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New Servers Drive Smarter, Faster, and More Efficient AI from the Data Center to the Edge with Entire Range of Intel® Xeon® 6 Processors Supporting Over 40% More Memory Bandwidth and up to 144 CPU Cores SAN JOSE, Calif. and NUREMBERG, Germany, March 12, 2025 /PRNewswire/ -- Supermicro, Inc. (NASDAQ: SMCI) a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, is introducing a wide range of new systems which are fully optimized for edge and embedded workloads. Several of these new compact servers, which are based on the latest Intel Xeon 6 SoC processor family (formerly codenamed Granite Rapids-D), empower businesses to optimize real-time AI inferencing and enable smarter applications across many key industries. Systems for AI and embedded workloads "As the demand for Edge AI solutions grows, businesses need highly reliable, compact systems that can process data at the edge in real-time," said Charles Liang, president and CEO of Supermicro. "At Supermicro, we design and deploy the industry's broadest range of application optimized systems from the data center to the far edge. Our latest generation of edge servers deliver advanced AI capabilities for enhanced efficiency and decision-making close to where the data is generated. With up to 2.5 times core count increase at the edge with improved performance per watt and per core, these new Supermicro compact systems are fully optimized for workloads such as Edge AI, telecom, networking, and CDN." For more information, please visit https://www.supermicro.com/en/products/embedded/servers Supermicro's new SYS-112D series systems are designed to run high-performance Edge AI solutions and feature the recently launched Intel Xeon 6 SoC with P-cores. These servers feature increased performance, improved performance per watt, and higher memory bandwidth compared to previous generations of systems. In addition, the new servers include AI acceleration, Intel® QuickAssist Technology with wireless protocols, Intel vRAN Boost Technology, Intel® Data Streaming Accelerator, and more. Supermicro's SYS-112D-36C-FN3P features the Intel Xeon 6 SoC with 36 P-cores, dual 100 GbE QSFP28 ports, up to 512GB of DDR5 memory, and one PCIe 5.0 FHFL slot for a GPU or other add-on card. Combined with Intel's onboard Media Acceleration and QuickAssist technologies, this makes the system ideal for Edge AI and media workloads, and with a chassis only 399mm/15.7inches deep and with front I/O access, it can easily be deployed in space-constrained environments or embedded in larger systems. Another server based on the same platform, the SYS-112D-42C-FN8P, provides a more telco-optimized configuration, featuring 8 25GbE ports, built-in GNSS and time sync technology, and an Intel Xeon 6 SoC model featuring Intel vRAN Boost. The combination of these features makes this model an all-in-one platform for various workloads in the RAN network. Supermicro is also introducing two new compact systems, the SYS-E201-14AR and SYS-E300-14AR, which are optimized for IoT and AI inferencing at the far edge. Both systems feature the 15th Gen Intel® CoreTM Ultra processors (codenamed Arrow Lake), which features up to 24 cores and an onboard NPU (Neural Processing Unit) AI accelerator. Both systems have two 2.5 GbE network ports, and connectors for HDMI, Display, and USB, and are optimized for enterprise edge use cases. The SYS-E300 can also be expanded to feature a single PCIe 5.0 x16 slot, allowing for the installation of a PCIe GPU card, enabling the system to expand its performance for Edge AI applications in security & surveillance, retail, healthcare, manufacturing and more. In the edge data center, Supermicro's edge AI systems can now be installed with the recently launched Intel Xeon 6700/6500 series processor with P-cores. This processor group is designed for the enterprise data center, aiming for a strong balance between performance and efficiency and delivering an average 1.4x better performance than the previous generation across a wide range of enterprise workloads. Supermicro's 2U Edge AI product family, such as the SYS-212B-FLN2T, combines Intel's new processor with up to 6 single-width GPU accelerators in a short-depth, front I/O form factor that can be deployed at the enterprise edge as well as in telco and space-constrained environments. Supermicro at Embedded World Visit Supermicro at booth #208 in Hall #1 from March 11-13 to learn more about these new systems. About Super Micro Computer, Inc.Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first-to-market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are a Total IT Solutions manufacturer with server, AI, storage, IoT, switch systems, software, and support services. Supermicro's motherboard, power, and chassis design expertise further enables our development and production, enabling next-generation innovation from cloud to edge for our global customers. Our products are designed and manufactured in-house (in the US, Asia, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling). Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc. All other brands, names, and trademarks are the property of their respective owners.
