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符合「automotive semiconductor」新聞搜尋結果, 共 20 篇 ,以下為 1 - 20 篇 訂閱此列表,掌握最新動態
Manz AG developed a breakthrough production solution of panel-level packaging to seize the growth of automotive semiconductor

Panel Level Packaging production solutions drive scale production of newly architecture automotive ICs Dedicated Total Fab Solutions build high-efficiency production lines for FOPLP from pilot line to mass production solutions Build best-in-class Cu-plating uniformity and high current density to increase yields and throughput TAOYUAN, Taiwan, May 23, 2023 /PRNewswire/ -- Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia 2023 on May 23-25 in Penang, Malaysia. The participation of this exhibition reflecting the company's focus on a total production solution of high-density packaging technologies that fulfill the high global demand for automotive chips. Highlighted within the Manz booth will be recent advancements in developing leading-edge Fan-Out Panel Level Packaging (FOPLP) solutions for ensuring higher efficiency and lower manufacturing cost. Manz has built the industrial largest 700 x 700 mm process area FOPLP redistribution layer (RDL) production lines. Combined with this work, the company provides Total Fab planning from customized process development, equipment construction to the integration of upstream and downstream manufacturing production lines. The full range of service helps automotive chipmakers facing the critical technological challenges of fine-pitch copper line formation in redistribution layers of FOPLP process. These innovative solutions satisfy the demand for high production yields, excellent Cu-plating uniformity and high-density packages to deliver high performance power management ICs for electric vehicles. With our full strength to drive FOPLP production solutions forward, we assist customers to pursue breakthrough production methodology as well as ESG targets by increasing energy efficiency, and waste reduction. Manz leveraging an open-architecture and modular design concept provides a comprehensive technology portfolio fulfilling the requirements of RDL process optimization and the flexibility to fit different stages of FOPLP production expansion. Seeing the huge growth of global automotive chip demand, Manz's production solutions transform FOPLP as the prevailing technology in the advanced packaging market.  FOPLP increases the performance of PMICs Electric vehicle architectures are rapidly evolving to accommodate high power density devices, multiple power electronics and controller ICs. Manz RDL technology provides high density of fine pitch metal interconnects that redistribute the I/O access to integrate multiple dies into one single package. With the line width and spacing (L/S) specification of 5/5µm ranges, enable a significant reduction in thickness, weight, and manufacturing costs of the packaging while performing complex pattering and complicated layers design to satisfy high density packaging requirements. PMIC Packaging made by Manz FOPLP production line Excellent uniformity, high thickness and fast speed of Cu-plating increase production yields plus assist customers for ESG targets The newly developed electroplating process ensure electroplating panel surface uniformity at 92%, the Cu thickness could reach ≧100 μm which increase chip density, heat dissipation and a high current density of up to 5 ASD to ensure higher process speed to boost overall manufacturing capacity. With unique automatic gentle handling and jig-free vertical electroplating systems, which can save the material purchase cost, as well as reduce the consumption of electroplating chemicals and the cost of maintenance to help customers achieving ESG targets. For more information please visit Manz website: https://reurl.cc/vklylA    

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 3454 加入收藏 :
LG Innotek to Showcase Mobility Innovations at CES 2025

