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ACE Group develops smart hospital upload systems and third-generation semiconductor material testing solutions based on 20 years of wireless communication, IoT, software, and hardware integration experience. National Yang-Ming Chiao Tung University (NYCU) and Linköping University (LiU) visit the enterprise to see digital healthcare, Terahertz (THz), and semiconductor performance. Industry-Academy Platform to Build Compound Semiconductor Advanced Materials Cooperation NYCU conducts a crucial project on the compound semiconductor. It applies advanced materials such as silicon carbide (SiC), gallium nitride (GaN) and gallium oxide (Ga2O3) to Power IC and RF. The project can build up advanced materials, software services, and platform design. Moreover, this can reach industry-academy partnerships. The Thin Film Physics Division of LiU conducts application-inspired basic research on thin films to fundamentally understand the atomistic nature of materials' properties and behavior and learn how to make materials perform better through new methods of synthesis and processing. The research concerns the design of new multifunctional materials for rigid and wear-resistant coatings, energy materials, magnetic materials, electronics, neutron-converting materials for the European spallation Source (ESS), wide-band gap semiconductors, and more. Prof. of NYCU, Horng, Ray-Hua recognizes that" ACE Group differentiates from other material testing companies. We look forward to cooperating with THz technology on non-destructive detection and failure analysis of materials; on the other hand, the Uniiform digital handwriting system can contribute to education." The Professors from LiU also indicates that the THz technology is awe-inspiring and suggests that the possibilities with polarized waves, used for instance in THz-ellipsometry, may further improve and expand the technology. The visitors also commented that the Uniiform digital handwriting system could be a great tool in education. ACE Group Competitive Advantages: Wireless Communication, Smart Hospital, and Semiconductor Integration Testing ACE Group specializes in RF electronic components, measuring instruments, communication system tests, and integration. Since 2014, the company has been committed to digital medicare and precision medical treatment of early diagnosis technology and devices. Combined with AI, it invents the Uniiform digital handwriting system and Data Stream (DS) for Anesthesiology (Spark), Ophthalmology (Eagle Park 100), and Dentistry medical form digital recording system particularly. ACE uses THz technology (TZ-6000) for wafer testing in the semiconductor testing field. Nowadays, ACE establishes partnerships with Teradyne to promote Eagle Test System (ETS). For the third-generation semiconductor, ETS can fulfill the high voltage and high current test solutions in automotive semiconductor production test requirements. ACE Group invites Dr. Philip F. Taday, the scientist of Teraview, to join the panel discussion at this event. Electro-Optical Terahertz Pulse Reflectometry (EOTPR) is an innovative time domain reflectometry (TDR) system that Intel and TeraView have successfully developed. It uses the isolation technique that is the first place in the world to detect package failures and monitor the quality of integrated circuits. It’s the first choice for non-destructive defect detection of integrated circuit packaging. Interdisciplinary skills swapping creates the novel industry application and research of advanced semiconductor materials.
ACE Group develops smart hospital upload systems and third-generation semiconductor material testing solutions based on 20 years of wireless communication, IoT, software, and hardware integration experience. National Yang-Ming Chiao Tung University (NYCU) and Linköping University (LiU) visit the enterprise to see digital healthcare, Terahertz (THz), and semiconductor performance. Industry-Academy Platform to Build Compound Semiconductor Advanced Materials Cooperation NYCU conducts a crucial project on the compound semiconductor. It applies advanced materials such as silicon carbide (SiC) and gallium nitride (GaN) to Power IC and RF. The project can build up advanced materials, software services, and platform design. Moreover, this can reach industry-academy partnerships. The Semiconductor Materials Division of LiU develops and investigates materials for novel electronics, especially on wide bandgap semiconductors, semiconductor device materials, and the sublimation materials unit. LiU focuses on silicon carbide, III-nitrides, and graphene for fundamental and application-motivated issues of interest for Swedish and European industries. ACE Group Competitive Advantages: Wireless Communication, Smart Hospital, and Semiconductor Integration Testing ACE Group specializes in RF electronic components, measuring instruments, communication system tests, and integration. Since 2014, the company has been committed to digital medicare and precision medical treatment of early diagnosis technology and devices. Combined with AI, it invents the Uniiform digital handwriting system and Data Stream (DS) for Anesthesiology (Spark), Ophthalmology (Eagle Park 100), and Dentistry medical form digital recording system particularly. ACE uses THz technology (TZ-6000) for wafer testing in the semiconductor testing field. Nowadays, ACE establishes partnerships with Teradyne to promote Eagle Test System (ETS). For the third-generation semiconductor, ETS can fulfill the high voltage and high current test solutions in automotive semiconductor production test requirements. ACE Group invites Dr. Philip F., the scientist of Teraview, to join the panel discussion at this event. Electro-Optical Terahertz Pulse Reflectometry (EOTPR) is an innovative time domain reflectometry (TDR) system that Intel and TeraView have successfully developed. It uses the isolation technique that is the first place in the world to detect package failures and monitor the quality of integrated circuits. It’s the first choice for non-destructive defect detection of integrated circuit packaging. Interdisciplinary skills swapping creates the novel industry application and research of advanced semiconductor materials.
