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Supermicro, Inc.(納斯達克股票代碼:SMCI)作為AI/ML、HPC、雲端、儲存和5G/邊緣領域的全方位IT解決方案提供企業,在其X14系列產品線中新增具有最高效能GPU、多節點配置、機架式設計的新型系統,這些系統搭載了採用效能核心的Intel Xeon 6900系列處理器(原產品代號Granite Rapids-AP)。新型領先業界的工作負載最佳化伺服器系列,可滿足來自現代資料中心、企業和服務供應商的需求。繼搭載Xeon 6700系列處理器(採用效率核心)的效率最佳化X14伺服器在2024年6月被推出後,今天追加推出的系統機型使Supermicro X14系列具備最高的運算密度與算力,提供業界內機型種類最全面的最佳化伺服器,支援從高需求的AI、高效能運算(HPC)、媒體與虛擬化,到高能效邊緣應用、橫向擴充型雲端原生與微服務應用程式等多元工作負載。 Supermicro總裁暨執行長梁見後表示:「Supermicro X14系統經過完全重新設計,能支援最新技術,包括新一代CPU、GPU、具有高頻寬和最低延遲的MRDIMM、PCIe 5.0,以及EDSFF E1.S和E3.S儲存。我們現在不僅提供超過15項系統產品系列,還可以運用這些設計來打造客製化解決方案,並搭配我們完整的機架整合服務和由內部開發的液冷解決方案。」 經認可的客戶能透過Supermicro的Early Ship計畫提早取得完善、可部署的系統或經由Supermicro JumpStart進行遠端測試。 這些新型Supermicro X14系統採用完全重新設計的架構,包括全新10U和多節點機型規格,能支援新一代GPU和更高的CPU核心密度,另外也具有每個CPU搭配12組記憶體通道的升級版記憶體插槽配置,以及記憶體頻寬比DDR5 DIMM高出37%的全新MRDIMM。 全新的Supermicro X14系列包含多個新系統,其中幾個系統具有全新架構,並針對特定工作負載分為三個類別: l 專為純粹的效能和強化型散熱功能所設計的GPU最佳化平台,可支援最新技術與最高瓦數的GPU。該系統架構從最基礎層級起被全新打造,適用於大規模AI訓練、大型語言模型(LLM)、生成式AI、3D媒體和虛擬化應用。 l 高運算密度的多節點機型,包括全新FlexTwin™、SuperBlade®和GrandTwin®,能透過共享電源和冷卻等資源以提高效率。其中的特定機型採用了直達晶片液冷技術,能使密度最大化且不影響效能。 l 經市場認可的Supermicro Hyper機架式平台,將單插槽或雙插槽架構、彈性I/O和傳統外型規格的儲存配置進行結合,幫助企業與資料中心隨著工作負載進化而進行垂直擴充與橫向擴充。 Supermicro的新型最高效能X14系統支援採用效能核心的全新Intel Xeon 6900系列處理器,此外,於2024年6月推出的X14效率最佳化系統則支援採用效率核心的Intel Xeon 6700系列處理器。這些系統所提供的插槽可支援將於2025年第一季度推出,採用效能核心的Intel Xeon 6900系列處理器,以及採用效率核心的Intel Xeon 6700系列處理器,進而帶來額外的靈活性,使系統在每核心效能或每瓦效能方面都能實現最佳化。 Intel Xeon產品副總裁暨總經理Ryan Tabrah表示:「Intel首次在同一代提供兩個截然不同的工作負載最佳化Xeon處理器系列,每個系列的設計皆具備專屬的效能和效率規格,能降低投資報酬所需耗時,為運算、功耗和機架密度層面帶來突破性改變,使現代資料中心的投資報酬率得到最大化。隨著新系列的推出,Supermicro 將能導入這些適用於AI和運算密集型工作負載的全新效能最佳化CPU,為客戶提供更多選擇。」 配置了搭載效能核心的Intel Xeon 6900系列處理器後,Supermicro系統可支援內建Intel® AMX加速器上的新型FP16指令,進一步強化AI工作負載效能。這些系統內的每個CPU搭配12 組記憶體通道,支援最高8800MT/s的DDR5-6400與MRDIMM,以及CXL 2.0,同時也為高密度、符合業界標準的EDSFF E1.S和E3.S NVMe硬碟提供更廣泛的支援。 Supermicro液冷解決方案 Supermicro透過機架級整合和液冷性能持續完善其經擴充後的X14產品組合。同時,Supermicro 藉由其領先業界的全球製造產能、廣泛的機架級整合與測試設施,以及一套全面的管理軟體解決方案,只需在幾週內就能設計、建構、測試、驗證和交付任何規模的完整資料中心解決方案。 Supermicro也提供內部開發的完善液冷解決方案,包括用於CPU、GPU和記憶體的散熱板,以及冷卻分配單元、冷卻分配歧管、軟管、連接器和冷卻水塔。液冷技術易於被納入機架級整合中,進一步提高系統效率,減少過熱降頻的發生,並降低資料中心部署的總體擁有成本(TCO)和總體環境成本(TCE)。 新型Supermicro最高效能X14系統支援採用效能核心的Intel Xeon 6900系列處理器。這些系統包括: GPU最佳化 – 最高效能的Supermicro X14系統專為,大規模AI訓練、大型語言模型、生成式AI和HPC所設計,能支援八個最新一代的SXM5和SXM6 GPU。這些系統可搭配氣冷或液冷式散熱技術。 PCIe GPU – 專為最大GPU彈性所設計,其散熱性能最佳化5U機箱可支援最高10個雙寬PCIe 5.0加速器卡。這些伺服器非常適合AI推論、媒體、協作設計、模擬、雲端遊戲和虛擬化工作負載。 Intel® Gaudi® 3 AI加速器 – Supermicro也計劃推出業界首款搭載Intel Gaudi 3加速器和Intel Xeon 6處理器的AI伺服器。此系統預計可提高大規模AI模型訓練和AI推論的效率,並降低成本。該系統具有八個Intel Gaudi 3加速器(安裝在OAM通用基板上),並配置了六個整合式OSFP連接埠,能實現高成本效益、橫向擴充式網路,同時也包含一個開放式平台,支援基於社群的開放原始碼軟體堆疊,無需後續軟體授權成本。 SuperBlade® – Supermicro X14系列內的6U高效能、密度最佳化且高能效SuperBlade能最大化機架密度,使每個機架最高可容納100台伺服器與200個GPU。每個節點針對AI、HPC,以及其他運算密集型工作負載進行了最佳化,並具備氣冷或直達晶片液冷技術,能使效率最大化且實現最低電力使用效率(PUE)與最佳總體擁有成本(TCO)。同時,每個節點也具有最多四個整合式以太網路交換器,支援100G上行鏈路和前置I/O,提供最高400G InfiniBand或400G乙太網路的靈活選擇。 FlexTwin™ – 新型Supermicro X14 FlexTwin架構是專為HPC而設計,具有高能效優勢,並能以多節點配置提供最大運算能力和密度,同時也可使一組48U機架搭載最多24,576個效能核心。每個節點皆針對HPC和其他運算密集型工作負載進行最佳化,並採用直達晶片液冷技術以最大化效率,減少CPU過熱降頻的發生,且具有HPC低延遲前置和後置I/O,支援最高400G的一系列彈性網路選項。 Hyper – X14 Hyper是Supermicro的旗艦級機架式平台,專為高需求的AI、HPC和企業應用程式提供最高效能,而其單插槽或雙插槽配置支援雙寬PCIe GPU,可實現最大工作負載加速。此平台具有氣冷和直達晶片液冷式機型,能支援頂級CPU而不受散熱因素限制,進而降低資料中心的冷卻成本並提高效率。 此外,現正供應的Supermicro X14效率最佳化系統搭載採用效率核心的Intel Xeon 6700系列處理器。這些系統包括: SuperBlade® – Supermicro高效能、密度最佳化且高能效的多節點平台,針對 AI、資料分析、HPC、雲端和企業工作負載最佳化。機型規格包括具有10個或5個節點的6U 機體,或具有20個或10個節點的8U機體,可使每個機架配置最高34,560個Xeon運算核心。 Hyper – 旗艦級高效能機架式伺服器,專為橫向擴充雲端工作負載所設計,具有高度儲存和I/O靈活性以提供客製化式機型,進而滿足不同應用需求。 CloudDC – 適用於雲端資料中心的一體成型平台,採用OCP資料中心模組化硬體系統(DC-MHS),具有靈活的I/O和儲存配置及雙AIOM插槽(支援PCIe 5.0;符合 OCP 3.0 標準),可實現最大資料傳輸量。 Petascale Storage – 透過 EDSFF E1.S和E3.S硬碟實現領先業界的All-Flash儲存密度和效能,以1U或2U式機型提供空前的容量和效能。 WIO – 具備高成本效益的架構,並提供靈活的 I/O 配置,可為加速、儲存和網路替代方案實現最佳化,進而加速效能、提高效率,以及完美地因應不同的特定企業應用。 BigTwin® – 2U 2節點或2U 4節點平台,透過每節點雙處理器和熱插拔免工具的設計,提供卓越的密度、效能和可維護性。這些系統的新機型非常適合雲端、儲存和媒體工作負載,包括支援E3.S硬碟,可實現卓越的密度和傳輸量。 GrandTwin® – 專為單處理器效能和記憶體密度所設計,具有前置(冷通道)熱插拔節點,以及前置或後置I/O,便於維護作業。目前的機型也支援E1.S硬碟,具有更佳的儲存密度和傳輸量。 Hyper-E – 提供我們旗艦級Hyper系列的強大功能和靈活性,並針對邊緣應用環境部署進行最佳化。針對邊緣應用的機型特色包括短機身機箱和前置I/O,使Hyper-E適用於邊緣資料中心和電信機櫃。這些短機身系統可支援最多3組高效能GPU或FPGA加速卡。 Edge/Telco – 具備高密度處理效能以及緊湊型機體規格,針對電信機櫃和智慧資料中心的安裝進行最佳化。這些系統可供選擇性搭配直流電源配置,以及最高55°C(131°F)優化式運行溫度設計。
