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符合「RISC-V」新聞搜尋結果, 共 69 篇 ,以下為 25 - 48 篇 訂閱此列表,掌握最新動態
S2C Launches Prodigy S8-100 Series: 100M Gate FPGA Prototyping for AI and HPC

SAN JOSE, Calif., Dec. 20, 2024 /PRNewswire/ -- S2C, a global leader in FPGA-based prototyping solutions, announces its Prodigy S8-100 Logic System, the latest addition to the eighth-generation family, is shipping and deployed by leading enterprises. Designed to address the growing demands of AI and HPC, the S8-100 series delivers unparalleled scalability, flexibility, and efficiency. Powered by AMD Versal™ Premium VP1902 adaptive SoC with 100M ASIC gate capacity, the S8-100 delivers 2x logic resources and 2.5x the I/O bandwidth when compared with its predecessor S7-19P. Available in Single, Dual, and Quad FPGA configurations, the S8-100 supports medium-scale to hyperscale designs with ease, making it a versatile choice for advanced chip development. Highlights: Rich Resources: The S8-100 delivers remarkable resources, featuring 18,507K system logic cells, 858Mb of internal memory, 6,864 DSP slices, dual-core Arm Cortex A72 and dual-core Arm Cortex R5 in each FPGA module. High-Speed & Flexible I/O Architecture: Equipped with 2,212 XPIOs supporting dynamic I/O voltages (1.0V–1.5V) and GTM/GTYP transceivers with PCIe Gen5 and data rates of up to 56Gbps, the S8-100 effortlessly meets a wide range of system requirements. Scaling and Partitioning Made Easy: PlayerPro-CT partitioning software supports TDM-driven, multi-strategy scheduling and placements. Fully automated flow takes RTL to bitstream with simple clicks, significantly boosting productivity. High Productivity Toolchain: Add-on tools, including PlayerPro-DT for multi-FPGA debugging, ProtoBridge for co-simulation, and an extensive library of Prototype Ready IP of pre-validated daughter cards, speed adapters, memory interface models and reference designs, accelerate deployment and shorten the development cycle. The S8-100 Logic System, with a capacity of 100M ASIC gates per FPGA, doubles the resources of its predecessor, the S7-19P, and offers a 2.5x increase in I/O bandwidth. Featuring high I/O counts and 32/56Gbps transceivers supporting protocols such as PCIe Gen5 and QSFP-DD, it combines robust performance with flexible scalability, meeting the demands of complex logic designs. In particular, advanced RISC-V cores can comfortably fit inside a single S8-100 system without the need to partition. A three to five times boost in performance can be expected. For hyperscale AI and HPC designs, the S8-100 reduces partitioning complexity, simplifies topology, and facilitates seamless optimization. To accelerate deployment, S2C offers a library of ready-to-use daughter cards, memory adapters, speed adapters, and reference designs. These tools streamline the setup of validation environments and simplify system integration. Frequently adopted options include high-speed PCIe Gen5, 400G Ethernet, and LPDDR/DDR5, and common SoC interfaces such as QSPI, MIPI D-PHY, and JTAG/debug, matching the needs across diverse applications. Combining the S8-100 with fully automated timing-driven partitioning software enables one-click flow from RTL to bitstream, simplifying the steps of large design partitioning. S2C's robust toolchain, including real-time control (Player Pro-RunTime), multi-debugging (Player Pro-DebugTime) and co-simulation (ProtoBridge), significantly boosts productivity, making it an essential tool for complex chip design. "The era of AI has begun, and chip design is getting ever more difficult to keep up." said Ying J Chen, VP of marketing. "Prodigy S8-100 with expanded capacity and superior performance is here to provide a robust verification solution for innovation in AI and HPC. Availability The Prodigy S8-100 Series (Single/Dual/Quad) is shipping now. For more information, please contact your local S2C representative or visit www.s2cinc.com. About S2C S2C is a leading global supplier of FPGA prototyping solutions for today's innovative SoC and ASIC designs, now with the second largest share of the global prototyping market. S2C has been successfully delivering rapid SoC prototyping solutions since 2003. With over 600 customers, including 11 of the world's top 25 semiconductor companies, our world-class engineering team and customer-centric sales team are experts at addressing our customers' SoC and ASIC verification needs. S2C has offices and sales representatives in San Jose, Seoul, Tokyo, Shanghai, Hsinchu, India, Europe and ANZ.

