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SJSemi closed $700M new financing to further boost its Advanced Packaging projects

JIANGYIN, China, Dec. 31, 2024 /PRNewswire/ -- SJ Semiconductor Corporation (hereinafter referred to as "SJSemi" or "the company") announced the efficient and successful closure of a new financing round amounting to $700 million on Dec. 31, 2024. The roster of newly onboarded investors includes Wuxi Chanfa Science and Technology Innovation Fund, Jiangyin Binjiang Chengyuan Investment Group, Fortera Capital, Shanghai International Group, Lingang Xinxin Fund of Shanghai Lingang Special Area Administration and Lingang Shuke Fund of Lingang Group, together with Social Security Fund Zhongguancun Independent Innovation Fund, China Life Private Equity Investment Limited, Golden Link, etc. Since its inception in 2014, SJSemi has continuously dedicated to the high-quality and high-standard production of 12-inch mid-end wafers. Complementing this, SJSemi extends its service to offer advanced packaging and testing services for the whole process of wafer level advanced packaging and multi-die integration processing, which are widely used in smartphones, 5G communication, high-performance computing, data centers, automotive and other electronics fields. In the wake of the artificial intelligence and digital economy boom, SJSemi is able to provide a variety of advanced packaging solutions for Chiplet production and continues to increase investments in innovation and R&D efforts, especially in the 3D multi-die integration space. In 2023 and 2024, SJSemi witnessed remarkable revenue growth for two successive years. According to Yole's market research report, SJSemi is the company with the highest revenue growth among global OSATs in 2023. According to CIC Insight Consulting, SJSemi is ranked No.1 in market share in mainland China's 12-inch Bumping, 12-inch WLCSP markets, and is ranked No.1 in revenue in the wafer testing and chip probing market. As of 2024, SJSemi is currently the only provider capable of mass producing silicon-based 2.5D packaging solutions in mainland China. In recent years, SJSemi has made significant progress in advanced packaging technologies due to its commitment to innovation. In May 2024, SJSemi debuted its 3x reticle TSV interposer technology, marking the company's entry into a new era of sub-micron level advanced chip interconnect technology, further improving interconnect density in its products. The latest round of $700M USD in financing will help the company further technological progress into ultra-high density 3D Multi-Die Integration project, allowing it to strengthen its position as a leading advanced packaging provider, becoming a one-stop shop solutions provider for multi-die integration solutions. Mr. Cui Dong, Chairman and Chief Executive Officer of SJSemi, states that, while proceeding  toward the IPO application process, the company opened the latest round of new financing for patient capital and industrial capitals who are firmly aligned with the long-term vision of SJSemi. This will also help to improve and optimize the company's equity governance structure.  The synergy between SJSemi's strategic business planning and state-owned capital from both Wuxi and Shanghai will look to inject new momentum into the company's long-term development and success, positioning the company favorably to best capitalize on new opportunities in artificial intelligence and the digital economy!" About SJSemi Established in August 2014, SJ Semiconductor Co., Ltd. is the first Middle-End-Of-Line (MEOL) pure play foundry equipped with Front-End-Of-Line (FEOL) manufacturing and quality system, serving global customers. Starting with advanced 12-inch bumping and RDL, SJSemi devotes to offer world-class Middle-End-Of-Line (MEOL) manufacturing and testing services, and develops to provide the advanced 3D Multi-Die Integration technology and solutions. Headquartered in Jiangyin High-tech Industrial Development Zone, China, the company has branches in Shanghai and Silicon Valley of the United States, serving advanced chip design enterprises at home and abroad.

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 629 加入收藏 :
盛合晶微完成7億美元新增定向融資,耐心資本助力三維多芯片集成技術龍頭

