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大陸港澳

Supermicro追加推出新型最高效能Intel架構X14伺服器，提供業界內機型種類最全面，且適用於AI、HPC、雲端和邊緣領域的工作負載最佳化系統

超過15個經過全面升級的伺服器產品系列，專為實現最高效能或效率而最佳化，並支援新一代GPU、更高頻寬的記憶體、400GbE網路、E1.S與E3.S 硬碟，以及直達晶片液冷（Direct-to-Chip，D2C）技術，且可搭載具有效能核心（P-Core）的全新Intel® Xeon® 6900系列處理器和效率核心（E-Core）的Intel Xeon 6700系列處理器加州聖荷西2024年9月30日 /美通社/ -- Supermicro, Inc.（納斯達克股票代碼：SMCI）作為AI/ML、HPC、雲端、儲存和5G/邊緣領域的全方位IT解決方案提供企業，在其X14系列產品線中新增具有最高效能GPU、多節點配置、機架式設計的新型系統，這些系統搭載了採用效能核心的Intel Xeon 6900系列處理器（原產品代號Granite Rapids-AP）。新型領先業界的工作負載最佳化伺服器系列，可滿足來自現代資料中心、企業和服務供應商的需求。繼搭載Xeon 6700系列處理器（採用效率核心）的效率最佳化X14伺服器在2024年6月被推出後，今天追加推出的系統機型使Supermicro X14系列具備最高的運算密度與算力，提供業界內機型種類最全面的最佳化伺服器，支援從高需求的AI、高效能運算（HPC）、媒體與虛擬化，到高能效邊緣應用、橫向擴充型雲端原生與微服務應用程式等多元工作負載。 SBI-612BA-1NE34 Supermicro總裁暨執行長梁見後表示：「Supermicro X14系統經過完全重新設計，能支援最新技術，包括新一代CPU、GPU、具有高頻寬和最低延遲的MRDIMM、PCIe 5.0，以及EDSFF E1.S和E3.S儲存。我們現在不僅提供超過15項系統產品系列，還可以運用這些設計來打造客製化解決方案，並搭配我們完整的機架整合服務和由內部開發的液冷解決方案。」經認可的客戶能透過Supermicro的Early Ship計畫提早取得完善、可部署的系統或經由Supermicro JumpStart進行遠端測試。這些新型Supermicro X14系統採用完全重新設計的架構，包括全新10U和多節點機型規格，能支援新一代GPU和更高的CPU核心密度，另外也具有每個CPU搭配12組記憶體通道的升級版記憶體插槽配置，以及記憶體頻寬比DDR5 DIMM高出37%的全新MRDIMM。全新的Supermicro X14系列包含多個新系統，其中幾個系統具有全新架構，並針對特定工作負載分為三個類別：專為純粹的效能和強化型散熱功能所設計的GPU最佳化平台，可支援最新技術與最高瓦數的GPU。該系統架構從最基礎層級起被全新打造，適用於大規模AI訓練、大型語言模型（LLM）、生成式AI、3D媒體和虛擬化應用。高運算密度的多節點機型，包括全新FlexTwin™、SuperBlade®和GrandTwin®，能透過共享電源和冷卻等資源以提高效率。其中的特定機型採用了直達晶片液冷技術，能使密度最大化且不影響效能。經市場認可的Supermicro Hyper機架式平台，將單插槽或雙插槽架構、彈性I/O和傳統外型規格的儲存配置進行結合，幫助企業與資料中心隨著工作負載進化而進行垂直擴充與橫向擴充。 Supermicro的新型最高效能X14系統支援採用效能核心的全新Intel Xeon 6900系列處理器，此外，於2024年6月推出的X14效率最佳化系統則支援採用效率核心的Intel Xeon 6700系列處理器。這些系統所提供的插槽可支援將於2025年第一季度推出，採用效能核心的Intel Xeon 6900系列處理器，以及採用效率核心的Intel Xeon 6700系列處理器，進而帶來額外的靈活性，使系統在每核心效能或每瓦效能方面都能實現最佳化。 Intel Xeon產品副總裁暨總經理Ryan Tabrah表示：「Intel首次在同一代提供兩個截然不同的工作負載最佳化Xeon處理器系列，每個系列的設計皆具備專屬的效能和效率規格，能降低投資報酬所需耗時，為運算、功耗和機架密度層面帶來突破性改變，使現代資料中心的投資報酬率得到最大化。隨著新系列的推出，Supermicro 將能導入這些適用於AI和運算密集型工作負載的全新效能最佳化CPU，為客戶提供更多選擇。」配置了搭載效能核心的Intel Xeon 6900系列處理器後，Supermicro系統可支援內建Intel® AMX加速器上的新型FP16指令，進一步強化AI工作負載效能。這些系統內的每個CPU搭配12 組記憶體通道，支援最高8800MT/s的DDR5-6400與MRDIMM，以及CXL 2.0，同時也為高密度、符合業界標準的EDSFF E1.S和E3.S NVMe硬碟提供更廣泛的支援。 Supermicro液冷解決方案 Supermicro透過機架級整合和液冷性能持續完善其經擴充後的X14產品組合。同時，Supermicro 藉由其領先業界的全球製造產能、廣泛的機架級整合與測試設施，以及一套全面的管理軟體解決方案，只需在幾週內就能設計、建構、測試、驗證和交付任何規模的完整資料中心解決方案。 Supermicro也提供內部開發的完善液冷解決方案，包括用於CPU、GPU和記憶體的散熱板，以及冷卻分配單元、冷卻分配歧管、軟管、連接器和冷卻水塔。液冷技術易於被納入機架級整合中，進一步提高系統效率，減少過熱降頻的發生，並降低資料中心部署的總體擁有成本（TCO）和總體環境成本（TCE）。新型Supermicro最高效能X14系統支援採用效能核心的Intel Xeon 6900系列處理器。這些系統包括： GPU最佳化 – 最高效能的Supermicro X14系統專為，大規模AI訓練、大型語言模型、生成式AI和HPC所設計，能支援八個最新一代的SXM5和SXM6 GPU。這些系統可搭配氣冷或液冷式散熱技術。 