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SAN FRANCISCO, July 11, 2023 /PRNewswire/ -- Global sales of total semiconductor manufacturing equipment by original equipment manufacturers next year are forecast to bounce back from a projected contraction of 18.6% to $87.4 billion in 2023 following the industry record of $107.4 billion in 2022, SEMI announced today in its Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON West 2023. The expected 2024 recovery – to $100 billion – will be driven by both the front-end and back-end segments. "Despite current headwinds, the semiconductor equipment market is set to see a strong rebound in 2024 after an adjustment in 2023 following a historic multi-year run," said Ajit Manocha, SEMI president and CEO. "Projections for robust long-term growth driven by high-performance computing and ubiquitous connectivity remain intact." Semiconductor Equipment Sales by Segment Sales of wafer fab equipment, which includes wafer processing, fab facilities and mask/reticle equipment, are projected to decrease 18.8% to $76.4 billion in 2023 – more than the 16.8% decline predicted by SEMI in the 2022 year-end forecast. The wafer fab equipment segment is projected to account for the bulk of the recovery to $100 billion in 2024, generating $87.8 billion in sales, a 14.8% increase. The 2022 decline in back-end equipment segment sales is expected to continue in 2023 due to challenging macroeconomic conditions and softening semiconductor demand. Semiconductor test equipment market sales are projected to contract by 15% to $6.4 billion in 2023, while assembly and packaging equipment sales are expected to drop by 20.5% to $4.6 billion in the same year. However, the test equipment and assembly and packaging equipment segments are expected to expand by 7.9% and 16.4%, respectively, in 2024. Semiconductor Equipment Sales by Application Equipment sales for foundry and logic applications, accounting for more than half of total wafer fab equipment receipts, are expected to drop 6% year-over-year to $50.1 billion in 2023, reflecting softer end-market conditions. Demand for leading-edge foundry and logic in 2023 is expected to remain stable, with a slight softening balanced out by a rise in spending on mature nodes. Foundry and logic investments are projected to increase 3% in 2024. DRAM equipment sales are expected to fall 28% to $8.8 billion in 2023 due to continuing weak consumer and enterprise demand for memory and storage but rebound 31% to $11.6 billion in 2024. NAND equipment sales are projected to decrease 51% to $8.4 billion in 2023 and surge 59% to $13.3 billion in 2024. Semiconductor Equipment Sales by Region Mainland China, Taiwan and Korea are expected to remain the top three destinations for equipment spending in 2023 and 2024. While Taiwan is forecast to regain the lead in 2023, Mainland China is projected to return to the top position in 2024. Equipment spending for most regions tracked is expected to fall in 2023 before returning to growth in 2024. The accompanying charts reflect market size by segment and application in billions of U.S. dollars. Source: SEMI July 2023, Equipment Market Data Subscription; * Total equipment includes new wafer fab, test, and assembly and packaging. Total equipment