Unleashing Performance, Speed, and Durability in a Dynamic Auto Racing-themed Showcase TAIPEI , June 4, 2024 /PRNewswire/ -- Kingston Technology, a world leader in memory products and technology solutions, returns to COMPUTEX 2024 with its race-themed "Kingston: Racing Beyond Limits" showroom. Capturing the adrenaline of auto racing, where cutting-edge vehicles and skilled drivers converge, Kingston transforms its product lines into elite racers, incorporating elements from the race field, such as a racetrack and pit stop, to create a spectacle of performance, speed, and durability. Kingston debuts a diverse range of technology solutions, including the limited-edition Kingston FURY Renegade DDR5 memory, new CAMM2 memory standard, and additional storage solutions. Alongside, an AI PC showcase featuring Kingston's solutions that empower autonomous race cars, reinstating its legacy of compelling innovation. "The transformative impact of AI and its versatile applications, extending from machine learning, cloud and edge computing to generative AI, has entirely changed the industry's landscape and prompted a shared aspiration to unlock its full potential." Said Kevin Wu, Sales/Marketing and Business Development Vice President of APAC region, "At COMPUTEX 2024, Kingston is proud to unveil a range of new high-performance memory and SSD products, with a race-themed showcase that underscore how Kingston products meet the escalating demands for high capacity, high performance solutions, Kingston remains dedicated to delivering best-in-class solutions, continuing to push boundaries as we 'race beyond limits'." Kingston: Racing Beyond Limits Showroom Highlights The "Kingston: Racing Beyond Limits" showroom integrates Kingston's three key product strengths—performance, speed and durability—into an auto racing-inspired space, featuring never-before-seen products in action. Kingston Champions: Kingston transforms its 6 product lines into a team of elite drivers using AI. Spanning gaming, content creation, enterprise, encrypted storage and more, each driver showcases distinctive strengths and Kingston's diverse capabilities. Kingston Champions Lineup Lightning FURY FURY is the powerful, confident driver who demolishes limitations, embodying Kingston's extreme performance DRAM and SSDs for gamers, offering horsepower to break records with overclocking speeds and aggressive designs. At COMPUTEX 2024, Kingston unveils the Kingston FURY Renegade DDR5 RGB Limited Edition— a DDR5 kit with blistering speeds and race car-inspired heat spreaders, displayed on a customized race-car shaped display model. Swift XS Characterizing the agility of a professional driver, Kingston's pocket-sized external SSDs provide extremely compact storage solutions with swift speeds. A new red option for the XS1000 External SSD is introduced, allowing creators to store data with a racing aesthetic, ensuring their prized files are safely stashed and ready for the road. Creative Canvas Canvas represents the spirit of Kingston's high performance Canvas SD and microSD memory cards, offering high speeds and massive capacities that allow creativity to flow. As a powerful combination of speed and storage, this lineup provides storage upgrades for creators to capture thrilling actions and preserve epic moments, bringing their visions to life. Guardian IronKey IronKey is the robust, seasoned driver prioritizing security and protection. As the hard defense that ensures data stays safe with reliability, IronKey's hardware-encryption storage options are certified to the highest standards. Its various security settings enable users to stay in control, whether enterprise or small business, safeguarding data against all threats. Versatile DataTraveler The all-terrain driver, DataTraveler, personifies Kingston's flexible USB drive lineup, adapting to any condition. With various capacities and form factors, these convenient USB drives offer reliable mobile storage for transferring files and media anywhere. Steadfast Enterprise Enterprise, the steadfast and reliable driver, epitomizes Kingston's enterprise-grade DRAM and SSDs, upon which data centers depend. With server-tested resilience and robust data integrity, Enterprise ensures seamless performance for data bases and infrastructures. FURY Fast Lane: Representing a racetrack experience in the field, the FURY Fast Lane unleashes turbocharged speed of the Kingston FURY range. The Kingston FURY Renegade DDR5 RGB Limited Edition and