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符合「compound semiconductor」新聞搜尋結果, 共 29 篇 ,以下為 25 - 29 篇 訂閱此列表,掌握最新動態
ITRI Set to Strengthen Taiwan-UK Collaboration on Semiconductors

HSINCHU, Taiwan, June 17, 2023 /PRNewswire/ -- The newly established Department for Science, Innovation and Technology (DSIT) in the UK has recently released the UK's National Semiconductor Strategy. Dr. Shih-Chieh Chang, General Director of Electronic and Optoelectronic System Research Laboratories at the Industrial Technology Research Institute (ITRI) of Taiwan had an initial exchange with DSIT. During the exchange, Dr. Chang suggested that Taiwan can become a trustable partner for the UK and that the partnership can leverage collective strengths to create mutually beneficial developments. According to the Strategy, the British government plans to invest 1 billion pounds over the next decade to support the semiconductor industry. This funding will improve access to infrastructure, power more research and development and facilitate greater international cooperation. ITRI offers consultation services for advanced packaging pilot lines, facilitates pre-production evaluations, and strengthens supply chain resilience. Dr. Chang stressed that ITRI looks forward to more collaboration with the UK on semiconductors to enhance the resilience of the supply chain. While the UK possesses cutting-edge capabilities in semiconductor IP design and compound semiconductor technology, ITRI has extensive expertise in semiconductor technology R&D and trial production. As a result, ITRI is well-positioned to offer consultation services for advanced packaging pilot lines, facilitate pre-production evaluation, and link British semiconductor IP design companies with Taiwan's semiconductor industry chain. "The expansion of British manufacturers' service capacity in Taiwan would create a mutually beneficial outcome for both Taiwan and the UK," said Dr. Chang. The British Office Taipei stated that the UK has been increasing collaboration with Taiwan on semiconductors over the last few years. In 2020, the Compound Semiconductor Applications Catapult (CSA Catapult) signed a memorandum of understanding with ITRI, paving the way for a long-lasting collaborative partnership. The Department for Business and Trade (DBT) is also focusing the Digital Trade Network in Taiwan to increase the UK's capability to support semiconductor trade and investment. Recognizing ITRI as a crucial driving force for Taiwan's semiconductor industry development, the British Office Taipei looks forward to more cooperation with ITRI for technological innovation, supply chain collaboration and stronger partnership. Dr. Chang indicated possible collaboration that can be forged to align the goals of the UK's National Semiconductor Strategy and the positive impact to expect. ITRI, he suggested, can assist in establishing relevant pilot lines by introducing necessary resources to address existing gaps or offering consultation services covering design, packaging and testing prior to mass production. This would help reduce the UK's reliance on external suppliers and thus create job opportunities. To minimize the risk of supply chain disruptions, the linkage of Taiwan's complete semiconductor industry chain can significantly enhance the UK's resilience in the global market as more comprehensive solutions can shorten time-to-market for innovative products and accelerate overall industrial development. Other than the collaboration with CSA Catapult on GaN semiconductor technologies, ITRI partnered with a renowned British semiconductor equipment manufacturer in 2021, resulting in achievements in areas such as HBLED, MEMS, Micro LED, silicon photonics, and nanoscale analysis. In the same year, ITRI worked with a leading British semiconductor IP manufacturer to jointly build a platform that assists startup companies in leveraging key patents to develop competitive new products. Based on the fruitful results, ITRI is set to expand its collaborative efforts with the UK in 2023, creating win-win opportunities for both sides. About ITRI Industrial Technology Research Institute (ITRI) is one of the world's leading technology R&D institutions aiming to innovate a better future for society. Founded in 1973, ITRI has played a vital role in transforming Taiwan's industries from labor-intensive into innovation-driven. To address market needs and global trends, it has launched its 2030 Technology Strategy & Roadmap and focuses on innovation development in Smart Living, Quality Health, and Sustainable Environment. It also strives to strengthen Intelligentization Enabling Technology to support diversified applications. Over the years, ITRI has been dedicated to incubating startups and spinoffs, including well-known names such as UMC and TSMC. In addition to its headquarters in Taiwan, ITRI has branch offices in the U.S., Europe, and Japan in an effort to extend its R&D scope and promote international cooperation across the globe. For more information, please visit https://www.itri.org/eng.        