More than 15 Product Families of Completely Upgraded Servers Optimized for Maximum Performance or Efficiency, Featuring Next-Generation GPU Support, Higher-Bandwidth Memory, 400GbE Networking, E1.S and E3.S Drives, and Direct-to-Chip Liquid Cooling Support, and are Based on the New Intel® Xeon® 6900 Series Processors with P-Cores and Intel Xeon 6700 Series Processors with E-cores SAN JOSE, Calif., Sept. 24, 2024 /PRNewswire/ -- Supermicro, Inc. (NASDAQ: SMCI) a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, today adds new maximum performance GPU, multi-node, and rackmount systems to the X14 portfolio, which are based on the Intel Xeon 6900 Series Processors with P-Cores (formerly codenamed Granite Rapids-AP). The new industry-leading selection of workload-optimized servers addresses the needs of modern data centers, enterprises, and service providers. Joining the efficiency-optimized X14 servers leveraging the Xeon 6700 Series Processors with E-cores launched in June 2024, today's additions bring maximum compute density and power to the Supermicro X14 lineup to create the industry's broadest range of optimized servers supporting a wide variety of workloads from demanding AI, HPC, media, and virtualization to energy-efficient edge, scale-out cloud-native, and microservices applications. SBI-612BA-1NE34 "Supermicro X14 systems have been completely re-engineered to support the latest technologies including next-generation CPUs, GPUs, highest bandwidth and lowest latency with MRDIMMs, PCIe 5.0, and EDSFF E1.S and E3.S storage," said Charles Liang, president and CEO of Supermicro. "Not only can we now offer more than 15 families, but we can also use these designs to create customized solutions with complete rack integration services and our in-house developed liquid cooling solutions." Approved customers can obtain early access to complete, full-production systems via Supermicro's Early Ship Program or for remote testing with Supermicro JumpStart. These new Supermicro X14 systems feature completely re-designed architectures, including all-new 10U and multi-node form factors that support next-generation GPUs and higher CPU core densities, updated memory slot configurations with 12 memory channels per CPU and new MRDIMMs, which provide up to 37% better memory bandwidth compared to DDR5 DIMMs. The new Supermicro X14 family comprises a number of new systems —several of which are completely new architectures—in three distinct, workload-specific categories: GPU-optimized platforms designed for pure performance and enhanced thermal capacity to support the latest technology and highest-wattage GPUs. System architectures are built from the ground up for large-scale AI training, LLMs, generative AI, 3D media, and virtualization applications. High compute-density multi-nodes including all-new FlexTwin™,SuperBlade®, and GrandTwin®, which leverage resources such as shared power and cooling to increase efficiency, as well as direct-to-chip liquid cooling on specific models to maximize density without compromising on performance. Market-proven Supermicro Hyper rackmounts combine single or dual socket architectures with flexible I/O and storage configurations in traditional form factors to help enterprises and data centers scale up and out as their workloads evolve. Supermicro's new max-performance X14 systems support the new Intel Xeon 6900 series processors with P-cores, while X14 efficiency-optimized systems support the Intel Xeon 6700 series processors with E-cores, which launched in June 2024. These systems will also offer socket compatibility with the upcoming Intel Xeon 6900 series processors with E-cores and Intel Xeon 6700 series processors with P-cores in Q1'25 to provide an additional dimension of flexibility when optimizing systems for either performance-per-core or performance-per-watt. "For the first time, Intel is offering two distinct, workload-optimized families of Xeon processors in the same generation, each designed to deliver specific performance and efficiency profiles that can shorten time-to-results, revolutionize compute, power and rack density, maximizing ROI for modern data centers," said Ryan Tabrah, VP and GM of Xeon Products at Intel. "With the new additions, Supermicro will be able to provide their customers with