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Learn About the Latest Products and Upgrades that Accelerate Intelligent Solutions in Ion Implant BEVERLY, Mass., Feb. 10, 2025 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced today that it will showcase its innovative Purion™ platform of ion implanters at SEMICON Korea 2025. The event is being held February 19th through February 21st, at the COEX Center in Seoul, Korea. SEMICON Korea will highlight key trends shaping the future, including AI, advanced packaging, and sustainable semiconductor manufacturing technologies. Axcelis will be located at Booth #D622. Semiconductor manufacturers are invited to visit the Axcelis exhibit to learn first-hand about the latest products and upgrades that accelerate intelligent solutions in ion implant and deliver significant technology and manufacturing advantages. This includes: The Purion™ Platform - Axcelis' flagship implant platform, offering the most advanced ion implantation technology available today. Our family of application specific systems addresses high current, medium current, medium energy and high energy implant requirements for all existing and emerging applications. The Purion Power Series™ - The industry leading implant portfolio for power devices, featuring innovative solutions to excel at these applications due to its innovative platform that offers the flexibility to handle multiple wafer sizes (150mm, 200mm and 300mm), various substrate types (including SiC, Si, GaN and GaAs wafers) and at various implant temperatures (room temperature, warm and hot). Innovative New Upgrade Offerings - Our Customer Solutions and Innovation organization has an expanding array of enhancements that deliver a variety of performance and efficiency benefits. Numerous new upgrades will be on display including innovative source technology, productivity packages to increase throughput and productivity, and product Life Cycle packages to optimize performance at every stage of equipment lifecycle. President and CEO of Axcelis Technologies, Russell Low, said, "We're excited to participate in SEMICON Korea, one of the leading semiconductor technology forums in the world. Korea is a very important market for Axcelis, and we are committed to providing the most advanced ion implant technology and support solutions to our customers. We are pleased to expand our operations in Korea with our recently opened Asia HUB Warehouse, which along with our Axcelis Asia Operations Center provides our customers with state-of-the-art manufacturing, engineering, services and logistics capabilities in the Asia Pacific region." About Axcelis:Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for over 45 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at www.axcelis.com. CONTACTS:Press/Media Relations Contact: Maureen HartSenior Director, Corporate & Marketing CommunicationsTelephone: (978) 787-4266Email: Maureen.Hart@axcelis.com Axcelis Investor Relations Contact:David RyzhikSenior Vice President, Investor Relations and Corporate StrategyTelephone: (978) 787-2352Email: David.Ryzhik@axcelis.com Logo - https://mma.prnasia.com/media2/1756239/Axcelis_1_Logo.jpg?p=medium600
TOKYO, Dec. 5, 2024 /PRNewswire/ -- As Moore's Law almost reaches to its limits, advanced packaging will drive to the next leap in transistor density. The growing demand for AI chips is propelling this evolution of fan-out packaging technologies from wafer-level (FO-WLP) to panel-level (FO-PLP) for more chip integration in devices. CKplas Panel FOUP 500mm CKplas has been developing PCB/ABF FOUPs for over 20 years, leveraging decades of experience to seamlessly transition into the Panel FOUP market. Our supported substrates have expanded from wafers to glass. Over half of the world's top 10 PLP manufacturers are CKplas customers. In addition to Taiwan, our products are now in mass production and supplied to Japan, Korea, the United States, and Europe. Seizing this market opportunity, CKplas will showcase its latest innovations in SEMICON Japan, held from December 11 to 13 at Tokyo Big Sight, East Hall 1, Booth #1828. We invite customers and industry partners to visit our booth for in depth discussions and to exchange valuable insights on the future of semiconductor technologies. Media Contact Lily Lin TEL:+886-3-3185300 Mail:mkt@ckplas.com