Renegade SSD power the Cooler Master Dyn X Racing Simulator, providing an immersive sensation of ultimate speed, matching the feeling of racing on a track. Just as race cars are fine-tuned to achieve peak performance, the Kingston FURY Impact DDR5 CAMM2 (Compression Attached Memory Module) debuts with a new memory module standard, offering a more compact size, lower power consumption, and increased capacity and speed. Targeting gaming laptops and mobile workstations, the new standard elevates computing experiences for users. Empowering AI: The "Pit Stop" is where racing cars undergo servicing and leverage gathered data to enhance their performance; drawing inspiration from this concept, Kingston sets up the "Built to Last" zone to demonstrate its AI applications. Kingston invites the NYCU Vulpes Racing Team to exhibit their autonomous race car, designed and built by the team. The car utilizes an AI PC equipped with Kingston, AMD and ASUS' solutions. Inside the AI PC, the Kingston FURY Renegade DDR5 memory and the unreleased PCIe 4.0 NVMe SSD, codenamed Kenting Bay, fuel all stages of the race car's development: from initial testing in simulated environments, processing and visualizing large data volumes, to making instant tuning adjustments and achieving optimal performance on the field. In addition, Kingston Server Premier DDR5 RDIMM server memory and DC600M Enterprise SSD, with high efficiency and low latency features tailored for data centers, meet the demands for storage capacity and performance from AI processing. As AI persists as a key player in the development of various industries, Kingston memory and storage solutions continue to empower and accelerate the implementation of AI-driven technologies. With every step into the future, Kingston is with you. Kingston can be found on: Facebook: https://www.facebook.com/KingstonAPAC YouTube: http://www.youtube.com/user/KingstonAPAC About Kingston Technology From big data, to laptops and PCs, to IoT-based devices like smart and wearable technology, to design-in and contract manufacturing, Kingston helps deliver the solutions used to live, work and play. The world's largest PC makers and cloud-hosting companies depend on Kingston for their manufacturing needs, and our passion fuels the technology the world uses every day. We strive beyond our products to see the bigger picture, to meet the needs of our customers and offer solutions that make a difference. To learn more about how Kingston Is With You, visit Kingston.com. Kingston and the Kingston logo are registered trademarks of Kingston Technology Corporation. IronKey is a registered trademark of Kingston Digital, Inc. Kingston FURY and the Kingston FURY logo are trademarks of Kingston Technology Corporation. All rights reserved. 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Edge Evolution – Shaping the Future of Embedded and Emerging Business TAIPEI, Dec. 8, 2023 /PRNewswire/ -- A global leader in embedded markets, hosted the Embedded-IoT World Partner Conference from Nov 30 to Dec 2 at Advantech's AIoT Co-Creation Campus. The conference gathered over 500 attendees from more than 40 countries and revolved around the key theme: Edge Evolution – Shaping the Future of Embedded and Emerging Business. The conference covered a wide range of topics, featuring over 80 solution showcases launched simultaneously. Additionally, 56+ guest speakers were invited to deliver lectures during the event, offering diverse insights into the AIoT industry. Miller Chang, President of Advantech's Embedded-IoT Group, emphasized that Advantech's commitment to product innovation spans 40 years. Recently, we have adopted a "Sector-Driven" approach, tightly aligning product innovation with industry-specific needs, and integrating 5G, AI, and cloud technologies into this approach. Through collaboration with global sales channels and distribution partners, Advantech aims to enter emerging domains such as EV infrastructure, robotics, and AMR. Additionally, to meet industry-specific needs and support the value-add business model, Advantech has announced a series of new generation edge computing and AI platform integrated with Edge AI SDK, EdgeSync 360, DeviceOn, and IoT security software, partnering with global strategic leaders including Intel, AMD, NVIDIA, Arm, NXP, Qualcomm, and Microsoft…etc. Advantech aimed to collectively seize the latest AIoT opportunities. Register to Watch Vision Keynote: https://connect.advantech.com/live/eiot01 