even more choice with the introduction of these new performance optimized CPUs for AI and compute-intensive workloads." When configured with Intel Xeon 6900 series processors with P-cores, Supermicro systems support new FP16 instructions on the built-in Intel® AMX accelerator to further enhance AI workload performance. These systems include 12 memory channels per CPU with support for both DDR5-6400 and MRDIMMs up to 8800MT/s, CXL 2.0, and feature more extensive support for high-density, industry-standard EDSFF E1.S and E3.S NVMe drives. Supermicro Liquid Cooling Solutions Complementing this expanded X14 product portfolio are Supermicro's rack-scale integration and liquid cooling capabilities. With an industry-leading global manufacturing capacity, extensive rack-scale integration and testing facilities, and a comprehensive suite of management software solutions, Supermicro designs, builds, tests, validates, and delivers complete data center solutions at any scale in a matter of weeks. Supermicro offers a complete in-house developed liquid cooling solution including cold plates for CPUs, GPUs, memory, Cooling Distribution Units, Cooling Distribution Manifolds, hoses, connectors, and cooling towers. Liquid cooling is easily included in rack-level integrations to increase system efficiency, reduce instances of thermal throttling, and lowers both the TCO and Total Cost to the Environment (TCE) of data center deployments. New Supermicro max-performance X14 systems featuring Intel Xeon 6900 series processors with P-cores include: GPU-optimized – The highest performance Supermicro X14 systems designed for large-scale AI training, large language models (LLMs), generative AI and HPC, and supporting eight of the latest-generation SXM5 and SXM6 GPUs. These systems are available in air-cooled or liquid-cooled configurations. PCIe GPU – Designed for maximum GPU flexibility, supporting up to 10 double-width PCIe 5.0 accelerator cards in a thermally-optimized 5U chassis. These servers are ideal for AI inferencing, media, collaborative design, simulation, cloud gaming, and virtualization workloads. Intel® Gaudi® 3 AI Accelerators – Supermicro also plans to deliver the industry's first AI server based on the Intel Gaudi 3 accelerator hosted by Intel Xeon 6 processors. The system is expected to increase efficiency and lower the cost of large-scale AI model training and AI inferencing. The system features eight Intel Gaudi 3 accelerators on an OAM universal baseboard, six integrated OSFP ports for cost-effective scale-out networking, and an open platform designed to use a community-based, open-source software stack, requiring no software licensing costs. SuperBlade® - Supermicro's X14 6U high-performance, density-optimized, and energy-efficient SuperBlade maximizes rack density, with up to 100 servers and 200 GPUs per rack. Optimized for AI, HPC, and other compute-intensive workloads, each node features air cooling or direct-to-chip liquid cooling to maximize efficiency and achieve the lowest PUE with the best TCO, as well as connectivity up to four integrated Ethernet switches with 100G uplinks and front I/O supporting a range of flexible networking options up to 400G InfiniBand or 400G Ethernet per node. FlexTwin™ - The new Supermicro X14 FlexTwin architecture is purpose-built for HPC, cost-efficient, and designed to provide maximum compute power and density in a multi-node configuration with up to 24,576 performance cores in a 48U rack. Optimized for HPC and other compute-intensive workloads, each node features direct-to-chip liquid cooling only to maximize efficiency and reduce instances of CPU thermal throttling, as well as HPC low latency front and rear I/O supporting a range of flexible networking options up to 400G per node. Hyper - X14 Hyper is Supermicro's flagship rackmount platform designed to deliver the highest performance for demanding AI, HPC, and enterprise applications, with single or dual socket configurations supporting double-width PCIe GPUs for maximum workload acceleration. Both air cooling and direct-to-chip liquid cooling models are available to facilitate the support of top-bin CPUs without thermal limitations and reduce data center cooling costs while also increasing efficiency. Also, now