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Development of 61TB product based on QLC technology, strengthening synergy with Solidigm in the AI data center SSD market Data transfer speed of up to 32GT/s with PCIe 5.0, with doubled sequential read performance compared to PCIe 4.0 products SK hynix to build a foundation for growth to become a full-stack AI memory provider with leadership in high-capacity eSSD technology SEOUL, South Korea, Dec. 18, 2024 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has completed development of its high-capacity SSD product, 'PS1012 U.21', designed for AI data centers. [1]U.2: A type of Form Factor for SSDs, typically 2.5 inches in size, primarily used in servers or high-performance workstations. It is known for large capacity storage and high durability. PS1012 As the era of AI accelerates, the demand for high-performance enterprise SSDs (eSSD) is rapidly increasing, and QLC2 technology, which enables high capacity, has become the industry standard. In line with this trend, SK hynix has developed a 61TB product using this technology and introduced it to the market. 2QLC: NAND flash is divided into SLC (Single Level Cell), MLC (Multi Level Cell), TLC (Triple Level Cell), QLC (Quadruple Level Cell), PLC (Penta Level Cell) depending on how much information is stored in one cell. As the amount of information stored increases, more data can be stored in the same area. PS1012 SK hynix has been leading the SSD market for AI data centers with Solidigm, a subsidiary which commercialized QLC-based eSSD for the first time in the world. With the development of PS1012, the company expects to build a balanced SSD portfolio, thereby maximizing synergy between the two companies. With the latest 5th generation (Gen5) PCIe3, PS1012 doubles its bandwidth compared to 4th generation based products. As a result, the data transfer speed reaches 32GT/s (Giga-transfers per second), with the sequential read performance of 13GB/s (Gigabyte per second), which is twice that of previous generation products. 3Peripheral Component Interconnect express (PCIe): A high-speed input/output interface with a serial structure used on the main board of a digital device. 4Giga-transfers per second (GT/s): Number of operations or information transferred per second. In addition, the company developed this product to support the OCP* 2.0 version, enhancing its compatibility with various data center server devices of global AI customers. 5Open Compute Project (OCP): An international consultative body that involves major data center companies around the world to discuss hardware, software and eSSD standards for building ultra-high-efficiency data centers. SK hynix plans to supply the sample of the new product to global server manufacturers within this year for product evaluation, and based on this, it plans to expand its product line to 122TB in the third quarter of next year. The company also aims to lead the SSD market for ultra-high capacity data centers by developing 244TB products based on the world's highest 321-high 4D NAND developed in November, to overcome the capacity limitations of eSSD. "SK hynix and Solidigm are strengthening our QLC-based high-capacity SSD lineup to solidify our technological leadership in NAND solutions for AI," said Ahn Hyun, President and Chief Development Officer of SK hynix. "In the future, we will lay the foundation for growth to become a Full Stack AI memory provider by meeting the diverse needs of AI data center customers based on our high competitiveness in the eSSD field." About SK hynix Inc. SK hynix Inc., headquartered in Korea, is the world's top-tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM"), flash memory chips ("NAND flash"), and CMOS Image Sensors ("CIS") for a wide range of distinguished customers globally. The Company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.