PCIe GPU – 專為最大GPU彈性所設計，其散熱性能最佳化5U機箱可支援最高10個雙寬PCIe 5.0加速器卡。這些伺服器非常適合AI推論、媒體、協作設計、模擬、雲端遊戲和虛擬化工作負載。 Intel® Gaudi® 3 AI加速器 – Supermicro也計劃推出業界首款搭載Intel Gaudi 3加速器和Intel Xeon 6處理器的AI伺服器。此系統預計可提高大規模AI模型訓練和AI推論的效率，並降低成本。該系統具有八個Intel Gaudi 3加速器（安裝在OAM通用基板上），並配置了六個整合式OSFP連接埠，能實現高成本效益、橫向擴充式網路，同時也包含一個開放式平台，支援基於社群的開放原始碼軟體堆疊，無需後續軟體授權成本。 SuperBlade® – Supermicro X14系列內的6U高效能、密度最佳化且高能效SuperBlade能最大化機架密度，使每個機架最高可容納100台伺服器與200個GPU。每個節點針對AI、HPC，以及其他運算密集型工作負載進行了最佳化，並具備氣冷或直達晶片液冷技術，能使效率最大化且實現最低電力使用效率（PUE）與最佳總體擁有成本（TCO）。同時，每個節點也具有最多四個整合式以太網路交換器，支援100G上行鏈路和前置I/O，提供最高400G InfiniBand或400G乙太網路的靈活選擇。 FlexTwin™ – 新型Supermicro X14 FlexTwin架構是專為HPC而設計，具有高能效優勢，並能以多節點配置提供最大運算能力和密度，同時也可使一組48U機架搭載最多24,576個效能核心。每個節點皆針對HPC和其他運算密集型工作負載進行最佳化，並採用直達晶片液冷技術以最大化效率，減少CPU過熱降頻的發生，且具有HPC低延遲前置和後置I/O，支援最高400G的一系列彈性網路選項。 Hyper – X14 Hyper是Supermicro的旗艦級機架式平台，專為高需求的AI、HPC和企業應用程式提供最高效能，而其單插槽或雙插槽配置支援雙寬PCIe GPU，可實現最大工作負載加速。此平台具有氣冷和直達晶片液冷式機型，能支援頂級CPU而不受散熱因素限制，進而降低資料中心的冷卻成本並提高效率。此外，現正供應的Supermicro X14效率最佳化系統搭載採用效率核心的Intel Xeon 6700系列處理器。這些系統包括： SuperBlade® – Supermicro高效能、密度最佳化且高能效的多節點平台，針對 AI、資料分析、HPC、雲端和企業工作負載最佳化。機型規格包括具有10個或5個節點的6U 機體，或具有20個或10個節點的8U機體，可使每個機架配置最高34,560個Xeon運算核心。 Hyper – 旗艦級高效能機架式伺服器，專為橫向擴充雲端工作負載所設計，具有高度儲存和I/O靈活性以提供客製化式機型，進而滿足不同應用需求。 CloudDC – 適用於雲端資料中心的一體成型平台，採用OCP資料中心模組化硬體系統（DC-MHS），具有靈活的I/O和儲存配置及雙AIOM插槽（支援PCIe 5.0；符合 OCP 3.0 標準），可實現最大資料傳輸量。 Petascale Storage – 透過 EDSFF E1.S和E3.S硬碟實現領先業界的All-Flash儲存密度和效能，以1U或2U式機型提供空前的容量和效能。 WIO – 具備高成本效益的架構，並提供靈活的 I/O 配置，可為加速、儲存和網路替代方案實現最佳化，進而加速效能、提高效率，以及完美地因應不同的特定企業應用。 BigTwin® – 2U 2節點或2U 4節點平台，透過每節點雙處理器和熱插拔免工具的設計，提供卓越的密度、效能和可維護性。這些系統的新機型非常適合雲端、儲存和媒體工作負載，包括支援E3.S硬碟，可實現卓越的密度和傳輸量。 GrandTwin® – 專為單處理器效能和記憶體密度所設計，具有前置（冷通道）熱插拔節點，以及前置或後置I/O，便於維護作業。目前的機型也支援E1.S硬碟，具有更佳的儲存密度和傳輸量。 Hyper-E – 提供我們旗艦級Hyper系列的強大功能和靈活性，並針對邊緣應用環境部署進行最佳化。針對邊緣應用的機型特色包括短機身機箱和前置I/O，使Hyper-E適用於邊緣資料中心和電信機櫃。這些短機身系統可支援最多3組高效能GPU或FPGA加速卡。 Edge/Telco – 具備高密度處理效能以及緊湊型機體規格，針對電信機櫃和智慧資料中心的安裝進行最佳化。這些系統可供選擇性搭配直流電源配置，以及最高55°C（131°F）優化式運行溫度設計。關於Super Micro Computer, Inc. Supermicro（納斯達克股票代碼：SMCI）為應用最佳化全方位IT解決方案的全球領導者。Supermicro的成立據點及營運中心位於美國加州聖荷西，致力為企業、雲端、AI和5G電信/邊緣IT基礎架構提供領先市場的創新技術。我們是全方位IT解決方案製造商，提供伺服器、AI、儲存、物聯網、交換器系統、軟體及支援服務。Supermicro的主機板、電源和機箱設計專業進一步推動了我們的發展與產品生產，為全球客戶實現了從雲端到邊緣的下一代創新。我們的產品皆由企業內部團隊設計及製造（在美國、亞洲及荷蘭），透過全球化營運實現極佳的規模與效率，並藉營運最佳化降低總體擁有成本（TCO），以及經由綠色運算技術減少環境衝擊。屢獲殊榮的Server Building Block Solutions®產品組合，讓客戶可以自由選擇這些具高度彈性、可重複使用且極為多元的建構式組合系統，我們支援各種外形尺寸、處理器、記憶體、GPU、儲存、網路、電源和散熱解決方案（空調、自然氣冷或液冷），因此能為客戶的工作負載與應用提供最佳的效能。 Supermicro、Server Building Block Solutions和We Keep IT Green皆為Super Micro Computer, Inc. 的商標和/或註冊商標。所有其他品牌、名稱和商標皆為其各自所有者之財產。 SYS-A22GA-NBRT SYS-522GA-NRT SYS-422GA-NBRT-LCC SYS-222FT-HEA-LCC SYS-212HA-TN