江陰2024年12月31日 /美通社/ -- 盛合晶微半導體有限公司(SJ Semiconductor Co.以下簡稱「盛合晶微」)宣佈,面向耐心資本的7億美元定向融資已高效交割。本次新增投資人包括無錫產發科創基金、江陰濱江澄源投資集團、上海國投孚騰資本、上海國際集團、上海臨港新片區管委會新芯基金及臨港集團數科基金,以及社保基金中關村自主創新基金、國壽股權投資、Golden Link等。 高起點、高質量、高標準快速建設,盛合晶微自2014年起就致力於12英吋中段硅片製造,並進一步提供晶圓級先進封裝和多芯片集成加工等全流程的先進封裝測試服務,其終端產品廣泛應用於高性能運算、人工智能、數據中心、汽車電子、智能手機、5G通信等領域。在人工智能爆發、數字經濟建設持續推進的大趨勢下,盛合晶微著眼未來,持續加大研發創新投入,致力於三維多芯片集成先進封裝技術的迭代發展,不斷突破技術瓶頸,目前已形成了全流程芯粒多芯片集成加工的完整技術體系和量產能力。 2023和2024年公司連續兩年營收大幅增長。根據Yole市場研究報告,盛合晶微是全球封測行業2023年收入增長最高的企業。根據CIC灼識咨詢《全球先進封裝行業研究報告》有關2023年中國大陸地區先進封裝行業統計,盛合晶微12英吋中段凸塊Bumping加工產能第一,12英吋WLCSP市場佔有率第一,獨立CP晶圓測試收入規模第一。截止2024年其報告發佈之日,盛合晶微是大陸唯一規模量產硅基2.5D芯粒加工的企業。 近幾年,盛合晶微持續創新,精微至廣,在多個先進封裝技術工藝平台取得進步,2024年5月推出3倍光罩尺寸TSV硅通孔載板技術,標誌著其芯片互聯先進封裝技術邁入亞微米時代,有能力進一步提升芯片互聯密度,從而持續搶佔技術制高點,保持發展先機。本次超50億人民幣融資將助力公司正在推進的超高密度三維多芯片互聯集成加工項目建設,通過高性能集成封裝一站式服務,進一步提升公司在高端先進封裝領域的綜合技術實力,提升為數字經濟基礎設施建設服務的能力。 盛合晶微董事長兼首席執行官崔東先生表示:「本次增資是在公司推進上市過程中快速完成的,有針對性地引入堅定看好和願意長期支持公司發展的耐心資本和產業資本,藉以改善和優化公司股權治理結構,並結合公司長期發展規劃佈局,引入無錫市和上海市兩地國資投資,為公司長期發展注入新動能,也有利於公司與產業鏈生態的緊密協作,必將有力地推動公司繼續保持快速發展的新態勢,在人工智能和數字經濟發展新機遇下創造更大的價值,做出更大的貢獻!」 關於盛合晶微 盛合晶微半導體有限公司於2014年8月註冊成立,是全球首家採用集成電路前段芯片製造體系和標準,採用獨立專業代工模式服務全球客戶的中段硅片製造企業。以先進的12英吋凸塊和再布線加工起步,公司致力於提供世界一流的中段硅片製造和測試服務,並進一步發展先進的三維繫統集成芯片業務。公司總部位於中國江陰高新技術產業開發區,在上海和美國硅谷設有分支機構,服務於國內外先進的芯片設計企業。

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 1242 加入收藏 :
SK hynix Begins Volume Production of the World's First 12-Layer HBM3E