AD/ADAS Sensing components, including the RGB-IR In-Cabin Camera Module, in the limelight Unveiling of new products for automotive communication and lighting, from AP modules to Nexlide Vision LAS VEGAS and SEOUL, South Korea, Jan. 7, 2025 /PRNewswire/ -- LG Innotek (CEO Moon Hyuksoo) will participate in the Consumer Electronics Show (CES) 2025 in Las Vegas from January 7 to 10, where it will unveil its innovations in future mobility. LG Innotek unveiled its CES 2025 booth during a Pre-Booth tour for Korean journalists on January 6. The booth, spanning approximately 3,500 square meters, will be located at the entrance of the West Hall in the Las Vegas Convention Center (LVCC). This year, the company has planned an exclusive exhibition dedicated to the theme of mobility. A representative of LG Innotek stated, "We focused on showcasing innovative mobility solutions that deliver distinguished customer value," and added, "We adopted a storytelling approach to enable visitors to vividly experience the unique solutions provided by LG Innotek from an end-user perspective." At the center of the exhibition booth will be a mockup of a future vehicle, showcasing 15 types of components for vehicle sensing, communication, and lighting—key business areas of LG Innotek. ■ AD/ADAS sensing components, including the RGB-IR In-Cabin Camera Module, in the limelight In the exhibition, LG Innotek will display many innovative products that are poised to spearhead its sensing components business for Autonomous Driving (AD) and Advanced Driver Assistance Systems (ADAS). One such example is the RGB-IR In-Cabin Camera Module, which will be unveiled for the first time at CES 2025. Equipped with a 5-megapixel RGB (red, green, blue) and IR (infrared) sensor, it can detect the driver's condition in real time to combat drowsiness. With a single compact camera module, it also monitors the condition of passengers, such as whether their seat belts are fastened in both the front and rear rows, improving space efficiency and design flexibility. Additionally, LG Innotek will exhibit its All-Weather Camera Solution, which adds a dust-cleaning function to the existing High-Performance Heating Camera Module. ■ Unveiling of new products for automotive communication and lighting, from AP modules to Nexlide Vision Vehicle communication components developed by incorporating LG Innotek's unparalleled proprietary wireless communication technology are also worth seeing. These include the 5G-V2X Communication Module; Next-Generation Digital Key Solution, combining Ultra-Wideband (UWB) radar technology; and Automotive AP Module, a new addition to LG Innotek's business portfolio of electronic components. AP modules, which are seeing increasing demand in the era of Software-Defined Vehicles (SDVs), are automotive semiconductor components that integrate automotive electronic systems such as ADAS and Digital Cockpit. They serve as the "brain" of a vehicle, similar to a computer's CPU. In addition, Nexlide A+, a vehicle lighting module that won the CES 2025 Innovation Award, will be showcased alongside other innovations in the vehicle mockup and Nexlide Zone, which was designed specifically to highlight LG Innotek's unique automotive lighting technologies and innovations. Among them, Nexlide Vision stands out. It combines the existing Pixel Lighting, which enables the vehicle's lighting to produce various text and animation effects, with Smart Film technology. This combination allows the simultaneous creation of not only pixels but also faces and line shapes, enhancing customer flexibility in design. Other products that will be on display include B-Link (Battery Link), the world's first combination of a wireless Battery Management System (BMS) and Battery Junction Box (BJB). This product is becoming increasingly popular as an essential component of electric vehicles. It uses miniaturization design technology for the efficient use of battery pack space. Compatible with both 400V and 800V chargers, it maximizes customer convenience. LG Innotek CEO Moon Hyuksoo said, "We anticipate the acquisition of new clients and business opportunities at CES 2025," and added, "LG Innotek aims to solidify its position as a total solution provider for future mobility." LG Innotek will also launch an online exhibition center on its website (https://lginnotek-virtualshowroom.com/ces-2025/) that replicates its offline booth at CES 2025. This platform will provide a multitude of information, including detailed information on products to be exhibited and a field sketch of the exhibition. Online visitors will be able to gain an interactive experience that makes them feel as if they are actually visiting the offline booth in person. Journalists participating in LG Innotek's Pre-Booth Tour on January 6 (local time).   Journalists participating in LG Innotek's Pre-Booth Tour on January 6 (local time).   LG Innotek’s vehicle lighting module, ‘Nexlide,’ showcased at CES 2025.   Overview of LG Innotek’s booth at CES 2025. [References] CES 2025 LG Innotek Booth by Zone <Open Booth> ①  Mobility Zone: Fifteen types of LG Innotek's core mobility components, including those for vehicle sensing, communication, and lighting, will be applied to a future vehicle mock-up—the highlight of the booth—and showcased to visitors. ②  Main Attractor Zone: This zone will feature a "User Scene"-based future mobility video that demonstrates how LG Innotek's various mobility components can transform drivers' daily lives. It will also include content introducing LG Innotek's new vision. ③  Nexlide Zone: This zone will display actual modules and exploded views of two of the latest Nexlide products. LG Innotek's patented technologies for automotive lighting, such as surface light source technology, will be presented in detail. The Nexlide-A+ product, which won the CES 2025 Innovation Award, will also be on display.  <Private Booth> ①  Smart and Safe Driving Zone:  Essential sensing components for safe driving, such as LiDAR (light detection and ranging) and the All-Weather Camera Solution, will be exhibited with demonstration videos. ②  Dynamic Space Zone: This zone will feature products that offer greater convenience for drivers and passengers inside vehicles, such as UWB digital keys and RGB-IR In-Cabin camera modules (5MP RGB-IR) designed for infotainment. ③  Sustainability Zone: This zone will display the wireless Battery Management System (BMS), which is becoming an essential part of electric vehicles, and B-Link (Battery Link), which combines BMS and Battery Junction Box (BJB) functions.  