shipping are Supermicro's X14 efficiency-optimized systems featuring Intel Xeon 6700 series processors with E-cores: SuperBlade® – Supermicro's high-performance, density-optimized, and energy-efficient multi-node platform optimized for AI, Data Analytics, HPC, Cloud, and Enterprise workloads. Available as a 6U enclosure with 10 or 5 nodes, or an 8U enclosure with 20 or 10 nodes, one rack can feature up to 34,560 Xeon compute cores. Hyper – Flagship performance rackmount servers designed for scale-out cloud workloads, with storage & I/O flexibility that provides a custom fit for a wide range of application needs. CloudDC – All-in-one platform for cloud data centers, based on the OCP Data Center Modular Hardware System (DC-MHS) with flexible I/O and storage configurations and dual AIOM slots (PCIe 5.0; OCP 3.0 compliant) for maximum data throughput. Petascale Storage – Industry-leading all-flash storage density and performance with EDSFF E1.S and E3.S drives, allowing unprecedented capacity and performance in a 1U or 2U chassis. WIO – Offers flexible I/O configurations in a cost-effective architecture to enable optimization of acceleration, storage, and networking alternatives to accelerate performance, increase efficiency and find the perfect fit for specific enterprise applications. BigTwin® – 2U 2-Node or 2U 4-Node platform providing superior density, performance, and serviceability with dual processors per node and hot-swappable tool-less design. These systems are ideal for cloud, storage, and media workloads with new models, including E3.S drive support for superior density and throughput. GrandTwin® – Purpose-built for single-processor performance and memory density, featuring front (cold aisle) hot-swappable nodes and front or rear I/O for easier serviceability. Now available with E1.S drives for better storage density and throughput. Hyper-E – Delivers the power and flexibility of our flagship Hyper family optimized for deployment in edge environments. Edge-friendly features include a short-depth chassis and front I/O, making Hyper-E suitable for edge data centers and telco cabinets. These short-depth systems support up to 3 high-performance GPU or FPGA cards. Edge/Telco – High-density processing power in compact form factors optimized for telco cabinet and Edge data center installation. Optional DC power configurations and enhanced operating temperatures up to 55° C (131° F). About Super Micro Computer, Inc. Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first to market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are a Total IT Solutions provider with server, AI, storage, IoT, switch systems, software, and support services. Supermicro's motherboard, power, and chassis design expertise further enable our development and production, enabling next generation innovation from cloud to edge for our global customers. Our products are designed and manufactured in-house (in the US, Asia, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling). Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc. All other brands, names, and trademarks are the property of their respective owners. SYS-A22GA-NBRT SYS-522GA-NRT SYS-422GA-NBRT-LCC SYS-222FT-HEA-LCC SYS-212HA-TN
全新 Rack-Scale Ready FlexTwin™ 系統以多節點設計實現前所未有的計算密度,其搭載的 DLC 雙 CPU 最高功率達 500W,並配備前置節點存取及優化網路 加州聖何塞2024年9月23日 /美通社/ -- Supermicro, Inc.(納斯達克股票代碼:SMCI)作爲 AI/ML、HPC、雲端、儲存和 5G/邊緣的整體 IT 解決方案供應商宣佈推出全新 FlexTwin 系統家族,旨在滿足科學家、研究人員、政府及各界企業應對日益複雜科研和業務的需求。FlexTwin 系統以其高度的靈活性,能夠無縫整合最新的 CPU、記憶體、儲存等硬件,並配備先進的電源和冷卻系統,以滿足金融服務、科研和複雜建模等日益複雜的 HPC 需求。這些系統已針對性能與成本比進行優化,並基於 Supermicro 模組化 Building Block Solutions®,可高度客製化,以滿足各種 HPC 應用及客戶的需求。 FlexTwin Supermicro 總裁兼行政總裁 Charles Liang 表示:「Supermicro 的 FlexTwin 伺服器在機架規模部署中樹立了新的標竿,在標準 48U 機架內可容納高達 96 個雙處理器計算節點。Supermicro 提供一站式解決方案,涵蓋伺服器、機架、網絡及完整的液冷系統,不僅縮短部署時間,更確保整體基礎設施的高品質與可靠性,協助客戶快速實現業務目標。使用液冷解決方案消除多達 90% 伺服器產生的熱量,從而節省大量的能源,並提供更高的運算效能。」 如需了解有關 FlexTwin 系統的更多資訊,請瀏覽此處。 此新型多節點設計採用 Supermicro 的模組化節能架構,透過共享電源與關鍵組件的高密度整合 (DLC),有效降低了原材料消耗,大幅提升能源利用效率和數據中心的電力使用效率 (PUE)。全新的 FlexTwin 架構包括一系列全新及行業標準技術,不僅可改善效能,還增強大型數據中心的工作負載彈性和可維修性。 支援最新一代高達 500W 的高頻 CPU,並配備 DLC,以實現傳統數據中心空氣冷卻無法達到的計算密度 多廠商 CPU 支援,每個 CPU 最多 12 個記憶體通道 前端存取的熱交換運算節點、I/O 連接埠和選購磁碟機槽,可提升可維修性,並簡化冷卻通道的維護工作 備援電源供應器和熱插拔液體冷卻泵,提升可靠性,降低停機時間 針對列內和機架內液體冷卻部署的最佳化整體機架級解決方案 為全面支援 FlexTwin 架構的大規模部署,Supermicro 提供專業的機架規模整合服務,從設計、建置、驗證到交付,皆能提供客製化的完整解決方案。