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KYOTO, Japan, Jan. 20, 2026 /PRNewswire/ -- Nuvoton Technology Corporation Japan (hereinafter "NTCJ") announced on January 20 the start of mass production of its high-power ultraviolet semiconductor laser (379 nm, 1.0 W), which delivers industry-leading (*) optical output in a 9.0-mm diameter CAN package (TO-9). This product achieves short wavelength, high output power, and long lifetime -- three elements previously considered difficult for ultraviolet semiconductor lasers -- through NTCJ's proprietary device structure and advanced high-heat-dissipation packaging technology. As a result, it contributes to fine patterning and improved production throughput in maskless lithography for advanced semiconductor packaging. (*) As of January 16, 2026, based on NTCJ's research of semiconductor lasers emitting at 379 nm in a TO-9 CAN package under continuous-wave (CW) operation at a case temperature (Tc) of 25C. Key visual: https://cdn.kyodonewsprwire.jp/prwfile/release/M108245/202601072090/_prw_PI1fl_x5FsfwAW.jpg Image: https://cdn.kyodonewsprwire.jp/prwfile/release/M108245/202601072090/_prw_PI2fl_038KkhpF.jpg As demand grows for information-processing capabilities driven by the evolution of artificial intelligence (AI), there is increasing need for higher semiconductor performance. On the other hand, as transistor miniaturization approaches its physical and economic limits, semiconductor back-end package technologies and advanced semiconductor packaging, which allow integration by arranging multiple chips side by side or stacking them vertically, have been attracting attention. One element supporting the evolution of these packaging technologies is maskless lithography. As a key light source in maskless lithography, semiconductor lasers have faced growing demands for shorter wavelengths closer to the i-line (365 nm) and higher output to enable finer wiring and improve equipment throughput. To meet these requirements, NTCJ has leveraged over 40 years of experience in laser design and manufacturing to develop and commercialize an ultraviolet semiconductor laser with a wavelength of 379 nm and an output of 1.0 W. Ultraviolet semiconductor lasers generally suffer from significant heat generation caused by low wall-plug efficiency (WPE), and a tendency for device degradation caused by ultraviolet light, making stable operation at high output levels above 1.0 W difficult. To address this, NTCJ took a dual approach by focusing on both a "device structure that enhances WPE" and a "high thermal conduction package technology that effectively dissipates heat," enabling NTCJ to develop a product that successfully combines short wavelength, high output, and long lifetime: a 1.0 W ultraviolet (379 nm) device. As a result, NTCJ is contributing to extending the lifetime of optical devices that utilize ultraviolet light. The product has been newly added to NTCJ's lineup of "semiconductor laser-based alternatives to mercury lamps," providing customers with a new choice. Details of the new product will be showcased at NTCJ's booth at SPIE Photonics West 2026 in San Francisco, USA, and at OPIE'26 in Yokohama, Japan. NTCJ sincerely looks forward to welcoming visitors. For more details about the product, please visit: https://nuvoton.co.jp/semi-spt/apl/rd/?id=1100-0172 About Nuvoton Technology Corporation Japan: https://www.nuvoton.co.jp/en/ SPIE Photonics West 2026, Nuvoton Booth Web: https://spie.org/ExhibitorDetail?ExpoID=5022&ExhibitorID=105454 OPIE (OPTICS & PHOTONICS International Exhibition): https://www.opie.jp/en/
TOKYO, Dec. 23, 2025 /PRNewswire/ -- As NEPCON JAPAN approaches its 40th anniversary, RX Japan is gearing up to host an expert-led conference programme, featuring the leading voices from across the global electronics and automotive sectors. The event, taking place on January 21–23, 2026, at Tokyo Big Sight, will run alongside AUTOMOTIVE WORLD, Factory Innovation Week, and SMART LOGISTICS Expo, creating one of the largest technology gatherings in Asia with 1,850 exhibitors across four shows. 200 Industry Leaders to Speak at NEPCON JAPAN The conference series at NEPCON JAPAN will feature more than 200 sessions addressing critical developments in semiconductors, packaging, and advanced electronics. Beginning on January 21, Rao Tummala, widely recognised as the "father of modern electronic packaging" and Emeritus Professor at Georgia Institute of Technology and Advisor to the Government of India, will present "Emergence of Indian Semiconductor Industry for India & World," highlighting India's growing role in the global semiconductor supply chain. Later that day, Ryutaro Yasuhara, Technical Manager at TSMC Japan 3DIC R&D Center, will deliver a speech titled "3DIC Technologies to Unleash AI Innovation." There will also be a lecture by Tarek Ibrahim, Senior Principal Engineer at Intel Foundry, on "Glass Core Substrate Advanced Packaging." On January 22, Scott Chen, Senior Vice President of Central Development Engineering at ASE, will deliver a keynote titled "Scaling AI Performance through Advanced Packaging and Power Efficiency." His session will examine how advanced packaging technologies enable AI systems to achieve higher performance while managing power constraints — a critical challenge for next-generation computing. AUTOMOTIVE WORLD, one of the co-located shows, will host specialised sessions on electrification, autonomous driving, and power device technologies, featuring experts from leading automotive and electronics companies such as Toyota Motor, Honda R&D, Nissan Motor, Mazda Motor, Denso, The Linux Foundation, Renesas Electronics, Panasonic Automotive Systems, among others. These discussions complement NEPCON JAPAN's focus on semiconductor packaging and sensor integration, providing visitors with a comprehensive view of technologies transforming mobility and electronics. Registration for NEPCON JAPAN 2026 is now open via https://x.gd/LTdFp. Attendees will gain access to expert-led discussions, the latest technologies, and a network of up to 92,000 industry professionals driving innovation across multiple sectors. For details and to secure your place, visit the official NEPCON JAPAN website. TEL: +81-3-6739-4102E-mail: inw.jp@rxglobal.comWeb: https://www.nepconjapan.jp/tokyo/en-gb.html
A12 藝術空間
Semiconductor Packaging
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