excludes wafer manufacturing equipment. Totals may not add due to rounding. Source: SEMI July 2023, Equipment Market Data Subscription; * Total equipment includes new wafer fab, test, and assembly and packaging. Total equipment excludes wafer manufacturing equipment. Totals may not add due to rounding. Source: SEMI July 2023, Equipment Market Data Subscription * Total equipment includes new wafer fab, test, and assembly and packaging. Total equipment excludes wafer manufacturing equipment. Totals may not add due to rounding. The SEMI forecast is based on collective input from top equipment suppliers, the SEMI Worldwide Semiconductor Equipment Market Statistics (WWSEMS) data collection program and the industry-recognized SEMI World Fab Forecast database. The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: Monthly SEMI North American Billings Report, an early perspective of equipment market trends Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and more than 22 market segments Bi-annual Total Semiconductor Equipment Forecast – OEM Perspective, an outlook for the semiconductor equipment market For more information online, please visit SEMI Market Data. About SEMISEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more. Association ContactMichael Hall/SEMIPhone: 1.408.943.7988Email: mhall@semi.org
MILPITAS, Calif., May 6, 2024 /PRNewswire/ -- Global semiconductor materials market revenue in 2023 contracted 8.2% to $66.7 billion from the market record of $72.7 billion set in 2022, SEMI, the global industry association representing the electronics manufacturing and design supply chain, reported today in its Materials Market Data Subscription (MMDS). Wafer fabrication materials revenue declined 7.0% to $41.5 billion in 2023, while packaging materials revenue fell 10.1% to $25.2 billion last year. The silicon, photoresist ancillaries, wet chemicals, and chemical mechanical planarization (CMP) segments logged the biggest contractions in the wafer fabrication materials market. The organic substrates segment accounted for much of the packaging materials market contraction. Demand for semiconductors softened in 2023 as the industry worked to reduce excess inventory, leading to lower fab utilization rates and, consequently, a drop in materials consumption. Taiwan, at $19.2 billion in revenue, was the world's largest consumer of semiconductor materials for the 14th consecutive year. Mainland China, at $13.1 billion in revenue, continued to register year-over-year growth, ranking second in 2023, while Korea remained the third largest consumer with $10.6 billion in revenue. All regions except Mainland China posted high single- or double-digit declines in 2023. Region 2023 2022 YoY % Growth Taiwan $19,176 $20,129 -4.7 % Mainland China $13,085 $12,970 0.9 % South Korea $10,575 $12,901 -18.0 % Rest of World $7,177 $8,627 -16.8 % Japan $6,828 $7,205 -5.2 % North America $5,561 $6,278 -11.4 % Europe $4,319 $4,580 -5.7 % Total $66,721 $72,691 -8 % Source: SEMI Materials Market Data Subscription (MMDS), May 2024 Note: Summed subtotals may not equal the total due to rounding.Rest of the World includes Singapore, Malaysia, the Philippines, other areas of Southeast Asia, and smaller global markets. The Materials Market Data Subscription