本網站使用瀏覽器紀錄 (Cookies) 來提供您最好的使用體驗，我們使用的 Cookie 也包括了第三方 Cookie。相關資訊請訪問我們的隱私權與 Cookie 政策。如果您選擇繼續瀏覽或關閉這個提示，便表示您已接受我們的網站使用條款。 關閉
【臺北訊】專業物聯網及人工智慧邊緣運算平臺研發製造大廠—研揚科技(股票代碼: 6579)，最近宣布推出了RICO-3568。這款RISC板卡搭載Rockchip RK3568晶片組，且符合Pico-ITX Plus標準尺寸。 RICO-3568的設計主要針對尋求堅固、工業級解決方案的客戶，特別適用於自動化、數位電子看板和邊緣運算等市場。這款產品提供了多樣的接口和擴充選項，充分發揮了Rockchip RK3568處理器的高性能低功耗特性。RICO-3568搭載了最多4GB的LPDDR4系統記憶體，並配備16GB的eMMC儲存容量、一個Micro-SD卡槽，以及一個支援mSATA硬碟的mini-PCIe插槽。 RICO-3568搭載四核心Arm® Cortex®-A55最新技術、整合型NPU和Arm® Mali™-G52顯示核心，支援多種影像編解碼格式。對於數位電子看板而言，這項功能特別實用，因為它具有無風扇設計，並提供HDMI 2.0和eDP 1.3顯示輸出（分別支援60Hz的4K和2560 x 1600解析度）。此外，RICO-3568還提供LVDS連接器，對於研揚的工業自動化客戶群來說非常適用，因為它適合人機介面（HMI）應用。 RICO-3568的尺寸僅100mm x 80mm，使其成為空間受限環境的理想選擇，同時不會影響性能。儘管體積小巧，RICO-3568提供了豐富的連接埠選項，包括USB Type-A（支援USB 3.2 Gen 1/USB 2.0信號）、Type-C和GbE LAN。RICO-3568在工業通訊方面表現出色。它配備了RS-232/422/485串口轉換器，一個用於偵錯或額外RS-232功能的排針座，以及可配置的UART和I2C等選項。此外，該平板電腦還擁有一個GPIO排針，支持各種工業通訊協議。為了滿足長距離無線連接的需求，RICO-3568透過其mPCIe插槽提供了內置Wi-Fi 6和LTE支援。 RICO-3568搭載Android™ 12和Debian® 10操作系統，讓開發人員能夠自由選擇最適合其需求的平台。研揚的強固型平板電腦部門資深產品經理楊大德表示：「我們的團隊努力不懈，致力於打造一款突破嵌入式運算界限的產品，RICO-3568充分展現RISC架構的性能和多功能性的新標準。」 更多RICO-3568的產品資訊，您可以上研揚官網查詢，也可以於官網訂購，或與研揚科技國內業務處02-89191234分機1142劉小姐聯繫。現在RICO-3568也同時在研揚eShop上販售，有小量需求的客戶，可透過eShop購買。 關於研揚科技 研揚科技集團（研揚）是台灣專業物聯智能解決方案研發製造大廠，成立於1992年。研發製造並行銷全球IoT及AI邊緣運算解決方案，另有嵌入式電腦主板及系統、工業液晶顯示器、強固型平板電腦、工控機、網路安全設備以及相關配件等，提供OEM/ODM客戶及系統整合商完整且專業之軟硬體解決方案。同時，研揚科技有專屬團隊提供客製化服務，協助您從研發初期發想到產品製作、量產到售後服務，提供一貫之專業諮詢與服務，為您量身打造高品質產品。研揚科技目前提供多款AI邊緣運算產品及智慧城市、智慧零售及智慧製造等系統整合和解決方案。研揚是英特爾鈦金級會員，同時也是NVIDIA的菁英級夥伴(Elite partner)。欲瞭解更多詳細資訊請參考研揚科技官方網站。
【臺北訊】專業物聯網及人工智慧邊緣運算平臺研發製造大廠—研揚科技 (股票代碼: 6579)，今日推出了 RTC-1010RK，這是其 10.1 吋強固型 平板電腦系列的最新成員。搭載 Rockchip RK3399 處理器，RTC-1010RK 利用四核心的 Arm® Cortex®-A53 和雙核心的 Arm® Cortex®-A72 進 行有效的計算資源分配。 研揚強固型平板電腦系列的設計目標在於應對各種具有挑戰性的部署環境，例如現場檢查、倉庫管理和工廠自動化。RTC-1010RK經過了 MIL-STD-810H 軍規級的振動、震動和落摔測試，因此適用於建築工地和訂單執行處理等需求，比標準型平板電腦更耐用的場所。 RTC-1010RK提供多種接口，包括 micro HDMI、COM、LAN 以及 USB Type-A 和 Type-C 接口。此外，它前後各配有800萬畫素鏡頭，並支持 Wi-Fi 802.11 a/b/g/n/ac 和 LTE，可選配 2D 條碼掃描器、GPS 和 GLONASS，以進一步滿足現場使用的需求。 RTC-1010RK支援 Android™ 11 操作系統，研揚預計這將有助於客戶提供更多開源工具，以客製 UI 和應用程式，以滿足特定的使用需求。該平臺還提供廣泛的安全功能，例如一次性權限、儲存空間隔離和增強生物識別身份驗證。因此，組織可以維護庫存管理系統的完整性，為現場服務技術員增加完善的數據保護，並對多個地點的移動銷售點（POS）系統進行訪問控制。 可選配件包括手提帶、背帶、擴充基座、充電底座、增強型電池組和電源適配器。 更多 RTC-1010RK的產品資訊，您可以上研揚官網查詢，也可以於官網訂購，或與研揚科技國內業務處 02-89191234 分機 1142 劉小姐聯繫。現在 BOXER-8651AI 也同時在研揚 eShop 上販售，有小量需求的客戶，可透過eShop購買。 關於研揚科技 研揚科技集團（研揚）是台灣專業物聯智能解決方案研發製造大廠，成立於 1992 年。研發製造並行銷全球 IoT 及 AI 邊緣運算解決方案，另有嵌入式電腦主板及系統、工業液晶顯示器、強固型平板電腦、工控機、網路安全設備以及相關配件等，提供 OEM/ODM 客戶及系統整合商完整且專業之軟硬體解決方案。同時，研揚科技有專屬團隊提供客製化服務，協助您從研發初期發想到產品製作、量產到售後服務，提供一貫之專業諮詢與服務，為您量身打造高品質產品。研揚科技目前提供多款 AI 邊緣運算產品及智慧城市、智慧零售及智慧製造等系統整合和解決方案。研揚是英特爾鈦金級會員，同時也是 NVIDIA 的菁英級夥伴 (Elite partner)。欲瞭解更多詳細資訊請參考研揚科技官方網站
SHENZHEN, China, Oct. 12, 2024 /PRNewswire/ -- On September 27, the Third GMIF2024 Innovation Summit (Global Memory Innovation Forum) was successfully concluded in Renaissance Shenzhen Bay Hotel. The event was hosted by the Semiconductor Investment Alliance and the Shenzhen Memory Industry Association, co-organized by the Guangdong Integrated Circuit Industry Association and the Shenzhen Semiconductor Industry Association, and organized by JW Insights Consulting (Xiamen) Co., Ltd. and Haitong Securities Co., Ltd. In recognition of outstanding achievements and innovation in the storage industry, the GMIF2024 Annual Awards winners were unveiled at the summit. Following a rigorous selection process, many companies, including Intel, Micron, CXMT, YMTC, GigaDevice, Arm, UNISOC, SIXUNITED, Victory Giant, BIWIN Storage, Solidigm, Western Digital, Rockchip, Allwinner Technology, Weibu Information, Heyan Technology, OKN Technology, Attach Point Intelligent Equipment, iWISEETEC, Tytantest, Hemei Jingyi, Silicon Motion, Maxio, QUANXING, MICROFROM, Konsemi, Silergy, Tongfang, LKAUTO, Maxwell, Skyverse, RORZE, ExTripod Electronics, EPS, InnoGrit, POWEV, KingSpec, LANYI and more, had been honored with the 2024 Annual Awards. The GMIF2024 Annual Awards feature over 38 subcategories across three main categories: Outstanding Industry Award, Outstanding Product Award, and Outstanding Brand Award. The list of winners is as follows: Outstanding SSD Product Breakthrough Award: Micron Technology Micron Technology, a leading global provider of storage and memory solutions, has been dedicated to promoting industry advancement through technological innovation. The latest addition to its data center SSD lineup, the Micron 9550 NVMe™ SSD, achieves industry-leading performance and demonstrates notable advancements in performance and energy efficiency for AI workloads. This breakthrough by Micron Technology illustrates its profound expertise and innovative abilities in storage technology and further emphasizes its leadership in AI storage solutions. Outstanding AI Storage Application Award: Solidigm Solidigm, a leader in AI storage solutions, draws on its rich experience in QLC SSD technology to deliver high-performance and high-capacity storage solutions for AI applications. Through ongoing technological innovation, Solidigm addresses the high requirements for storage density and efficiency in the AI sector, significantly improving data processing capabilities and overall performance for AI applications. Solidigm exhibits robust technical strength and market leadership in the implementation of AI storage solutions, providing vital support for the rapid growth of the AI industry. Outstanding Technology Innovation Award: Western Digital As a premier global data storage solutions provider, Western Digital remains at the cutting edge of technological innovation. Thanks to its vertical integration in NAND flash and hard disk technology, Western Digital has successfully released various high-performance and high-capacity storage products, greatly enhancing the efficiency and performance of data centers and enterprise storage. Its relentless pursuit of technological breakthroughs not only fosters the growth of the storage industry but also offers exceptional storage experiences to customers around the world. Western Digital's commitment to innovation sets a new benchmark in the industry. Outstanding Technology Leadership Award: Intel (China) Ltd. Intel (China) Ltd. exemplifies strong technological leadership through its sustained innovation in the semiconductor and computing sectors. As a frontrunner in the global technology landscape, Intel drives the evolution of computing and storage technologies with its state-of-the-art processor architectures and innovative solutions. The company's technological advancements in pioneering fields like AI and data centers offer global customers high-performance, highly reliable product experiences, further solidifying its leadership status in the industry. Intel sets new standards for development in the industry through its exceptional technological innovation. Outstanding AIoT Platform Contribution Award: Rockchip Electronics Co., Ltd. Rockchip Electronics Co., Ltd. excels in the AIoT platform sector, and leverages its innovative chip designs and robust technological capabilities to further promote the fast development of the AIoT ecosystem. The company provides efficient and stable solutions for smart devices and the Internet of Things through a comprehensive product portfolio and technological breakthroughs, which significantly enhances the overall performance of AIoT platforms. With its continuous innovation and deep commitment to the ecosystem, Rockchip has made significant contributions to the industry, and has now become a key player in the AIoT platform field. Outstanding