superior image quality, up to 120 kHz line rates for mono, or 60 kHz x 2 for HDR imaging, at a pixel size of 28 µm or 900 dpi resolution, so that defects can be detected with unprecedented precision. Its unique sensor design covers the entire field of view without missing pixels, providing a 100% seamless image without any interpolation. HDR imaging is achieved using dual rows with independent exposure control, which enables better detectability for highly reflective materials with improved dynamic range. In addition to defect detection, its unique design also supports true metrology applications. AxCIS has been designed with scalability to various fields of view with a single 24V power supply. With a small form factor and an optical path with an IP60 dust proof design, AxCIS can fit almost anywhere in your system, even with limited vertical clearance. Its Camera Link HS SFP+ fibreoptic interface delivers high throughput data over standard low-cost, long-length cables with immunity to EMI radiation for harsh industrial environments. Please visit the AxCIS product page for more information and for sales enquiries, visit our contact page. Teledyne DALSA is a part of Teledyne’s Vision Solutions group and a leader in the design, manufacture, and deployment of digital imaging components for machine vision. Teledyne DALSA image sensors, cameras, smart cameras, frame grabbers, software, and vision solutions are at the heart of thousands of inspection systems around the world and across multiple industries. For more information, visit www.teledynedalsa.com/imaging. Media ContactJessica BroomJessica.broom@teledyne.com A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/30f63c2f-758c-4dfc-bace-e1351b500c6f
WATERLOO, Canada, July 09, 2024 (GLOBE NEWSWIRE) -- Teledyne DALSA is pleased to announce that its AxCIS™ family of high-speed and high-resolution fully integrated line scan imaging modules are now available in color. These easy-to-use Contact Image Sensors (CIS) combine sensors, lenses, and lights all-in-one, offering a lower cost inspection system for many demanding machine vision applications including battery and print inspection. Powered by Teledyne’s multiline CMOS image sensors, AxCIS delivers superior image quality with up to a 60 kHz x 3-line rate of native RGB colors, at a pixel size of 28 µm or 900 dpi resolution, so that defects can be detected with unprecedented precision. Its unique sensor design covers the entire field of view without missing pixels, providing a 100% seamless image without any interpolation. In addition to defect detection, its unique design also supports true metrology applications. AxCIS has been designed with scalability to various fields of view with a single 24V power supply. With a small form factor and an optical path with an IP50 dust proof design, AxCIS can fit almost anywhere in your system, even with limited vertical clearance. Its Camera Link HS SFP+ fibreoptic interface delivers high throughput data over standard low-cost, long-length cables with immunity to EMI radiation for harsh industrial environments. Please visit the AxCIS product page for more information and for sales enquiries, visit our contact page. Teledyne DALSA is a part of Teledyne’s Vision Solutions group and a leader in the design, manufacture, and deployment of digital imaging components for machine vision. Teledyne DALSA image sensors, cameras, smart cameras, frame grabbers, software, and vision solutions are at the heart of thousands of inspection systems around the world and across multiple industries. For more information, visit www.teledynedalsa.com/imaging. Media ContactJessica BroomJessica.broom@teledyne.com A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/03e316ba-79a6-4903-8f72-76e48faaaf99
GRENOBLE, France, Feb. 25, 2025 (GLOBE NEWSWIRE) -- Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, introduces Lince5M™ NIR, a state-of-the-art high-speed CMOS image sensor. Leveraging Teledyne e2v’s advanced imaging technologies, this new sensor delivers enhanced performance in both visible and near-infrared (NIR) wavelengths, making it ideal for a wide range of commercial, industrial, and medical applications. The Lince5M NIR is a monochrome image sensor with a resolution of 5.2 megapixels (2,560 x 2,048). Building on the established Lince5M, this new sensor combines high-speed capabilities and high Quantum Efficiency (35% at 850 nm) in both visible and near-infrared wavelengths. It achieves a high frame rate of 250 fps (full resolution, 12-bit ADC), using the 24 LVDS output channels. Lince5M NIR delivers superior performance for demanding