憑藉每月高達5,000 個機架(包括1,350 個液冷機架)的業界領先的全球製造能力、完善的機架規模整合和測試設施以及一整套管理軟體解決方案,可提供任何規模的完整解決方案。 關於 Super Micro Computer, Inc.Supermicro(納斯達克股票代碼:SMCI)是全球領先的應用程式最佳化全面 IT 解決方案提供商。Supermicro 在加州聖荷西創立和運作,致力為企業、雲端、AI 和 5G 電信/邊緣 IT 基礎設施,提供市場創新。我們是一家全面 IT 解決方案供應商,提供服務器,AI,存儲,物聯網,交換器系統,軟件和支援服務。Supermicro 的主機板、電源和機箱設計專業知識,進一步支援開發和生產,並為全球客戶實現從雲端到邊緣的新一代創新。我們(在美國、亞洲和荷蘭)內部設計和製造產品,利用全球營運來實現規模和效率,從而務求提高整體擁有成本 (TCO) 和減少對環境的影響(綠色運算)。Server Building Block Solutions® 產品組合,屢獲殊榮。客戶可在多個系統系列中作選擇,從而準確提升工作量和應用程式。這些系統在我們靈活兼可重複使用構建塊上建立,並廣泛支援各外形規格、處理器、記憶體、GPU、儲存、網絡、電源和冷卻解決方案(冷氣機、自然風冷或液冷)。 Supermicro、Server Building Block Solutions 和 We Keep IT Green,均為 Super Micro Computer, Inc. 的商標及/或註冊商標。 所有其他品牌、名稱和商標均為其各自所有者的財產。
完整的架構升級包含全新效能最佳化CPU、新一代GPU的支援、升級版記憶體MRDIMM、400GbE網路、包含E1.S和E3.S硬碟的新型儲存選項,以及直達晶片(Direct-to-Chip,D2C)液冷技術,並基於即將推出、搭載效能核心(P-Core)的Intel® Xeon® 6900系列處理器(原代號為Granite Rapids-AP),進而支援高需求工作負載 加州聖荷西2024年9月5日 /美通社/ -- Supermicro, Inc.(納斯達克股票代碼:SMCI)為AI/ML、高效能運算、雲端、儲存和5G/邊緣領域的全方位IT解決方案提供企業,預告將推出經完全重新設計的全新X14伺服器平台,並將透過新一代技術,使運算密集型工作負載與應用程式的效能最大化。繼Supermicro於2024年6月推出的效率最佳化X14伺服器獲得了成功,新型系統以該系列伺服器為基礎進行全面重大升級,在單一節點中空前地支援256個效能核心(P-Core),以及最高8800MT/s的MRDIMM記憶體,並與新一代SXM、OAM和PCIe GPU相容。此項組合可顯著加速AI和運算效能,同時使大規模AI訓練、高效能運算和複雜資料分析程序所耗費的時間與成本大幅降低。經認可的客戶能透過Supermicro的Early Ship計畫提早取得完善、可部署的系統,或透過Supermicro進行遠端測試。 SYS-A22GA-NBRT Supermicro總裁暨執行長梁見後表示:「我們持續將這些新平台納入已相當完善的資料中心建構組件解決方案中,提供空前的效能和全新的先進規格。Supermicro已準備好透過業界最全面的直達晶片液冷(Direct-to-Chip,D2C)技術、全方位機架整合服務,以及每月最高5,000個機架(包括 1,350 個液冷式機架)的全球製造產能,提供機架級高效能解決方案。透過Supermicro的全球製造產能,我們可以提供充分最佳化的解決方案,並以空前的速度加快交付時間,同時降低總體擁有成本(TCO)。」 點擊此處了解更多相關資訊。 這些全新的X14系統使用了經完全重新設計的架構,包含新型10U與多節點外型規格,能支援新一代GPU和更高的CPU密度,同時也具有讓每個CPU搭配12組記憶體通道的升級版記憶體插槽配置,以及記憶體效能比DDR5-6400 DIMM提升最高37%的全新 MRDIMM。此外,升級版儲存介面將支援更高的硬碟密度,並能將液冷式系統直接整合到伺服器架構中。 Supermicro X14系列的新產品包含超過十個新系統,其中幾個系統基於全新架構,針對特定工作負載分為三個類別: 專為純粹的效能和強化型散熱功能所設計的GPU最佳化平台,可支援最高瓦數的GPU。該系統架構從最基礎層級起被全新打造,適用於大規模AI訓練、大型語言模型(LLM)、生成式AI、3D媒體和虛擬化應用。 高運算密度的多節點機型,包括SuperBlade®和全新FlexTwin™,並採用直達晶片液冷技術,與前幾代系統相比,可大幅增加標準型機架中的效能核心數量。 經市場認證的Hyper機架式平台,將單插槽或雙插槽架構、彈性I/O和傳統外型規格的儲存配置進行結合,幫助企業與資料中心隨著工作負載進化而進行垂直擴充與橫向擴充。 Supermicro X14效能最佳化系統將支援即將推出並搭載效能核心的Intel® Xeon® 6900系列處理器,其插槽也將支援2025年第一季度中的Intel Xeon 6900系列處理器(搭載效率核心)。這種內建設計使系統能在每核心效能或每瓦效能方面實現工作負載最佳化。 Intel Xeon 6副總裁暨總經理Ryan Tabrah表示:「搭載效能核心的新型Intel Xeon 6900系列處理器是我們有史以來最強大的處理器,並具有更多核心、卓越的記憶體頻寬和I/O,可為AI和運算密集型工作負載達到全新等級的效能。我們持續與Supermicro合作,推出一些業界最強大的系統,而這些系統已準備好滿足不斷提高的現代AI和高效能運算需求。」 配置了搭載效能核心的Intel Xeon 6900系列處理器後,Supermicro系統可支援內建Intel® AMX加速器上的新型FP16指令,進一步強化AI工作負載效能。這些系統內的每個CPU搭配12 組記憶體通道,支援最高8800MT/s的DDR5-6400與MRDIMM,以及CXL 2.0,同時也為高密度、符合業界標準的EDSFF E1.S和E3.S NVMe硬碟提供更廣泛的支援。 Supermicro液冷解決方案 Supermicro透過機架級整合和液冷性能持續完善這個廣泛X14產品組合。同時,Supermicro 藉由其領先業界的全球製造產能、廣泛的機架級整合與測試設施,以及一套全面的管理軟體解決方案,只需在幾週內就能設計、建構、測試、驗證和交付任何規模的完整解決方案。 此外,Supermicro也提供內部開發的完善液冷解決方案,包括用於CPU、GPU和記憶體的散熱板、冷卻分配單元、冷卻分配歧管、軟管、連接器和冷卻水塔。液冷技術易於被納入機架級整合中,進一步提高系統效率,減少過熱降頻的發生,同時降低資料中心部署的總體擁有成本(TCO)和總體環境成本(TCE)。 即將推出的Supermicro X14效能最佳化系統包含: GPU最佳化 – 最高效能的Supermicro X14系統專為大規模AI訓練、大型語言模型、生成式AI和高效能運算所設計,能支援八個最新一代的SXM5和SXM6 GPU。這些系統可搭配氣冷或液冷式散熱技術。 PCIe GPU – 專為最大GPU彈性所設計,其散熱性能最佳化5U機箱支援最高10個雙寬PCIe 5.0加速器卡。這些伺服器非常適合媒體、協作設計、模擬、雲端遊戲和虛擬化工作負載。 Intel® Gaudi® 3 AI加速器 – Supermicro也計劃推出業界首款搭載Intel Gaudi 3加速器和Intel Xeon 6處理器的AI伺服器。此系統預計可提高大規模AI模型訓練和AI推論的效率,並降低成本。該系統具有八個Intel Gaudi 3加速器(安裝在OAM通用基板上),並配置了六個整合式OSFP連接埠,能實現高成本效益、橫向擴充式網路,同時也包含一個開放式平台,支援基於社群的開放原始碼軟體堆疊,無需後續軟體授權成本。 SuperBlade® – Supermicro X14系列內的6U高效能、密度最佳化且高能效SuperBlade能最大化機架密度,使每個機架最高可容納100台伺服器與200個GPU。每個節點針對AI、高效能運算,以及其他運算密集型工作負載進行了最佳化,並具備氣冷或直達晶片液冷技術,能使效率最大化且實現最低電力使用效率(PUE)與最佳總體擁有成本(TCO)。同時,每個節點也具有最多四個整合式以太網路交換器,支援100G上行鏈路和前置I/O,提供最高400G InfiniBand或400G乙太網路的靈活選擇。 FlexTwin™ – 新型Supermicro X14 FlexTwin的架構設計能以多節點配置提供最大運算能力和密度,使48U機架可搭載最多24,576個效能核心。每個節點皆針對高效能運算和其他運算密集型工作負載進行最佳化,並採用直達晶片液冷技術以最大化效率,減少CPU過熱降頻的發生,且具有高效能運算低延遲前置和後置I/O,支援最高400G的一系列彈性網路選項。 Hyper – X14 Hyper是Supermicro的旗艦級機架式平台,專為高需求的AI、高效能運算和企業應用程式提供最高效能,而其單插槽或雙插槽配置支援雙寬PCIe GPU,可實現最大工作負載加速。此平台具有氣冷和直達晶片液冷式機型,能支援頂級CPU而不受散熱因素限制,進而降低資料中心的冷卻成本並提高效率。 關於Super Micro Computer, Inc. Supermicro(納斯達克股票代碼:SMCI)為應用最佳化全方位IT解決方案的全球領導者。Supermicro的成立據點及營運中心位於美國加州聖荷西,致力為企業、雲端、AI和5G電信/邊緣IT基礎架構提供領先市場的創新技術。我們是全方位IT解決方案製造商,提供伺服器、AI、儲存、物聯網、交換器系統、軟體及支援服務。Supermicro的主機板、電源和機箱設計專業進一步推動了我們的發展與產品生產,為全球客戶實現了從雲端到邊緣的下一代創新。我們的產品皆由企業內部團隊設計及製造(在美國、亞洲及荷蘭),透過全球化營運實現極佳的規模與效率,並藉營運最佳化降低總體擁有成本(TCO),以及經由綠色運算技術減少環境衝擊。屢獲殊榮的Server Building Block Solutions®產品組合,讓客戶可以自由選擇這些具高度彈性、可重複使用且極為多元的建構式組合系統,我們支援各種外形尺寸、處理器、記憶體、GPU、儲存、網路、電源和散熱解決方案(空調、自然氣冷或液冷),因此能為客戶的工作負載與應用提供最佳的效能。 Supermicro、Server Building Block Solutions和We Keep IT Green皆為Super Micro Computer, Inc.的商標和/或註冊商標。 所有其他品牌、名稱和商標皆為其各自所有者之財產。 SYS-522GA-NRT SYS-422GA-NBRT-LCC SYS-222FT-HEA-LCC SYS-212HA-TN SBI-612BA-1NE34