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 145 加入收藏 :
Cargobase Secures SOC 2 Compliance For Leading Spot Freight Automation & Transportation Management System (TMS)

SINGAPORE, Nov. 20, 2024 /PRNewswire/ -- Cargobase, a logistics technology platform for enterprise shippers, today announced that it has achieved SOC 2 Type II compliance, specifically meeting the Security, Availability and Confidentiality (SAC) Trust Services Criteria. This independent verification underscores Cargobase's commitment to data security, system reliability and the protection of sensitive information, reinforcing the company's dedication to setting industry benchmarks in secure logistics solutions. This attestation complements Cargobase's ISO 27001 certification, further strengthening the foundation of trust our customers rely on. "We're proud to announce that Cargobase has achieved SOC 2 Type II compliance, demonstrating our commitment to data security and meeting the evolving needs of our clients. Recognizing the growing importance of this requirement within the industry, we've invested in robust security measures to provide our customers with the confidence and assurance they require," said Wiebe Helder, CEO at Cargobase. "In the dynamic world of logistics and supply chain management, large volumes of sensitive data are exchanged daily," said Arnout Wagenaar, Chief Strategy Officer at Cargobase. "Data security is paramount for our customers, who entrust us with information critical to their operations. Achieving SOC 2 Type II compliance underscores our unwavering commitment to data integrity and protection, thus building trust with our partners and allowing us to better serve the needs of enterprise shippers worldwide." Understanding SOC 2 Compliance The SOC 2 framework is a globally recognized standard developed by the American Institute of CPAs (AICPA). It focuses on Trust Services Criteria, including Security, Availability and Confidentiality to ensure that systems are protected from unauthorized access, reliably available to customers and employees, and that sensitive information remains confidential. What is SOC 2 Type II Compliance? Obtaining a SOC 2 report involves a CPA audit to attest to an organization's security controls. It aims to determine whether the controls put in place are designed correctly. Type I reports evaluate an organization's controls at a single point in time, whereas a Type II report examines how well those controls perform over a period of time (typically 3-12 months). What it means for our customers This achievement reaffirms Cargobase's position as a trusted partner for enterprise shippers worldwide. By prioritizing data security, we empower our clients to navigate the complexities of global logistics with peace of mind. ABOUT CARGOBASE Founded in Singapore in 2013, Cargobase is a global logistics software company whose mission is to simplify logistics for all. Its solution: "Logistics Software That Works". The Cargobase platform is designed for shippers to manage their local, regional or global supply chains across all freight modes, giving logistics professionals the visibility and control to make better decisions from day one. Cargobase TMS is used in 50 countries by leading enterprise shippers across Automotive, Semiconductor, Oil & Gas and Industrial Machinery sectors. Cargobase has offices in Singapore, Malaysia, Netherlands, Mexico, and the United States. For more information, visit www.cargobase.com.