Intelligent Terminal Application Award: Allwinner Technology Co., Ltd. Allwinner Technology Co., Ltd. provides high-performance and low-power SoC solutions by relying on its ongoing innovations in smart terminal processors, and now its products have been widely used in smart terminal devices across the globe. Dedicated to refining product performance, Allwinner has taken a big leap in enhancing the computational power and user experience of smart devices, contributing to driving both technological advancement and application expansion in the smart terminal industry. The company's outstanding achievements in this field have garnered it broad industry recognition, establishing it as one of the leaders in the smart terminal sector. Outstanding Intelligent Terminal Award: Weibu Information Inc. Weibu Information Inc. has drawn on its strong innovation capabilities and deep technical expertise to roll out a set of effective and intelligent terminal solutions. The company has enhanced the performance and user experience of smart terminal devices by optimizing its technical architecture, with applications spanning multiple industries. Through its continued innovation, Weibu Information has not only expanded the use of smart terminal devices but also invigorated the industry, earning widespread acclaim from the market and its clients. Outstanding Packaging Equipment Support Award: Shenyang Heyan Technology Co., Ltd. Shenyang Heyan Technology Co., Ltd. continues to make strides in the semiconductor packaging equipment sector, offering robust support for chip packaging technology through its innovative fully automatic grinding and polishing machines and film lamination and stripping machines. With considerable efforts put in the enhancement of equipment's precision and efficiency, Heyan now provides the market with more thinner, more precise chips, making a difference to the progress of domestic semiconductor packaging technology. Outstanding Memory Testing System Gold Award: Suzhou OKN Technology Co., Ltd. Suzhou OKN Technology Co., Ltd. has successfully introduced a series of efficient and reliable testing equipment, backed by its professional expertise and ongoing innovation in memory testing systems. Through years of technical accumulation, the company has continuously refined the accuracy and performance of its testing systems, delivering effective memory testing solutions to its clients. OKN's excellent products and services have garnered widespread trust from customers, and it's now recognized as a crucial contributor in the memory testing field. Outstanding Packaging Equipment Service Award: Dongguan Attach Point Intelligent Equipment Co., Ltd. Reinforced by its strength in innovative R&D of semiconductor packaging equipment, Dongguan Attach Point Intelligent Equipment Co., Ltd. has brought out a variety of high-precision and high-efficiency packaging solutions to the market. The company remains focused on improving equipment performance and service standards to deliver more competitive packaging support to its clients. Supported by outstanding technology and dependable service, APIE has earned significant market recognition and become a key partner in the semiconductor packaging equipment industry. Outstanding Product Award: Shenzhen Hemei Jingyi Semiconductor Technology Co., Ltd. Shenzhen Hemei Jingyi Semiconductor Technology Co., Ltd. takes the full advantage of its excellence in IC packaging substrate design and manufacturing to launch a range of high-quality products that are widely used across multiple industries. The company's commitment to ongoing technological innovation and strict quality assurance has resulted in enhanced product performance and reliability, earning significant customer recognition. Hemei Jingyi's outstanding product performance has made it a prominent supplier in the packaging substrate industry, setting a benchmark for the market. Outstanding Controller Leadership Award: Silicon Motion Technology Corp. The SM2508 from Silicon Motion is a high-performance, low-power PCIe Gen5 SSD controller solution designed specifically for AI laptops requiring high capacity, high performance, and low-power storage solutions. The company's continuous innovation in flash controller technology has driven performance enhancements in solid-state storage devices, solidifying its leadership position in the industry. Outstanding Controller Market Application Award: Maxio Technology (Hangzhou) Co., Ltd. Maxio Technology (Hangzhou) Co., Ltd. has leveraged its deep technological expertise in storage controller chips to launch a range of high-performance solutions that meet the diverse needs of the market. By continuously optimizing product performance and application scenarios, the company has effectively covered both consumer and enterprise markets, and its products has now been acknowledged widely by customers. Endorsed by its outstanding market performance and strong application capabilities, Maxio has become a significant driver in the controller chip market. Outstanding Brand Influence Award: iSoftStone Computing (Tongfang Computer) Tongfang Computer has successfully established an internationally competitive brand image through its continuous efforts in technological innovation and product quality. The company's remarkable performance in high-performance computing and storage solutions covers multiple application sectors and has earned it high acclaim from users globally. By consistently enhancing its brand influence and market performance, Tongfang Computer has become a well-known brand in the storage industry, driving sustainable development in the sector. Outstanding Market Breakthrough Award: Shenzhen Like Automation Equipment Co., Ltd. Shenzhen Like Automation Equipment Co., Ltd. has achieved significant market breakthroughs through its continuous innovation in the field of semiconductor packaging and testing intelligent equipment. The company's independently developed fully automatic IC substrate ball bonder machine demonstrates outstanding competitiveness in both technical performance and market performance, filling a gap in the domestic equipment landscape. By continuously enhancing its product technology level and market coverage, LKAUTO has earned high recognition from its customers. Outstanding Equipment Technology Breakthrough Award: Suzhou Maxwell Technologies Co., Ltd. Maxwell Technologies, a provider of complete process solutions for semiconductor wafer grinding and 2.5D/3D advanced packaging in the post-Moore era, has continually invested in R&D and adhered to independent innovation. In recent years, the company has achieved breakthroughs in high-end equipment and core components for wafer thinning, cutting, and bonding/debonding. Maxwell is dedicated to producing high-quality products and delivering exceptional service, aiming to create more value for customers and foster win-win outcomes. Outstanding Semiconductor Metrology Technology Innovation Award: Skyverse Technology Co., Ltd. Skyverse Technology Co., Ltd. has become an industry benchmark thanks to its technological innovations in the field of semiconductor testing and measurement. By continuously investing in R&D and making significant technological breakthroughs, the company has enhanced the accuracy and efficiency of measurements in semiconductor manufacturing processes, fostering technological progress across the industry. Skyverse has garnered high recognition from clients both at home and abroad and has achieved multiple independent innovations