Supermicro, Inc.(納斯達克股票代碼:SMCI)為AI/ML、高效能運算、雲端、儲存和5G/邊緣領域的全方位IT解決方案提供企業,預告將推出經完全重新設計的全新X14伺服器平台,並將透過新一代技術,使運算密集型工作負載與應用程式的效能最大化。繼Supermicro於2024年6月推出的效率最佳化X14伺服器獲得了成功,新型系統以該系列伺服器為基礎進行全面重大升級,在單一節點中空前地支援256個效能核心(P-Core),以及最高8800MT/s的MRDIMM記憶體,並與新一代SXM、OAM和PCIe GPU相容。此項組合可顯著加速AI和運算效能,同時使大規模AI訓練、高效能運算和複雜資料分析程序所耗費的時間與成本大幅降低。經認可的客戶能透過Supermicro的Early Ship計畫提早取得完善、可部署的系統,或透過Supermicro進行遠端測試。 Supermicro總裁暨執行長梁見後表示:「我們持續將這些新平台納入已相當完善的資料中心建構組件解決方案中,提供空前的效能和全新的先進規格。Supermicro已準備好透過業界最全面的直達晶片液冷(Direct-to-Chip,D2C)技術、全方位機架整合服務,以及每月最高5,000個機架(包括 1,350 個液冷式機架)的全球製造產能,提供機架級高效能解決方案。透過Supermicro的全球製造產能,我們可以提供充分最佳化的解決方案,並以空前的速度加快交付時間,同時降低總體擁有成本(TCO)。」 點擊此處了解更多相關資訊。 這些全新的X14系統使用了經完全重新設計的架構,包含新型10U與多節點外型規格,能支援新一代GPU和更高的CPU密度,同時也具有讓每個CPU搭配12組記憶體通道的升級版記憶體插槽配置,以及記憶體效能比DDR5-6400 DIMM提升最高37%的全新 MRDIMM。此外,升級版儲存介面將支援更高的硬碟密度,並能將液冷式系統直接整合到伺服器架構中。 Supermicro X14系列的新產品包含超過十個新系統,其中幾個系統基於全新架構,針對特定工作負載分為三個類別: • 專為純粹的效能和強化型散熱功能所設計的GPU最佳化平台,可支援最高瓦數的GPU。該系統架構從最基礎層級起被全新打造,適用於大規模AI訓練、大型語言模型(LLM)、生成式AI、3D媒體和虛擬化應用。 • 高運算密度的多節點機型,包括SuperBlade®和全新FlexTwin™,並採用直達晶片液冷技術,與前幾代系統相比,可大幅增加標準型機架中的效能核心數量。 • 經市場認證的Hyper機架式平台,將單插槽或雙插槽架構、彈性I/O和傳統外型規格的儲存配置進行結合,幫助企業與資料中心隨著工作負載進化而進行垂直擴充與橫向擴充。 Supermicro X14效能最佳化系統將支援即將推出並搭載效能核心的Intel® Xeon® 6900系列處理器,其插槽也將支援2025年第一季度中的Intel Xeon 6900系列處理器(搭載效率核心)。這種內建設計使系統能在每核心效能或每瓦效能方面實現工作負載最佳化。 Intel Xeon 6副總裁暨總經理Ryan Tabrah表示:「搭載效能核心的新型Intel Xeon 6900系列處理器是我們有史以來最強大的處理器,並具有更多核心、卓越的記憶體頻寬和I/O,可為AI和運算密集型工作負載達到全新等級的效能。我們持續與Supermicro合作,推出一些業界最強大的系統,而這些系統已準備好滿足不斷提高的現代AI和高效能運算需求。」 配置了搭載效能核心的Intel Xeon 6900系列處理器後,Supermicro系統可支援內建Intel® AMX加速器上的新型FP16指令,進一步強化AI工作負載效能。這些系統內的每個CPU搭配12 組記憶體通道,支援最高8800MT/s的DDR5-6400與MRDIMM,以及CXL 2.0,同時也為高密度、符合業界標準的EDSFF E1.S和E3.S NVMe硬碟提供更廣泛的支援。 Supermicro液冷解決方案 Supermicro透過機架級整合和液冷性能持續完善這個廣泛X14產品組合。同時,Supermicro 藉由其領先業界的全球製造產能、廣泛的機架級整合與測試設施,以及一套全面的管理軟體解決方案,只需在幾週內就能設計、建構、測試、驗證和交付任何規模的完整解決方案。 此外,Supermicro也提供內部開發的完善液冷解決方案,包括用於CPU、GPU和記憶體的散熱板、冷卻分配單元、冷卻分配歧管、軟管、連接器和冷卻水塔。液冷技術易於被納入機架級整合中,進一步提高系統效率,減少過熱降頻的發生,同時降低資料中心部署的總體擁有成本(TCO)和總體環境成本(TCE)。 即將推出的Supermicro X14效能最佳化系統包含: GPU最佳化 – 最高效能的Supermicro X14系統專為大規模AI訓練、大型語言模型、生成式AI和高效能運算所設計,能支援八個最新一代的SXM5和SXM6 GPU。這些系統可搭配氣冷或液冷式散熱技術。 PCIe GPU – 專為最大GPU彈性所設計,其散熱性能最佳化5U機箱支援最高10個雙寬PCIe 5.0加速器卡。這些伺服器非常適合媒體、協作設計、模擬、雲端遊戲和虛擬化工作負載。 Intel® Gaudi® 3 AI加速器 – Supermicro也計劃推出業界首款搭載Intel Gaudi 3加速器和Intel Xeon 6處理器的AI伺服器。此系統預計可提高大規模AI模型訓練和AI推論的效率,並降低成本。該系統具有八個Intel Gaudi 3加速器(安裝在OAM通用基板上),並配置了六個整合式OSFP連接埠,能實現高成本效益、橫向擴充式網路,同時也包含一個開放式平台,支援基於社群的開放原始碼軟體堆疊,無需後續軟體授權成本。 SuperBlade® – Supermicro X14系列內的6U高效能、密度最佳化且高能效SuperBlade能最大化機架密度,使每個機架最高可容納100台伺服器與200個GPU。每個節點針對AI、高效能運算,以及其他運算密集型工作負載進行了最佳化,並具備氣冷或直達晶片液冷技術,能使效率最大化且實現最低電力使用效率(PUE)與最佳總體擁有成本(TCO)。同時,每個節點也具有最多四個整合式以太網路交換器,支援100G上行鏈路和前置I/O,提供最高400G InfiniBand或400G乙太網路的靈活選擇。 FlexTwin™ – 新型Supermicro X14 FlexTwin的架構設計能以多節點配置提供最大運算能力和密度,使48U機架可搭載最多24,576個效能核心。每個節點皆針對高效能運算和其他運算密集型工作負載進行最佳化,並採用直達晶片液冷技術以最大化效率,減少CPU過熱降頻的發生,且具有高效能運算低延遲前置和後置I/O,支援最高400G的一系列彈性網路選項。 Hyper – X14 Hyper是Supermicro的旗艦級機架式平台,專為高需求的AI、高效能運算和企業應用程式提供最高效能,而其單插槽或雙插槽配置支援雙寬PCIe GPU,可實現最大工作負載加速。此平台具有氣冷和直達晶片液冷式機型,能支援頂級CPU而不受散熱因素限制,進而降低資料中心的冷卻成本並提高效率。
A Complete Architecture Upgrade that Includes New Performance-Optimized CPUs, Next-Generation GPU support, Upgraded Memory MRDIMMs, 400GbE Networking, New Storage Options Including E1.S and E3.S drives, and Direct-to-Chip Liquid Cooling, based on the Upcoming Intel® Xeon® 6900 Series Processors with P-Cores (formerly codenamed Granite Rapids-AP) Supporting Demanding Workloads SAN JOSE, Calif., Aug. 29, 2024 /PRNewswire/ -- Supermicro, Inc. (NASDAQ: SMCI) a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, is previewing new, completely re-designed X14 server platforms which will leverage next-generation technologies to maximize performance for compute-intensive workloads and applications. Building on the success of Supermicro's efficiency-optimized X14 servers that launched in