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 3924 加入收藏 :
Collaboration Insights of TZ6000 from TeraView– The Nondestructive Wafer Testing Accomplishment in Semiconductor Industry

Dr. Don Arnone is the CEO of TeraView. In March 2023, he visited ACE Solution (ACE), the Taiwan representative partner that launched the TZ6000, a non-destructive wafer quality measurement tool. It incorporates with TeraView's TeraPulse Lx technologies, particularly for crucial applications such as wafer and substrate defect inspection. TZ6000 characterizes the wafer properties by thickness, refractive index, resistivity, dielectric constant, and surface/subsurface defects scanning graph.   Key Driving Factors for TZ6000 Success and Market Advantages To explore the market for TZ6000, Dr. Don Arnone shares two influencing factors: " One is to transmit product information; the other is to make a demonstration to customer in terms of favorable impression." Since 2023, the proof of concept (POC), the initial sales, will rely on sturdy teamwork. Based on ACE and TeraView professionals, TZ6000 is the thriving base for forward-looking. TeraView possesses competitive advantages of Terahertz instrument experience, while ACE has tremendous expertise for integration solutions such as TZ6000. Under the two leading companies' cross-border cooperation, it will bring an unprecedented solution for customers.   Subsurface Damage (SSD) of semiconductor wafers commonly happens in the surface machining process. At present, wafer inspection relies on VIS/IR/UV optical inspection that can analyze the surface properties of the wafer but not the SSD because of its low penetration depth. Terahertz (THz) waves have the features of high penetration depth in semiconductor wafers for silicon, silicon carbide, and gallium nitride. Therefore, THz-based TZ6000 can meet the market needs for compound semiconductor wafer non-destructive inspection.   TZ6000 Accomplishment Insights from ACE and TeraView From Dr. Don Arnone's viewpoint, there are three takeaways for TZ6000 task achievement. ACE works enthusiastically and hard to reach our milestones and follows customer requirements. In addition, team flexibility brings the capability to address the challenge of market adoption. These factors are also key to take the TZ6000 from the project phase through to final commercialization. TeraView's TeraPulse Lx System is the pioneer product for terahertz analysis. Specifically, it meets material inspection in imaging or spectroscopy applications for the compound semiconductor industry. The modular architecture and patented laser-gated photoconductive emitters and detectors are flexible and expandable. The system also boasts an industry-leading 3,200 ps time-delay line as standard. With a lightweight, compact core unit that allows easy transport, the TeraPulse Lx System incorporates the TeraPulse Lx modules to meet market demands.   Steve Hsu, President of ACE, says it's a precious chance to collaborate with TeraView. ACE takes the lead in electrical precision tests, integrating service and solution. Through the TeraPulase Lx module and TZ6000 system incorporation, it frames a unique THz-TDS probe for simultaneous measurement of multiple parameters of wafer characterization. In the wafer manufacturing and R&D process, TZ6000 possesses user-friendly and graphically illustrated software for quality inspection. "TeraView and ACE have very complimentary skills and experience. Our partnership is a representative case of international cooperation. I'm proud of this unique accomplishment and enjoying working with President Steve's team.", Dr. Don Arnone says with trust. Starting the TZ6000 business in Taiwan, ACE has confidence in creating a great business via technology integration in the long run.     About ACE Solution Founded in 2000, ACE Solution (https://www.acesolution.com.tw/en/index/) locates in Hsinchu City, Taiwan, with branch offices in Suzhou and Shenzhen, China. Our mission is to provide customized test solutions to meet customer needs in electrical components, devices, and system manufacturing and provide technology solutions through our partners. We focus on RF, mmWave, and terahertz with the expert technical support team. ACE Solution offers professional, innovative, and multi-functional integrated techniques and solutions.   About TeraView Founded in 2001, TeraView (https://teraview.com/) is the world’s first and leading company solely focused on applying terahertz light to solve customer issues. A spin-out from the Toshiba Corporation and Cambridge University, TeraView has developed its proprietary technology across many markets. These include fault analysis and quality assurance for semiconductor chips used in mobile computing and communications and non-destructive inspection of high-value coatings used in the automotive, pharmaceutical, food, and solar industries.     Contact ACE Solution, Co., Ltd. Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 E-mail: thzlab@acebiotek.com Website: https://www.acesolution.com.tw/en/index/ https://www.acebiotek.com/en/thz-service/apply

文章來源 : 筑波科技股份有限公司 發表時間 : 瀏覽次數 : 3191 加入收藏 :
Infineon to acquire GaN Systems, strengthening its GaN portfolio and further reinforcing its global leadership in Power Systems