BEVERLY, Mass., Dec. 3, 2024 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced today that it will showcase its Purion™ and GSD Ovation™ Series of ion implanters at the SEMICON Japan 2024 exhibition. The conference and exhibition are being held December 11-13, at the Tokyo Big Sight in Tokyo, Japan. Axcelis will be in Hall 4, Booth #4621. Semiconductor manufacturers are invited to visit the Axcelis exhibit to learn first-hand about innovative ion implant solutions that deliver significant technology and manufacturing advantages. Purion Power Series™ - Featuring Axcelis' innovative solution for thin silicon, TAIKO and silicon carbide (SiC) wafer processing across the full power device applications space, and wafer handling capable for 150mm, 200mm and 300mm wafers. Purion H™ Series - Offering unmatched purity and precision while achieving industry leading productivity across the full high current operating space. Purion H200™ - Axcelis' state of the art single wafer high current medium energy implanter designed to address the unique implant needs for devices designed for the Internet of Things (IoT) and power applications. Purion XE™ Series - The industry leading high energy implant platform with the widest energy range, including the Purion XEmax model featuring patented Boost Technology™ for the most advanced image sensor applications up to 15MeV. Purion M™ Series - The lowest power consumption medium current implanter offering the broadest range of mid-current doses available, and unparalleled flexibility to meet today's evolving implant requirements. GSD Ovation™ - Providing the most cost-effective way to extend high current and high energy batch platform capability by supporting emerging applications in wafer splitting (Si and SiC) and alternate substrates (lithium tantalate and ceramic). During the show, Axcelis will also host the following events on Thursday, Dec. 12th: SiC Power Device Manufacturing Ion Implant TechnologyExhibitor's TechSPOT Hall 5, 15:30 - 15:50 p.m.The power device market is at a critical inflection point as chipmakers transition from 150mm to 200mm SiC wafers. Ion implant equipment needs to offer the flexibility to handle multiple wafer sizes, various substrate types and operate at various implant temperatures. Please join us to learn about Axcelis' Silicon & Silicon Carbide (SiC) power semiconductor product line, SiC implant Al ion sources and productivity options and Si IGBT wafer handling and proton (H+) implant solutions. Axcelis Happy Hour CelebrationHall 4 Booth #4261, 16:00 – 17:00 p.m.Join us for beverages and appetizers and meet the Axcelis team! President and CEO of Axcelis Technologies Russell Low, said, "We're excited to be a part of this important market and the opportunity to provide the most advanced ion implant technology to Japan chipmakers. We are proud of our growing installed base and support infrastructure in Japan and remain focused on expanding our market share by providing customers the most innovative, enabling implant technology and support solutions to ensure their success." Charles Pieczulewski, Axcelis Country Manager, Japan, commented, "Japan customers continue to be impressed by Axcelis' broad implant product portfolio for power, image sensor, memory and logic applications. We look forward to displaying our newest technological advancements at SEMICON Japan." About Axcelis:Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for over 45 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at www.axcelis.com. AXCELIS CONTACTS:Japan:Charles Pieczulewski (Country Manager, Japan) +81.3.5860.2586 Global:Maureen Hart (Editorial/Media) +1.978.787.4266David Ryzhik (Investor Relations) +1.978.787.2352 Logo - https://mma.prnasia.com/media2/1756239/Axcelis_1_Logo.jpg?p=medium600
(觀傳媒編輯中心)【記者郭嘉 / 綜合報導】SEMICON Taiwan 2024 日前圓滿落幕,計吸引近九萬名來自世界各地極富影響力的微電子產業人士共襄盛舉。有著完善半導體供應鏈、獨特地理位置、政策以及產業優勢的日本佐賀縣府,也親率「佐賀半導體論壇」、荻野製作所、田口電機工業、日本鎢業(Nippon Tungsten)以及西原理工等當地半導體相關代工與製成應用企業,大秀多項獨家專利技術以及佐賀縣得天獨厚之優勢,成為展場上一大焦點。 ▲日本佐賀縣府今年再度參與SEMICON Taiwan,並親率當地半導體相關代工與製成應用企業,大秀多項獨家專利技術以及佐賀縣得天獨厚之優勢,成為展場上一大焦點。(圖/佐賀縣府提供) 佐賀縣展區提供一對一的翻譯洽談,前來商談人士絡繹不絕,佐賀縣官方代表指出,今年是佐賀縣第二年率團來台參加半導體展,也同步主動出擊與場內業者交流,讓業內人士更加了解在佐賀縣設廠的發展潛力與優勢。「佐賀縣位於日本九州的西北部,其機場飛往桃園機場僅145分鐘,一小時內的車程可抵達熊本縣;業務持續性(BCP)方面則有著極大之優勢,工業用地的平均價格為台灣的1/11;對於需要高度穩定生產環境的半導體行業,佐賀縣擁有強大的基礎設施,包括供水、排水、電力供應以及便捷的物流系統。此外,佐賀縣位於地震相對較少的區域,也預測無海嘯,進一步保證生產的穩定性。 ▲由佐賀縣府集結產官學共同設立的「佐賀半導體論壇」(同等台灣的協會),獨有的「招攬企業永續協助員」制度,能給予外國企業更安心的協助。(圖/佐賀縣府提供) 而佐賀縣府集結產官學共同設立的「佐賀半導體論壇」(同等台灣的協會),目前有61家企業團體會員,佐賀縣官方代表表示,進駐於此的企業不僅能夠方便獲取所需的生產材料和設備,增加與日本企業建立起緊密合作關係的機會,並且在房地產、徵才、職能提升、建教合作等獨有的「招攬企業永續協助員」制度下,給予外國企業更安心的協助,共同打造半導體產業聚落生態鏈。 ▲展期三天中,一同參展的日本企業:荻野製作所、田口電機工業、日本鎢業(Nippon Tungsten)以及西原理工,帶來吸睛的獨家技術、應用;據了解,已有進一步的媒合機會。(圖/佐賀縣府提供) 在展期三天中,一同參展的日本企業帶來吸睛的獨家技術、應用,據了解,已有進一步的媒合機會。有著「電鍍百貨」美譽的田口電機工業,擁有超過50種電鍍選項,並擅長1微米精密電鍍,市場潛力大。主打延長零件壽命30倍的日本鎢業(Nippon Tungsten),展示獨家鎢製品與精細陶瓷製品,助提升生產性,創造循環經濟模式。西原理工憑借70年以上技術,在產業界大放異彩,並與時俱進涉足IoT與AI領域,國內外廠商爭相合作。荻野製作所主推冷卻塔內不投藥、省成本且環保的改善方案,ESG概念大受企業青睞! 據經濟部統計,台日貿易額去年達757.69億美元,其中半導體占比達四成,隨著台積電赴日設廠,供應鏈廠商可望隨之布局。佐賀縣官方代表則強調,會展的結束,也意味著商機的開始,台日半導體產業鏈有著高度互補性,我們已做足最好的準備,有信心成為半導體產業設廠的首選地區,攜手台灣廠商一同成長、共同創新,構建最具競爭力的半導體生態圈。 ▲佐賀縣展區提供一對一的翻譯洽談,前來商談人士絡繹不絕。(圖/佐賀縣府提供) 更多佐賀縣半導體相關資訊可洽詢:kigyouricchi@pref.saga.lg.jp