in measurement technology, positioning itself as an important force in the development of the industry. Outstanding Controller Contribution Award: InnoGrit Corporation InnoGrit Corporation has leveraged its in-depth expertise and innovation in the storage controller chip sector to successfully introduce multiple high-performance controller chips, catering to a diverse range of applications from SATA to PCIe. Through ongoing technological advancements, InnoGrit not only delivers efficient and reliable storage solutions to clients worldwide but also promotes the development and evolution of storage controller technology, demonstrating formidable technical leadership and making significant contributions to the industry. Outstanding Industry Award: Victory Giant Technology (Huizhou) Co., Ltd. Victory Giant Technology (Huizhou) Co., Ltd., one of the top 100 global printed circuit board manufacturers, has been dedicated to advancing smart manufacturing in China while actively promoting technological innovation in the PCB industry. Adhering to principles of intelligent manufacturing, green development, and innovation leadership, Victory Giant has achieved stable growth bolstered by its outstanding products, technologies, and service advantages, setting an industry benchmark in electronic circuit boards. Its high-quality products and services have earned it wide recognition in the market. Outstanding Testing Equipment Leadership Award: Tytantest Co., Ltd. Tytantest Co., Ltd. has made significant strides in the chip testing equipment sector by introducing several high-performance testing devices through its innovative R&D efforts, greatly enhancing the efficiency and accuracy of chip testing. The company focuses on optimizing product design and performance to provide clients with effective testing solutions. Tytantest is recognized widely in the market for its superior technical expertise and reliable equipment support. Outstanding Industry Service Award: ChangXin Memory Technologies Inc. (CXMT) CXMT has been awarded for its outstanding performance in DRAM technology research, development, and production. As an innovative pioneer in China's high-end memory sector, CXMT has become a backbone of the progress in China's semiconductor industry by independently developing core technologies and launching high-quality products, contributing to the high-level development of the domestic memory industry chain. Outstanding Storage Technology Breakthrough Award: Yangtze Memory Technologies Co., Ltd. (YMTC) Yangtze Memory Technologies Co., Ltd. (YMTC) has made significant strides in the 3D NAND flash technology sector since its establishment in 2016, achieving remarkable breakthroughs from the ground up. Notably, the third-generation QLC flash memory released by YMTC in 2020 garnered widespread acclaim for its industry-leading I/O speed and storage density. The company's ongoing innovation has not only elevated the technological standards of China's semiconductor industry but also spurred competition and innovation within the sector, allowing more cost-effective domestic products to secure a vital position in the global market. Outstanding Industry Contribution Award: GigaDevice Semiconductor Inc. GigaDevice, as a leading global fabless chip supplier, has played a pivotal role in the rapid development of the semiconductor industry through its outstanding product research and development capabilities and technological innovations. Its achievements in memory and microcontroller fields have not only enhanced the international competitiveness of China's chip industry but also provided global customers with high-quality, high-performance solutions. With its ongoing contributions and profound impact, GigaDevice has become a key driving force behind industry advancement. Outstanding Industry Promotion Award: Arm As a leading global provider of semiconductor intellectual property, Arm is dedicated to advancing technological development and innovation within the semiconductor industry. Through its exceptional chip architecture design and extensive ecosystem, Arm not only provides robust technical support for global technological progress but also actively promotes collaborative development and technical exchange across the industry chain. Its ongoing contributions to the construction of the global semiconductor ecosystem have ushered in considerable transformations, facilitating higher levels of technological breakthroughs and advancements within the industry. Outstanding Industry Ecosystem Award: UNISOC (Shanghai) Technologies Co., Ltd. UNISOC, a leading chip design company in China, has become a pivotal force in advancing the semiconductor industry ecosystem. With the backing of innovative chip technology and a broad product portfolio, the company actively promotes collaborative development within the industry chain, driving technological progress in various fields, including smart terminals, the Internet of Things (IoT), and 5G. Through its outstanding technological prowess and capability in ecosystem development, UNISOC has made significant contributions to the sustainable growth of the global technology industry, further enhancing the global competitiveness of China's semiconductor sector. Outstanding Industry Innovation Award: BIWIN Storage Technology Co., Ltd. BIWIN Storage Technology Co., Ltd. has successfully established an "Integrated R&D and Packaging" business model through continuous technological innovation and strong R&D capabilities. The company demonstrates exceptional competitiveness in research on storage medium characteristics, firmware algorithm development, and packaging testing technologies. BIWIN Storage actively invests in IC design, advanced packaging and testing, and test equipment development, continually driving advancements in storage technology. This commitment enables the company to provide efficient and stable storage solutions to the global market, making it a significant force in leading industry innovation and development. Outstanding Packaging Equipment Market Performance Award: Suzhou iWISEETEC Co., Ltd. Suzhou iWISEETEC Co., Ltd. has excelled in the semiconductor packaging equipment sector, leveraging its innovative R&D capabilities and efficient equipment solutions to provide reliable packaging support for customers. The company continually enhances the precision and efficiency of its devices to meet diverse packaging requirements. With stable product performance and high-quality service, iWISEETEC has garnered significant recognition from the market and its clients, establishing itself as a key partner in the packaging equipment field. AI Storage Innovation Breakthrough Award: Shenzhen Quanxing Technology Co., Ltd. Capitalizing on its strategic foresight in the AI storage solutions sector, Shenzhen Quanxing Technology Co., Ltd. has successfully developed several innovative storage products with high performance and large capacity in the AI storage solutions sector, which meet the stringent data storage requirements of AI applications. Through continuous technological breakthroughs, the company provides efficient and reliable storage support for training and inference of large AI models, facilitating the practical application of AI across industries. With its outstanding innovative capabilities, QUANXING has received widespread recognition from the industry, and emerged as a significant force for innovation in the AI storage field. Outstanding Industrial-Grade Storage Service Award: Shenzhen Micro Innovation Industry