from SEMI provides annual revenue with 10 years of historical data and a two-year forecast. The annual subscription includes quarterly updates for the materials segment and reports revenue for seven market regions (North America, Europe, Japan, Taiwan, South Korea, Mainland China and Rest of World). The report also features detailed historical data for silicon shipments and revenues for photoresist, photoresist ancillaries, process gases and lead frames. For more information about the report or to subscribe, please contact the SEMI Market Intelligence Team at mktstats@semi.org. More details are also available on the SEMI Market Data webpage. Download a sample of the MMDS report. About SEMI SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members' business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more. Association Contact Michael Hall/SEMIPhone: 1.408.943.7988Email: mhall@semi.org
The Netherlands Office Taipei, representing the Netherlands government, held an opening press conference today at the Netherlands Pavilion of SEMICON Taiwan 2023, emphasizing the importance of fostering closer ties and expanding business opportunities in the semiconductor industry between the Netherlands and Taiwan. This week-long event, led by Mr. Erwin Nijsse, Director General of Enterprise & Innovation Ministry of Economic Affairs and Climate Polic, marks the first visit to Taiwan, bringing together nearly 50 individuals comprising industry, government, academia, and research sectors, collectively referred to as "Team Semicon NL." Fourteen representatives from various segments of the semiconductor industry supply chain, along with nine Netherlands innovation institutes, unite to present a comprehensive and robust Netherlands semiconductor ecosystem. Mr. Erwin Nijsse highlighted the longstanding trade relationship between the Netherlands and Taiwan, dating back 400 years, and the Netherlands' current position as Taiwan's second most significant trading partner in Europe. Taiwan is renowned globally for its exceptional semiconductor manufacturing, while the Netherlands specializes in semiconductor equipment and photonics technology, catalysing the entire industry. This visit aims to provide both sides with an enhanced platform to share expertise and promote collaboration during this inaugural visit, we hope to work together for the long term with Taiwan on the next generation of semi conductors. Netherlands and Taiwan Collaborate to Break Through Semiconductor Technology Framework Semiconductors play a pivotal role in technology, the economy, security, communications, and sustainability. Currently, over 70% of semiconductor chips find applications in consumer electronics, spanning household appliances, wearables, unmanned aerial vehicles, and autonomous vehicles. The Netherlands boasts a complete semiconductor research and production ecosystem, encompassing IC design, equipment, RF integrated circuits, radar, lidar, integrated photonics, advanced packaging, and testing technologies. As a European Union hub for technological research and development, the Netherlands is one of only three countries globally with a fully integrated semiconductor supply chain within a 200-kilometer radius. In terms of industry scale, the Netherlands