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 303 加入收藏 :
Smartkem Signs Multi-Year Agreement with FlexiIC to Develop a New Generation of CMOS for Smart Sensors

New project builds on ongoing collaboration to develop custom circuits using Smartkem's organic transistor technology MANCHESTER, England, Dec. 5, 2024 /PRNewswire/ -- Smartkem (NASDAQ: SMTK), which is seeking to change the world of electronics using its disruptive organic thin-film transistors (OTFTs), has signed a multi-year agreement with FlexiIC, a company providing innovation in the design of flexible integrated circuits and systems, to begin a new project to develop a new generation of CMOS for smart sensors. The goal of the two-year project is the development of custom circuitry using Smartkem's organic thin-film transistor (OTFT) technology and n-type oxide TFT to make low-power CMOS enabled sensor devices. The devices are expected to incorporate mixed signal and digital IPs, such as RISC-V cores (a circuit type which uses an open-source instruction set), as well as utilizing machine learning (ML), a type of artificial intelligence (AI) that allows machines to learn and improve from data without being explicitly programmed, to improve processing of signals. Smartkem Chairman and Chief Executive Officer, Ian Jenks commented, "This project with FlexiIC furthers Smartkem's technology for potential use in the field of large area, low power consumption electronics suitable for the internet-of-things (IOT), a market which is expected to grow to approximately $4,062.34 billion by 2032, a CAGR or 24.3% from 2024[1]. The use of CMOS architecture in this application is significant as it consumes much less power, has better noise margins, generates less heat and has enhanced scalability compared to alternative PMOS architectures. We are excited to be involved in this ambitious project and, if successful, we believe that this project will demonstrate the utility of Smartkem's technology in next generation biosensors, force sensors, optical sensors, chemical sensors, item level tracking, and other new areas of flexible electronics." FlexiIC co-CEO Dr Eloi Ramon stated "Our innovative sensor acquisition platform offers affordability, adaptability, and eco-friendliness, empowering diverse sensor applications with robust amplification and transmission capabilities to mitigate noise interferences effectively. The partnership in this project with Smartkem to provide custom circuits in foil with low power and a rapid turnaround from design through fabrication is vital to the success of system in foil devices".  The project commencement is subject to receipt of the approval of grant funding by the Centro para el Desarrollo Tecnológico Industrial (CDTI), a Spanish public entity under the Ministry of Economy and Competitiveness. About SmartkemSmartkem is seeking to reshape the world of electronics with its disruptive organic thin-film transistors (OTFTs) that have the potential to revolutionize the display industry.  Smartkem's patented TRUFLEX® liquid semiconductor polymers can be used to make a new type of transistor that can be used in a number of display technologies, including next generation microLED displays. Smartkem's organic inks enable low temperature printing processes that are compatible with existing manufacturing infrastructure to deliver low-cost displays that outperform existing technology. Smartkem develops its materials at its research and development facility in Manchester, UK and provides prototyping services at the Centre for Process Innovation (CPI) at Sedgefield, UK. It has a field application office in Taiwan. The company has an extensive IP portfolio including 125 granted patents across 19 patent families and 40 codified trade secrets. For more information, visit: www.Smartkem.com and follow us on LinkedIn http://www.linkedin.com/company/Smartkem-limited. About FlexiICFounded by organic electronics researchers and chip designers from the Institute of Microelectronics of Barcelona (IMB-CNM-CSIC), FlexiiC provides innovation in the design of system-on-chip (SoC) solutions for Edge Computing applied to Smart Systems and IoT. FlexiiC innovates in the development of disposable electronics for Life Sensing by creating and integrating flexible, organic integrated circuits and sensors using sustainable, functional materials. By incorporating advanced computing capabilities, FlexiiC aims to deliver smart, short-lifespan monitoring systems designed for applications in medical & healthcare, packaging, and environmental applications. For more information, visit: https://flexiic.tech/  Forward-Looking StatementsAll statements in this press release that are not historical are forward-looking statements, including, among other things, its market position and market opportunity, expectations and plans as to its product development, manufacturing and sales, and relations with its partners and investors. These statements are not historical facts but rather are based on Smartkem Inc.'s current expectations, estimates, and projections regarding its business, operations and other similar or related factors. Words such as "may," "will," "could," "would," "should," "anticipate," "predict," "potential," "continue," "expect," "intend," "plan," "project," "believe," "estimate," and other similar or elated expressions are used to identify these forward-looking statements, although not all forward-looking statements contain these words. You should not place undue reliance on forward-looking statements because they involve known and unknown risks, uncertainties, and assumptions that are difficult or impossible to predict and, in some cases, beyond the Company's control. Actual results may differ materially from those in the forward-looking statements as a result of a number of factors, including those described in the Company's filings with the Securities and Exchange Commission. The Company undertakes no obligation to revise or update information in this release to reflect events or circumstances in the future, even if new information becomes available. 1 https://www.fortunebusinessinsights.com/industry-reports/internet-of-things-iot-market-100307

