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SAN FRANCISCO, April 1, 2025 /PRNewswire/ -- At the OFC Conference, from March 30 to April 3, 2025, at San Francisco's Moscone Center, Yangtze Optical Fibre and Cable Joint Stock Limited Company (YOFC) (stock tickers: 601869. SH, 06869.HK) highlighted several new developments in hollow-core fibre technology. During a workshop entitled "How will future submarine systems look like", Dr. LUO Jie, YOFC's Chief Technology Officer, presented groundbreaking advances in the field of hollow-core fibre technology. YOFC's presentation focused on its latest strides in reducing attenuation to a record-low of 0.05dB/km and extending the manufacturing length of single fibres to over 20 kilometers—achievements that not only set new global benchmarks but also starkly outperform traditional solid-core fibres. These technological advancements were demonstrated through a 21.7 km long hollow-core fibre with a proprietary supporting tube structure (ST-HCF). This drew considerable attention at the exhibition for its potential implications in optical communications. Hollow-core fibre technology represents a paradigm shift in optical communications, enabling light to be transmitted through an air core. The design facilitates a 47% increase in transmission speed and a 31% reduction in latency compared to conventional fibres, showcasing the significant potential for applications requiring rapid and efficient data transmission such as in data centers, AI models, and financial trading. Additionally, the technology's exceptionally low attenuation and nonlinearity could potentially address the capacity bottlenecks faced by submarine communication networks and long-distance terrestrial communication lines. In his presentation, Dr. LUO Jie explored both the practical and theoretical enhancements that hollow-core fibres could bring to submarine cable systems, emphasizing their ability to increase data throughput and reduce transmission times in future deployments. YOFC has been at the forefront of hollow-core fibre technology development, leveraging its comprehensive research capabilities and autonomous raw material research system to overcome significant industrial challenges. As the digital economy grows, YOFC's continued innovation in hollow-core fibre technology is set to play a crucial role in supporting the evolution of global digital infrastructure, ensuring it is robust, efficient, and equipped to meet future demands.
Important Risk Disclosures and Fund Information CMS Hang Seng Tech Index ETF (the "Sub-Fund") is a sub-fund of CMSAM(HK) Funds Series 1 OFC which is a public umbrella open-ended fund company established under Hong Kong law with variable capital with limited liability and segregated liability between sub-funds. The Sub-Fund is a passively managed index tracking exchange traded fund. It offers shares in both listed and unlisted classes. The listed class is traded on The Stock Exchange of Hong Kong Limited. The investment objective of the Sub-Fund is to provide investment results that, before deduction of fees and expenses, closely correspond to the performance of the Hang Seng TECH Index which represents the 30 largest technology companies listed in Hong Kong with high business exposure to selected technology themes. The Sub-Fund is passively managed and the Manager will not have the discretion to adapt to market changes. It is also subject to tracking error risk. The Sub-Fund's investments are concentrated in Hong Kong listed companies that are active in technology sector. They are subject to concentration risks in Greater China region and companies with a technology theme. The Sub-Fund's investments are subject to risks relating to a relatively short operating history, higher volatility in price performance, intense competition, government intervention, rapid changes, loss of impairment of intellectual property rights, cyber security and different technology sectors. Investors in shares of the listed and unlisted classes are subject to different pricing and dealing arrangements. The net asset value per share in respect of the listed and unlisted classes may be different due to different fees and cost applicable to each class. The listed class of the Sub-Fund is subject to trading risks that its shares may trade at a substantial premium or discount