MUNICH, GERMANY AND OTTAWA, CANADA - Media OutReach - 3 March 2023 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and GaN Systems Inc. ("GaN Systems") announced that the companies have signed a definitive agreement under which Infineon will acquire GaN Systems for US$830 million. GaN Systems is a global technology leader in the development of GaN-based solutions for power conversion. The company is headquartered in Ottawa, Canada, and has more than 200 employees. "GaN technology is paving the way for more energy-efficient and CO2-saving solutions that support decarbonization. Adoption in applications like mobile charging, data center power supplies, residential solar inverters, and onboard chargers for electric vehicles is at the tipping point, leading to a dynamic market growth," said Jochen Hanebeck, CEO of Infineon. "The planned acquisition of GaN Systems will significantly accelerate our GaN roadmap, based on unmatched R&D resources, application understanding and customer project pipeline. Following our strategy, the combination will further strengthen Infineon's leadership in Power Systems through mastery of all relevant power technologies, be it on silicon, silicon carbide or gallium nitride." Jim Witham, CEO of GaN Systems, said: "The GaN Systems team is excited about teaming up with Infineon to create highly differentiating customer offerings, based on bringing together complementary strengths. With our joint expertise in providing superior solutions, we will optimally leverage the potential of GaN. Combining GaN Systems' foundry corridors with Infineon's in-house manufacturing capacity enables maximum growth capability to serve the accelerating adoption of GaN in a wide range of our target markets. I am very proud of what GaN Systems has accomplished so far and cannot wait to help write the next chapter together with Infineon. As an integrated device manufacturer with a broad technology capability, Infineon enables us to unleash our full potential." As a wide bandgap material, GaN offers customer value by higher power density, higher efficiency, and size reductions, especially at higher switching frequencies. These properties enable energy savings and smaller form factors, making GaN suited for a wide range of applications. By 2027, market analysts expect the GaN revenue for power applications to grow by 56% CAGR to approx. US$2 billion (source: Yole, Compound Semiconductor Market Monitor-Module I Q4 2022). As such, GaN is becoming a key material for power semiconductors, alongside silicon and silicon-carbide, and coupled with new topologies, such as Hybrid Flyback and multi-level implementations. In February 2022, Infineon announced doubling down on wide bandgap by investing more than €2 billion in a new frontend fab in Kulim, Malaysia, strengthening its market position. The first wafers will leave the fab in the second half of 2024, adding to Infineon's existing wide bandgap manufacturing capacities in Villach, Austria. The planned acquisition of GaN Systems in an all-cash transaction will be funded from existing liquidity. The transaction is subject to customary closing conditions, including regulatory approvals. Hashtag: #Infineon #GaN #semiconductor #acquisitionThe issuer is solely responsible for the content of this announcement.About InfineonInfineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The company has around 56,200 employees worldwide and generated revenue of about €14.2 billion in the 2022 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY). This press release is available online at www.infineon.com/press Follow us: Twitter - Facebook - LinkedInAbout GaN SystemsGaN Systems is a global leader in GaN power semiconductors with a broad portfolio of transistors which address the needs of today's most demanding industries including consumer electronics, data center servers and power supplies, renewable energy systems, industrial motors, and automotive electronics. This press release is available online at www.gansystems.com/press-releases Follow us: Twitter - Facebook - LinkedIn

文章來源 : Media OutReach Limited 發表時間 : 瀏覽次數 : 4415 加入收藏 :
陽明交大與瑞典Linköping University (LiU)參訪筑波集團-攜手智慧醫療與化合物半導體產學創新