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 166 加入收藏 :
2024壓軸登場!筑波科技化合物半導體與矽光子技術研討會,引領智慧製造未來

筑波科技 (ACE Solution) 攜手美商泰瑞達 (Teradyne),於2024年11月14日成功舉辦年度壓軸「化合物半導體與矽光子技術研討會」。本次活動由國立陽明交通大學、中原大學電子工程學系共同主辦,打造產官學交流平台。主題涵蓋Teradyne ETS高功率類比與混合訊號測試,適用於晶片探測 (CP)、良品晶片 (KGD)、功率器件 (PD)、功率模組 (PM) 等多樣需求。同時,矽光子結合半導體應用提供優化測試支援。太赫茲非破壞性檢測技術則適用於材料及晶圓測試及高階封裝的非破壞性測試方案。   此次特別融入半導體自動化應用,包括協作型機器人及自主移動機器人整合方案,靈活應用於智慧製造環境,提升操作效率並降低人力成本。隨著電動車及新能源市場需求增長,化合物半導體材料如碳化矽 (SiC) 和氮化鎵 (GaN),其高頻率、耐高壓及優異的散熱性能,成為車用半導體及電源管理IC關鍵技術。筑波科技攜手泰瑞達推廣ETS,提供業界最高規格功率IC測試平台可支持達6000V和4000A測試,應對高電流、高電壓需求。也應用太赫茲檢測技術,滿足非破壞性晶圓材料及3DIC高階封裝測試需求,涵蓋從研發到量產的製程管理,提升效率並減少潛在風險。   活動開幕引言由筑波科技許深福董事長致詞:「因應化合物半導體及車用市場需求,筑波科技致力於跨足產業鏈,專注提供彈性系統整合測試方案,引進協作手臂自走車,推動半導體產業的工廠自動化。很榮幸邀請來自全球的專家學者共同參與,期望創造更大的合作效益。」在上半場活動,由筑波科技工程部專案經理邱世耀介紹ETS測試系統在高功率類比與混合訊號測試上的應用,SEMI Taiwan/陽明交大光電所教授郭浩中則分享矽光子技術在AI Data Center前景。日本九州大學系統資訊科學研究生院資訊電子學系加藤和利教授也專題探討化合物半導體光混頻器於太赫茲波應用成果。會場提供四大展示體驗站,包括高功率類比與混合訊號測試方案、矽光子光電整合測試模組方案、晶圓及材料非破壞性測試方案,及UR與MiR的整合解決方案。   下半場活動由合晶科技新產品技術處資深處長徐文浩探討氮化鎵基板材料的創新應用,筑波科技總經理徐舜範分享UR (協作型機器人) 與 MiR (自主移動機器人) 半導體自動化應用,系統整合專案經理吳煜坤則介紹PXIE介面提升矽光子光電整合測試效率、相干光技術及多通道解決方案。最後,專案經理許永周講解化合物半導體材料晶圓及3DIC測試。   筑波科技期盼未來能與更多客戶及合作夥伴攜手合作,可提供完整測試與自動化解決方案,共同推動產業創新,拓展商業契機與市場機會。         聯絡筑波科技  筑波科技股份有限公司ACE Solution, Co., Ltd. 地址:新竹縣竹北市台元街28號2樓之1 電話:03-5500909 電子郵件:service@acesolution.com.tw 網站:https://www.acesolution.com.tw/en/index/     關於筑波科技(ACE Solution) 筑波科技(https://www.acesolution.com.tw/en/index/)成立於2000年,位於台灣新竹,在中國蘇州和深圳設有分公司。我們的使命是提供訂製的測試解決方案,以滿足電氣元件、設備和系統製造商的客戶需求,通過合作夥伴提供技術解決方案。我們專注於射頻、毫米波和太赫茲領域,擁有專業的技術支援團隊,提供專業、創新和多功能的綜合技術和解決方案。  