Co., Ltd. (MICROFROM) With a strong focus on industrial control storage, Shenzhen Micro Innovation Industry Co., Ltd. has developed a series of stable and reliable storage solutions that are widely applied across various industrial environments. The company has made considerable efforts to continuously enhance the performance and reliability of its products, ensuring their stable operations under stringent industrial control settings. MICROFROM's commitment to quality and service has garnered significant trust from its customers, making it a prominent service provider in the industrial control storage industry. Outstanding Product Performance Award: Hefei Kangxinwei Storage Technology Co., Ltd. (KONSEMI) With its technical expertise in storage controller chips and storage modules, Hefei Kangxinwei Storage Technology Co., Ltd. has introduced a range of high-performance products that find extensive applications in consumer and automotive markets. The company's independently developed eMMC products have earned high praise from customers for their rapid read and write speeds, low power consumption, and exceptional reliability, achieving cumulative sales of over 50 million units. Outstanding Market Performance Award: Silergy Corp. Silergy Corp. stands as a leader in the analog chip industry and focuses on independent innovation with a global strategy. It has achieved a sustained annual growth rate of over 30% for several years. Aided by its industry-leading process technologies, the company designs innovative mixed-signal and analog chips, and its products encompass a wide range of fields including DC conversion, power management, LED lighting, and battery management systems. Silergy's developed solutions empower applications across automotive, industrial, consumer electronics, cloud computing, and telecommunications. Outstanding Market Service Award: RORZE Createch Co., Ltd. RORZE Createch Co., Ltd. has demonstrated exceptional innovation and market service in the field of industrial automation equipment. Through continuous breakthroughs in precision control and intelligent manufacturing solutions, the company has significantly improved its clients' production efficiency and product quality. With robust technical support and strong market responsiveness, RORZE has earned widespread recognition from its customers. Outstanding Packaging and Testing Equipment Service Award: ExTripod Electronics Technology Limited ExTripod Electronics Technology Limited has emerged as a leader in the semiconductor packaging and testing equipment sector through continuous innovation and outstanding performance. Specializing in advanced packaging and power semiconductor fields, the company provides efficient and reliable packaging and testing equipment and solutions, offering comprehensive technical support to OSAT, IDM, and Fabless customers. ExTripod Electronics has gained strong customer trust by driving technological advancements and optimizing services, making significant contributions to the industry's development. Outstanding Packaging Substrate BT Materials Service Award: Guangdong EPS Technology Co., Ltd. Guangdong EPS Technology Co., Ltd. has achieved remarkable success in providing advanced BT substrate materials and solutions for the IC packaging and Mini & Micro LED display industries. Through continuous technological innovation and efficient services, the company has successfully satisfied the demand for high-end packaging materials, driving the localization of semiconductor packaging materials. EPS has not only reached international standards in technology but also earned strong industry recognition for its excellent customer support and market responsiveness. Outstanding Domestic Storage Brand Influence Award: Powev Electronic Technology Co., Ltd. As a leading provider of high-end domestic storage solutions, POWEV has always adhered to offering customers high-performance, stable, and reliable storage products with excellent value, helping them navigate diverse market demands. POWEV's achievements are not only reflected in its technological breakthroughs but also in elevating the influence of domestic storage brands, setting trends in the localization of the market. Outstanding Industrial-Grade Storage Solution Award: Shenzhen KingSpec Electronics Technology Co., Ltd. Shenzhen KingSpec Electronics Technology Co., Ltd. has distinguished itself in the industrial control sector with its stable and reliable storage solutions. Underpinned by deep technical expertise and continuous innovation, the company has introduced a range of high-quality storage products capable of withstanding harsh industrial environments. These innovations not only offer high performance and stability but also demonstrate exceptional reliability under extreme conditions, making them widely applicable in fields such as industrial automation and the Internet of Things (IoT), delivering significant value and earning strong market recognition. Outstanding High-Precision Testing Service Award: Dongguan Lanyi Electronic Technology Co., Ltd. Dongguan Lanyi Electronic Technology Co., Ltd. has established itself as an industry leader through its innovative advancements in high-precision test probes and test sockets. With continuous investment in research and development, Lanyi Electronic has mastered several proprietary core technologies, offering customers high-precision, highly reliable testing solutions. This dedication to quality and innovation has earned the company widespread trust and recognition from clients and the market alike. Outstanding Terminal Industry Award: Shanghai Sixunited Intelligent Technology Co., Ltd. SIXUNITED is committed to driving global innovation and technological transformation, creating an exciting digital lifestyle through information technology. The company has made significant strides in the smart terminal industry, particularly with its contributions to AI computing power products. These advancements highlight SIXUNITED's comprehensive presence and strong capabilities in the intelligent computing sector, earning widespread recognition within the industry. ABOUT GMIF GMIF (Global Memory Innovation Forum) is the most important annual event of Shenzhen Memory Industry Association (SMIA). The forum aims to build a globally-focused, professional platform for the storage industry to collectively explore new technologies, applications, collaborations, and emerging opportunities. The Third GMIF2024 Innovation Summit had been successfully concluded on September 27, 2024 at Renaissance Shenzhen Bay Hotel. Under the theme of "AI Leads Memory's New Momentum", the summit aims to foster communication and interaction among both upstream and downstream enterprises in the storage industry. By promoting collaboration and complementary growth among industry partners, the GMIF seeks to help participating companies expand their product and brand reach and contribute to a thriving, win-win ecosystem in the global storage sector. For more information about GMIF, please visit https://www.gmif.com.cn/. Media Contact:Ms. Gu, +86 15064010336, wenjing.gu@gmif.com.cn