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 120 加入收藏 :
Microchip推出支援後量子安全的高效能64位元PIC64HX微處理器

未來五年,全球邊緣計算市場預計將增長30%以上,服務於航太、國防、軍事、工業和醫療領域關鍵任務應用。爲了滿足混合關鍵性系統對可靠嵌入式解決方案日益增長的需求,Microchip Technology Inc.今日宣佈推出PIC64HX系列微處理器(MPU)。與傳統MPU不同,PIC64HX 專爲滿足智慧邊緣應用的獨特需求而設計。   作爲Microchip 64位元產品組合中的最新產品,PIC64HX是一款高效能、多核心64位元RISC-V® MPU,具有先進的人工智慧和機器學習(AI/ML)處理功能、整合的時敏網路(TSN)以太網連接功能以及後量子支援的防禦級安全性。 PIC64HX MPU可提供全面的容錯、彈性、可擴展性和能效。   Microchip通訊業務副總裁Maher Fahmi表示:「PIC64HX MPU是一款具有開創性的產品, 以單個解決方案提供數個先進功能。將TSN以太網交換整合到MPU中,有助於開發人員將基於標準的網路連接和計算相結合,進而簡化系統設計、降低系統成本並加快產品上市時間。」   整合式以太網交換器包含TSN功能集,支援重要的新興標準: 用於航太以太網通訊的IEEE P802.1DP TSN、用於汽車車載以太網通訊的IEEE P802.1DG TSN Profile 以及用於工業自動化的IEEE/IEC 60802 TSN Profile。   八個64位元RISC-V CPU核心(SiFive Intelligence™ X280)具有向量擴展功能,有助於實現混合關鍵性系統的高效能計算、虛擬化和向量處理,進而加速人工智慧工作負載。PIC64HX MPU 允許系統開發人員以多種方式部署核心,實現SMP、AMP 或雙核心同步操作。它還提供WorldGuard 硬體架構支援,以實現基於硬體的隔離和分區。   「下一代飛機需要新一代處理器來實現飛行控制、駕駛艙顯示、機艙網路和引擎控制等關鍵任務應用。OHPERA 聯盟將 RISC-V 技術視為未來安全和永續飛機的重要組成元素。」OHPERA技術主管Christophe Vlacich表示。OHPERA 聯盟由領先的航空航太公司組成,目標是共同評估新技術以應用於下一代飛機。「我們很高興看到像Microchip的PIC64HX MPU這樣具備計算效能、分區、連接性和安全性等特性的商業產品即將面世,這些特性將塑造航空業的未來。」   量子計算機的預期出現將使當前的安全措施失效,進而對人類的生存構成威脅。因此,全球政府機構和企業開始呼籲在任何關鍵基礎設施中採用後量子加密技術。爲了滿足當前和未來的安全需求,PIC64HX是市場上首批支援全面防禦級安全的 MPU之一,包括最近透過NIST標準化的FIPS 203 (ML-KEM)和 FIPS 204(ML-DSA)後量子加密演算法。   PIC64HX MPU 是一款功能強大的多功能解決方案,適用於智慧邊緣應用,可滿足低延遲、安全性、可靠性和符合行業標準等關鍵要求。   開發工具 PIC64HX MPU由一整套工具、庫、驅動程式和啓動韌體提供支援。它支援多種開源、商業和即時操作系統,包括Linux®和 RTEMS,以及Xen等虛擬機管理程式。PIC64HX MPU利用 Microchip廣泛的Mi-V工具生態系統和設計資源來支援RISC-V 應用。爲幫助縮短開發週期和加快產品上市時間,Microchip 提供Curiosity Ultra+ PIC64HX 評估工具套件,並與單板計算機合作伙伴開展合作。   Aries Embedded執行長Andreas Widder表示:「Aries Embedded長期以來一直是RISC-V生態系統的支援者。我們很榮幸能成爲PIC64HX的主要系統級模組合作伙伴,並期待着幫助Microchip實現關鍵任務智慧邊緣應用。」   供貨 Microchip先期合作伙伴將於2025年獲得PIC64HX MPU樣品。如需瞭解更多訊息,請聯繫Microchip業務代表。