applications that require sharp images at very high-speeds and in low-light conditions, such as motion capture, sport analytics, industrial metrology, retinal imaging, and intelligent traffic monitoring. Designed around Teledyne e2v’s 5 µm global shutter pixel, this image sensor offers a dynamic range of 55 dB in standard mode and over 100 dB in High Dynamic Range mode, making it perfect for observing high-contrast scenes. Lince5M NIR is housed in a robust 28 x 28 mm 181 PGA (Pin-Grid Array) ceramic package and features a 1-inch optical format compatible with a broad range of C-mount lenses, for cost-effective camera integration. With an operating temperature range from -40°C up to 125°C, the Lince5M NIR is suitable for both indoor and outdoor applications. François Trolez, Marketing Manager at Teledyne e2v, said, “We are very pleased to release Lince5M NIR, specifically designed to offer unique features for high-speed imaging beyond the visible spectrum, with high performance in the near-infrared region. With its robust design, Lince5M NIR meets the demands of both industrial and commercial applications. Camera manufacturers currently using our Lince5M will find it easy to switch to Lince5M NIR, as both products share the same mechanical and electrical interfaces. This new product will enhance our ability to address new markets and applications.” Lince5M NIR will be showcased during Vision China, Shanghai, China from 26-28 March 2025. Visit us on Teledyne stand 5413 in Hall W5 or contact us online for more information. Documentation, samples, and kits for evaluation or development are available upon request. About Teledyne e2v Teledyne e2v innovations lead developments in healthcare, life sciences, space, transportation, defense and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of their customers and partnering with them to provide innovative standard, semi-custom or fully custom imaging solutions, bringing increased value to their systems. For more information, visit https://www.teledynevisionsolutions.com/ Teledyne e2v media enquiries contact:Jessica.Broom@teledyne.com A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/9a26992d-b72c-43e8-9c89-5b13b58e21fb
Teledyne e2v's Emerald Gen2 Emerald Gen2 is ideal for applications that require sharp images at very high speeds GRENOBLE, France, Nov. 21, 2023 (GLOBE NEWSWIRE) -- Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces Emerald™ Gen2, its new state-of-the-art CMOS image sensor family. Built on Teledyne e2v’s advanced imaging technologies, this new family delivers enhanced performance, making the new sensors ideal for a wide range of machine vision uses, outdoor surveillance, and traffic detection and monitoring cameras. Emerald Gen2 is available in 8.9-Megapixels (4,096 x 2,160) or 12-Megapixels (4,096 x 3,072), in monochrome or color, and in two-speed grades, standard and high. The high-speed models provide superior performance for demanding applications that require sharp images at very high speeds, such as food sorting, inspection, and Intelligent Traffic Systems. The sensor has a small 2.8 µm global shutter pixel, designed with Teledyne e2v’s latest generation light pipe technology, which provides up to 67 dB dynamic range in 10-bit and 12-bit ADC mode. This allows cameras to work in high-contrast scenes without any exposure issues in the images. This new generation has several improved features compared to the original Emerald family. Its matrix is centered in a compact 21 x 20 mm² Ceramic Land Grid Array (CLGA) package, which fits 1-inch optical formats for easier and more cost-effective integration. It has two types of output, LVDS and MIPI CSI 2, providing camera manufacturers with the option to use either interface, depending on their customer's requirements. It also offers excellent low-noise performance with < 3e- readout noise and increased sensitivity and angular response with dual-light pipe technology. Maxime Taupin, Marketing Manager at Teledyne e2v, said, “We’re excited to launch the Emerald Gen2 sensor family, which has been specifically designed for the current and future demands of multiple industries. With improved electro-optical performance and the flexibility to choose outputs, this new generation of sensors provides cameras manufacturers with high-performance solutions for a wide range of demanding customer needs.” See a live demo of Emerald Gen2 at the International Technical Exhibition on Image Technology and Equipment (ITE), Yokohama, Japan 6-8 December 2023. Visit us on Teledyne stand D-04 or contact us online for more information. Documentation and samples are available now upon request. About Teledyne e2v Teledyne e2v innovations lead developments in healthcare, life sciences, space, transportation, defense and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of their customers and partnering with them to provide innovative standard, semi-custom or fully custom imaging solutions, bringing increased value to their systems. For more information, visit imaging.teledyne-e2v.com. Teledyne e2v media enquiries contact:Jessica.Broom@teledyne.com A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/392af852-8c4d-417a-970c-7e396437b14b