Hsinchu, Taiwan, September 9, 2024 -SEMICON Taiwan officially opened on September 6, 2024, with ACE Solution and HON. PRECISION is joining forces to showcase its latest advancements in silicon photonics testing technology, precision measurement, and automated machinery integration. Their exhibition focused on high-density optoelectronic integration testing solutions designed to meet the increasing demands of silicon photonics for high-capacity and high-channel testing. The integrated optoelectronic signal testing system effectively addresses the challenges posed by increased data center traffic and high-speed transmission needs, significantly boosting transmission rates and reducing energy consumption. With semiconductor packaging evolving towards Co-Packaged Optics (CPO), ACE Solution highlighted its silicon photonics solutions developed through deep collaboration with Quantifi, integrating PXI testing modules to offer an efficient, multi-system testing solution supporting 800G and 1.6T high-speed transmission. These integrated solutions meet the research and production needs for high-speed, high-precision, and high-efficiency testing while offering programmable automation for flexible applications. ACE Solution also demonstrated its latest innovations in compound semiconductor testing. The Teradyne ETS-88 testing platform is widely used for SiC, GaN, PMIC, automotive electronics, aerospace, and defense industries. Key features include multi-site CP, second-contact KGD, dynamic/static power device FT, and fully automated high-output module FT. The ETS-364 and ETS-800 platforms are tailored for mixed-signal, digital, and analog testing, offering the industry's highest-spec power IC testing capabilities with support for up to 6000V and 4000A, making them ideal for high-current, high-voltage applications, particularly in EV power and battery management. The TZ-6000 non-destructive wafer and materials inspection system utilizes terahertz (THz) technology, focusing on compound semiconductor testing for GaAs, SiC, and GaN. It offers greater penetration depth and flexibility, handling various sizes and shapes of wafers. Equipped with advanced wafer probes and intelligent software analysis, it can simultaneously measure parameters such as thickness, refractive index, resistivity, dielectric constant, surface/subsurface defects, and full wafer scans, enabling non-destructive wafer quality measurements. The Electro-Optic Terahertz Pulse Reflectometer (EOTPR) is the world's first instrument to use isolation technology to detect IC package faults and monitor package quality, making it ideal for non-destructive defect detection in 3DIC package analysis. With 5-micron pinpoint precision, the EOTPR is widely used in advanced IC packaging fault analysis for devices such as stacked packages (PoP), flip-chip, and TSV in 3D packaging. Major semiconductor companies have extensively deployed EOTPR for advanced IC packaging quality assurance in manufacturing environments. Steve Hsu, President of ACE Solution, stated, "With over 20 years of experience in hardware-software integration, ACE Solution has expanded from wireless communication testing to various testing fields, meeting the needs of our local clients. We are thrilled to collaborate with HON. PRECISION to showcase our achievements in automation and precision testing." Alan Hsieh, President of HON. PRECISION commented, "This exhibition marks a new milestone in our partnership with ACE Solution. We look forward to offering more advanced solutions, fostering greater collaboration and innovation across the industry." For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Peter Lee, Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw Website: https://www.acesolution.com.tw/en/ About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to the specific requirements of our customers in the field of electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished team of technical experts who offer unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively.