文章來源 : APR 發表時間 : 瀏覽次數 : 2128 加入收藏 :
MICROIP and Vietnam's Ho Chi Minh City University of Foreign Languages and Information Technology Sign MOU to Promote Semiconductor and Artificial Intelligence Development

TAIPEI, Oct. 9, 2024 /PRNewswire/ -- MICROIP and Vietnam's Ho Chi Minh City University of Foreign Languages and Information Technology (HUFLIT) have officially signed a Memorandum of Understanding (MOU) to embark on extensive cooperation in the fields of Integrated Circuit (IC) Design and Artificial Intelligence (AI). The MOU was signed by Dr. James Yang, Chairman of MICROIP, and Dr. Nguyen Anh Tuan, President of HUFLIT, establishing a close partnership in the internationalization of high-tech education and innovation. Dr. James Yang, Chairman of MICROIP (right), and Dr. Nguyen Anh Tuan, President of Ho Chi Minh City University of Foreign Languages and Information Technology (HUFLIT) (left), signed a Memorandum of Understanding As part of this collaboration, HUFLIT has purchased over USD 1 million worth of IC design intellectual property and semiconductor-related hardware and software from MICROIP. The purchase includes FPGA development boards from the Trion and Titanium series, Memory Controllers IP, DDR, HyperRAM, SDRAM, RISC-V SoC IP, MIPI DSI/CSI Tx/Rx controller IP, Ethernet IP, and Efinix Efinity IDE software. These resources will be used in the university's semiconductor-related educational courses to help Vietnam cultivate more internationally competitive semiconductor professionals. According to the MOU, MICROIP will assist HUFLIT in jointly developing multiple key semiconductor areas, including artificial intelligence, integrated circuit design, talent cultivation, establishment of research and development centers, software development, and course certification programs. This will significantly enhance the university's capabilities in technological innovation and professional technical education and promote long-term development in technical exchange and cooperation between both parties. Dr. James Yang stated, "MICROIP is very honored to collaborate with HUFLIT to jointly promote international talent cultivation and technological innovation in the semiconductor and AI fields. MICROIP will fully leverage its professional expertise in IC design and AI to make substantial contributions to Vietnam's high-tech education and industry development, and this is also a key aspect of our global market deployment." The alliance between MICROIP and HUFLIT is one of the first instances in Vietnam's educational history where a Vietnamese university and a Taiwanese semiconductor company have engaged in industry-academia collaboration. Both parties also plan to promote this collaboration model to more universities in Vietnam, expanding the influence of Vietnam's higher education system in the semiconductor and AI fields, and deepening joint collaboration between Taiwan and Vietnam in the semiconductor industry. President Dr. Nguyen Anh Tuan pointed out, "This cooperation with MICROIP holds great significance for Vietnam's higher education. Through this agreement, we look forward to significantly enhancing the level of semiconductor research and teaching at our university, establishing a solid foundation for Vietnam's rapidly developing semiconductor industry, and cultivating more globally competitive technological talents." This cooperation not only strengthens the exchange between both parties in the semiconductor and artificial intelligence fields but also injects new vitality into Vietnam's higher education and high-tech industries. About MICROIPFounded in Taiwan, MICROIP specializes in IC design services, AI design services, and IP licensing platforms. The company is dedicated to helping clients develop customized chips, significantly shortening development time and reducing costs. Its IP licensing platform allows various businesses to purchase and use idle IP, accelerating the design process and increasing the value of IP. For more information, please visit MICROIP's official website: www.micro-ip.com