June 2024, the new systems feature significant upgrades across the board, supporting a never-before-seen 256 performance cores (P-cores) in a single node, memory support up for MRDIMMs at 8800MT/s, and compatibility with next-generation SXM, OAM, and PCIe GPUs. This combination can drastically accelerate AI and compute as well as significantly reduce the time and cost of large-scale AI training, high-performance computing, and complex data analytics tasks. Approved customers can secure early access to complete, full-production systems via Supermicro's Early Ship Program or for remote testing with Supermicro JumpStart. SYS-A22GA-NBRT "We continue to add to our already comprehensive Data Center Building Block solutions with these new platforms, which will offer unprecedented performance, and new advanced features," said Charles Liang, president and CEO of Supermicro. "Supermicro is ready to deliver these high-performance solutions at rack-scale with the industry's most comprehensive direct-to-chip liquid cooled, total rack integration services, and a global manufacturing capacity of up to 5,000 racks per month including 1,350 liquid cooled racks. With our worldwide manufacturing capabilities, we can deliver fully optimized solutions which accelerate our time-to-delivery like never before, while also reducing TCO." Click here for more information. These new X14 systems feature completely re-designed architectures including new 10U and multi-node form factors to enable support for next-generation GPUs and higher CPU densities, updated memory slot configurations with 12 memory channels per CPU and new MRDIMMs which provide up to 37% better memory performance compared to DDR5-6400 DIMMS. In addition, upgraded storage interfaces will support higher drive densities, and more systems with liquid cooling integrated directly into the server architecture. The new additions to the Supermicro X14 family comprise more than ten new systems, several of which are completely new architectures in three distinct, workload-specific categories: GPU-optimized platforms designed for pure performance and enhanced thermal capacity to support the highest-wattage GPUs. System architectures have been built from the ground up for large-scale AI training, LLMs, generative AI, 3D media, and virtualization applications. High compute-density multi-nodes including SuperBlade® and the all-new FlexTwin™, which leverage direct-to-chip liquid cooling to significantly increase the number of performance cores in a standard rack compared to previous generations of systems. Market-proven Hyper rackmounts combine single or dual socket architectures with flexible I/O and storage configurations in traditional form factors to help enterprises and data centers scale up and out as their workloads evolve. Supermicro X14 performance-optimized systems will support the soon-to-be-released Intel® Xeon® 6900 series processors with P-cores and will also offer socket compatibility to support Intel Xeon 6900 series processors with E-cores in Q1'25. This designed-in feature allows workload-optimized systems for either performance-per-core or performance-per-watt. "The new Intel Xeon 6900 series processors with P-cores are our most powerful ever, with more cores and exceptional memory bandwidth & I/O to achieve new degrees of performance for AI and compute-intensive workloads," said Ryan Tabrah, VP and GM of Xeon 6 at Intel. "Our continued partnership with Supermicro will result in some of the industry's most powerful systems that are ready to meet the ever-heightening demands of modern AI and high-performance computing." When configured with Intel Xeon 6900 series processors with P-cores, Supermicro systems support new FP16 instructions on the built-in Intel® AMX accelerator to further enhance AI workload performance. These systems include 12 memory channels per CPU with support for both DDR5-6400 and MRDIMMs up to 8800MT/s, CXL 2.0, and feature more extensive support for high-density, industry-standard EDSFF E1.S and E3.S NVMe drives. Supermicro Liquid Cooling Solutions Complementing this expanded X14 product portfolio are Supermicro's rack-scale integration and liquid cooling capabilities. With an industry-leading global manufacturing capacity, extensive