Plans to Integrate Qualcomm's High-Performance IoT Solutions Across Headquarters and Subsidiary Products, Expanding Collaborative Efforts "We Will Drive Progress by Expanding AI Application Models Tailored to Our Business Needs." SEOUL, South Korea, March 11, 2025 /PRNewswire/ -- SK Networks (CEO Hojeong Lee), an AI-centric holding company leading innovation across its headquarters and subsidiaries while driving future business value, is teaming up with Qualcomm Technologies Inc.(hereafter referred to as Qualcomm) to accelerate the growth and advancement of its AI business. SK Networks and Qualcomm Technologies Inc. have been actively exploring collaboration strategies to unlock synergies and have reached an agreement to work together across SK Networks’ wide-ranging business sectors. In a strategic meeting held last December at the Samil Building, Sunghwan Choi, President & COO of SK Networks (left), and O. H. Kwon, President of APAC and Senior Vice President, Qualcomm Technologics Inc., captured sealing their collaboration with a handshake. The company announced on the 11th that, in collaboration with Qualcomm, it will integrate Qualcomm's IoT solutions into its headquarters and subsidiaries, marking a pivotal step fast-tracking the expansion of its AI-driven business portfolio. By harnessing Qualcomm's technology, SK Networks sets to lay the groundwork for the development of innovative new business models, powered by on-device AI, spanning a diverse array of industries. Qualcomm plans to equip SK Networks with IoT solutions such as the 'Qualcomm Dragonwing™ QCS6490,' a high-performance system-on-chip (SoC) that supports on-device large language models (LLM). Designed for industrial and commercial IoT applications, the Dragonwing QCS6490 is optimized for a broad spectrum of use cases, ranging from robotics and drones to gateways, tablets, and kiosks. This collaboration is expected to generate synergies by aligning with SK Networks' unique characteristics, wherein its investment affiliates are actively incorporating AI into a broad business sectors. SK Networks is gearing up to tap into opportunities to leverage Qualcomm's technologies across its headquarters and subsidiaries while utilizing top-tier IoT solutions to push the envelope on AI performance and security. Additionally, the company is doubling down on innovation, aiming to future-proof its business by capitalizing on its global technology and investment expert network, Hicosystem, to stay ahead of the curve in the ever-evolving digital landscape. Sunghwan Choi, President & COO of SK Networks, remarked, "Collaboration with Qualcomm, a global technology powerhouse, enables us to propel our transformation into an AI-driven enterprise." He further emphasized, "By embedding AI into SK Networks' products and services, we are not only enhancing customer experiences but also paving the way for a smarter, more connected future that drives meaningful progress for humanity." O. H. Kwon, President of APAC and Senior Vice President, Qualcomm Technologics Inc., stated, "Qualcomm has been steadily broadening its industrial and commercial IoT portfolio, garnering positive market traction across key sectors such as robotics, manufacturing, logistics, and retail." He added, "Our collaboration with SK Networks marks the first step in broadening our business portfolio, as we continue to champion the advantages of on-device AI and drive innovation across industries." Meanwhile, SK Networks, which unveiled its vision of 'Democratization of AI for Civilization of Humanity' early last year, has been aggressively advancing AI-integrated business models across its diverse operations. SK Speedmate, for instance, has joined forces with Germany's DAT to roll out AI-powered automatic quotation systems. En-core, recognizing the rising prominence of generative AI, introduced its 'Data Orchestration Strategy for AI' in October last year and is preparing to launch a new solution package this year. MINTIT is drawing on AI technology to assess and grade mobile phone performance. Additionally, Silicon Valley-based startup PhnyX Lab debuted Korea's first modular retrieval-augmented generation (RAG)-based AI solution tailored for medical and pharmaceutical applications late last year, receiving significant buzz within the industry. SK Networks plans to continue expanding these AI-driven business models, further embedding AI into its strategic growth initiatives. For more detailed information about SK Networks, please visit the SK Networks website (https://www.sknetworks.co.kr/en).