to its net asset value and reliance on market makers risks. The Sub-Fund is also subject to equity market risk, securities lending transactions and early termination risk. Distributions (if any) may be paid out of capital or effectively out of capital at the Manager's discretion, which amount to a return or withdrawal of part of an investor's original investment or from any capital gains attributable to that original investment. Any such distributions may result in an immediate reduction in the net asset value per share of the Sub-Fund and will reduce the capital available for future investment. Investment involves risks and your investment in the Sub-Fund may suffer losses. You should not make investment decision on the basis of this material alone. Please read the prospectus and the product key facts statement of the Sub-Fund for further details including the risk factors. HONG KONG, April 1, 2025 /PRNewswire/ -- CMS Asset Management (HK) Co., Limited ("CMS Asset Management (HK)" or the "Company", a fully-owned subsidiary of China Merchants Securities International Company Limited) is pleased to announce that CMS Hang Seng Tech Index ETF (Stock Code: 3423.HK) was listed on The Stock Exchange of Hong Kong (the "HKEX") [on 31 March]. CMS Hang Seng Tech Index ETF (Stock Code: 3423.HK) tracks the Hang Seng TECH Index, helping investors seize growth opportunities in China's cutting-edge technology sector. CMS Hang Seng Tech Index ETF (Stock Code: 3423.HK) is listed at initial price of HKD10 per unit, with a board lot size of 10 shares, and a management fee of 0.70% (listed share); as of 31 March 2025, the initial AUM reached HKD 368 million. The Hang Seng TECH Index covers the 30 largest technology companies listed in Hong Kong, including leading enterprises in the fields such as Internet, fintech, e-commerce and artificial intelligence. With China's technology industry ushering in historic development opportunities, it has become an important indicator reflecting the development of China's emerging technology industry since its launch in 2020. CMS Hang Seng Tech Index ETF (Stock Code: 3423.HK) closely tracks the Hang Seng TECH Index, actively deploys in the core sectors such as artificial intelligence, semiconductors and new energy. It offers an investment solution with low-cost advantage in China's technology stocks, helping investors share the benefits of China's technology development. Mr. Liu Bo, Chairman of China Merchants Securities International Company Limited, said: "CMS Asset Management (HK) is committed to creating investment returns for investors through its distinctive investment strategies, high-quality asset portfolios, professional management team and rigorous risk control system. Currently, the world is undergoing an unprecedented technological revolution. The launch of CMS Hang Seng Tech Index ETF (Stock Code: 3423.HK) aims to help investors seize investment opportunities in the China's technology sector in a timely manner, sharing the growth of these innovative enterprises, and participate in the investment of China's leading technology companies in a low-cost and high-efficiency way. CMS Asset Management (HK) has focused on forward-looking positioning in the technology and innovation sector, continuously investing in the global technology industry and developing multiple innovative ETF products. With the launch of the Hang Seng TECH Index ETF, combined with the existing Pando CMS Innovation ETF (Stock Code: 3056.HK)^, the CMSAM(HK) has established the investment layout in the two major technology camps of China and U.S., possessing the capability to allocate high-quality global technology assets for investors." Mr. Zhou Geng, Chief Executive Officer of CMS Asset Management (HK) Co., Limited, said: "In recent years, the size of the passive index investment market has grown rapidly due to its low cost, high transparency and long-term outstanding performance, making ETFs increasingly favored by investors. The newly launched CMS Hang Seng Tech Index ETF (Stock Code: 3423.HK) further enriches the Company's product line and provides investors with more diversified asset allocation options. The CMS Hang Seng Tech Index ETF gathers the top 30 most representative leading technology enterprises listed in Hong Kong. Through the full industry chain service capability of CMS International's