ranks fourth globally and first within the European Union. In 2021, the Netherlands semiconductor industry witnessed a remarkable growth of approximately 31.1%, achieving an estimated €39.1 billion in global semiconductor sales. Powerful Delegation of Industry, Government, Academia, and Research Visits Taiwan for the First Time To strengthen the stability of the semiconductor supply chain, the Netherlands government places significant emphasis on sustainability and knowledge exchange within the semiconductor industry, particularly with Taiwan. The Netherlands actively promotes international collaboration in innovation, technology, and science, fostering cooperation among industry, government, academia, and research sectors. The nation's strong research foundation is built upon an excellent educational system, focusing on enhancing the competitiveness and autonomy of domestic semiconductor research and development. Netherlands enterprises collaborate closely with universities and technical research institutions, forming a robust research and development ecosystem. This semiconductor research ecosystem revolves around four key regions: Eindhoven, Delft, Nijmegen, and Enschede, featuring prominent academic institutions such as Eindhoven University of Technology, Casimir Institute、University of Twente MESA+, and technical support from enterprises including Phix Photonics Assembly、SCIL Nanoimprint Solutions、SMART Photonics、OostNL、PhotonDelta、CITC and PITC. The collaboration between industry, academia, and research institutions ensures a continuous supply of high-tech talent, further enhancing the competitiveness of Netherlands semiconductor companies on the global stage. This collaborative endeavor is exemplified by the participation of 14 Netherlands semiconductor companies (see chart below). These companies leverage the nation's strong foundation and offer diverse expertise across various domains, contributing to the establishment of a complete semiconductor industry chain and boosting competitiveness in the international market. Enhancing International Semiconductor Industry Collaboration to Boost Chip Market Competitiveness Since February 2022, the European Union has been actively pursuing the "European Chips Act," allocating a substantial budget of 1.37 trillion euros, and establishing the "Alliance for Processors and Semiconductor Technologies" to strengthen the EU's technological capabilities in the international semiconductor arena. As a prominent hub for semiconductor research and production within the EU, the Netherlands ranks 6th in the Global Innovation Index, contributing significantly to the EU's semiconductor autonomy through the development of high-tech systems, materials, quantum, and photonics technologies. The Netherlands government has also allocated 20 billion euros from the National Growth Fund for key industries between 2021 and 2025. This funding includes substantial support for semiconductor and photonics projects, aiming to enhance the international competitiveness and technological leadership of the Netherlands semiconductor industry. According to official statistics, demand for semiconductor-related products is expected to double by 2030 compared to 2020. The accelerating digital transformation and diverse technological applications underscore the growing significance of this industry. While facing challenges brought by Moore's Law, the industry is leveraging increased international collaboration, turning crises into opportunities. These new opportunities are likely to open emerging markets, and the Netherlands visit to Taiwan is expected to contribute to a win-win situation for the semiconductor industry.