The company plans to supply the highest-performing, highest-capacity 12-layer HBM3E to customers by the end of the year DRAM chips made 40% thinner to increase capacity by 50% at the same thickness as the previous 8-layer product The company to continue HBM's success with outstanding product performance and competitiveness SEOUL, South Korea, Sept. 26, 2024 /PRNewswire/ -- SK hynix Inc. (or 'the company', www.skhynix.com) announced today that it has begun mass production of the world's first 12-layer HBM3E product with 36GB[1], the largest capacity of existing HBM[2] to date. HBM3E [1] Previously, the maximum capacity of HBM3E was 24GB from eight vertically stacked 3GB DRAM chips. [2] HBM (High Bandwidth Memory): This high-value, high-performance memory vertically interconnects multiple DRAM chips and dramatically increases data processing speed in comparison to traditional DRAM products. HBM3E is the extended version of HBM3, the fourth generation product that succeeds the previous generations of HBM, HBM2 and HBM2E. The company plans to supply mass-produced products to customers within the year, proving its overwhelming technology once again six months after delivering the HBM3E 8-layer product to customers for the first time in the industry in March this year. SK hynix is the only company in the world that has developed and supplied the entire HBM lineup from the first generation (HBM1) to the fifth generation (HBM3E), since releasing the world's first HBM in 2013. The company plans to continue its leadership in the AI memory market, addressing the growing needs of AI companies by being the first in the industry to mass-produce the 12-layer HBM3E. According to the company, the 12-layer HBM3E product meets the world's highest standards in all areas that are essential for AI memory including speed, capacity and stability. SK hynix has increased the speed of memory operations to 9.6 Gbps, the highest memory speed available today. If 'Llama 3 70B'[3], a Large Language Model (LLM), is driven by a single GPU equipped with four HBM3E products, it can read 70 billion total parameters 35 times within a second. [3] Llama 3: Open-source LLM released by Meta in April 2024, with 3 sizes in total: 8B (Billion), 70B, and 400B. SK hynix has increased the capacity by 50% by stacking 12 layers of 3GB DRAM chips at the same thickness as the previous eight-layer product. To achieve this, the company made each DRAM chip 40% thinner than before and stacked vertically using TSV[4] technology. The company also solved structural issues that arise from stacking thinner chips higher by applying its core technology, the Advanced MR-MUF[5] process. This allows to provide 10% higher heat dissipation performance compared to the previous generation, and secure the stability and reliability of the product through enhanced warpage controlling. [4] TSV (Through Silicon Via): This advanced packaging technology links upper and lower chips with an electrode that vertically passes through thousands of fine holes on DRAM chips. [5] MR-MUF (Mass Reflow Molded Underfill): The process of stacking semiconductor chips, injecting liquid protective materials between them to protect the circuit between chips, and hardening them. The process has proved to be more efficient and effective for heat dissipation, compared with the method of laying film-type materials for each chip stack. SK hynix's advanced MR-MUF technology is critical to securing a stable HBM mass production as it provides good warpage control and reduces the pressure on the chips being stacked. "SK hynix has once again broken through technological limits demonstrating our industry leadership in AI memory," said Justin Kim, President (Head of AI Infra) at SK hynix. "We will continue our position as the No.1 global AI memory provider as we steadily prepare next-generation memory products to overcome the challenges of the AI era." About SK hynix Inc. SK hynix Inc., headquartered in Korea, is the world's top-tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM"), flash memory chips ("NAND flash"), and CMOS Image Sensors ("CIS") for a wide range of distinguished customers globally. The Company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com. HBM3E

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 874 加入收藏 :
ACE Solution and HON. PRECISION Unveil Advanced Compound Semiconductor and Silicon Photonics Technologies at SEMICON Taiwan 2024

Hsinchu, Taiwan, September 9, 2024 -SEMICON Taiwan officially opened on September 6, 2024, with ACE Solution and HON. PRECISION is joining forces to showcase its latest advancements in silicon photonics testing technology, precision measurement, and automated machinery integration. Their exhibition focused on high-density optoelectronic integration testing solutions designed to meet the increasing demands of silicon photonics for high-capacity and high-channel testing. The integrated optoelectronic signal testing system effectively addresses the challenges posed by increased data center traffic and high-speed transmission needs, significantly boosting transmission rates and reducing energy consumption. With semiconductor packaging evolving towards Co-Packaged Optics (CPO), ACE Solution highlighted its silicon photonics solutions developed through deep collaboration with Quantifi, integrating PXI testing modules to offer an efficient, multi-system testing solution supporting 800G and 1.6T high-speed transmission. These integrated solutions meet the research and production needs for high-speed, high-precision, and high-efficiency testing while offering programmable automation for flexible applications.   ACE Solution also demonstrated its latest innovations in compound semiconductor testing. The Teradyne ETS-88 testing platform is widely used for SiC, GaN, PMIC, automotive electronics, aerospace, and defense industries. Key features include multi-site CP, second-contact KGD, dynamic/static power device FT, and fully automated high-output module FT. The ETS-364 and ETS-800 platforms are tailored for mixed-signal, digital, and analog testing, offering the industry's highest-spec power IC testing capabilities with support for up to 6000V and 4000A, making them ideal for high-current, high-voltage applications, particularly in EV power and battery management.   The TZ-6000 non-destructive wafer and materials inspection system utilizes terahertz (THz) technology, focusing on compound semiconductor testing for GaAs, SiC, and GaN. It offers greater penetration depth and flexibility, handling various sizes and shapes of wafers. Equipped with advanced wafer probes and intelligent software analysis, it can simultaneously measure parameters such as thickness, refractive index, resistivity, dielectric constant, surface/subsurface defects, and full wafer scans, enabling non-destructive wafer quality measurements.   The Electro-Optic Terahertz Pulse Reflectometer (EOTPR) is the world's first instrument to use isolation technology to detect IC package faults and monitor package quality, making it ideal for non-destructive defect detection in 3DIC package analysis. With 5-micron pinpoint precision, the EOTPR is widely used in advanced IC packaging fault analysis for devices such as stacked packages (PoP), flip-chip, and TSV in 3D packaging. Major semiconductor companies have extensively deployed EOTPR for advanced IC packaging quality assurance in manufacturing environments.   Steve Hsu, President of ACE Solution, stated, "With over 20 years of experience in hardware-software integration, ACE Solution has expanded from wireless communication testing to various testing fields, meeting the needs of our local clients. We are thrilled to collaborate with HON. PRECISION to showcase our achievements in automation and precision testing." Alan Hsieh, President of HON. PRECISION commented, "This exhibition marks a new milestone in our partnership with ACE Solution. We look forward to offering more advanced solutions, fostering greater collaboration and innovation across the industry."   For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Peter Lee, Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw Website: https://www.acesolution.com.tw/en/   About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to the specific requirements of our customers in the field of electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished team of technical experts who offer unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively.    