New AI tool simplifies counting inspections for manufacturers across all industries NATICK, Mass., Aug. 6, 2024 /PRNewswire/ -- Cognex Corporation (NASDAQ: CGNX), the leader in industrial machine vision, expanded the capabilities of its In-Sight SnAPP™ vision sensor with the launch of an AI-enabled counting tool. This innovative software tool transforms how manufacturers handle counting tasks, allowing them to easily automate assembly verification and quantity checks that were previously time-consuming or prone to error. This advanced AI technology also provides an ease of use that lets more manufacturers accurately count challenging part types including objects of similar size, reflective and distorted parts, and objects with varying contrasts and shapes. The In-Sight SnAPP machine vision camera, which now has access to an AI-powered counting tool. "Using cutting-edge AI technology and our easy-to-use vision sensors, we're now providing our customers with a counting solution that not only enhances accuracy and efficiency but also simplifies the user experience," said Lavanya Manohar, Senior Vice President of Products. "We're excited to see how this innovation will benefit manufacturers worldwide and continue making automation more accessible." Powered by AI, the new tool reliably identifies and counts objects to ensure consistent quality control, without complex programming. Image-based training, guided setup, and embedded AI allow operators of all skill levels to quickly and effectively solve counting tasks, eliminating the need for complex setups or extensive training. Suitable for a wide range of industries, the counting tool can be set up in minutes to perform a range of tasks. Food and beverage producers can easily count the number of food products in final packaging to ensure completeness. Pharmaceutical companies can verify the correct count of vaccine vials or count pills in a blister pack. Automotive manufacturers can quickly count modules in an EV battery pack tray to confirm proper assembly and avoid recalls. The In-Sight SnAPP vision sensor was first released in September 2023 and is designed to solve common quality control tasks including presence/absence detection, basic inspections, classification, and now counting applications. For more information about In-Sight SnAPP, visit cognex.com/in-sight-snapp or call 1-855-4-COGNEX. About Cognex Corporation Cognex Corporation invents and commercializes technologies that address some of the most critical manufacturing and distribution challenges. We are a leading global provider of machine vision products and solutions that improve efficiency and quality in high-growth-potential businesses across attractive industrial end markets. Our solutions blend physical products and software to capture and analyze visual information, allowing for the automation of manufacturing and distribution tasks for customers worldwide. Machine vision products are used to automate the manufacturing or distribution and tracking of discrete items, such as mobile phones, electric vehicle batteries and e-commerce packages, by locating, identifying, inspecting, and measuring them. Machine vision is important for applications in which human vision is inadequate to meet requirements for size, accuracy, or speed, or in instances where substantial cost savings or quality improvements are maintained. Cognex is the world's leader in the machine vision industry, having shipped more than 4.5 million image-based products, representing over $11 billion in cumulative revenue, since the company's founding in 1981. Headquartered in Natick, Massachusetts, USA, Cognex has offices and distributors located throughout the Americas, Europe, and Asia. For details, visit cognex.com. IR ContactNathan McCurrenHead of Investor RelationsCognex Corporationir@cognex.com Media ContactJeremy SaccoSenior Manager, Global Content MarketingCognex Corporationpr@cognex.com The In-Sight SnAPP counting tool can verify the correct number of pills in a blister pack - even through reflective surfaces.