TAIPEI, Feb. 25, 2026 /PRNewswire/ -- Advantech (TWSE: 2395), a global leader in AIoT and Edge Computing, is strengthening its commitment to the rapidly expanding robotics market by enabling seamless, scalable vision integration across Autonomous Mobile Robots (AMRs), humanoid robots, robotic arms, and next‑generation edge AI systems. Advantech’s GMSL Camera Enablement for Robotics In all modern robotic platforms, vision is the foundation for perception, safety, and autonomy—but also one of the most challenging subsystems to integrate. GMSL2/3 cameras have become the industry standard for high‑bandwidth, low‑latency perception, yet the bring‑up process—especially with advanced SoCs—frequently requires weeks of kernel‑level optimization and vendor‑specific driver tuning. Breaking the Bottleneck: Pre-Validated GMSL Cameras Whether enabling SLAM navigation in AMRs, stereo depth perception for humanoid locomotion, or high‑speed industrial inspection for robotic arms, developers face the same barriers: Desired cameras are often not supported on the preferred edge computing platforms Reference designs published by CPU vendors are not applicable High cost of camera enablement Camera drivers are not upgraded with the latest edge computer BSP and OS Advantech closes this gap through deep collaborations with NVIDIA, Qualcomm, Intel, and Rockchip. By mastering the driver and kernel requirements of each ecosystem, Advantech provides production‑ready, pre-validated GMSL drivers in association with top-notch camera vendors. Expansive Camera Ecosystem and Joint Design-in Service Advantech AFE/ASR series support a broad portfolio of validated GMSL2/3 cameras, covering the full breadth of perception needs across different robot types. Developers can choose from 2D, Stereo, and 3D cameras made by the following partners: APPRO Basler D3 Embedded e-con FRAMOS innodisk Leopard Imaging Orbbec oToBrite RealSense SENSING StereoLabs Advantech and the camera partners jointly provide design-in service that accelerates robotics vision development by supporting new camera‑SoC enablement, optimal sensor selection, image quality tuning, and customized driver development. This collaboration streamlines integration, shortens development cycles while ensuring reliable and scalable deployment across diverse robotic platforms and applications. One‑Click Installation and Long-Term BSP Support At the center of Advantech's vision strategy is the One‑Click Installation Package, which transforms camera integration from a complex engineering task into a simple, streamlined experience. GMSL camera drivers are included and maintained in the board support packages (BSPs) of Advantech's robotics controllers, particularly the AFE and ASR series. In addition, the drivers are provided as ROS Nodes within the Robotic Suite—a complementary software package consisting of open-source toolkits like ROS2 and Autoware, optimized AI inferencing SDKs, and sample codes for robotic applications. Multi‑Architecture Robotics Controller Series Designed for real‑time responsiveness and high‑performance edge AI processing, the AFE/ASR series deliver reliable perception, motion control, and multi‑sensor integration within a unified software environment. Turnkey GMSL enablement, continuous driver maintenance, and streamlined sensor integration significantly accelerate deployment across diverse robotic applications. The AFE/ASR series are available as commercial off‑the‑shelf carrier boards and system‑level products built on leading processor platforms, including NVIDIA® Jetson™ Thor, Jetson AGX Orin™, Jetson Orin™ NX, Qualcomm® Robotics platforms such as the IQ9 series, Intel® Core™ Ultra processors, and Rockchip RK3588‑based solutions. This broad platform coverage enables design flexibility, modular scalability, and long‑lifecycle availability, providing robotics developers with a stable foundation for building next‑generation autonomous systems. Learn more about Advantech's Robotics Solutions: here About Advantech Advantech is a global leader in IoT intelligent systems and embedded platforms, with the corporate vision of "Enabling an Intelligent Planet." To embrace the trends of edge computing and artificial intelligence, Advantech fully deploys its sector-driven strategy and focus on Edge Computing and Edge AI. In the meantime, Advantech is enhancing its global presence and core competitiveness by integrating its Edge Computing hardware platform, the WISE-IoT software platform, and sector-specific Edge AI solutions with domain expertise. ContactCindy.liu@advantech.com.tw
SHENZHEN, China, Sept. 30, 2024 /PRNewswire/ -- In the golden glow of autumn, Shenzhen brings all together to convene a grand celebration. On September 27, the Third GMIF2024 Innovation Summit (Global Memory Innovation Forum) has been successfully concluded in Shenzhen. The event was hosted by the Semiconductor Investment Alliance and the Shenzhen Memory Industry Association, co-organized by the Guangdong Integrated Circuit Industry Association and the Shenzhen Semiconductor Industry Association, and organized by JW Insights Consulting (Xiamen) Co., Ltd. and Haitong Securities Co., Ltd. With the theme of "AI Leads Memory's New Momentum", this year's summit has brought together leading enterprises from various segments of the memory industry chain, including major wafer manufacturers, memory controller suppliers, module producers, packaging and testing enterprises, equipment and materials manufacturers, and terminal manufacturers, as well as representatives from investment institutions. The event centered around all aspects of key topics such as product innovation, technological evolution, and the collaborative development of the industrial chain, all with the aim of advancing industry cooperation and creating a shared future of success. GMIF2024 Innovation Summit Accelerating Deployment of AI Applications to Unlock New Growth in the Storage Industry The explosive growth of AI in the new era is reshaping the global semiconductor landscape. The widespread application of AI is driving demand for high-performance, high-computing-power chips, while also creating significant growth opportunities for high-bandwidth, large-capacity, and low-power storage chips. The GMIF2024 Innovation Summit officially kicked off with the welcoming remarks from Mr. Rixin Sun, President of the Shenzhen Memory Industry Association (SMIA). Over the recent years, the exponential growth of AI, 5G, Big Data and Internet has seen a brand-new revolutionizing period in global storage industry. Mr. Sun addressed that the GMIF2024 Innovation Summit turns special attention to the entire upstream and downstream storage value chain that goes beyond just the storage and memory itself. In particular, it unfolds critical areas across the industry, consisting of storage media, solutions, system platforms, testing equipment and more. Mr. Sun affirmed that only through collaboration across the entire industry chain can we continuously drive the advancement of the sector and maintain a leading position in global competition. Xiaofei Zhang, Chief Analyst for Electronics Industry from Haitong Securities, stated that, from the perspective of overall storage market, the HBM3e has exerted impacts on the production schedule of DDR5, and the decline in DRAM prices remains restricted. In the NAND sector, the inventory adjustments at server terminals are entering the final stages; coupled with AI driving demand for high-capacity storage products, prices have continued to rise in Q2. Although the recent increase in NAND prices has slowed, it still exceeds market concerns. Looking ahead, the penetration of AI terminal applications is accelerating, leading to a sustained increase in demand for computing and storage solutions. Yimao Cai, Dean of the School of Integrated Circuits at Peking University, expressed that semiconductor storage, considered as one of the largest segment of the integrated