ETF, it collaborates with numerous high-quality partners to ensure the ETF closely tracks the relevant index, providing investors with a more cost-effective investment method." Overview of Fund Information ETF name CMS Hang Seng Tech Index ETF Listing Date (SEHK) 31 March 2025 Stock Code: 3423.HK Manager: CMS Asset Management (HK) Co., Limited Ongoing charges over a year: 0.89 % Estimated annual tracking difference: - 0.99 % Underlying Index Hang Seng TECH Index About CMS Asset Management (HK) Co., Limited CMS Asset Management (HK) Co., Limited is a wholly-owned subsidiary of China Merchants Securities International Company Limited, established in 2008, focusing on providing diversified asset management services to institutional and individual investors. Its managed fund products cover the fields such as equities, equity-bond hybrids, fixed income and cash management, with stable and good return performance. Among them, two ETF products jointly managed by CMS Asset Management (HK) and Pando Finance Limited recently received three accolades: the Pando CMBI Innovation Thematic ETF (3056.HK) was awarded the "Bloomberg Businessweek TOP FUNDS 2024 - Technology Equity ETF One-Year Return Excellence Award" and the "2024 Offshore China Fund Awards - Most Innovative Product Award"; the Pando CMS Blockchain ETF (3112.HK) received the "Bloomberg Businessweek TOP FUNDS 2024 - Blockchain Technology Equity ETF One-Year Return Outstanding Award". For more information about the products of CMS Asset Management (HK), please visit the website at http://www.cmschina.com.hk/en/AM/FundProduct Notes： ^CMS Asset Management (HK) acts as the investment adviser, jointly managing the Fund with Pando Finance Limited. Disclaimer This document is issued by CMS Asset Management (HK) Co., Limited ("CMSAM(HK)"). The content shall not be changed or modified and the content shall not be used in any other manner unless with the prior written consent of CMSAM(HK). CMSAM(HK) reserves the right to change the content without notice. This document is for informational and illustrative purposes only and should not be construed as legal, tax, investment or other advice. This document does not constitute an offer to sell, or the solicitation of an offer to buy, any securities of CMSAM(HK) Funds Series 1 OFC (the "Fund") and its sub-fund, CMS Hang Seng Tech Index ETF (the "Sub-Fund") or any other fund(s). This document has not been reviewed by the SFC. Investors should note that all investments involve risks (including the possibility of loss of the capital invested), prices of shares and income distributions payable, if any, may go up as well as down and past performance (if any) is not indicative of future performance. Investors should read the Prospectus (including the Product Key Facts Statement and the full text of the risk factors stated therein) in detail before making any investment decision, as well as seek separate, independent financial advice if required prior to making an investment in the Sub-Fund or any other fund(s) to assess the suitability, lawfulness and risks involved. The information contained herein does not have any regard to the specific investment objectives, financial situation or the particular needs of any person. Investors should consider the fees and charges involved. SFC authorization is not a recommendation or endorsement of the Sub-Fund nor does it guarantee the commercial merits of the Sub-Fund or its performance. It does not mean the Sub-Fund is suitable for all investors nor is it an endorsement of its suitability for any particular investor or class of investors. CMSAM(HK) shall not be liable for any loss, damage or expense incurred directly or indirectly as a result of the use of and/or reliance upon the whole or any part of the contents in this document. This document is not legally binding. This document is not applicable in jurisdictions where the distribution of this document is restricted. The product is only available in jurisdictions where it can be lawfully provided. For index provider disclaimers, please refer to the offering documents of the relevant funds. Mr. Liu Bo, Chairman of China Merchants Securities International Company Limited (left) and Mr. Zhou Geng, Chief Executive Officer of CMS Asset Management (HK) Co., Limited (right) participating in the gong-striking ceremony.