受到全球政經情勢快速變動，以及永續、資安等意識高漲等因素影響，過去數十年所累積成形的國際供應鏈正進入重整階段，以期深化產業韌性、推升全球產業升級。臺灣年度最大半導體產業盛事SEMICON TAIWAN 2023國際半導體展今(23)年展會論壇聚焦多項供應鏈韌性升級關鍵領域，其中「半導體資安趨勢高峰論壇」、「高科技智慧製造論壇」匯集華碩(ASUS)、思科(CISCO)、微軟(Microsoft)、輝達(NVIDIA)、三星集團(Samsung)等產業專家分享全球半導體產業趨勢變化；「策略材料高峰論壇」則邀請到碳權交易所總經理田建中到場解析台灣碳交易市場發展，與產業共同探討如何提升產業韌性以強化全球競爭力。 SEMI國際半導體產業協會全球行銷長暨臺灣區總裁曹世綸表示：「全球市場的快速變化，讓產業韌性成為半導體供應鏈上下游快速因應生產成本、國際標準等變動因素的關鍵解方。今年SEMICON TAIWAN從資安防護、智慧製造、淨零永續等面向切入，邀集各界專家學者共同解構產業韌性方程式，更持續投入資源以期建立完善的生態體系，攜手產業夥伴邁向下一個里程碑。」 智慧製造發展核心 資安助力產業再創新局 工業4.0與IoT物聯網技術帶來高度整合的網路，讓每個生產設備能夠相互溝通，促成全面自動化的製造流程，成為提升半導體產業競爭力的關鍵。而設備連網後的智動化也推動企業高度重視資安議題，以防堵可能的風險破口，進一步讓發展資安防護策略成為強化半導體供應鏈韌性的關鍵；此外，因應半導體產業上中下游間合作緊密，建立受產業鏈一致認可之資安標準勢在必行。 SEMI作為全球性產業平臺，承擔著凝聚產業共識的重要角色，透過成立SEMI資安工作小組並推動全球首個由臺灣主導的半導體資安標準—SEMI E187，奠定臺灣於推動半導體資安不可撼動的地位。未來，資安防護更將成為策略合作夥伴的評選關鍵指標。今年SEMICON TAIWAN展會中的「半導體資安趨勢高峰論壇」將以「Building a better security supply chain」為主題，邀請產業專家以及來自應用材料(Applied Materials)、微軟、新思科技(Synopsys)等多位半導體資安長共同探討公私部門、智慧製造、5G專網、OT/IT、零信任等多元資安議題，剖析半導體產業中資安關鍵發展趨勢，強化業界對於資安驅動產業韌性的共識。 先進效率強化產業韌性 激發高科技智慧製造AI發展新契機 全球智慧製造產業加速發展，企業積極透過人工智慧決策系統、邊緣及雲端運算等達到生產數據可視化、數位分身(Digital Twin)、虛擬工廠、設備節電管理等以強化企業數位韌性。今年SEMICON TAIWAN展會中的「高科技智慧製造論壇」將以「AI-Driven Digital Model for Smart Manufacturing」為主題，邀請全球領導公司共同探討如何以AI、機器學習等技術帶領半導體產業從自動化走向智慧化。 而同期展出之「高科技智慧製造特展」更邀集企業先進聚焦展示軟體運動控制系統、高精度檢測應用與先進封裝自動搬運系統等智慧製造先進技術；此次展會也睽違2年舉行Smart Manufacturing Journey(SMJ)高科技智慧製造未來展區活動，以「AI驅動創新-未來智動化」為主題，現場邀集智慧製造領導廠商台達研究院(Delta Research Center)、日月光半導體(ASE Inc.)、台灣西克(SICK Taiwan)攜手展出高科技製造業中智慧製造、系統整合等解決方案，共同打造虛實整合、技術應用互動裝置，展現AI為半導體應用帶來的深遠影響及下一波商機與成長動能。 關鍵材料促進減碳動能 產官攜手拓展永續發展潛能 關鍵策略材料兼顧生產效率、良率、成本以及永續的特性，使其成為企業積極投入的重點面向，根據SEMI最新《半導體材料市場報告》(Materials Market Data Subscription, MMDS)指出，2022年全球半導體材料市場年成長率為8.9%，營收達727億美元，持續創下歷史新高。國際半導體產業協會(SEMI)整合產、官等各界資源成立「材料委員會」，持續攜手產業建立完善材料發展環境；同時，因應全球綠色永續浪潮，企業也積極尋求更減碳與具使用效率的生產流程與合作方式。 今年SEMICON TAIWAN關注材料市場與永續相關趨勢，將於「策略材料高峰論壇」探討製程中材料永續以及減碳策略等議題，邀請到台積電(TSMC)、欣興電子(Unimicron)、台灣康寧(Corning)、英特格(Entegris)、台灣精材(Forcera)、環球晶圓(GlobalWafers)、台灣默克(Merck)、索爾維(Solvay)；SEMI也偕同台灣半導體產業協會(TSIA)共同舉辦「半導體永續力國際論壇」，邀集美光科技(Micron Technology)、麥肯錫(McKinsey & Company)、應用材料、施耐德電機(Schneider Electric)、Global Now Pte、康肯株式會社(Kanken Techno)等國際企業重量級講師分享永續工程的創新與協作，與各界產業先進共迎永續產能兼備的半導體未來新局勢。
SEMICON Taiwan 2023國際半導體展將於明(6)日起一連三天於台北南港展覽館1館與2館盛大登場。本次展會吸引10國產業、950家企業，展出達3,000個展覽攤位、規模再創新高，展現半導體產業持續發展之強大動能。SEMI國際半導體產業協會今(5)日舉行展前記者會，邀請行政院政務委員兼國科會主委吳政忠、日月光半導體執行長吳田玉、環球晶圓集團董事長暨執行長徐秀蘭、台灣默克集團董事長李俊隆、SEMI全球行銷長暨台灣區總裁曹世綸，以及SEMI產業研究資深總監曾瑞榆齊聚、剖析半導體產業現況、市場趨勢及前瞻策略，協助台灣半導體產業鏈深化布局、迎接下一波成長動能。 SEMI全球行銷長暨台灣區總裁曹世綸表示：「半導體產業正站在全球合作的新起點，面對著跨世代技術創新、淨零發展以及人才永續等機會，我們需要掌握創新與永續雙軌轉型的契機，邁向1兆美元產值的發展之路。今年，我們也見證多間資通訊企業穩步跨足半導體領域，為產業生態圈注入活水。期待能在全球專家、學者和產業領袖的支持下，助力台灣成為領航者，引領全球半導體產業邁向永續發展的未來。」 SEMI分享多篇半導體產業領域之研究報告顯示，高效能運算、人工智慧、汽車電子和其他成長中的應用，將帶動並持續推升產業的長期發展。而綜觀半導體領域投資，全球半導體設備和材料市場在去(22)年紛紛創下了歷史新高，設備市場在2022年成長5%，達1,074億美元；材料市場的年成長率更是達到9%，整體產值來到727億美元。儘管今年投資步伐放緩，但明年復甦依然可期。此外，在產能區域化的浪潮下，預期台灣仍然是全球最重要的半導體生產樞紐。 