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 915 加入收藏 :
打破邊界,探索可能— RICO-MX8P 助力智慧城市與數位媒體

【臺北訊】專業物聯網及人工智慧邊緣運算平臺研發製造大廠—研揚科技(股票代碼: 6579),最近宣布推出全新 RICO-MX8P,這是一款基於 Pico-ITX Plus 尺寸規格的無風扇單板電腦,搭載 NXP i.MX 8M Plus 處理器。RICO-MX8P 採用 i.MX 8M Plus 平台,結合了四核心 Arm® Cortex®-A53 處理器、Arm® Cortex® M7 核心,以及可選的神經處理單元(NPU),提供高達 2.3 TOPS 的推理性能。   RICO-MX8P 配備了整合型 Vivante GC7000 UltraLite 3D GPU、專用 VPU、MIPI DSI 接口及 HDMI 2.0 埠,充分展現研揚科技將此產品定位於多媒體應用領域的決心,特別適合用於數位看板、智慧櫃檯與互動式戶外廣告(DOOH)等多元場景。該板卡還支援 OpenGL ES 3.1、Vulkan 和 OpenCL 1.2 等 API,並具備多格式編碼與解碼功能,大幅提升其應用潛力。   然而,RICO-MX8P 不僅限於多媒體應用,它還是一款功能多樣的單板電腦,憑藉強大的處理器平台與豐富的接口配置,能夠支援低延遲、入門級工業 AI 應用。該板卡提供多種外部設備連接選項,包括 GbE LAN、兩個 USB 3.2 Gen 1 連接埠(Type-C OTG 和 Type-A)以及 HDMI 2.0 連接埠。   在內部接口方面,RICO-MX8P 配備 RS-232/422/485 針腳、UART、GPIO 和 40-pin FPC 接頭,具有足夠的靈活性來支援多種工業通信協議,非常適合用於 PLC 和遠程監控等工業控制系統,尤其考慮到其可承受 -20°C 至 70°C 的工作溫度範圍、輕量化設計與小型化外形。   RICO-MX8P 還提供多種擴充選項,包括支援 Wi-Fi 和藍牙的 M.2 2230 E-Key 插槽,以及具備 4G/LTE 連接功能的全尺寸 mPCIe 插槽,並配有 Micro SD 和 Nano SIM 卡槽(Push-Push 類型),以滿足行動網路連接與額外儲存需求。   如需了解更多 RICO-MX8P 的詳細規格與資訊,請上研揚官網的產品頁面。或是您可以在eShop官網直接下單,或聯繫研揚科技國內業務處劉小姐(02-89191234 分機 1142)洽詢。   關於研揚科技 研揚科技集團(研揚)是台灣專業物聯智能解決方案研發製造大廠,成立於1992年。研發製造並行銷全球IoT及AI邊緣運算解決方案,另有嵌入式電腦主板及系統、工業液晶顯示器、強固型平板電腦、工控機、網路安全設備以及相關配件等,提供OEM/ODM客戶及系統整合商完整且專業之軟硬體解決方案。同時,研揚科技有專屬團隊提供客製化服務,協助您從研發初期發想到產品製作、量產到售後服務,提供一貫之專業諮詢與服務,為您量身打造高品質產品。研揚科技目前提供多款AI邊緣運算產品及智慧城市、智慧零售及智慧製造等系統整合和解決方案。研揚是英特爾鈦金級會員,同時也是NVIDIA的菁英級夥伴(Elite partner)。欲瞭解更多詳細資訊請參考研揚科技官方網站。

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elexcon2024深圳國際電子展將盛大開幕!展現全棧技術與產品,引領產業創新浪潮

