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ACE Solution will participate in SEMICON Taiwan 2024 from September 4th to 6th Location: TaiNEX Hall 1 Booth: K3076 @HON. PRECISION We will showcase the latest achievements in semiconductors and silicon photonics during the exhibition. ACE Solution will introduce the following solutions: 👉 Teradyne ETS Compound Semiconductor Testing: The industry’s highest-spec power IC testing platform accommodates a wide range of IC types, with testing capabilities reaching 6000V and 4000A. This platform addresses the challenges of high-current and high-voltage testing, particularly in electric vehicle power and battery management applications. 👉 TZ-6000 Non-Destructive Wafer and Material Inspection: Utilizing Terahertz (THz) technology, this solution offers superior penetration depth compared to silicon, silicon carbide, and gallium nitride for semiconductor wafers. It provides non-destructive measurements of wafer quality, including thickness, refractive index, resistivity, dielectric constant, surface/subsurface defects at selected locations, and full-wafer scanning. 👉 EOTPR Non-Destructive Testing for 3DIC Advanced Packaging: The Electro-Optical Terahertz Pulse Reflectometry (EOTPR) system delivers 5-micron accuracy for fault analysis in complex and advanced IC packaging, such as Package-on-Package (PoP), Flip-Chip, and Through-Silicon Via (TSV) in 3D packaging. EOTPR is widely adopted in advanced IC packaging fault analysis and is extensively deployed in quality assurance and inspection within manufacturing environments. 👉 Photonic Integrated Silicon Photonics Testing: In collaboration with Hon Precision, ACE Solution offers a highly integrated electro-optical signal testing system architecture. This solution supports high-capacity, high-channel testing to meet the demands of high-speed data transmission and increased data center traffic. Integrating photonics and electronics significantly enhances transmission rates while reducing power consumption, leading to improved testing efficiency. We will also be organizing booth tours during the exhibition. Due to limited availability, spots will be arranged based on actual conditions, so please register early：https://docs.google.com/forms/d/e/1FAIpQLSe5vtgle1wl4dIxliik12YMNnObdqAFD7DwdBYVIxaxMWqlxQ/viewform?fbzx=-6591255857878872603 We welcome partners from all sectors to visit and discuss technical and business cooperation. 📢 Follow ACE Group LinkedIn, to stay updated with the news! For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Peter Lee, Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw Website: https://www.acesolution.com.tw/en/ About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to our customers' specific requirements in electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished technical expert team offering unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge, integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively.
筑波科技將於2024年9月4日至9月6日參加SEMICON Taiwan 2024。 展會地點：台北南港展覽館一館 攤位：K3076 @鴻勁精密 展覽期間，筑波科技將展示我們在半導體及矽光子領域的最新成果，並介紹以下先進方案： 👉 Teradyne ETS 化合物半導體測試：為業界最高規格之功率IC測試平台，廣納不同IC類型，最高測試可以達到6000V、4000A，可解決因應高電流、高電壓測試需求的挑戰，特別是在電動車的電源、電池管理等應用。 👉 TZ-6000 非破壞性晶圓和材料檢測：太赫茲 (THz) 技術針對半導體晶圓能比矽、碳化矽和氮化鎵有更高的穿透深度。針對厚度、折射率、電阻率、介電常數、選定位置表面/次表面缺陷和整個晶圓掃描達成非破壞性晶圓品質測量。 👉 EOTPR 3DIC高階封裝非破壞性檢測：電光太赫茲脈衝反射儀 (EOTPR) 提供 5 微米的定位精准度以解決在手機和電腦應用中複雜且先進積體電路晶片封裝的故障分析，其應用的封裝形式如堆疊式封裝層迭 (PoP)、覆晶(Flip-Chip)和 3D 封裝中的矽通孔 (TSV)。目前 EOTPR已經廣泛的被先進 IC 封裝故障分析業界所使用，並且這項技術已在品質保證與檢驗的製造環境中大量部署。 👉 光電整合矽光子測試：筑波科技與鴻勁精密合作，提供光電整合，提供集成度高，混合的光電信號一體化的測試系統架構技術。滿足高容量、高通道的測試，滿足產品在高速傳輸需求及數據中心流量提升之需求。光電結合，極大提升傳輸速率和降低能號達到測試效率。 我們將安排Booth Tour，名額有限，將依實際狀況安排，請及早報名：https://docs.google.com/forms/d/e/1FAIpQLSe5vtgle1wl4dIxliik12YMNnObdqAFD7DwdBYVIxaxMWqlxQ/viewform?fbzx=-6591255857878872603 歡迎各界夥伴蒞臨攤位，與我們討論技術及商業合作。 📢 請追蹤筑波集團LinkedIn，掌握最新消息！ 聯絡筑波科技 筑波科技股份有限公司ACE Solution, Co., Ltd. 地址：新竹縣竹北市台元街28號2樓之1 電話：03-5500909 電子郵件：service@acesolution.com.tw 網站：https://www.acesolution.com.tw/en/index/ 關於筑波科技（ACE Solution） 筑波科技（https://www.acesolution.com.tw/en/index/）成立於2000年，位於台灣新竹，在中國蘇州和深圳以及越南設有分公司，可提供服務。我們的使命是提供訂製的測試解決方案，以滿足電氣元件、設備和系統製造商的客戶需求，通過合作夥伴提供技術解決方案。我們專注於射頻、毫米波和太赫茲領域，擁有專業的技術支援團隊，提供專業、創新和多功能的綜合技術和解決方案。
A12 藝術空間
battery quality inspection
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