文章來源 : 筑波科技股份有限公司 發表時間 : 瀏覽次數 : 2485 加入收藏 :
Cyient, Allegro MicroSystems Partner to Drive Innovation in Magnetic Sensors & Power Semiconductors for Automotive Industry

HYDERABAD, India, Nov. 15, 2024 /PRNewswire/ -- Cyient, a global Intelligent Engineering services company, today announced the expansion of its partnership with Allegro MicroSystems, Inc. ("Allegro MicroSystems") (Nasdaq: ALGM), a global leader in power and sensing solutions for motion control and energy efficiency, with the inauguration of a Center of Excellence (CoE) in Hyderabad, India. The CoE, located at Cyient's Manikonda Campus, will focus on developing next-generation magnetic sensors and power semiconductor products for the automotive industry. The state-of-the-art facility was inaugurated by Allegro MicroSystems President & CEO Vineet Nargolwala in the presence of Max Glover, Senior Vice President WW Sales, Allegro MicroSystems, and Suman Narayan, Senior Vice President, Products, Allegro MicroSystems.     The CoE will house over 100 skilled engineers specializing in key areas such as post-silicon validation, design verification, analog design, analog mixed-signal verification, and embedded systems. This expansion significantly strengthens Allegro MicroSystems's presence in India, providing access to a highly skilled talent pool and fostering collaboration within the vibrant Indian technology ecosystem. The CoE will play a crucial role in accelerating the development of Allegro MicroSystems's sensor and power integrated circuit (IC) product portfolios, which are essential components in electric vehicles, advanced driver-assistance systems (ADAS) and other automotive applications. By leveraging Cyient's expertise in India, Allegro MicroSystems aims to bring innovative products to market faster and more efficiently. The collaboration will also focus on addressing key industry trends, including the increasing demand for magnetic sensors in electric vehicles, the rise of high-power devices such as SiC and GaN and the growing importance of embedded systems and platforms. "India's rapidly growing automotive market presents a tremendous opportunity for Allegro MicroSystems," said Vineet Nargolwala, CEO of Allegro MicroSystems. "This CoE established with Cyient's partnership, will enable us to accelerate innovation in magnetic sensors and power semiconductors, delivering cutting-edge solutions that address the evolving needs of the automotive industry. This investment reinforces Allegro MicroSystems's commitment to driving e-mobility, clean energy and automation forward, aligning perfectly with our vision for a safer, more sustainable and autonomous future." "Our relationship with Allegro MicroSystems has flourished over the past two years and we are incredibly proud of the team and the contributions they have made to Allegro MicroSystems's product portfolio. Semiconductors are at the heart of innovation across industries and this CoE strengthens Cyient's position as a leading partner for companies seeking to develop and manufacture cutting-edge semiconductor products," said Krishna Bodanapu, Executive Vice-Chairman & Managing Director, Cyient. This collaboration marks a significant milestone for both companies, reinforcing their commitment to driving innovation in the automotive semiconductor market. The CoE will not only contribute to the growth of the semiconductor industry in India but also support the global automotive industry's transition towards a more sustainable and technologically advanced future. About Allegro MicroSystems Allegro MicroSystems, Inc. is leveraging more than three decades of expertise in magnetic sensing and power ICs, to propel automotive, clean energy and industrial automation forward with solutions that enhance efficiency, performance and sustainability. Allegro MicroSystems's commitment to quality drives transformation across industries, reinforcing our status as a pioneer in "automotive grade" technology and a partner in our customers' success. For additional information, please visit https://www.allegromicro.com/en/.  About CyientCyient (Estd: 1991, NSE: CYIENT) delivers Intelligent Engineering solutions for creating a digital, autonomous and sustainable future for over 300 customers, including 30% of the top 100 global innovators. As a company, Cyient is committed to designing a culturally inclusive, socially responsible and environmentally sustainable tomorrow together with our stakeholders. For more information, please visit www.cyient.com. Cyient Contact: Gowtham UyallaKaizzen PRgowtham.uyalla@kaizzencomm.com Phalguna Hari JandhyalaCyient phalguna.harijandhyala@cyient.com Allegro MicroSystems Contact:   Tyler Weiland  Corporate Communications  (972) 571-7834 tweiland.cw@allegromicro.com  