Keynote Highlights AIoT and Edge Computing Vision Keynote: Advantech: Next-Stage Core Strategy: AIoT & Edge Computing NVIDIA: Generative AI and Accelerated Edge computing Qualcomm: Future of IoT at the Edge Intel: Democratizing AI—Empowering AIPC for Every Workload Microsoft: The AI-era of Industrial Transformation Forum Highlights Edge Computing & AI Solutions Edge AI Solutions (Intel, Hailo) High Performance Edge Computing (AMD, NVIDIA, Phison) Next-Gen Edge Software Solutions (Microsoft, Intel, Trellix, Canonical, Bureau Veritas) Industrial Intelligence Solutions (Qualcomm, FPC, Nordic, E Ink) Embedded Design-in and Emerging Markets The Evolution of Design-In Services (Nuvoton, NYCU) Robot & AMR (DEKA, FixPosition, Movella, Twinny) EV Infrastructure (CharIN, SK Signet, ACTAIN, Magnetec Group) Mission Critical (KLC Group LLC, ACME Portable Corp, Panasonic System Design, GLEAP) Partner Innovation Lounges (19 x Open Topics of Solution Highlights from NXP, Qualcomm, MediaTek, Arm, Canonical, Hailo, Axelera AI, Intel, AMD, Cyberlink, Avdor Helet, Cyient, Neubility, Cogniteam, e-con System, Innodisk, D3, Microprogram, DEKA) CONTACT: Crystal.Hsu@advantech.com.tw
NEW ORLEANS, Oct. 18, 2023 /PRNewswire/ -- Techman Robot, in collaboration with the Intelligent System Control Integration Laboratory (ISCI Lab) from NYCU unveiled a groundbreaking demonstration at ROSCon 2023, held from October 18th to 20th in New Orleans, Louisiana. Techman Robot Showcases Innovative MR-Based Robot Task Assignment and Programming The highlight of the demonstration was the MR-based Robot Task Assignment and Programming system, which showcased the potential of Mixed Reality (MR) technology in the realm of robotics. Introducing the cutting-edge robotics solution. It features Gesture Recognition, which uses MR glasses to track and interpret hand movements for virtual path planning. Users can intuitively plan robot movements with Gesture-based path planning. Task simulation enables users to test tasks virtually before execution. Once the path is set, it's sent to the TM AI Cobot's controller for precise execution. This innovation is set to transform robotics and automation. This application revolutionizes cobot programming. Its accessibility and user-friendliness open doors for non-professionals to deploy cobot in real work settings. Another highlight is TM AI Cobot equipped with built-in vision system and AI technology. This powerful combination enables the cobot to perform tasks with exceptional precision and efficiency. By integrating MR technology, it enhances human-robot interaction, boosting efficiency across industries. In recent years, the ROS system has been widely adopted in the academic field. Techman Robot's training center not only offers the ROS Driver but also provides comprehensive teaching resources and technical support for users. Moreover, Techman Robot's market-leading built-in vision function now seamlessly supports direct image data acquisition within the ROS2 system. This eliminates the need for users to grapple with the complexities of integrating vision capabilities independently, allowing them to focus more on advancing their research projects.
洞悉化合物半導體產業趨勢 近年來化合物半導體特別是碳化矽(SiC)、氮化鎵(GaN)等新材料,除了應用於消費性電子外,在車用動力系統及電源管理有獨特優勢,其耐高電壓、高電流之特性,可因應電動車、綠能零排碳、5G、雷達及資料中心等多種終端應用。筑波科技自2022年起攜手美商泰瑞達辦理多場化合物半導體研討會,提供跨產業平台供經驗交流。 2023年度跨界交流會於新竹竹北盛大登場 今年度第二場跨界盛會於4月28日新竹筑波醫電大樓登場,本次活動由美商泰瑞達Teradyne、筑波科技主辦;國立陽明交通大學NYCU、科磊KLA、優貝克ULVAC、皮托科技PITOTECH、光電科技工業協進會PIDA協辦。演講主題從WBG市場切入,再深入探討堅韌材料、SiC與GaN晶圓MA測試解決方案、多重物理耦合模擬技術加速第三類半導體研發與成長、電動車用SiC功率元件之動態量測與可靠度分享。 筑波科技代理泰瑞達Eagle Test System (ETS) 系列產品,結合20年無線通訊整合經驗,為半導體廠商提供完整測試Total Solution,並於台灣與深圳辦公室設立半導體中心 (Engineering Center),本次活動讓貴賓一窺系統實際運作。會中更藉由五大產品展示與交流,包含GaN/SiC PMIC/IGBT測試、光通訊(Silicon photonics)、Wafer及材料非破壞性測試、設備租賃服務與5G方案等,讓現場觀眾眼見為憑、線上同步體驗。 沙龍論壇聚共創產學鏈生機 本活動尾聲以沙龍論壇畫下完美句點,由鴻海研究院半導體研究所HHRI、科磊、筑波科技、優貝克、漢鼎智慧科技公司領導貴賓互動。筑波科技在此活動不僅分享半導體市場及ETS系統特色,更額外分享Quantifi Photonics光通訊應用、TZ-6000太赫茲用於晶圓之非破壞檢測以及租賃服務等,能提供多樣客製化測試整合方案。 關於筑波科技 筑波科技 (https://www.acesolution.com.tw/en/index/) 成立於 2000 年,位於台灣新竹,在中國蘇州和深圳設有分公司。我們的使命是提供訂製的測試解決方案以滿足電氣元件、設備和系統製造商的客戶需求,透過合作夥伴提供技術解決方案。我們專注於射頻、毫米波和太赫茲,擁有專業的技術支持團隊,提供專業、創新和多功能的綜合技術和解決方案。 連絡我們 筑波科技股份有限公司ACE Solution, Co., Ltd. 地址: 新竹縣竹北市台元街28號2樓之1 電話: 03-5500909 E-mail: service@acesolution.com.tw 網站: https://www.acesolution.com.tw/en/index/ LinkedIn: https://www.linkedin.com/company/30620922/admin/ Facebook: https://www.facebook.com/ACERFSolution
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