40% believe their employer ‘copies’ competitors in order to keep workplace relevantTAIPEI, TAIWAN - Media OutReach Newswire - 31 March 2025 – Taiwan's talent shortage continues to escalate, with the National Development Council forecasting a 480,000 workforce gap by 2030. However, businesses are already experiencing the pressure. The latest survey from Robert Walters, the world's most trusted talent solutions firm, reveals that 52% of companies in Taiwan plan to expand hiring in 2025while 71% of employers report difficulties in filling critical positions, with nearly half (49%) struggling to recruit mid-to-senior level professionals. In an increasingly competitive hiring market, businesses are transforming their recruitment and retention strategies. Robert Walters' research reveals that 40% stated that 'what other companies do' is the leading factor driving change in their workplace – followed by the company's financial position, the wider economy, and lastly 'what professionals want.' In Taiwan, 51% of employers identify intense competition among companies as a significant hurdle to talent acquisition and retention. John Winter, Country Manager of Robert Walters Taiwan, emphasises: " The competition for top talent is intensifying. The most forward-thinking companies are prioritising adaptability, digital transformation, and a people-centric approach to stay ahead. As external competition increasingly drives workplace change, the key to success lies in agility, innovation, and cultivating a culture where top talent can thrive. Those who embrace this evolution will set themselves apart in the shifting landscape." To help organisations navigate this rapidly evolving landscape, Robert Walters has launched the latest Talent Trends 2025 Report, which explores key global workforce trends and strategic insights for talent attraction and retention. The Biggest Workplace Trends in 2025 AI in recruitment Human-centric leadership Treat your candidates like customers Rethinking remote working Window working Career lattice vs ladder Un-retiring Preparing your people for the jobs of tomorrow Work-life balance & human-centric leadership: the keys to attracting and retaining talent The Robert Walters 2025 Salary Survey finds that professionals in Taiwan prioritise three key factors when considering job opportunities, "Bonus scheme" (95%), "Flexi/remote working" (75%), "Extended holiday/sabbatical/holiday entitlement" (73%). This reflects a growing demand for work-life balance and flexibility among job seekers. However, the "return-to-office" movement driven by businesses in 2024 has clashed with employee expectations. According to the Robert Walters Talent Trends 2025 Report, organisations that prioritise a people-first leadership approach—centered on inclusivity, empathy, and employee well-being—are more successful in attracting and retaining top talent. Companies that foster flexibility, psychological safety, and a well-being-focused workplace gain a competitive edge in employee engagement and retention. As a result, innovative hybrid work models, such as the "four-day workweek" and "window working" continue to gain traction. As a rising flexible work model, "window working" allows employees to structure their work schedules around peak productivity hours rather than adhering to traditional fixed hours. This enhances efficiency and job satisfaction while enabling employees to balance professional and personal commitments. By adopting this model, companies can enhance job satisfaction and productivity while maintaining team collaboration and business continuity. John Winter, Country Manager of Robert Walters Taiwan, shares: "Empathy-driven leadership and workplace flexibility will be key to organisational success in 2025, helping businesses enhance employee satisfaction and productivity." 94% of employees stay longer with companies that prioritise career development - a shift from rigid career ladders to dynamic career lattices! The latest Robert Walters research reveals that 94% of employees are more likely to stay with companies that invest in career development. This underscores the importance of learning & development (L&D) programmes in talent retention strategies. Furthermore, traditional career progression models are evolving. Instead of the rigid career ladder, professionals now favour a career lattice model, where lateral moves, cross-functional experience, and skills-based growth take precedence over hierarchical promotions. With 39% of workplace skills expected to change by 2030, companies must proactively upskill employees in both technical and soft skills to remain competitive. In Taiwan, 92% of companies have already implemented diverse strategies, such as enhancing L&D programmes and easing hiring requirements, to address talent shortages and meet organisational needs for skilled professionals. AI in recruitment: accelerating hiring while maintaining human-centric decisions As AI adoption accelerates, over 40% of businesses in Taiwan are already leveraging AI tools like ChatGPT to enhance productivity. However, the current use of AI in recruitment remains in its early stages. In the future, AI will transform every aspect of the hiring process, from job ad creation, candidate sourcing and screening, to final hiring decisions. By integrating AI-driven recruitment strategies, businesses will significantly reduce hiring timelines, cut costs, and enhance hiring efficiency. However, the Robert Walters Talent Trends 2025 Report highlights that AI in recruitment still has limitations. Companies must balance automation with fairness, ethical hiring practices, and human decision-making, as AI cannot fully replace human judgment. Organisations should find the right equilibrium between AI-powered efficiency and human intuition. Robert Walters Talent Trends 2025 Report have gathered insights and views from experts within the recruitment industry to help businesses navigate a rapidly evolving hiring market and develop effective strategies for attracting and retaining talent. Download the full report here: https://reurl.cc/04Y0Ob Hashtag: #RobertWaltershttps://www.robertwalters.com.tw/The issuer is solely responsible for the content of this announcement.Robert WaltersRobert Walters is the world's most trusted talent solutions business. Across the globe, we deliver recruitment, recruitment process outsourcing and advisory services for businesses of all shapes and sizes, opening doors for people with diverse skills, ambitions, and backgrounds. We help organisations find the skills and solutions to reach their goals and assist talented professionals to power their unique potential. The Taipei office specialises in placing candidates in the following specialities: accounting & finance, electronics & industrial, healthcare, human resources, IT & digital transformation, marketing, manufacturing, sales, semiconductors, software, supply chain, logistics & procurement.