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 731 加入收藏 :
敬邀:11/14筑波科技 化合物半導體與矽光子技術研討會

在電動車與新能源市場需求下,化合物半導體材料如碳化矽 (SiC) 和氮化鎵 (GaN) 具高頻率、耐高壓、優異的散熱性能和高效能轉換,成為車用半導體及電源管理IC的關鍵技術。在晶圓製造、檢測分析如材料分析 (MA)、故障分析 (FA) 及車用半導體測試,有效掌握從研發到量產的製程。   面對高效能運算和AI趨勢,矽光子和先進封裝技術,包括3DIC及矽光子技術,顯著提升頻寬互連能力。矽光子在高速通信和資料傳輸中展現出替代傳統電子元件的潛力,帶來高效能、低耗能的資料處理,提高系統整合密度和效率。特別是在AI、電動車(EV)及高速通信,矽光子和化合物半導體技術結合自動化為提升性能和效率提供重要支持。   筑波科技與美商Teradyne合作,推廣ETS解決功率器件和功率模塊測試,並利用太赫茲檢測分析技術,應對非破壞性Wafer材料測試及3DIC高階封裝的測試挑戰。誠摯邀請業界先進至報名網站,共同蒞臨參與。   日期:2024年11月14日(四) 12:30-17:00 地點:筑波醫電大樓1F 諾貝爾講堂(新竹縣竹北市生醫二路66號) 報名:https://register.acesolution.com.tw/20241114_WBGSemiconductor_Seminar   VIP貴賓/講師陣容/主題: 講師陣容: l   國立陽明交大 光電工程研究所/ SEMI Taiwan 郭浩中 教授:Recent Progress of SiPh for AI Data Center l   筑波科技 邱世耀 工程部專案經理:利用ETS測試系統應對高功率類比與混合訊號測試挑戰 l   日本九州大學 系統資訊科學研究生院 資訊電子學系 加藤 和利 教授:Compound Semiconductor Photomixer for Terahertz Wave Application l   合晶科技 徐文浩 新產品技術處資深處長:如何創新氮化鎵基板材料來引領多元應用市場 l   筑波科技 徐舜範 總經理:UR (協作型機器手臂) 與 MiR (自主載具車) 的協作解決方案:智能自動化的應用 l   筑波科技 吳煜坤 系統整合專案經理:以PXIE介面提升矽光子光電整合測試效率:相干光技術驗證與多通道解決方案 l   筑波科技 許永周 專案經理:化合物半導體材料Wafer與3DIC測試的挑戰與應用     聯絡筑波科技 筑波科技股份有限公司ACE Solution, Co., Ltd. 地址:新竹縣竹北市台元街28號2樓之1 電話:03-5500909 電子郵件:service@acesolution.com.tw 網站:https://www.acesolution.com.tw/en/index/   關於筑波科技(ACE Solution) 筑波科技(https://www.acesolution.com.tw/en/index/)成立於2000年,位於台灣新竹,在中國蘇州和深圳以及越南設有分公司,可提供服務。我們的使命是提供訂製的測試解決方案,以滿足電氣元件、設備和系統製造商的客戶需求,通過合作夥伴提供技術解決方案。我們專注於射頻、毫米波和太赫茲領域,擁有專業的技術支援團隊,提供專業、創新和多功能的綜合技術和解決方案。

文章來源 : 筑波科技股份有限公司 發表時間 : 瀏覽次數 : 2195 加入收藏 :
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