circuit industry, has encountered considerable challenges after stepping into the post-Moore and AI era. On one hand, traditional memory technologies have posed significant limits on the integration density and reliability below 28nm, and there is an urgent need for breakthroughs in underlying technologies. On the other hand, the traditional computing chips are insufficient to satisfy the high-efficiency demands for intelligent equipment, catalyzed by the surging growth in AI computing needs, as the traditional chip hardware incurs high costs and energy consumption. It can be observed that innovations in foundational units and process integration are crucial to the progress of memory technology, and new forms of storage technology are becoming increasingly mature. Prasad Alluri, VP and GM for Client Storage, SBU from Micron Technology, emphasized that "AI is everywhere and AI applications have entered every corner of people's daily lives in all kinds of forms. For instance, smartphone manufacturers have introduced AI capabilities in high-end phones, and the storage capacity of LPDDR 5 has been increased to between 12GB and 16GB to accommodate ever-increasing datasets. In addition, storage technology has evolved to UFS 4.0, which more than doubles power efficiency compared to the previous generation. In the realm of edge devices, autonomous driving will be elevated from Level 0 to Level 5 supported by the enhanced AI technology. Industry experts predict that the bit density required for automotive memory will increase by approximately 30 times, while the non-collision bits in power systems will grow nearly 100 times. None of the enhancements, whether in data centers, edge devices, or memory and storage environments, would be possible without the technological progress we've achieved generation after generation." Yan Li, Vice President of Advanced Technology at Western Digital, pointed out that the 3D NAND flash market is highly competitive and constantly evolving. The number of NAND cells stacked has experienced substantial growth, from 48 layers in 2017 to 64 and 96 layers. Up to date, Western Digital has completed mass production of its 218-layer products; while Micron Technology has already mass-produced its 280-layer products as stated in its keynote. Dr. Yan Li shared her insights that the continuous increase of layers might not be considered as an ideal strategy because large amounts of capitals are required for new equipment as complexity of the products rises. Should the market fail to accommodate these new products and prices start to decline, it could lead to a vicious cycle. Dr. Yan Li then moved on to make some explanations of the trade-offs involved in 3D NAND scaling technology. There are four main vectors to scaling: vertical scaling, lateral scaling, architecture scaling, and logical scaling. Taking its product PC SN5000S NVMe SSD as an example, Dr. Li noted that this model is equipped with cost-effective BiCS6 NAND technology and DRAM-less QLC PCIe Gen4 SSD, and its internal controller and firmware provide a perfectly optimized solution which can be introduced to the market within a shorter time and allowed for quality control. Compared to the previous generation, it offers a 51% improvement in memory density and a 12% increase in layer density. In relation to the mainstream TLC SSD, QLC SSD features enhanced performance and its major metrics are matched with TLC SSD. In consumer and commercial sectors, QLC SSDs are now being widely adopted by PC OEMs. Wallace C. Kou, President & CEO of Silicon Motion, claimed that AI will be the ever-lasting energy and vitality that propel continuous growth in the global market. Storage is regarded as one of the key areas in the artificial intelligence ecosystem, and the market requires more relevant software and applications to make AI edge devices more meaningful and appealing to consumers. Benny Ni, GAR Sales VP at Solidigm, remarked that the company currently possesses leading innovative technologies in the fields of TLC and QLC, enabling it to offer a powerful portfolio of data center storage products and storage solutions that optimize AI storage efficiency. Zhinong Liu, Executive Vice President of UNISOC, signified that in the all-scenario AI computing system, software serves as the "engine", chips as the "foundation", the ecosystem as the "link", and products as the "carrier". The company will continue to strengthen its advanced semiconductor manufacturing platform based on strategy and capability centers, maintain supply chain security, ensure efficient and stable product delivery, and enhance customer satisfaction. Haibing Xie, Director of Application Design in Center, Intel China, mentioned that AI PCs are the best carriers for edge-side AI and will lead the next explosion in the PC industry. The Intel Core Ultra is equipped with powerful AI capabilities, enabling the deployment of "generative AI" on PCs. At present, the company's AI PC chips have shipped 20 million units, and it is expected to reach 40 million units by the end of the year, with projected shipments of 100 million units in 2024-2025. Haiqing Huang, R&D Vice General Manager at Victory Giant Technology, revealed that the AI investment landscape among global tech companies is currently marked by an unparalleled enthusiasm, and the three main application markets, namely the smartphones, PCs, and servers, are bound to experience a welcome upswing brought by the development of AI applications. As of now, there is a constant increase in memory bandwidth, and Victory Giant has been accelerating its product R&D investments to meet the demands of high-performance computing, data centers, AI training, and inference scenarios. The fifth-generation high-performance memory (DDR5) is already in mass production, while the development of the sixth generation (DDR6) and seventh generation (DDR7) products is underway. Sam Sun, Chairman of BIWIN Storage, voiced that the evolving storage industry has brought a bright spot and prominent attention to the testing and packaging sector. This is particularly true as advanced packaging moves towards miniaturization and integration, and technical barriers are progressively becoming higher. The company is deepening its research and development efforts in the integrated packaging and testing layout to enhance its competitive edge. It is anticipated that the Integrated R&D and Packaging 2.0 Strategy will transform the company from a storage product supplier into a comprehensive partner offering wafer-level advanced packaging and testing services. This will provide industry partners with higher-quality in-depth solutions and promote a comprehensive enhancement of customer value. Rui Ding, General Manager, Product Department, Consumer Cloud Platform Business Group at iFLYTEK, declared that the development of large models has transitioned AI from a "tool" to an "assistant", capable of performing a wider range of tasks through more natural conversational forms. In the future, iFLYTEK hopes to collaborate with various industry stakeholders to promote the development of AI technology. Chloe Ma, VP of China GTM for IoT Line of Business at Arm, claimed that the wave of AI is sweeping across various sectors. Generative AI is not only being deployed in the cloud but is also rapidly making its way to the edge, where storage plays a crucial role in AI computing from the cloud to the edge. In response to the innovative demands of the new era of edge AI, Arm is committed to advancing in three major