文章來源 : 筑波科技股份有限公司 發表時間 : 瀏覽次數 : 762 加入收藏 :
筑波科技與鴻勁精密亮相 SEMICON Taiwan 2024 展示先進化合物半導體與矽光子技術

台灣新竹,2024年09月09日,SEMICON 國際半導體展盛大開幕,筑波科技 (ACE Solution) 與鴻勁精密 (Hon. Precision) 攜手參展,展示光電整合矽光子測試技術、精密量測及自動化機台的整合,著重高密度與光電結合測試方案,專為應對高容量與高通道的矽光電子測試需求,提供高度集成的光電信號一體化測試系統,有效應對高速傳輸和數據中心流量增加的挑戰,顯著提升傳輸速率並降低能耗。精密半導體封裝已邁向 CPO (Co-Packaged Optics) 發展,筑波科技此次展示的矽光子解決方案來自與 Quantifi 的深度合作,整合 PXI 測試模組提供高效整合的多機一體測試方案,支援 800G 和 1.6T 的高速傳輸。在光通訊與高速訊號介面傳輸的整合中,滿足研發與生產部門對高速率、高精度、高效率的測試需求,也具備靈活的可程式自動化規劃功能。   筑波科技還展示其在化合物半導體測試最新成果。Teradyne ETS-88 測試方案廣泛應用於 SiC、GaN、PMIC、車用電子、航空航天和國防工業等。該方案具備多工位 CP、二次接觸 KGD、動/靜一體功率器件 FT 和全自動高產出模組 FT 四大特色。ETS-364 和 ETS-800 則專門用於混合信號、數位和類比測試,提供業界最高規格功率 IC 測試平台可支持達 6000V 和 4000A 測試,能應對高電流、高電壓需求,尤其在電動車電源和電池管理等應用中具有優越性能。   TZ-6000 非破壞性晶圓和材料檢測系統利用太赫茲 (Terahertz, THz) 技術,專注於砷化鎵、碳化矽和氮化鎵等化合物半導體測試,提供更高穿透深度。具備高度靈活性,適用各種尺寸和形狀的晶圓,並配備獨有多元晶圓探頭及智能軟體分析功能,能同時測量多個參數,如厚度、折射率、電阻率、介電常數、表面/次表面缺陷及整個晶圓掃描,實現非破壞性晶圓品質測量。   電光太赫茲脈衝反射儀 (EOTPR) 是全球首款使用隔離技術檢測積體電路封裝故障和監測封裝品質的設備,特別適用於 3DIC 積體電路封裝的非破壞性缺陷檢測。該儀器提供 5 微米的定位精度,適合用於手機和電腦應用中複雜且先進積體電路芯片的故障分析,包括堆疊式封裝層迭 (PoP)、覆晶 (Flip-Chip) 和 3D 封裝中的矽通孔 (TSV) 等封裝形式。EOTPR 已在各大半導體公司的先進 IC 封裝故障分析領域得到廣泛應用,在品質保證與檢驗的製造環境大量部署。   筑波科技董事長許深福表示:「筑波科技擁有 20 年的軟硬體整合經驗,從無線通訊測試基礎延伸至各個測試領域,致力於滿足本地客戶的需求。我們非常高興能與鴻勁精密合作,共同展示我們的機構自動化與精密測試的協同技術成果。」鴻勁精密董事長謝旼達表示:「此次展會標誌著鴻勁與筑波科技合作的新里程碑。我們期待未來能夠提供更多先進解決方案,促進行業間的交流與合作。」未來筑波科技將與鴻勁精密持續攜手推動創新,為客戶提供卓越方案。   請追蹤筑波集團LinkedIn,掌握最新消息!   聯絡筑波科技 筑波科技股份有限公司ACE Solution, Co., Ltd. 地址:新竹縣竹北市台元街28號2樓之1 電話:03-5500909 電子郵件:service@acesolution.com.tw 網站:https://www.acesolution.com.tw/en/index/   關於筑波科技(ACE Solution) 筑波科技(https://www.acesolution.com.tw/en/index/)成立於2000年,位於台灣新竹,在中國蘇州和深圳以及越南設有分公司,可提供服務。我們的使命是提供訂製的測試解決方案,以滿足電氣元件、設備和系統製造商的客戶需求,通過合作夥伴提供技術解決方案。我們專注於射頻、毫米波和太赫茲領域,擁有專業的技術支援團隊,提供專業、創新和多功能的綜合技術和解決方案。

