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加利福尼亞州聖荷西2025年10月13日 /美通社/ -- 作為專業伺服器設計與製造商，神達控股股份有限公司（股票代號：3706）旗下子公司神雲科技股份有限公司（MiTAC Computing Technology Corporation），將於2025 OCP Global Summit（10月13日至16日，舊金山聖荷西）隆重登場，並於C14展位展出最新AI叢集與資料中心解決方案。此次展出主軸為「From AI Server to Cluster – Open for Growth. Built to Cool.」，展現從單一AI伺服器擴展至完整叢集的開放式基礎架構，並搭配創新的液冷節能設計，全面提升效能與永續性。 MiTAC Computing Showcases Future-Ready AI Cluster Solutions at the 2025 OCP Global Summit to Empower Open and Energy-Efficient Data Centers 此次展出涵蓋AI、HPC、雲端與企業級應用，完整呈現神雲科技伺服器從單機到叢集的整合實力，並攜手AMD、Broadcom、CoolIT、Intel、Micron、Murata、NVIDIA與 Solidigm等合作夥伴，共同推動開放運算與永續發展。 從Server到Cluster｜以氣冷到水冷，AI到HPC的機櫃，展示完整資料中心解決方案神雲科技本次展會中展示完整機櫃級解決方案，進一步展現「From AI Server to Cluster」的核心理念。現場展出的OCP ORv3機櫃與EIA標準機櫃，分別代表新一代開放式基礎架構與傳統企業資料中心的兩大方向。 OCP ORv3液冷機櫃｜液冷散熱與模組化電源，實現永續高效能資料中心神雲科技展示的OCP ORv3 43OU液冷機櫃，搭載多達14台C2811Z5多節點伺服器，每節點支援AMD EPYC™ 9005系列處理器與DDR5記憶體擴充，專為高效能運算與大規模資料中心部署而設計。整體叢集配置中，加入Lake Erie儲存模組，搭配管理交換器與數據交換器，實現運算、儲存與網路的完整協作。 在基礎設施部分，機櫃導入Murata 33kW Power Shelf MWOCES-211-P-D電源系統，提供高效率且具備彈性的電力管理，足以支援持續高負載的運算環境。散熱方面，配置 CoolIT 200kW CHx200+ In-Rack CDU液冷解決方案，具備200kW等級散熱能力，有效將高密度運算伺服器的熱能導出，確保系統在長時間運作下仍維持穩定效能與節能表現。 透過OCP ORv3的模組化設計與開放式架構，神雲科技的液冷機櫃不僅展現了高效能與高可靠性，更兼顧能源效率與永續性，為資料中心提供從單機到叢集、從氣冷到液冷的完整升級路徑，加速AI、HPC與雲端應用的導入與擴展。 EIA 氣冷機櫃｜標準化架構結合800G高速互連，推動 AI 叢集快速部署神雲科技在本次展會展示的EIA 45U氣冷機櫃，配置4台G8825Z5 8U AI伺服器，搭載 AMD Instinct™ MI350X/ MI325X GPU，為大型語言模型訓練與生成式AI推論提供強大算力。網路部分導入Dell Z9864F-ON交換器，其核心採用Broadcom Tomahawk 5晶片，可支援800G高速互連，確保節點間資料傳輸的低延遲與高可靠性。機櫃同時整合GC68C-B8056管理伺服器與TS70A-B8056儲存伺服器，實現高效能計算與高速資料存取的緊密結合。透過伺服器、網路、管理與儲存的完整整合，神雲科技將傳統EIA標準架構延伸至叢集級別，幫助企業在不改變現有資料中心基礎設施的情況下，快速建置相容、可擴充且具高可用性的AI/HPC叢集環境，真正落實「From Server to Cluster」的理念。 Live Demo｜開源韌體驅動透明、安全與永續的資料中心在C14攤位，神雲科技也將進行Live Demo，展示OpenBMC與Open Platform Firmware (OPF) 如何在真實環境中改變資料中心的管理模式。透過與Open Source Firmware Foundation、ISV 與開放硬體社群的合作，神雲科技展示了以開放韌體取代專有堆疊的創新路徑：包括透過Redfish實現一致化伺服器管理、以 Coreboot／LinuxBoot／UEFI等可選架構加速開機並縮短POST時間達50%，同時結合Broadcom MegaRAID 9560-16i / MegaRAID 9660-16i RAID卡，進一步強化資料存取的可靠性與安全性，再透過可審計的安全機制支援SBOM與NIST 800-193防護。 此外，神雲科技也與全球領導廠商共同推動OCP OPF規範的制定，並展示已在AMD EPYC™ 9005/9004系列處理器平台上完成的Open Platform Firmware PoC，進一步驗證其在真實硬體上的可行性與未來擴展潛力。這場Demo將讓與會者直觀體驗開放、模組化且具永續性的基礎架構，如何為未來Server到Cluster的擴展提供透明度、掌控力與長期安全性。 在展示叢集解決方案與開源韌體創新之後，神雲科技也將完整呈現其伺服器產品線，涵蓋 AI運算、HPC與雲端、以及企業級資料處理，展現從單機到叢集的全面升級實力。 AI 運算平台｜液冷與 GPU 加速全面升級，驅動大規模 AI 訓練與生成式應用 G4527G6：採用NVIDIA MGX™ 4U架構，搭配雙路Intel® Xeon® 6767P處理器，可配置8張NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs與Solidigm D7-P5520 SSD，結合GPU的強大平行運算效能與SSD的高效資料存取，特別適合電腦視覺、深度學習模型訓練與AI應用開發。 G4826Z5：首次亮相的AI液冷高密度GPU平台，支援多達8顆AMD Instinct™ MI355X GPU與AMD EPYC™ 9005/9004系列處理器，同時可擴充至24個DDR5-6400記憶體插槽，最高容量達6TB。平台採用CPU與GPU全面液冷設計，確保在高密度配置下仍能維持長時間穩定效能。搭載Broadcom P2200G網路介面卡，提供高速、低延遲的連接能力，專為大規模AI訓練與資料密集型運算打造，是本次展會的重點液冷旗艦產品。 HPC與雲端的最佳實踐｜OCP標準平台，兼顧高效能與大規模部署 C2811Z5：符合OCP標準的液冷High Density多節點伺服器，支援AMD EPYC™ 9005系列處理器，每節點可配置12個DDR5-6400記憶體插槽，最高容量達 3TB。搭載 NVMe E1.S儲存介面，並配合Micron 9550 NVMe SSD，在高頻寬存取與長時間運算下，依然能保持穩定效能，特別適合科學模擬、工程設計與氣象分析等HPC場景。其液冷設計不僅有效提升散熱效率，更協助資料中心在效能、能源效率與可靠性間取得最佳平衡。 Capri 3：OCP雲端伺服器平台，具備模組化與彈性擴充特性，並搭配 Broadcom N1400GD網路介面卡，提供高速且穩定的網路連線。適合雲端虛擬化、軟體定義儲存與大型資料湖架構，能靈活應對不同的雲端工作負載與大規模資料中心部署需求。 Enterprise 資料處理與儲存｜靈活擴充與高可靠性，支援企業級應用與資料密集工作負載 R1520G6：企業級1U伺服器，搭載Intel® Xeon® 6700P系列處理器，並結合Micron DDR5 DRAM與 Micron 6550 ION NVMe SSD，在高記憶體需求與長時間高密度讀寫場景中，展現卓越效能與耐久性，滿足企業級應用對可靠性與高效率的嚴苛要求。 R2520G6：企業級2U伺服器，支援雙路Intel® Xeon® 6700P系列處理器與多達 24顆NVMe U.2 SSD。搭載 Solidigm D7-PS1010 SSD，具備PCIe 5.0高頻寬與長時間效能穩定性，特別適合資料儲存、大數據分析與 AI 資料預處理等需要高速儲存的應用，幫助企業快速將龐大資料轉化為即時洞察，協助決策與營運優化。 除了完整的機櫃解決方案與現場 Live Demo，神雲科技也將於10 月 14日舉辦兩場高階論壇（Executive Sessions），深入探討AI叢集的未來發展趨勢以及永續資料中心的架構演進。神雲科技誠摯邀請產業先進蒞臨C14展位，親身體驗最新的伺服器與叢集解決方案，並與我們一同交流，探索「From Server to Cluster」的創新之路。 如需產品型錄與更多資訊，可參閱：MiTAC Computing 2025 OCP Global Summit Landing Page 神雲科技官方網站：https://www.mitaccomputing.com/Intel 平台型錄AMD 平台型錄