areas: hardware, software, and ecosystem development. Feng Chen, Senior Vice President of Rockchip, mentioned that an increasing number of industries and applications are integrating AI with IoT, making AIoT the optimal pathway for the intelligent transformation of traditional sectors and a key direction for the future development of the IoT. The rapid expansion of the AIoT market is creating opportunities for AIoT chips while also driving greater demands for data transmission, storage, and computing, which poses challenges for chip processing power. Rockchip continues to release new chips to support AIoT applications. Jie Chen, Co-founder and VP of Data Storage Technology at InnoGrit, highlighted that in the AI era, as well as the data age, higher challenges have been presented for storage technologies. Faster and more efficient SSD interfaces will contribute to breaking through storage limitations. The collaborative optimization between InnoGrit's memory controller chips and domestically produced flash memory will enhance the read/write performance and QOS competitiveness of storage products, jointly shaping the future of China's storage industry. Vic Huang, Vice General Manager of QUANXING Technology, noted that the computing architecture of solutions provided by QUANXING is not constrained by the size of large models, which contributes to a significant reduction in the cost of local deployment. The company is focused on a full range of high-end domestic storage products, aiming to complete the "last mile" of AI and striving to become a leader in the era of AI for everyone. Zheng Qiu, Technical Marketing Manager at Montage Technology, remarked that the rapid development of AI has generated immense demand for both computing power and storage capacity. The high-speed and stable data transfer between high-performance processors and large-capacity memory is of utmost importance. In response, "transmission chips" surfaced as a timely solution. Don Hu, Vice President of Marketing at Allwinner Technology, shared insights on the company's industrial layout, technological direction, and industry applications. Mr. Hu introduced Allwinner's exploration in areas such as general-purpose computing power, dedicated computing power, computational expansion, and multi-modal sensing. He also explained how Allwinner gives a full play to the fundamental role played by computing power to provide high-quality chips and services for industries like smart living, smart cities, and smart industries. Lei Hu, Director of Business Management at Applied Materials (AMAT), conducted an in-depth analysis of the technologies involved in high-bandwidth memory, including DRAM chips, logic controllers, and HBM stacks, as well as the additional material engineering processes. He further added that AMAT is capable of providing clients with cutting-edge packaging equipment to empower the elevation of customer value by taking advantage of its strong R&D capabilities to facilitate the advancement of high-bandwidth memory technology. Lee Chee Ping, Senior Director of LAM Research, commented that the AI chip market is flourishing with rapid growth, and the enhancement of AI chip performance requires the essential support of advanced packaging. Moreover, advanced packaging and heterogeneous integration are also the primary methods in the semiconductor industry for optimizing performance, power, form factor, and cost. Youngsuk Kim, Director of DISCO, remarked that from 2023 to 2029, the advanced packaging market is expected to grow at a compound annual growth rate of 11%, making 2.5D/3D packaging equipment increasingly important. DISCO has extensive experience in mass production and has closely collaborated with customers during the R&D phase, providing solutions for thinning and cutting HBM and 2.5D-PKG. Mr. Kim then introduced the performance and advantages of various equipment, including DFD6860HS, DGP8761HC, DGP8761, DFL7262, DFL7362, and DFD6362/6363. Focusing on Frontline Technologies to Foster a New and Autonomous Ecosystem The summit also established a dedicated forum, dubbed "Memory Industry Chain Ecosystem Forum", for enterprises across the memory industry chain to further decode memory future trends. An array of leading companies, including Skyverse, Loongson, Like Automation Equipment, Micro-Nano (HongKong), OKN Technology, Maxwell, Attach Point Intelligent Equipment, Tytantest, Maxio, Silergy and Heyan Technology, had gathered to share their insights. Discussions focused on cutting-edge trends, industry pain points, and solutions related to wafer testing, memory packaging, aging testing, product and technology innovation, terminal applications, yield improvement, and cost reduction. Song Zhang, Executive Vice President of Skyverse, observed that it has become the industry trend to identify defects by machines through AI decision-making, aimed at helping customers to locate defects more effectively and further enhance production yield and efficiency. In practical applications, it can be noted that system inspection has demonstrated better results in efficiency and accuracy than manual inspection, which aids to significantly improve production efficiency for the clients. Skyverse will remain dedicated to driving innovation in AI products to provide high-quality solutions for domestic customers in the future. Shan Jiang, General Manager of Guangdong Loongson Electronic Technology, affirmed that Loongson has gained more innovative space for the industry and market through self-reliance and independence. Autonomy has granted Loongson greater freedom, enhanced cost-effectiveness, and a more secure supply chain. Committed to becoming both a contributor and a maintainer of the international upstream community, Loongson aims to achieve independence and compatibility on the global stage at the same time, rather than decoupling or breaking the chain. Simon Ye, General Manager of Like Automation Equipment, expressed that the company's next-generation innovative technology of 2.5D/3D large-size packaging bumping is currently being validated through product development with domestic clients. Steve Pei, CEO of Micro-Nano (Hong Kong) Technology, mentioned that as a professional manufacturer of wafer thickness measurement systems, Micro-Nano now mainly provides the SemDex M1 semi-automatic system and the SemDex A fully automatic system, with over 1,000 units installed globally, placing the company at the forefront of the industry. Ming Zhao, General Manager of OKN Technology, observed that the company has initiated the R&D for PCIe GEN6 based on the GEN5 SSD testing system. With intense competition in the industry, OKN sees this as an opportunity to enhance its internal drive, strengthen its R&D capabilities, and foster product innovation, continuously providing better solutions for its customers. Kuilin Jin, Vice General Manager of Sales at Maxwell Technologies, pointed out that independent R&D is crucial. Through technological innovation, Maxwell aims to achieve the import substitution of key core components, break the foreign technology monopoly and ensure supply chain security. Xiaolong Ouyang, R&D VP at Attach Point Intelligent Equipment (APIE), shared his insights that APIE's one-stop solution has achieved AI Inside applications, supporting the packaging of mature storage chips required for AI, as well as advanced packaging solutions for AI storage chips, including HBM, 2.5D, TCB, and HB. Aaron Xu, CTO of Tytantest, highlighted that through its efforts on forward R&D, domestic