High-accuracy packaging in panel level packagingTOKYO, JAPAN - Media OutReach Newswire - 27 March 2025 - Toray Engineering Co., Ltd.,has developed the UC5000, a high-accuracy semiconductor packaging equipment (bonder) for panel level packaging "PLP". PLP is an advanced semiconductor packaging technology, for which there is growing demand particularly from AI servers. Sales of the UC5000 will commence in April 2025. PLP-compatible bonder UC5000 This system is capable of packaging chips with a high accuracy of ±0.8μm using thermal compression bonding "TCB" on 515mm × 510mm and 600mm × 600mm panels complying with the SEMI Standards. It can also carry out high-accuracy TCB packaging on glass panels, which is gaining attention as an alternative material to silicon, contributing to the manufacturing of next-generation semiconductor packaging. Toray Engineering aims to supply the UC5000 to manufacturers of semiconductors, targeting 3 billion yen in orders in FY2025 and 10 billion yen in FY2030. With the increasing performance of semiconductors, chiplets—a technology that packages several semiconductors chips into a single package, as represented by 2.5D packaging—is gaining attention. Wafer level packaging based on silicon wafers, such as those using interposers for high-speed transmission between semiconductor chips, was the mainstream for semiconductor packages comprising such chiplets. Going forward, with semiconductor packages becoming bigger due to increasing performance, PLP based on glass panels, which allow sizes larger than wafers and rectangular shapes, is gaining attention because wafers cannot grow larger in size and have poor manufacturing efficiency, having to cut rectangular shapes from round wafers. However, compared to wafers, large glass panels warp significantly and are difficult to transfer, and require larger heaters to heat the panels. There were thus issues with heat control within system as well as difficulties in achieving high-accuracy packaging while taking into account the expansion and shrinking of materials due to heat. The UC5000 achieves high-accuracy packaging of ±0.8μm on large panels and TCB through: a technology—used in TCB packaging equipment for small substrates, for which Toray Engineering has a mass production track record at least 100 units so far—that maintains accurate packaging, calibrating for impact from heat arising from high temperatures of 300℃ and higher during soldering; high-accuracy packaging technology and panel-warping correction transfer technology that were used in systems equipped with bridge chips for large panels, for which there is a mass production track record of at least 50 units; and a complete overhaul of the core control system for use in the UC5000. This system is also compatible with front-opening unified pods (FOUPs) for panels and tape frames that comply with SEMI Standards, which are starting to be adopted in the downstream processes of semiconductors, and its composition can also handle mass production at the latest plants. Besides the TRENG coater and large glass substrate inspection system, Toray Engineering will contribute to the further adoption of PLP by adding the UC5000 to the lineup for the field of advanced semiconductor packaging. For more information, please visit www.toray-eng.com.Hashtag: #TorayEngineeringThe issuer is solely responsible for the content of this announcement.