SAN JOSE, Calif., Oct. 13, 2025 /PRNewswire/ -- MiTAC Computing Technology, a global leader in high-performance and energy-efficient server solutions, is proud to announce its participation at the 2025 OCP Global Summit (October 13–16, San Jose, CA) , Booth C14. Under the theme "From AI Server to Cluster – Open for Growth. Built to Cool." MiTAC will showcase modular, scalable infrastructures advancing from single AI servers to full clusters, powered by cutting-edge liquid-cooling and sustainable designs. MiTAC Computing Showcases Future-Ready AI Cluster Solutions at the 2025 OCP Global Summit to Empower Open and Energy-Efficient Data Centers Teaming up with AMD, Broadcom, CoolIT, Intel, Micron, Murata, NVIDIA, and Solidigm, MiTAC continues to drive open computing innovation and energy-efficient data center evolution. From Server to Cluster | From Air-Cooled to Liquid-Cooled, From AI to HPC – Showcasing Complete Data Center Solutions At the summit, MiTAC Computing presents both OCP ORv3 and EIA standard racks, covering next-generation open and enterprise data center architectures. OCP ORv3 Liquid-Cooled Rack — Supports up to 14 C2811Z5 multi-node servers powered by AMD EPYC™ 9005 series processors. Integrated Murata 33kW Power Shelf MWOCES-211-P-D and CoolIT 200kW CHx200+ In-Rack CDU deliver efficient power and thermal management for high-density deployments. The system's open, modular design with MiTAC Lake Erie storage modules provides seamless compute, storage, and network integration, enabling an effortless upgrade path from server to cluster. EIA Air-Cooled Rack — Configured with MiTAC G8825Z5 AI servers using AMD Instinct™ MI350X/MI325X GPUs, this 45U rack integrates a Dell Z9864F-ON switch featuring the Broadcom Tomahawk 5 chipset for 800G high-speed interconnect, along with MiTAC GC68C-B8056 management server and MiTAC TS70A-B8056 storage server. The result is rapid, compatible AI and HPC cluster deployment within existing infrastructure, enabling enterprises to scale efficiently from single server to cluster. Live Demo: Open Firmware for Transparent and Secure Data Centers At Booth C14, MiTAC Computing will host a live demonstration featuring OpenBMC and Open Platform Firmware (OPF), developed in collaboration with the Open Source Firmware Foundation, ISVs, and the open hardware community. The demo showcases Redfish-based unified server management, with Coreboot, LinuxBoot, and UEFI options that reduce POST time by up to 50%. It also integrates Broadcom MegaRAID 9560-16i / 9660-16i RAID cards to enhance data reliability and security. MiTAC Computing will further unveil an OPF proof-of-concept (PoC) on AMD EPYC™ 9005/9004 processor platforms, validating real-hardware scalability and transparency for future data center evolution. After showcasing its cluster-level solutions and open firmware innovations, MiTAC Computing will also present a complete server portfolio spanning AI, HPC, cloud, and