筑波集團從3C到3醫,基於20年無線通訊、IoT軟硬體整合經驗,開發智慧醫院上傳、第三代化合物半導體材料測試等方案。國立陽明交通大學及瑞典Linköping University (LiU)林雪平大學率團來訪交流,參觀智慧醫療、太赫茲(Terahertz, THz)應用及半導體方案應用成果。   產學跨界平台鏈結半導體創新材料應用 陽明交大承接國科會化合物半導體重大發展計畫之一,將碳化矽(SiC)、氮化鎵(GaN)與氧化鎵(Ga2O3)等新材料應用於Power IC、RF,藉此開發鏈結創新材料、軟體服務及設計平台成果,並透過跨產業與學術交流活動促成跨界合作。林雪平大學薄膜物理團隊(Thin Film Physics Division)對薄膜進行應用啟發的基礎研究,從根本上了解材料特性和鍍膜行為,並學習如何通過新的合成和加工方法使材料性能更好。研究涉及新型多功能材料的設計,用於硬質耐磨塗層、能源材料、磁性材料、電子產品、中子束繞射材料、寬帶隙半導體等。   陽明交大洪瑞華教授肯定:「筑波有別於其他材料檢測的公司,雙方能合作將THz技術用於非破壞性檢測、材料缺陷等分析,Uniiform智慧手寫輔助系統則對教學輔助非常有幫助」;林雪平大學的團隊表示:「筑波智慧手寫輔助系統及材料檢測技術令人印象深刻,若能加入光偏振的THz橢偏儀技術,將能更進一步提升檢測技術應用層級並更廣泛的被用於半導體晶圓測試市場」。   筑波集團三大即戰力:無線通訊、智慧醫院、半導體整合測試 筑波集團致力於無線通訊、RF量測儀器設備、高頻、電子元件/模組等整合測試方案。自2014年起投入智慧醫療領域致力於早期病變精準醫療之篩檢技術與設備研發,結合AI開發Uniiform、智慧上傳閘道器(Data Stream, DS),各科別整合上傳方案如Spark智慧麻醉紀錄系統、看得健100智慧眼科紀錄系統、牙科。在半導體測試領域,筑波的THz技術之TZ-6000用於半導體晶圓測試市場,並與美商泰瑞達Teradyne攜手推廣Eagle Test System (ETS)系列,針對第三代半導體高電壓、高電流之車用測試提供整合設計,滿足各產業鏈客戶需求。   本次交流亦邀請TeraView 的科學家Dr. Philip F. Taday共襄盛舉,Teraview的電光太赫茲脈衝反射儀(EOTPR) 是世界上第一款使用隔離技術來檢測積體電路中封裝故障和監測封裝品質,是廣用作為積體電路封裝非破壞性缺陷檢測首選。藉由跨領域的切磋開創先進半導體材料研究、業界創新應用。

文章來源 : 筑波醫電股份有限公司 發表時間 : 瀏覽次數 : 17587 加入收藏 :
陽明交大與瑞典Linköping University (LiU)參訪筑波集團 攜手智慧醫療與化合物半導體產學創新

筑波集團從3C到3醫,基於20年無線通訊、IoT軟硬體整合經驗,開發智慧醫院上傳、第三代化合物半導體材料測試等方案。國立陽明交通大學及瑞典Linköping University (LiU)林雪坪大學率團來訪交流,參觀智慧醫療、太赫茲(Terahertz, THz)應用及半導體方案應用成果。   產學跨界平台鏈結半導體創新材料應用 陽明交大承接國科會化合物半導體重大發展計畫之一,將碳化矽(SiC)、氮化鎵(GaN)等新材料應用於Power IC、RF,藉此開發鏈結創新材料、軟體服務及設計平台成果,並透過跨產業與學術交流活動促成跨界合作。林雪坪大學半導體材料系主攻開發和研究新型電子材料,以寬能帶半導體、半導體器件、昇華材料單元為主,特別是SiC、III族氮化物和石墨烯,以應用瑞典和歐洲工業基礎產業區塊需求。   筑波集團三大即戰力:無線通訊、智慧醫院、半導體整合測試 筑波集團致力於無線通訊、RF量測儀器設備、高頻、電子元件/模組等整合測試方案。自2014年起投入智慧醫療領域致力於早期病變精準醫療之篩檢技術與設備研發,結合AI開發Uniiform智慧手寫輔助系統、智慧上傳閘道器(Data Stream, DS),各科別整合上傳方案如Spark智慧麻醉紀錄系統、看得健100智慧眼科紀錄系統、牙科。在半導體測試領域,筑波的THz技術之TZ-6000用於半導體晶圓測試市場,並與美商泰瑞達Teradyne攜手推廣Eagle Test System (ETS)系列,針對第三代半導體高電壓、高電流之車用測試提供整合設計,滿足各產業鏈客戶需求。   本次交流亦邀請TeraView 的科學家Dr. Philip F.共襄盛舉,Teraview的電光太赫茲脈衝反射儀(EOTPR) 是世界上第一款使用隔離技術來檢測積體電路中封裝故障和監測封裝品質,是廣用作為積體電路封裝非破壞性缺陷檢測首選。藉由跨領域的切磋開創先進半導體材料研究、業界創新應用。

文章來源 : 筑波醫電股份有限公司 發表時間 : 瀏覽次數 : 6025 加入收藏 :
2025 年 3 月 25 日 (星期二) 農曆二月廿六日
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