深圳, 中國 - Media OutReach Newswire - 2024年8月24日 - 博聞創意會展主辦的elexcon2024深圳國際電子展將於2024年8月27日至29日在深圳會展中心(福田)盛大開幕。此次展會將匯集全球電子技術精英,全麵展示最新的全棧技術與產品,旨在推動電子產業的復蘇並迎接人工智能時代的挑戰與機遇。 作為電子行業的年度重要事件,elexcon2024深圳國際電子展將為與會者呈現一系列行業前沿技術和創新應用。展覽涵蓋AI芯片、嵌入式處理器、智能傳感、新能源汽車電子等多個熱門領域,超過400家知名展商將現場展示嵌入式AI、存儲技術、汽車芯片元件等尖端技術。 展會現場,AI芯片、嵌入式處理器/MCU/MPU、存儲、智能傳感、RISC-V技術與生態、AIoT方案、無源器件/分立器件、PMIC與功率器件、Chiplet和SiP先進封裝等技術和近千款產品悉數亮相,將吸引眾多參觀者的目光,成為科技愛好者的盛宴。來自Kaifa Gala專區的ARM、NXP、英飛凌、瑞薩、富士通、兆易創新、順絡、中電港、Digikey、矽力杰、江波龍、西安紫光國芯、海康存儲、華潤微封測事業部、華大電子、太陽誘電、德明利、珠海半導體、國芯、敏矽微、威剛、靈動微電子、東芯半導體、朗科、三疊紀、易靈思、立功科技、富瀚微、Mouser、車用芯片/元件專區、中國IC獨角獸傳感器專區、SiC/GaN產業鏈專區等眾多優質廠商匯聚一堂。 除了技術和產品的展示,elexcon2024還特別注重新應用和新生態的推廣。展會上,AI硬件、電動汽車與新能源、AI PC與數據中心、邊緣智能、工業電機控制、智慧醫療等前沿領域的最新成果將一一呈現,為參觀者帶來一場科技盛宴。 此次展會不僅為電子產業的復蘇注入了新的活力,也為AI時代的到來以及雙碳領域創造了充分的交流平台。展會期間,將同期舉辦20多場專業論壇會議,涵蓋了AI PC、智能傳感器、新能源汽車電子、化合物半導體、數字電源、FPGA生態、工業AI數智化、電子元器件供應鏈發展趨勢、系統級封裝SiP等多個主題。來自全球的電子產業精英齊聚一堂,共同探討電子產業的發展趨勢和挑戰,分享最新的技術成果和應用經驗。 論壇期間,200多位行業專家和企業高管將進行精彩的演講和討論,包括Arm物聯網事業部業務拓展副總裁Chloe Ma、英飛凌科技副總裁劉偉等眾多行業內的專家和企業高管將進行演講和精彩的討論。這些會議和論壇將探索電子行業的最新技術趨勢、市場發展以及行業面臨的挑戰和機遇,為參與者提供了一個交流和學習的平台。 展會期間,備受期待的"Kaifa Gala工程師/開發者嘉年華"也將如期舉行,在展會現場為大家帶來爆款產品拆解,以及10多個社群的大型面基現場和領取開發板的豐富活動。 此次嘉年華還將邀請21IC電子網、野火電子、正點原子、嵌入式Linux等知名開發者社群的參與,並得到了英飛凌、瑞薩電子、富士通、兆易、全志、瑞芯微等電子行業領軍企業的支持。他們將帶來最新、最熱門的開發板,與工程師和開發者們共同搭建一個酷炫的賽博專區,展現前沿科技的無限魅力。 值得一提的是,此次嘉年華還將特別邀請了硬件開發者社群共同主辦年度爆品的現場拆解、BOM分析活動。這一環節將引爆了AI+未來技術與生態的熱烈討論,讓現場觀眾更加深入地了解最新科技產品的內部構造和技術原理。 "Kaifa Gala工程師/開發者嘉年華"的再度升級,不僅為工程師和開發者們提供了一個交流、學習的平台,也為電子行業的發展注入了新的活力。 由博聞創意會展主辦的elexcon2024深圳國際電子展的盛大開幕,充分展現了電子行業跨越周期的強勁韌性與活力。在此次展會上,他們將見證諸多創新技術與產品的湧現,深刻感受到了業界同仁為共同推動電子產業繁榮發展所作的不懈努力。他們堅信,在產業的攜手共進下,電子產業的未來前景可期。參展請聯繫0755-88311535;關於展會更多詳情請登錄官方網站www.elexcon.com。 Hashtag: #elexcon2024發佈者對本公告的內容承擔全部責任

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2025 年 2 月 13 日 (星期四) 農曆正月十六日
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