文章來源 : 筑波科技股份有限公司 發表時間 : 瀏覽次數 : 2869 加入收藏 :
Invitation: ACE Solution to Showcase Latest Semiconductor and Silicon Photonics Technologies at SEMICON Taiwan 2024

ACE Solution will participate in SEMICON Taiwan 2024 from September 4th to 6th Location: TaiNEX Hall 1 Booth: K3076 @HON. PRECISION   We will showcase the latest achievements in semiconductors and silicon photonics during the exhibition. ACE Solution will introduce the following solutions: 👉 Teradyne ETS Compound Semiconductor Testing: The industry’s highest-spec power IC testing platform accommodates a wide range of IC types, with testing capabilities reaching 6000V and 4000A. This platform addresses the challenges of high-current and high-voltage testing, particularly in electric vehicle power and battery management applications.   👉 TZ-6000 Non-Destructive Wafer and Material Inspection: Utilizing Terahertz (THz) technology, this solution offers superior penetration depth compared to silicon, silicon carbide, and gallium nitride for semiconductor wafers. It provides non-destructive measurements of wafer quality, including thickness, refractive index, resistivity, dielectric constant, surface/subsurface defects at selected locations, and full-wafer scanning.   👉 EOTPR Non-Destructive Testing for 3DIC Advanced Packaging: The Electro-Optical Terahertz Pulse Reflectometry (EOTPR) system delivers 5-micron accuracy for fault analysis in complex and advanced IC packaging, such as Package-on-Package (PoP), Flip-Chip, and Through-Silicon Via (TSV) in 3D packaging. EOTPR is widely adopted in advanced IC packaging fault analysis and is extensively deployed in quality assurance and inspection within manufacturing environments.   👉 Photonic Integrated Silicon Photonics Testing: In collaboration with Hon Precision, ACE Solution offers a highly integrated electro-optical signal testing system architecture. This solution supports high-capacity, high-channel testing to meet the demands of high-speed data transmission and increased data center traffic. Integrating photonics and electronics significantly enhances transmission rates while reducing power consumption, leading to improved testing efficiency.   We will also be organizing booth tours during the exhibition. Due to limited availability, spots will be arranged based on actual conditions, so please register early:https://docs.google.com/forms/d/e/1FAIpQLSe5vtgle1wl4dIxliik12YMNnObdqAFD7DwdBYVIxaxMWqlxQ/viewform?fbzx=-6591255857878872603   We welcome partners from all sectors to visit and discuss technical and business cooperation. 📢 Follow ACE Group LinkedIn, to stay updated with the news!       For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Peter Lee, Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw Website: https://www.acesolution.com.tw/en/   About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to our customers' specific requirements in electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished technical expert team offering unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge, integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively.  

文章來源 : 筑波科技股份有限公司 發表時間 : 瀏覽次數 : 1114 加入收藏 :
2025 年 2 月 20 日 (星期四) 農曆正月廿三日
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