rack-scale integration and testing facilities, and a comprehensive suite of management software solutions, Supermicro designs, builds, tests, validates, and delivers complete solutions at any scale in a matter of weeks. In addition, Supermicro offers a complete in-house developed liquid cooling solution including cold plates for CPUs, GPUs and memory, Cooling Distribution Units, Cooling Distribution Manifolds, hoses, connectors, and cooling towers. Liquid cooling can be easily included in rack-level integrations to further increase system efficiency, reduce instances of thermal throttling, and lower both the TCO and Total Cost to Environment (TCE) of data center deployments. Upcoming Supermicro X14 performance-optimized systems include: GPU-optimized – The highest performance Supermicro X14 systems designed for large-scale AI training, large language models (LLMs), generative AI and HPC, and supporting eight of the latest-generation SXM5 and SXM6 GPUs. These systems are available in air-cooled or liquid-cooled configurations. PCIe GPU – Designed for maximum GPU flexibility, supporting up to 10 double-width PCIe 5.0 accelerator cards in a thermally-optimized 5U chassis. These servers are ideal for media, collaborative design, simulation, cloud gaming, and virtualization workloads. Intel® Gaudi® 3 AI Accelerators – Supermicro also plans to deliver the industry's first AI server based on the Intel Gaudi 3 accelerator hosted by Intel Xeon 6 processors. The system is expected to increase efficiency and lower the cost of large-scale AI model training and AI inferencing. The system features eight Intel Gaudi 3 accelerators on an OAM universal baseboard, six integrated OSFP ports for cost-effective scale-out networking, and an open platform designed to use a community-based, open-source software stack, requiring no software licensing costs. SuperBlade® - Supermicro's X14 6U high-performance, density-optimized, and energy-efficient SuperBlade maximizes rack density, with up to 100 servers and 200 GPUs per rack. Optimized for AI, HPC, and other compute-intensive workloads, each node features air cooling or direct-to-chip liquid cooling to maximize efficiency and achieve the lowest PUE with the best TCO, as well as connectivity up to four integrated Ethernet switches with 100G uplinks and front I/O supporting a range of flexible networking options up to 400G InfiniBand or 400G Ethernet per node. FlexTwin™ - The new Supermicro X14 FlexTwin architecture is designed to provide maximum compute power and density in a multi-node configuration with up to 24,576 performance cores in a 48U rack. Optimized for HPC and other compute-intensive workloads, each node features direct-to-chip liquid cooling only to maximize efficiency and reduce instances of CPU thermal throttling, as well as HPC Low Latency front and rear I/O supporting a range of flexible networking options up to 400G per node. Hyper - X14 Hyper is Supermicro's flagship rackmount platform designed to deliver the highest performance for demanding AI, HPC, and enterprise applications, with single or dual socket configurations supporting double-width PCIe GPUs for maximum workload acceleration. Both air cooling and direct-to-chip liquid cooling models are available to facilitate the support of top-bin CPUs without thermal limitations and reduce data center cooling costs while also increasing efficiency. About Super Micro Computer, Inc. Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first to market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are a Total IT Solutions provider with server, AI, storage, IoT, switch systems, software, and support services. Supermicro's motherboard, power, and chassis design expertise further enable our development and production, enabling next generation innovation from cloud to edge for our global customers. Our products are designed and manufactured in-house (in the US, Asia, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling). Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc. All other brands, names, and trademarks are the property of their respective owners. SYS-522GA-NRT SYS-422GA-NBRT-LCC SYS-222FT-HEA-LCC SYS-212HA-TN SBI-612BA-1NE34
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