SHANGHAI, March 26, 2025 /PRNewswire/ -- Hesai Technology (NASDAQ: HSAI), the global leader in lidar solutions, today announced it has secured an exclusive series production partnership with Chery Automobile's new energy brand, iCAR. Under the agreement, Hesai's groundbreaking ATX Lidar will be integrated in new iCAR vehicles, with mass production scheduled to commence in the fourth quarter of 2025. Hesai's ATX lidar, a compact, ultra-high-definition, long-range sensor, is set to enhance iCAR vehicles' perception capabilities in complex scenarios including active braking, adaptive cruise control, urban navigation, and smart parking. The partnership is part of Chery's comprehensive intelligent mobility strategy which is designed to make it a leader in smart mobility ecosystems. "We are glad to have been selected as the exclusive lidar provider for iCAR's new models. Our partnership with Chery represents a significant milestone in our endeavor to make intelligent driving technology accessible to the mass market," said Yifan "David" Li, Hesai's Co-Founder and CEO. To date, Hesai has secured design wins with 22 automotive OEMs for over 120 vehicle models globally. In December 2024, Hesai became the first lidar company in the world to deliver more than 100,000 units in a single month.
SHANGHAI, March 26, 2025 /PRNewswire/ -- From April 15 to 17, 2025, Shanghai New International Expo Centre will stage an annual grand event in the electronic industry—electronica China 2025. This year's exhibition has specially crafted a forum matrix centered on three dimensions, namely technological innovation, industrial integration, and ecological co-construction, spotlighting cutting-edge fields like electric vehicles, humanoid robots, third-generation semiconductors, and AI chips. It will invite numerous industry leaders and technical experts to deliver an industrial feast of intellectual exchange. Register Now: https://ec.global-eservice.com/?lang=en&channel=mts Key themes of concurrent forums April 15: Day of Intelligent Connectivity and Innovation Ecosystem International Connector Innovation Forum: To unravel the connector technology revolution across emerging sectors like rail transit and new energy vehicles, and uncover the new paradigms of material innovation and intelligent manufacturing International Medical Electronics Innovation Forum: To delve into the forefront of medical artificial intelligence (AI) and robotics, tracing the evolution of wearable devices and the smart healthcare ecosystem 2025 Innovation Forum on Energy Storage Technology: To tackle industry pain points like battery safety and efficient conversion, creating an integrated platform for communication among the industry, universities, research institutions, and markets 2025 AI Technology Innovation Forum: To conduct an in-depth analysis of Chiplet architecture, edge computing, and AIoT chip technology, exploring new pathways for data security and computing power revolution International Embedded System Innovation Forum: To establish a new ecosystem for the development of intelligent equipment, with a focus on industrial internet of things and embedded AI applications 2025 International Automotive Electronics Technology Innovation Forum: To redefine the automotive electronic architecture and usher in a new era of intelligent travel, concentrating on advances in automotive-grade chip design and multimodal sensing technologies April 16: Day of Energy Revolution and Humanoid Intelligence 2025 New Energy Vehicles Three Electric Technology Summit Forum: To offer a detailed explanation of breakthroughs in core technologies like the 800V high-voltage platforms and thermal management systems 2025 Third Generation Semiconductor Technology and Application Forum: To unveil the application prospects of new power devices in new energy and other fields Humanoid Robot Innovation Forum: To delve into the core components of humanoid robots and forecast opportunities in the blue ocean of trillion-yuan markets New Energy and Intelligent Vehicle Technology Forum: To discuss challenges in the mass production of automotive-grade chips and explore a new collaborative model between automobile assembly plants and semiconductor enterprises International Motor Drive and Control Technology Forum 2025: To empower Industry 4.0 upgrading through high-efficiency algorithms and digital solutions Register Now: https://ec.global-eservice.com/?lang=en&channel=mtsLearn more about electronica China: https://www.electronicachina.com.cn/en/ [About electronica China]As an important exhibition in the global electronic industry, electronica China remains committed to driving technological innovation and industrial upgrading. Covering an area of over 100,000 square meters, this year's exhibition is expected to bring together nearly 1,800 exhibitors and over 80,000 professional visitors. By deeply integrating exhibitions and forums, it will establish a platform for communication and cooperation that spans the entire industrial chain. For more information, please contact:Chloe Qiu at chloe.qiu@mm-sh.com.
A12 藝術空間
Semiconductors
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