enterprise applications, highlighting its ability to scale from single servers to full clusters and deliver end-to-end solutions. AI Computing Platforms | Liquid Cooling and GPU Acceleration for Large-Scale Training and Generative AI G4527G6: A 4U server based on the NVIDIA MGX™ architecture, with dual Intel® Xeon® 6767P CPUs, supporting up to 8 NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs and Solidigm D7-P5520 SSDs. Combining GPU parallel computing with high-speed storage, it is designed for deep learning, computer vision, and enterprise AI development. G4826Z5: Making its debut at the summit, this high-density liquid-cooled GPU platform supports up to eight AMD Instinct™ MI355X GPUs and AMD EPYC™ 9005/9004 series processors. With 24 DDR5-6400 memory slots and full CPU/GPU liquid cooling, it ensures consistent performance for dense deployments. Equipped with the Broadcom P2200G network adapter, the G4826Z5 delivers high-speed, low-latency connectivity and stands as MiTAC's flagship liquid-cooled system at this year's exhibition. HPC and Cloud Best Practices | OCP-Compliant Platforms for Scalable Workloads C2811Z5: An OCP-compliant, liquid-cooled, high-density multi-node server powered by AMD EPYC™ 9005 series processors. Each node supports up to 12 DDR5-6400 memory slots and 3TB capacity, with NVMe E1.S storage paired with Micron 9550 NVMe SSDs, for consistent performance in bandwidth-intensive workloads. Designed for HPC workloads such as simulation and engineering, its liquid cooling boosts thermal efficiency and system reliability. Capri 3: An OCP-based cloud server platform offering modularity and flexible expansion, integrated with the Broadcom N1400GD network adapter for high-speed, stable connectivity. Ideal for cloud virtualization, software-defined storage, and data lake architectures, it provides agile scalability for modern data center deployments. Enterprise Data Processing & Storage | Reliable Performance and Flexible Expansion for Data-Intensive Applications R1520G6: A 1U enterprise server powered by Intel® Xeon® 6700P processors, equipped with Micron DDR5 DRAM and Micron 6550 ION NVMe SSDs. Optimized for memory-intensive and sustained read/write workloads, it delivers high performance and reliability for demanding enterprise environments. R2520G6: A 2U dual-processor server supporting up to 24 NVMe U.2 SSDs, featuring Solidigm D7-PS1010 PCIe 5.0 drives for long-term performance stability. Designed for data storage, big data analytics, and AI data preprocessing, it enables enterprises to turn massive datasets into real-time insights for smarter decision-making. In addition to its full rack-level solutions and live demonstrations, MiTAC Computing will host two Executive Sessions on October 14 to explore the future of AI clusters and the architectural evolution of sustainable data centers. MiTAC Computing sincerely invites industry leaders and partners to visit Booth C14 to experience its latest server and cluster solutions firsthand and join the company in exploring the innovative journey "From Server to Cluster." For product catalogs and more information, please visit:MiTAC Computing 2025 OCP Global Summit Landing PageMiTAC Computing Technology Corporation website: https://www.mitaccomputing.com/Intel Platform BrochureAMD Platform Brochure
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