manufacturing of complete machines, and validation on self-owned production lines, Tytantest strives to achieve fully automated and self-controllable processes, enabling to develop solutions that better meet customer needs. Huan Ren, Marketing Director at Maxio Technology, confirmed that the company continues to maintain a high level of investment in research and development. Its R&D expenditures have increased from 155 million yuan in 2021 to 380 million yuan in 2023, which have already been translated into several mass-produced products. Among these, the MAP1102 main control chip has exceeded 50 million units shipped. Compared to similar products on the market, Maxio's offerings demonstrate a leading advantage in I/O speed and energy efficiency, as well as a deep understanding and proactive layout in the integration of hardware and software. Leo Cao, Senior Sales Director at Silergy, said that in the storage industry chain, the company possesses several advantages, including highly efficient product integration, extensive experience collaborating with top-tier clients, a wide range of product coverage, supply chain security, and global collaborative research and development. Silergy has achieved a global layout in R&D and service, and stayed true to its mission to prioritize customer needs. Kent Wang, Business Development Manager at Heyan Technology, introduced that the company has gone through three development stages: the basic products of 6-inch dicing machines, upgraded products of 8-inch/12-inch dicing machines, and high-end products such as cutting and sorting machines and de-bonding machines. With rich technological accumulation and industrial experience, the company is capable of providing reliable and stable consistency assurance for customers, supporting customized solutions for different processes, and offering process-related technological innovations to meet advanced packaging demands. After a day of intense intellectual exchanges, the guests gathered for a grand dinner where the GMIF 2024 Annual Awards were presented. Following a rigorous selection process, many companies, including Intel, Micron, GigaDevice, Arm, UNISOC, SIXUNITED, Victory Giant, BIWIN Storage, Solidigm, Western Digital, Rockchip, Allwinner Technology, Weibu Information, Heyan Technology, OKN Technology, Attach Point Intelligent Equipment, iWISEETEC, Tytantest, Hemei Jingyi, Silicon Motion, Maxio, QUANXING, MICROFROM, Konsemi, Silergy, LKAUTO, Maxwell, Skyverse, RORZE, ExTripod Electronics, EPS, InnoGrit, POWEV, KingSpec and more, had been honored with the 2024 Annual Awards, receiving unanimous recognition from the expert judges. In summary, as a grand feast in the global storage field, the GMIF Innovation Summit has successfully held three consecutive sessions and received commendation from the industry. It has now become one of the most influential high-end summits in the domestic storage sector. In the future, the GMIF Innovation Summit will strive for deeper market service and innovative formats, creating a higher-level platform for communication and collaboration. The summit aims to explore more impactful industry events, analyze industry trends and opportunities with an international perspective, and promote mutual benefits within the industry. We look forward to seeing you again next year! About GMIF GMIF (Global Memory Innovation Forum) is the most important annual event of Shenzhen Memory Industry Association (SMIA). The forum aims to build a globally-focused, professional platform for the storage industry to collectively explore new technologies, applications, collaborations, and emerging opportunities. The Third GMIF2024 Innovation Summit is scheduled to be held on September 27, 2024 at Renaissance Shenzhen Bay Hotel. Under the theme of "AI Leads Memory's New Momentum", the summit aims to foster communication and interaction among both upstream and downstream enterprises in the storage industry. By promoting collaboration and complementary growth among industry partners, the GMIF seeks to help participating companies expand their product and brand reach and contribute to a thriving, win-win ecosystem in the global storage sector. For more information about GMIF, please visit https://www.gmif.com.cn/. Media Contact:Ms. Gu, 15064010336, wenjing.gu@gmif.com.cn
SHENZHEN, China, Sept. 19, 2024 /PRNewswire/ -- On September 27, 2024, the "Third GMIF2024 Innovation Summit (Global Memory Innovation Forum)" will be held at the Renaissance Shenzhen Bay Hotel. The event is hosted by the Semiconductor Investment Alliance and the Shenzhen Memory Industry Association, co-organized by the Guangdong Integrated Circuit Industry Association and the Shenzhen Semiconductor Industry Association, and organized by JW Insights Consulting (Xiamen) Co., Ltd. and Haitong Securities Co., Ltd. The Third GMIF2024 Innovation Summit, themed "AI Leads Memory's New Momentum" and with a keen focus on storage and memory, connects upstream and downstream enterprises in the semiconductor industry chain and academia. The summit brings together heavyweight guests from listed companies, industry leaders, experts, and investment institutions, including Peking University, Micron, Western Digital, Solidigm, UNISOC, Intel, Silicon Motion, Victory Giant, BIWIN, Arm, iFLYTEK, Rockchip, Allwinner, Montage, InnoGrit, DISCO, LAM Research, AMAT, Skyverse, Loongson, LKAUTO, QUANXING, Micro-Nano, OKN, Maiwei, Tytantest, AttachPoint, Maxio, Silergy, Heyan Technology and more. Through keynote speeches, panel discussions, and other formats, the participating enterprises will share insights on cutting-edge technologies, innovative products, and market trends in the industry. This gathering convenes key representative companies from across the industry chain, providing attendees with opportunities for in-depth discussions and exploring limitless possibilities for business collaboration. For application manufacturers, the summit serves as a frontline platform to acquire the latest technological trends and innovative solutions, empower product innovation and enhance market competitiveness. Furthermore, the summit will contribute to fostering efficient interactions between primary and secondary investment institutions and enterprises by featuring the participation of renowned listed companies and industry leaders. About GMIF GMIF (Global Memory Innovation Forum) is the most important annual event of Shenzhen Memory Industry Association (SMIA). The forum aims to build a globally-focused, professional platform for the storage industry to collectively explore new technologies, applications, collaborations, and emerging opportunities. The Third GMIF2024 Innovation Summit is scheduled to be held on September 27, 2024 at Renaissance Shenzhen Bay Hotel. Under the theme of "AI Leads Memory's New Momentum", the summit aims to foster communication and interaction among both upstream and downstream enterprises in the storage industry. By promoting collaboration and complementary growth among industry partners, the GMIF seeks to help participating companies expand their product and brand reach and contribute to a thriving, win-win ecosystem in the global storage sector. For more information about GMIF, please visit https://www.gmif.com.cn/. Seek for Cooperation:Ms. Liu, 18618416028, lin.liu@gmif.com.cn Media Contact:Ms. Gu, 15064010336, wenjing.gu@gmif.com.cn Attendee Registration:Mr. Mo, 17878125570, zengcan.mo@gmif.com.cn
A12 藝術空間
Rockchip
請先登入後才能發佈新聞。
還不是會員嗎？立即 加入台灣產經新聞網會員 ，使用免費新聞發佈服務。 （服務項目） （投稿規範）