NUREMBERG, Germany, March 6, 2025 /PRNewswire/ -- Silicon Motion Technology Corporation (NasdaqGS: SIMO) ("Silicon Motion"), a global leader in NAND flash controllers for solid-state storage devices, today announced its participation in Embedded World 2025, taking place from March 11–13, 2025, in Nuremberg, Germany. At the event, Silicon Motion will showcase its latest storage and display interface solutions, including PCIe NVMe Gen4/5 SSD controllers, Ferri embedded storage solutions, and advanced display interface SoCs. These cutting-edge innovations are designed to maximize performance per watt, extend device longevity and power for the next generation of AI-driven industrial, embedded, automotive, and data center applications. Products showcased at Embedded World in Hall 1, Stand 358 include: Automotive SSD Controllers The SM2264XT-AT is a PCIe Gen4 automotive-grade SSD controller featuring eight NAND channels with speeds of up to 1,600 MT/s per channel. The controller is equipped with built-in SR-IOV capability, which allows up to eight virtual machines to share a single physical PCIe device, enhancing flexibility, scalability, security, and reliability for automotive applications. Designed to meet AEC-Q100 Grades 2/3, ISO 26262 functional safety, and ISO 21434 cybersecurity standards, the SM2264XT-AT offers unmatched reliability for automotive and embedded applications. The SM2264XT-AT is the first solution to achieve ASPICE Capability Level 3 certification, ensuring industry-leading software quality and compliance for next-generation automotive systems. Ferri Family: Advanced Storage Solutions for Embedded System, Industrial, and AIoT Applications Silicon Motion's Ferri embedded storage solutions—including FerriSSD®, Ferri-eMMC®, and Ferri-UFS®— are designed to meet the rigorous demands of AI embedded systems such as industrial automation and automotive AI applications. Manufactured using high-quality industrial and automotive-grade processes, these solutions ensure exceptional reliability, data integrity, and endurance for edge computing, industrial control, medical devices, robotics, and smart infrastructure. Featuring proprietary technologies such as NANDXtend® ECC, IntelligentScan™, and DataRefresh™, Ferri solutions deliver enhanced endurance, error correction, and real-time health monitoring, ensuring stable and long-lasting performance in harsh industrial environments and mission-critical embedded applications. SM770 Display Interface SoC: Premium Multi-Display Solution The SM770 is a high-performance display interface SoC engineered for multi-display and supports up to three 4K UHD (3840x2160@60p) displays for industrial and embedded systems applications. The SM770 integrates Silicon Motion's proprietary CAT™ 2.0 (Content Adaptive Technology) to ensure the best balance