KUALA LUMPUR, Malaysia , Nov. 30, 2024 /PRNewswire/ -- HIKSEMI, a well-known global provider of intelligent storage solutions, today officially launched high-performance gaming DDR and SSD in collaboration with Malaysian Dota 2 star Mushi and his brand MUSH-E. These co-branded products are now available for purchase at the newly opened official MUSH-E store. This partnership marks a significant milestone for HIKSEMI in the gaming storage market, reinforcing its market presence in Southeast Asia. The co-branded DDR and SSD integrate HIKSEMI's advanced technology with Mushi's deep esports expertise, delivering superior gaming performance. The MUSH-E X FUTURE RGB DDR is available in both DDR4 and DDR5 models, catering to the widely used DDR standards in gaming PCs. The DDR5 model supports frequencies up to 7600MHz, ensuring superior smoothness and responsiveness during gameplay. The eye-catching RGB lighting design creates a personalized and immersive gaming environment. HIKSEMI's advanced overclocking technology guarantees exceptional stability and reliability, even during intense gaming sessions. Complementing the DDR is the introduction of the FUTURE Lite PCIe 4.0 SSD, which boasts read speeds of up to 7300 MB/s, ensuring rapid system boots and game loads. In combination, the MUSH-E X FUTURE RGB DDR and the FUTURE Lite PCIe 4.0 SSD form a powerful solution that significantly enhances computer performance, giving esports players a competitive edge. These co-branded products are the achievement of a deep and meaningful collaboration between HIKSEMI and MUSH-E, reflecting Mushi's esports philosophy and meeting the demands of professional esports players. Mushi, a legendary figure in the esports community, brings his exceptional skills and extensive experience to ensure the products resonate with gamers. As a specialist in storage solutions, HIKSEMI has already achieved widespread acclaim in Southeast Asian markets, such as Thailand. This collaboration with MUSH-E in Malaysia further underscores HIKSEMI's dedication to delivering high-performance storage solutions and enhancing the gaming experience for esports enthusiasts. Moving forward, HIKSEMI will continue to innovate and introduce high-quality storage products, empowering gamers to achieve excellence in their gaming endeavors. HIKSEMI: facebook instagram linkedin youtube
Western Digital 推出超大容量遊戲 SSD，強化沉浸式體驗 Western Digital 宣布擴展其屢獲殊榮的高效能遊戲儲存產品線，推出容量高達 8TB 的 WD_BLACK™ SN850X NVMe™ SSD（提供無散熱片及散熱片版本），並新增 4TB 型號的散熱片版本。 WD_BLACK™ SN850X NVMe™ SSD 是專為追求大容量儲存空間的硬派玩家、遊戲 PC 組裝及升級達人所設計，採用 M.2 NVMe™ 規格，適用於儲存大型文件與檔案，包括遊戲庫、直播錄影、媒體伺服器等。 8TB1 WD_BLACK™ SN850X NVMe™ SSD 具備卓越效能，使用者可以盡享遊戲體驗，不必擔心延遲。此外，Windows® 使用者下載 WD_BLACK™ Dashboard 軟體可自動開啟 Game Mode 2.0 模式，帶來更流暢快速的操作體驗，協助玩家在遊戲中保持巔峰表現。WD_BLACK™ SN850X NVMe™ SSD 配備多項創新功能，包括負載預測、SSD 開銷平衡及自適應溫度管理技術。 Western Digital 副總裁 Eric Spanneut 表示：「遊戲已發展為全方位的沉浸式體驗，突破了虛擬世界、社群與競技的極限。8TB WD_BLACK™ SN850X NVMe™ SSD 的推出，展現 Western Digital 在容量與效能上的持續進化，致力帶來頂尖的遊戲體驗。」 8TB WD_BLACK™ SN850X NVMe™ SSD 建議售價為 NT$32,900 元（無散熱片）及 NT$33,900 元（含散熱片），4TB WD_BLACK™ SN850X NVMe™ SSD 散熱片版本建議售價為 NT$12,590 元，即日起可透過全台指定之 Western Digital 線上通路商購買。 ### 11TB = 1,000,000,000,000 位元組。實際可用容量可能因運作環境而改變。
TAIPEI, Nov. 18, 2024 /PRNewswire/ -- Exascend, a leader in innovative high-performance storage and memory solutions, proudly announces the AEC-Q100 certification of AS500 series automotive-grade HSBGA SSD (Heat Sink Ball Grid Array solid state drive). Engineered to meet and surpass the rigorous reliability demands of next-generation connected and autonomous vehicles, as well as aerospace and edge applications, AS500 Series supports operation at automotive grade 2 temperature (-40°C to +105°C). It delivers a comprehensive suite of advanced features, including exceptional performance, virtualization capabilities, robust security, reliability and resilience to shock and vibration. Housed in an ultra-compact 16mm x 20mm BGA form factor and providing up to 1TB of storage capacity, it adeptly addresses space and capacity constraints in automotive, aerospace and embedded