SINGAPORE, Oct. 29, 2025 /PRNewswire/ -- MetaOptics Ltd (Catalist: 9MT) ("MetaOptics"), a leading-edge semiconductor optics company pioneering metalens technology, is pleased to announce the establishment of its United States entity, MetaOptics Inc. (USA), registered in Nevada. This expansion affirms MetaOptics' commitment to advancing next-generation optical technologies and strengthening cross-border collaborations in semiconductor manufacturing, integrated photonics, and nanophotonics. The formation of MetaOptics Inc. (USA) marks a key milestone in the Company's global strategy to deliver high-performance metaoptics solutions to customers across North America. MetaOptics now extends its metalens design & manufacturing expertise to many world class USA clients and partners across the United States in the field of 5G smart phones, data communications, data centers, fiber optics, AI semiconductor manufacturing, and consumer electronics. In parallel with this corporate expansion, MetaOptics has achieved a major technical breakthrough by successfully prototyping a 127μm diameter co-packaged optical component for integrated circuit and chip-making applications. Co-packaged optics, which combine electrical and optical functions in ultra-compact form factors, are widely recognised for delivering significant gains in bandwidth, energy efficiency, and signal integrity in data centers and AI infrastructure. MetaOptics' new 127μm diameter device is expected to set new benchmarks for miniaturisation and scalability, positioning the Company at the forefront of next-generation optical interconnects. Further amplifying its innovation journey, MetaOptics has initiated discussions with a renowned USA university to co-develop a "tunable metalens" project, aimed at realising dynamic and reconfigurable optical systems for future photonics applications. Tunable metalenses are an emerging class of optical devices whose properties can be modified post-fabrication, enabling breakthroughs in advanced imaging, sensing, and AR/VR functionalities. MetaOptics is also in actively engaging several major USA-based technology companies to explore partnership opportunities in metaoptics solutions for data communications, next-generation sensors, and smart devices. These engagements underscore MetaOptics' commitment to expanding its presence in the USA, and growing its market presence in the USA, and driving technological leadership in optical innovation. Mr. Thng Chong Kim, Executive Chairman and CEO of MetaOptics Ltd, commented, "Establishing MetaOptics Inc. (USA) reflects our dedication to scaling cutting-edge optical technologies for global markets, with the USA as a strategic growth base. Our new advances in co-packaged optics and collaborations with world-class USA institutions demonstrate our resolve to innovate and drive value for customers in the semiconductor and photonics markets." MetaOptics will be participating in CES 2026 from January 6th to January 9th in Las Vegas, USA, and will unveil a series of cutting-edge innovations in metalens imaging and optical technology. MetaOptics has successfully completed manufacturing several 12-inch glass wafers featuring its 5-megapixel color imaging rectangular metalens. Early lab results demonstrate significantly sharper image quality and higher resolution compared to the previous round metalens generation. In addition, a generation 2 thinner Pico Projector is underway, with printed circuit boards currently in assembly with working samples expected to debut at CES 2026. A major highlight at the exhibition would be MetaOptics' 5G Metalens Smart Phone prototype – a groundbreaking 6mm-thin AI-powered phone that integrates the proprietary color imaging metalens camera without the traditional camera bump. This device also features a 3D non-contact fingerprint sensor, showcasing the diverse capabilities and compact integration potential of metalens technology. - END - About MetaOptics Ltd MetaOptics Ltd (Catalist: 9MT) is a leading-edge semiconductor optics company pioneering glass-based metalens solutions enhanced by AI-driven image processing. Using advanced optical design and a scalable 12-inch DUV lithography process, it powers next-generation applications in CPO, mobile, AR VR, automotive and other emerging markets. Headquartered in Singapore, MetaOptics aims to deliver high-performance optics with the reliability and scalability demanded by today's most innovative technology brands. For sales inquiries, please contact sales@metaoptics.sg. This press release is issued by DLK Advisory Limited on behalf of MetaOptics Ltd. This press release has been reviewed by the Company's sponsor, ZICO Capital Pte. Ltd. (the "Sponsor"). This press release has not been examined or approved by the Singapore Exchange Securities Trading Limited (the "SGX-ST") and the SGX-ST assumes no responsibility for the contents of this press release, including the correctness of any of the statements or opinions made or reports contained in this press release.
A12 藝術空間
contact image sensor
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