between performance and computing power, unleashing the CPU from constant heavy loading and reducing bandwidth usage and latency for a seamless viewing experience. Moreover, the SM770 InstantView® software enables plug-and-play functionality without requiring a display driver for a driverless user experience. Broad compatibility with Microsoft Windows, Apple macOS, Linux, Android™, ChromeOS, and major display brands, the SM770 delivers a flexible and seamless multi-display solution for both professional and consumer applications. MonTitan™ 128TB QLC SSD Development Kit: Industry-First PCIe Gen5 Reference Design Kit (RDK) with Flexible Data Placement (FDP) and PerformaShape™ for AI Workloads The MonTitan™ 128TB QLC SSD, powered by SM8366, supports PCIe Gen5 x4 NVMe 2.0 and OCP 2.5 data center specifications, offering unmatched performance, QOS, and capacity for next-generation large AI data lake storage needs. It delivers exceptional sequential read speeds of over 14 GB/s and random read performance exceeding 3.3 million IOPS, maximizing throughput and increasing capacity-per-watt efficiency. MonTitan™ SSD solutions provide faster LLM training and GNN completion times, reducing power budgets to AI storage platforms while improving AI GPU utilization. For more information, please visit: https://www.siliconmotion.com/events/2025EW/ About Silicon Motion: We are the global leader in supplying NAND flash controllers for solid state storage devices. We supply more SSD controllers than any other company in the world—for servers, PCs and other client devices—and are the merchant market leader in controllers for eMMC/UFS mobile embedded storage used in smartphones, IoT and other applications. We also supply customized high-performance hyperscale data center and specialized industrial and automotive SSD solutions. Our customers include most of the NAND flash vendors, storage device module makers and leading OEMs. For further information on Silicon Motion, visit us at www.siliconmotion.com. Corporate Media Contact:Minnie LinDirector of Marketing CommunicationE-mail: minnie.lin@siliconmotion.com Investor Contacts:E-mail:IR@siliconmotion.com Sales Contact:E-mail: service@siliconmotion.com EU Media Contact:Tracy AnnandaleCoastal PRE-mail: tracy@coastalpr.co.uk
Korea's First Automotive AI Accelerator with 200 TOPS NPU (Neural Processing Unit) Customizable AI Design Solutions with Flexible Architecture Targeting Market Gaps to Lead the Automotive AI Accelerator Segment Proprietary Design Boosts AI Performance and Reduces Development Time & Costs SEOUL, South Korea, March 6, 2025 /PRNewswire/ -- Telechips(054450/KOSDAQ), a leading fabless semiconductor company, has unveiled its game-changing automotive AI accelerator, A2X (TCA2000/TCA1000), setting a new benchmark for the future of mobility (SDV). With its cutting-edge technology, A2X is ready to accelerate the adoption of AI-driven automotive systems, streamlining development processes and reducing costs for manufacturers. Telechips(054450/KOSDAQ), a leading fabless automotive semiconductor company, has introduced Korea's first automotive AI accelerator, ‘A2X (TCA2000/TCA1000)’, accelerating AI innovation in the era of Software-Defined Vehicles (SDVs). The A2X is a highly integrated solution, combining sensor interfaces, data preprocessing, and AI acceleration into a single chipset. It delivers peak AI processing power while simplifying development timelines and lowering system costs. Notably, it is equipped with the largest-ever NPU (Neural Processing Unit) in a domestic automotive AI accelerator, ensuring exceptional AI controller performance and maximizing system efficiency. Traditional autonomous driving and ADAS (Advanced Driver-Assistance Systems) rely on a single SoC (System-on-Chip) to handle all processes, from sensor data input to image pre-processing, AI computation, vehicle prediction, and control. This approach often leads to inefficiencies in data flow, increased computational load, and over-dependence on high-performance SoCs, resulting in higher power consumption, escalating costs, and increased system complexity, ultimately burdening automotive manufacturers with lengthy development timelines. The A2X overcomes these challenges with its 200/100TOPS NPU and 100K/50K DMIPS CPU, providing unmatched AI computation performance. It features key preprocessing blocks like De-warp, Multi-scaler, and Point Cloud Accelerator, reducing the load on the main SoC and enabling real-time AI processing at peak efficiency. The A2X also offers seamless integration with ADAS and IVI processors, boosting system scalability and reinforcing the competitive edge of SDVs. It will soon support on-device AI features, including LLM/sLLM. The automotive semiconductor market is growing rapidly. According to Global Information, the market was valued at $19.89 billion in 2023 and is projected to grow at an annual rate of nearly 30% through 2030, with the share of AI semiconductors increasing each year. Major global competitors in this sector have primarily focused on high-performance SoCs with integrated AI capabilities rather than dedicated AI accelerators. With the launch of A2X, Telechips aims to aggressively expand its presence in both domestic and international markets, targeting white space opportunities in the automotive AI accelerator segment and creating sustainable growth opportunities through strategic promotions. JK Lee, CEO of Telechips, stated, "A2X is a groundbreaking solution that combines flexible architecture with powerful AI processing capabilities, allowing customers to accelerate their technology roadmaps. As AI