designs. Exascend Launches AEC-Q100 Certified AS500 BGA SSD Industry-Leading PCIe Gen 4x4 Performance The AS500 series sets a new standard with PCIe Gen 4x4 interface and NVMe 1.4 support, delivering outstanding read and write speeds up to 5GB/s and 1.6GB/s, respectively. This performance is critical for seamless handling of the data-intensive requirements of modern automotive applications, and edge AI workloads. SR-IOV Virtualization for Advanced AI Applications Single root I/O virtualization (SR-IOV) enables a single physical device to appear as multiple separate logical devices that can be directly assigned to virtual machines (VM), minimizing latency and overhead typical of software-based virtualization. The AS500 Series supports up to 4 concurrent VMs, facilitating efficient scalability and optimal resource allocation. SR-IOV reduces CPU overhead and enhances real-time data processing, accelerating throughput and minimizing latency for Advanced Driver Assistance Systems (ADAS) and AI workloads. Adaptive Thermal Control™ (ATC) Ensures Consistent Performance under Thermal Stress The AS500 series features Exascend's Adaptive Thermal Control™ (ATC), a proprietary algorithm designed to ensure consistent performance under thermal stress. ATC dynamically monitors changes in temperature and regulates performance to prevent overheating, thereby extending device lifespan. This technology is essential for industrial, automotive and aerospace applications where environmental conditions can be unpredictable and demanding, requiring AS500 Series to remain reliable and perform optimally even in the most challenging situations. Enhanced Security with TCG OPAL 2.0 Support AS500 Series with TCG Opal 2.0 strengthens automotive data security by providing hardware-based encryption and access control for sensitive data like sensor readings, event logs and control algorithms, safeguarding sensitive information against unauthorized access and intrusion, and ultimately enhancing the safety and reliability of autonomous and assisted driving systems. Energy-Efficient and Thermally Optimized Design The AS500 series features an optimized low-power design achieved through careful component selection, consuming less than 2.5W at full performance. Its exceptional energy efficiency is ideal for space-constrained and thermally challenging environments, achieving substantial power savings without sacrificing performance. Built-in heat sink further enhances thermal dissipation and effectively manages heat buildup, coupled with our proprietary Adaptive Thermal Control™ algorithm ensures reliability and stability even in high thermal stress conditions. Customizable Application Optimized Firmware Service The AS500 series offers firmware customization and optimization to meet specific customer needs. Features like write protection and data purge can be tailored for unique application requirements, while performance and power tuning provide flexibility and adaptability across various industries, enabling optimized storage solutions. Rugged Design Options for Versatile Applications Available in BGA, M.2 2230, and 2280 form factors, the AS500 Series offers exceptional shock and vibration resistance, making it ideal for harsh environments. Its compact size is particularly suitable for space-constrained designs including those adhering to COM Express standards, extends its applicability beyond automotive to aerospace and other high-reliability applications. About Exascend Exascend is a service-focused provider of cutting-edge storage and memory solutions, specializing in low-power, high-performance, and high-reliability products. With over 80 patents worldwide, Exascend offers a wide range of storage solutions, empowering global customers to push the boundaries of innovation. For more information, visit us at: http://www.exascend.com For more information about AS500 BGA SSD, visit us at: https://bit.ly/3UR1nTU