台灣新竹,2024年09月09日,SEMICON 國際半導體展盛大開幕,筑波科技 (ACE Solution) 與鴻勁精密 (Hon. Precision) 攜手參展,展示光電整合矽光子測試技術、精密量測及自動化機台的整合,著重高密度與光電結合測試方案,專為應對高容量與高通道的矽光電子測試需求,提供高度集成的光電信號一體化測試系統,有效應對高速傳輸和數據中心流量增加的挑戰,顯著提升傳輸速率並降低能耗。精密半導體封裝已邁向 CPO (Co-Packaged Optics) 發展,筑波科技此次展示的矽光子解決方案來自與 Quantifi 的深度合作,整合 PXI 測試模組提供高效整合的多機一體測試方案,支援 800G 和 1.6T 的高速傳輸。在光通訊與高速訊號介面傳輸的整合中,滿足研發與生產部門對高速率、高精度、高效率的測試需求,也具備靈活的可程式自動化規劃功能。 筑波科技還展示其在化合物半導體測試最新成果。Teradyne ETS-88 測試方案廣泛應用於 SiC、GaN、PMIC、車用電子、航空航天和國防工業等。該方案具備多工位 CP、二次接觸 KGD、動/靜一體功率器件 FT 和全自動高產出模組 FT 四大特色。ETS-364 和 ETS-800 則專門用於混合信號、數位和類比測試,提供業界最高規格功率 IC 測試平台可支持達 6000V 和 4000A 測試,能應對高電流、高電壓需求,尤其在電動車電源和電池管理等應用中具有優越性能。 TZ-6000 非破壞性晶圓和材料檢測系統利用太赫茲 (Terahertz, THz) 技術,專注於砷化鎵、碳化矽和氮化鎵等化合物半導體測試,提供更高穿透深度。具備高度靈活性,適用各種尺寸和形狀的晶圓,並配備獨有多元晶圓探頭及智能軟體分析功能,能同時測量多個參數,如厚度、折射率、電阻率、介電常數、表面/次表面缺陷及整個晶圓掃描,實現非破壞性晶圓品質測量。 電光太赫茲脈衝反射儀 (EOTPR) 是全球首款使用隔離技術檢測積體電路封裝故障和監測封裝品質的設備,特別適用於 3DIC 積體電路封裝的非破壞性缺陷檢測。該儀器提供 5 微米的定位精度,適合用於手機和電腦應用中複雜且先進積體電路芯片的故障分析,包括堆疊式封裝層迭 (PoP)、覆晶 (Flip-Chip) 和 3D 封裝中的矽通孔 (TSV) 等封裝形式。EOTPR 已在各大半導體公司的先進 IC 封裝故障分析領域得到廣泛應用,在品質保證與檢驗的製造環境大量部署。 筑波科技董事長許深福表示:「筑波科技擁有 20 年的軟硬體整合經驗,從無線通訊測試基礎延伸至各個測試領域,致力於滿足本地客戶的需求。我們非常高興能與鴻勁精密合作,共同展示我們的機構自動化與精密測試的協同技術成果。」鴻勁精密董事長謝旼達表示:「此次展會標誌著鴻勁與筑波科技合作的新里程碑。我們期待未來能夠提供更多先進解決方案,促進行業間的交流與合作。」未來筑波科技將與鴻勁精密持續攜手推動創新,為客戶提供卓越方案。 請追蹤筑波集團LinkedIn,掌握最新消息! 聯絡筑波科技 筑波科技股份有限公司ACE Solution, Co., Ltd. 地址:新竹縣竹北市台元街28號2樓之1 電話:03-5500909 電子郵件:service@acesolution.com.tw 網站:https://www.acesolution.com.tw/en/index/ 關於筑波科技(ACE Solution) 筑波科技(https://www.acesolution.com.tw/en/index/)成立於2000年,位於台灣新竹,在中國蘇州和深圳以及越南設有分公司,可提供服務。我們的使命是提供訂製的測試解決方案,以滿足電氣元件、設備和系統製造商的客戶需求,通過合作夥伴提供技術解決方案。我們專注於射頻、毫米波和太赫茲領域,擁有專業的技術支援團隊,提供專業、創新和多功能的綜合技術和解決方案。
A12 藝術空間
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