semiconductors become a key determinant of future mobility competitiveness, Telechips is committed to leading the automotive AI accelerator market and establishing a distinctive market position." Starting April 1, Telechips will provide engineering samples (ES) of A2X to customers, preparing for mass production. Meanwhile, the company continues to expand its AI product lineup for SDVs. About Telechips:Telechips is a global fabless company providing comprehensive semiconductor solutions for the automotive industry. With expertise in high-performance and highly reliable SoC technology, Telechips plays a key role in the software-driven mobility era, covering infotainment, MCU, high-performance network gateways, ADAS, and AI. www.telechips.comTelechips Media enquiries:KW Lee/ Team Leader (+82-2-3017-5730/ ma40481@telechips.com)Alley Chun/ Manager (+82-2-3017-5722/ alley.chun@telechips.com)
本文旨在介紹如何使用亞信電子的AX58400 EtherCAT從站雙核微控制器快速導入EtherCAT從站產品設計。 隨著人工智慧（AI）和機器人技術的不斷創新，工業自動化產業正邁向更高智慧和高效能的嶄新未來。EtherCAT 工業通訊技術以其高效能、超低延遲、高可靠性、精確的時間同步和低設置成本，成為現今工業乙太網路通訊技術的主流標準。本文將闡述如何使用亞信電子（ASIX Electronics Corporation）的AX58400 EtherCAT從站雙核微控制器開發套件，快速導入高效能的EtherCAT從站解決方案，加速企業推展智慧工業自動化的進程。 高速可靠且超低延遲的EtherCAT工業乙太網路晶片 EtherCAT工業乙太網路晶片以其獨特的「飛速傳輸」（Processing on the fly）數據交換機制，充分利用工業乙太網路的帶寬資源，大幅降低資料傳輸延遲至小於1微秒（us），從而確保工業自動化通訊的實時性和確定性。亞信電子推出一系列EtherCAT從站控制晶片，包括AX58100控制器、AX58200專用通訊SoC以及AX58400雙核微控制器，這些晶片皆已獲得 EtherCAT 技術協會（ETG）的認可，並正式列入ETG 協會網站的 EtherCAT 產品指南。 （圖一） ETG產品指南 － 亞信AX58x00系列EtherCAT從站控制晶片 AX58400是一款高效能EtherCAT從站雙核微控制器，集成了意法半導體STM32H755雙核微控制器，擁有480MHz ARM Cortex-M7和240MHz Cortex-M4雙內核。其內建的EtherCAT從站控制器配備兩個高速乙太網路PHY。AX58400支援各種通訊/控制周邊介面，包括具有MII/RMII介面的10/100 Mbps高速乙太網路MAC、高速USB 2.0 OTG、LCD-TFT顯示控制器、DCMI數位攝像頭介面、JPEG硬體編解碼器，以及SPI、UART、I2C等，另外還支援AES/TDES/HASH/HMAC硬體加密引擎及ROP/PCROP/防篡改訊息安全技術。 （圖二） AX58400 EtherCAT從站雙核微控制器 AX58400支援CoE、FoE、VoE等各種標準的EtherCAT通訊協定，適用於各種實時工業自動化控制應用，包括馬達與運動控制、數位/類比訊號I/O控制、感測器數據採集、機器人轉軸控制、EtherCAT轉IO-Link閘道器和EtherCAT Junction從站模組等。 （圖三） AX58400 EtherCAT從站典型產品應用 簡便的EtherCAT從站開發套件 亞信電子提供多款AX58400 EtherCAT從站開發套件，包括馬達運動控制、數位/類比I/O控制以及EtherCAT轉IO-Link閘道器模組，幫助客戶加速前期評估及產品設計開發時程。這些開發套件內含詳細的產品設計資料與參考源代碼，包括產品數據手冊、電路圖、電路板佈線圖、軟硬體設計指南及軟韌體源代碼。 （圖四） AX58400 EtherCAT從站開發套件 EtherCAT產品設計流程簡介 AX58400 EtherCAT從站雙核微控制器內建STM32H755雙核微控制器，並在馬達控制參考設計中結合了意法半導體的X-NUCLEO-IHM08M1 BLDC馬達驅動擴展板及STM32馬達控制軟體開發套件（MCSDK）來進行產品應用開發。因此，設計人員可以遵循以下軟硬體設計流程，使用亞信電子提供的AX58400 EtherCAT從站馬達控制開發套件，並搭配STM32開發工具（STM32 MC Workbench、STM32CubeMX、STM32CubeIDE和STM32CubeProgrammer），來完成AX58400馬達控制產品的設計開發。 亞信電子也提供完整的AX58400 EtherCAT從站數位I/O控制開發套件，設計人員可依據此軟硬體設計流程，快速完成AX58400 EtherCAT從站I/O控制產品的開發設計。此外，亞信還提供整合了亞信自主研發IO-Link主站軟體協議棧的AX58400 EtherCAT 轉 IO-Link閘道器解決方案，可根據客戶需求提供相關技術支援服務。 Ÿ 硬體設計流程概述 亞信電子提供的AX58400 EtherCAT從站馬達控制開發套件包含完整的參考電路圖、PCB佈線圖和硬體設計指南。設計人員可以依據這些資料，迅速完成EtherCAT從站產品的硬體設計。此外，亞信電子的技術服務團隊還提供免費的電路圖和PCB佈線圖檢查服務，以協助客戶順利完成AX58400產品的硬體設計。