國科會、日月光半導體、環球晶圓、默克集團共同展望半導體前瞻發展 行政院政務委員兼國科會主委吳政忠指出：「臺灣是全球半導體設計與製造的重鎮，在全球半導體產業扮演領導地位。迎接5G、IoT及AI時代的到來，加上生成式AI帶來的規則改變(Game-changing)影響，迎接全球生成式AI等新興科技導引產業發生革命創新，行政院已規劃「晶片驅動臺灣產業創新計畫（簡稱晶創臺灣計畫）」，由國科會協調各相關部會共同合作，規劃以10年布局，透過以各行各業全產業創新之需求為驅動，加速結合生成式AI之晶片研發、吸納全球研發人力厚植培育量能、設立海外基地培育IC設計人才、並藉此吸引國際對於各行各業創新應用的IC設計新創來臺，將臺灣打造為全球IC設計的創新泉源與投資重鎮。同時布局產業創新所需異質整合及先進技術，協助IC設計產業進入先進節點，促成我國產業生態系持續維持軟硬體在國際領先地位。」 SEMI全球董事會執行委員會副主席暨日月光半導體執行長吳田玉認為：「經濟規模和創新是半導體產業的二個驅動力，然而地緣政治導致半導體市場循環模式的改變；成本上升和規模收縮的壓力逐增，因此需要注入更多創新，創造更高附加價值。與此同時，我們必須尋求最佳的成本效益架構，加強人才培養，以引領產業的進一步發展。此外，永續責任及社會信任更是刻不容緩的議題。」 SEMI全球董事會成員暨環球晶圓集團董事長暨執行長徐秀蘭表示：「僅管半導體市場受到景氣波動和去化庫存影響，但汽車、工業電子和生成式AI已成為支撐產業成長的關鍵驅動力。我們除了將最佳化產品光譜並拓展終端應用佈局，以滿足來自全球不同領域的需求；持續推動綠晶圓發展，也成為我們應對未來市場變化的關鍵戰略。」 台灣默克集團董事長李俊隆提及：「默克致力將綠色DNA導入產業轉型進程，除了提供專為半導體產業打造的整合式解決方案，並透過數位化平台，幫助加速材料開發及發展綠色製程，協助企業擁抱綠色創新以實踐永續目標。我們也在政府單位及供應鏈業者協力之下，於2021年宣布在台擴大投資，期待能補足台灣半導體產業鏈上游的材料缺口，為未來成長動能提供供應鏈韌性，同時以在地化生產，減少因全球供應鏈所衍生的碳足跡。」 SEMICON Taiwan 2023展覽規模再創歷年新高促進全球半導體業交流 10大國家展覽專區、13大展覽主題專區以及超過20場國際論壇全面掌握產業趨勢脈動 SEMICON Taiwan 2023匯聚全球超過950家領導企業，共展出超過3,000個攤位，為全台年度最大半導體展會。9/6下午重磅登場的「大師論壇(CEO Summit)」則由日月光半導體執行長吳田玉、台積電董事長劉德音、Cadence總裁暨執行長Anirudh Devgan、科林研發總裁暨執行長Tim Archer、Tokyo Electron (TEL)社長暨執行長河合利樹、Google生成式AI解決方案架構副總裁Hamidou Dia，以及默克電子科技事業體技術長John Langan等產業意見領袖，聚焦產業創新趨勢，勾勒產業黃金20年航道。 今年SEMICON Taiwan涵蓋先進製程、異質整合、材料創新、化合物半導體、車用晶片、智慧製造、半導體資安、永續、人才培育與量子等十大產業趨勢，舉辦超過20場國際論壇，並由來自日月光半導體、台積電、三星電子、大陸集團、電裝、英飛凌、Meta等的業界專家擔任講者，引領並開拓前瞻性思維，持續強化台灣的全球領導地位。此外，展區更設立10大國家專區、13大展覽主題專區，通過深入交流、洞察創新，共同為半導體產業的未來探索出更多可能性。
【台北訊，2023 年 9 月 6 日】漢高於 SEMICON Taiwan 2023 期間展示其廣泛的半導體封裝材料解決方案，並舉辦系列活動與客戶深入討論，一同解決應用端面臨的挑戰。漢高透過近期專為高可靠性先進封裝和打線設備推出的創新產品，展現漢高展現出在汽車、工業和高效運算領域嚴苛封裝設計的影響力。 漢高黏合劑電子事業部半導體全球市場總監 Ramachandran (Ram) Trichur 表示，如同 SEMICON Taiwan 主辦方所強調，半導體產業是驅動全球科技發展和解決部分全球重大重要挑戰的核心；而漢高是上述發展過程中的關鍵貢獻者，為高可靠性的汽車封裝、人工智慧、高效能運算與不斷演進的工業應用，提供先進的半導體封裝材料。 漢高在晶片接著劑和薄膜領域擁有數十年的領導地位，帶來許多突破性的先進封裝解決方案。漢高在 SEMICON Taiwan 分享許多先進材料，有助於半導體技術人員應對微電子發展，包括： 汽車電氣化、回應速度和可靠性：從電源 IC、微控制器到感測器，所有推進現代汽車電氣化、安全和網路連接的設備，都需要有強大的處理能力和卓越實用性能的材料。漢高高導熱晶片接著劑 Loctite Ablestik 6395T 和無壓燒結材料 Loctite Ablestik 8068TI，提供車規級認證最高標準的 0 級可靠性，並相容於包括銅（Cu）在內的各種導線架表面鍍材處理。 此外，漢高在導電晶片延續著薄膜材料方面的開創性成就，也展現在 Loctite Ablestik CDF 200P 和 Loctite Ablestik CDF 600P 這兩款重要產品。兩者除了具備導電晶片接著薄膜的既有優點，如嚴格的鍵合線控制、一致的週邊成形、無傾斜與無樹脂滲出等，並具備不同導熱性和導電性，並與各種晶片尺寸相容。漢高的導電晶片接著薄膜材料廣泛用於汽車微控制器封裝，例如 QFP（Quad Flat Package；方型扁平式封裝技術）和 TSSOP（Thin Shrink Small Outline Package；薄型小外形封裝）。 高效能運算與行動處理解決方案：新一代處理器正在整合最先進的矽節點倒裝晶片，保護處理器免受熱應力，這對可靠性而言至關重要。漢高去年推出能在高填料填充量與快速流動特性之間取得平衡的突破性半導體級底部填充膠 Loctite Eccobond UF 9000AG；協助封裝專家滿足量產需求，並同時對晶片相互連結提供出色的保護。保護蓋及強化件接著劑也是漢高產品組合的一部分，透過穩定保護蓋和外圍強化件來降低翹曲、維持共面性，進一步保護高價值的 2.5D 和 3D 封裝，在某些情況下，還可以提供接地和屏蔽功能。 Ramachandran (Ram) Trichur 進一步分享，微型化、高效能和極高可靠性等多元整合需求，使半導體元件創新較以往更為複雜；漢高將持續藉由能超越可靠度的材料，協助客戶正面應對挑戰。 欲瞭解更多有關漢高半導體封裝材料、公司全球研發能力，以及應用工程專業，請參閱。 關於漢高（Henkel） 漢高憑藉其品牌、創新和技術，在全球工業和消費品領域中擁有領先的市場地位。漢高黏合劑技術業務部是全球黏合劑、密封劑和功能性塗層市場的領導者。漢高消費品牌在各國市場和眾多應用領域中具有領先地位，在頭髮護理、洗滌劑及家用護理領域尤為突出。樂泰（Loctite）、寶瑩（Persil）和施華蔻（Schwarzkopf）是公司的三大核心品牌。2022 財年，漢高實現銷售額逾 220 億歐元，調整後營業利潤達 23 億歐元左右。漢高的優先股已列入德國 DAX 指數。永續發展在漢高有著悠久的傳統，公司確立有明晰的永續發展策略和具體目標。漢高成立於 1876年，如今，漢高在全球範圍內約有 5 萬名員工，在強大的企業文化、共同的價值觀與企業目標「Pioneers at heart for the good of generations」的引領下，融合為一支多元化的團隊。更多資訊，敬請參閱 www.henkel.com 漢高 Henkel 媒體聯絡人 Sophie ZHANG Email: Sophie.zhang@henkel.com
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