Western Digital 擴充旗下 WD Blue 系列，推出為內容創作者設計的全新 4TB NVMe SSD 【台北訊，2024 年 11 月 14 日】數位內容創作者透過引人入勝的故事、視覺驚豔的照片與高畫質影片於多平台間吸引觀眾目光，為了產出優質的內容，創作者需要大量的儲存空間以及更快速、高效的工作流程。隨著 AI 應用程式生成的媒體素材日漸增長，高效能且大容量的資料儲存也變得更加不可或缺。 全新 Western Digital WD Blue® SN5000 NVMe™ SSD 是專為內容創作者及專業人士設計的次世代儲存解決方案，適用於需要處理 4K 多重串流影片、圖像及音訊的工作流程。WD Blue® SN5000 NVMe™ SSD 具備 M.2 2280 外型規格，適合希望提升 PC 效能並擴充 NVMe SSD 容量、重度使用的內容創作者。 WD Blue® SN5000 NVMe™ SSD 與 AI 資料週期中的第四和第六階段保持一致，能為使用者提供具進階效能的儲存解決方案，將 AI 環境下的內容創作工作流程最佳化。 WD Blue® SN5000 NVMe™ SSD 透過以下功能驅動 AI 應用程式並加速工作流程： · 高達 4TB* 的容量，相較前一代產品多出兩倍的儲存空間** · 採用 PCIe® Gen4 技術，提供高達 5,500MB/s 的速度，加速工作流程並提高生產力，效能較前一代提升 24%*** · 採用 Western Digital nCache™ 4.0 技術，能快速複製資料夾與檔案 · 藉由 NVMe™ 技術讓繁重的多工專案處理能更加流暢 · 具備高達 1,200 TBW**** 的耐寫度，有效提升草圖繪製與渲染階段的效能 全新的 Western Digital WD Blue® SN5000 NVMe™ SSD 將在台灣上市，提供 500GB（建議售價 NT$1,680 元）、1TB（建議售價 NT$2,480 元）、2TB（建議售價 NT$4,680 元）和 4TB（建議售價 NT$12,980 元）四種容量，預計 12 月初可透過全台指定之 Western Digital 線上通路商如 momo、PChome 商城購買。詳細規格及更多資訊，請參閱此處。 欲了解更多企業資訊，歡迎造訪 Western Digital Newsroom。 * 1TB = 1,000,000,000,000 位元組。實際可用容量可能因運作環境而改變。 ** 比較基準為 Western Digital WD Blue® SN580 2TB NVMe™ SSD *** 比較基準為 Western Digital WD Blue® SN580 1TB NVMe™ SSD 與 Western Digital WD Blue® SN5000 4TB NVMe™ SSD **** TBW（寫入的百萬位元組數）數值依據 JEDEC 用戶端工作負載（JESD219）計算，依產品容量而異
TAIPEI, Nov. 13, 2024 /PRNewswire/ -- Innodisk, a leading global AI solution provider, has introduced its new E1.S SSD, which is specifically designed to meet the demands of growing edge computing applications. The E1.S edge server SSD offers exceptional performance, reliability, and thermal management capabilities to address the critical needs of modern data-intensive environments and bridge the gap between traditional industrial SSDs and data center SSDs. Innodisk has introduced its new E1.S SSD, which is specifically designed to meet the demands of growing edge computing applications. As AI and 5G technologies rapidly evolve, the demands on data processing and storage continue to grow. The E1.S SSD addresses the challenges of balancing heat dissipation and performance, which has become a major concern for today's SSDs. Traditional industrial and data center SSDs often struggle to meet the needs of edge applications. Innodisk's E1.S eliminates these bottlenecks with its Enterprise and Data Center Standard Form Factor (EDSFF) design and offers a superior alternative to U.2 and M.2 SSDs. The E1.S SSD is engineered to excel in demanding environments, featuring robust thermal management capabilities, including dynamic thermal throttling technology and a wide operating temperature range of -40°C to 85°C. With capacity options ranging from 400GB to 8TB and high drive writes per day (DWPD) support, this versatile drive serves both as an efficient boot drive for data centers and a reliable storage solution for high-performance computing applications. Its exceptional durability and compact form factor make it particularly well-suited for deployment in 1U servers, AI systems, and machine-learning environments. Optimized for PCIe Gen 5, the E1.S addresses the heat dissipation and power challenges typical in M.2 SSDs under high-performance workloads. Its hot-plug design ensures seamless upgrades while reducing downtime. The E1.S has been validated for next-gen industrial computers and edge servers, including integration into NVIDIA's MGX short-form edge AI server. The E1.S standard temperature series also serves as a robust boot drive for data centers, featuring hot-swappable capability and advanced features—including SSD event logs, self-monitoring, and online firmware updates. For larger server infrastructures, Innodisk offers the E3.S SSD with additional capacity and durability, which is ideal for data centers. Innodisk leads the market with its industrial-grade NAND technology, advanced thermal management, and customizable SSD solutions. By offering tailored services, Innodisk ensures the perfect balance between SSD heat dissipation and performance. Whether for AI, edge computing, or high-performance enterprise environments, the E1.S and E3.S SSDs deliver the reliability and performance needed for today's most demanding workloads.
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