AX58400 EtherCAT從站馬達控制產品的硬體設計流程如下， a. 根據AX58400 EtherCAT從站馬達控制開發板的電路圖和硬體設計指南，完成AX58400設備的電路圖設計。 b. 參考AX58400 EtherCAT從站馬達控制開發板PCB佈線圖與硬體設計指南，進行AX58400設備的PCB佈線圖設計。 c. 可將新設計的AX58400設備電路圖與PCB佈線圖提交給亞信電子技術服務團隊進行檢查。 d. 進行AX58400設備的PCB板製作後，即可開始準備驗證新AX58400設備的硬體功能。 （圖五） AX58400 EtherCAT從站馬達控制參考設計 （圖六） AX58400硬體設計參考電路圖&PCB佈線圖 Ÿ 軟體設計流程概述 AX58400 EtherCAT從站馬達控制開發套件除了硬體設計參考資料外，還提供完整的軟韌體參考源代碼和軟體設計指南。設計人員可參考這些源代碼、設計指南及教學影片，快速架設AX58400開發環境。新的AX58400硬體設備製作完成後，即可在此環境中驗證功能，並根據產品應用需求修改和測試軟韌體源代碼。這些源代碼包括Bootloader、產品應用韌體和TwinCAT PLC應用程式。以下是AX58400 EtherCAT從站馬達控制產品的軟體設計流程， a. 使用ARM KEIL MDK uVision 5開發工具編譯AX58400 Bootloader源代碼，然後通過STM32CubeProgrammer工具將其燒錄到AX58400硬體設備中。 b. 使用EtherCAT SSC工具生成EtherCAT SSC源代碼；通過STM32CubeIDE或ARM KEIL MDK uVision 5開發工具編譯AX58400 EtherCAT從站馬達控制韌體源代碼，再使用STM32CubeIDE或STM32CubeProgrammer工具將新編譯的韌體燒錄到AX58400硬體設備中。 c. 使用倍福（Beckhoff）TwinCAT 3 XAE開發工具創建一個新專案，載入並編譯AX58400 EtherCAT從站馬達控制TwinCAT PLC應用程式源代碼，執行該應用程式燒錄EEPROM，並開始驗證AX58400硬體設備功能。 d. 通過AX58400硬體設備功能驗證後，即可開始根據產品需求進行軟韌體源代碼的修改與測試。 （圖七） AX58400 EtherCAT從站開發工具 （圖八） AX58400馬達控制TwinCAT PLC應用程式 EtherCAT產品相容性測試 在完成新的EtherCAT從站設備功能驗證後，可以使用倍福的EtherCAT一致性測試工具（CTT）進行相容性測試，以確保產品設計符合標準的EtherCAT工業通訊協定。此CTT工具可以安裝在Windows電腦上當作EtherCAT主站，連接待測的EtherCAT從站設備並載入ESI檔，即可開始進行相容性測試。 （圖九） 倍福EtherCAT一致性測試工具 (CTT) 結論 本文探討了如何使用亞信電子的AX58400 EtherCAT從站雙核微控制器開發套件，快速實現高效能EtherCAT從站產品的設計。透過詳細介紹AX58400的晶片特性、開發套件、硬體與軟體設計流程及產品相容性測試，我們希望能為工程師們提供清晰的產品設計思路，並期待未來有更多企業採用EtherCAT工業通訊技術，共同推動智慧工業自動化產業的蓬勃發展。
深圳2025年3月6日 /美通社/ -- 近日，華為數字能源在國際權威的獨立保障和風險管理機構DNV、戰略客戶的全程見證下，圓滿完成了智能組串式構網型儲能的極限燃燒試驗，以打破行業傳統安全邊界的創新理念和真實場景極限驗證，為儲能行業安全標準樹立全新里程碑。 Huawei's Smart String & Grid Forming ESS Triumphs in Extreme Ignition Test 極限認證：全場景燃燒測試 華為數字能源在國際通行標準UL9540A測試方法的基礎上，大幅增加熱失控電芯數量，測試嚴苛程度呈指數級提升，全面驗證了智能組串式構網型儲能在極限燃燒時的系統安全防護能力。 亮點一：100%量產真機實測，構築真實、完整極限驗證環境 本次極限燃燒試驗嚴格遵循實際應用場景，A/B/C/D四組智能組串式構網型儲能箱均為100%量產真機，現場充電至100%SOC後，按照實際電站最小維護間距和安全距離要求部署，測試全程未經人為控制及干預，構建起真實、完整的系統級極限驗證環境。 亮點二：12顆電芯熱失控，箱內無可燃氣體，主動點火無燃爆 相比傳統儲能系統1顆電芯發生熱失控時，可燃氣體在儲能箱內部聚集並造成起火、燃爆，華為智能組串式構網型儲能A箱在發生12顆電芯同時熱失控的極限場景時，仍能通過首創的正壓阻氧+定向排煙聯合防禦機制，實現可燃氣體快速導排，箱內無可燃氣體，主動點火無燃爆，安全事故自終止，體現了電池包級不起火、不擴散的極致安全能力。 亮點三：最大供氧條件燃燒，更嚴苛測試工況，極致耐火不擴散 為進一步構造大規模燃燒條件，測試時不斷增加熱失控電芯數量，直至整個電池包發生熱失控，並提供最大進氧量，構築更嚴苛的燃燒測試工況。試驗過程中，相鄰B/C/D三組箱體內最高電芯溫度為47℃，遠低於電芯熱失控溫度閾值，未發生熱失控蔓延。測試後對A箱拆機驗證，儲能箱主體、耐火層、內部電池包等各部件均呈現出良好的完整性，證明了極限場景下箱級熱失控不擴散的兜底安全能力。 亮點四：耗時7小時才觸發燃燒，更多早期干預時間，避免惡性事故發生 傳統儲能系統任意1顆電芯熱失控後，存在即時燃爆風險，通常快速演變為安全事故。華為通過絕緣絕熱、定向排煙等創新設計，在不斷主動增加熱失控電芯數量的極限場景下，仍耗時7小時才觸發A箱燃燒，呈現出非常緩慢的演變過程。這意味著真實應用場景的電芯發生熱失控時，事故應急處理人員有更多時間進行早期干預，抑制事故發生，保障人身和財產安全。 Huawei's Smart String & Grid Forming ESS Triumphs in Extreme Ignition Test 技術破壁：重構儲能安全邏輯 儲能安全是新能源產業持續高質量發展的基石。華為數字能源基於電力電子技術和數字技術領域的深厚積累，在質量和安全領域堅定投入，並通過架構級創新突破，成功將電化學儲能的安全防護體系從行業主流的箱級升級至電池包級熱失控不擴散。華為數字能源通過技術創新和極限試驗驗證，重新定義了儲能系統的安全基準，實現熱失控防護能力的代際跨越，為全球儲能產業高質量發展構築起堅實的技術底座，持續引領行業向系統級安全、智能化防護的新紀元邁進。
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