文章來源 : PR Newswire 美通社 發表時間 : 2024/9/30 瀏覽次數 : 1267 加入收藏 :

Global Business News

Samsung Launches 990 EVO Plus SSD With Higher Capacity, Power Efficiency and Performance Speeds Supported by PCIe 4.0

With capacities of up to 4TB, 73% better power efficiency and random read and write speeds of 1,050K IOPS and 1,400K IOPS respectively, the 990 EVO Plus offers the best-in-class SSD experience to consumers, workers and gamers alikeSINGAPORE - Media OutReach Newswire - 30 September 2024 - Samsung Electronics Singapore today announced the release of the 990 EVO Plus SSD, which comes with PCIe 4.0 support and the latest NAND technology to offer higher performance, capacities and power efficiency. Optimised for business and creative endeavours as well as gaming, the 990 EVO Plus is an ideal solution for consumers who are seeking faster data processing speeds and expanded storage capacities on their PCs. "As consumers create higher quality images, video content and engage in next-generation gaming, this creates a corresponding demand for high-performance, high-capacity storage options to facilitate quick transfers for valuable data. As the world leader in advanced memory technology, Samsung is introducing the 990 EVO Plus to users who want enhanced performance and efficiency on their laptops and desktop PCs. With faster data read and write speeds, expanded storage capacities and improved power efficiency, the 990 EVO Plus offers the best-in-class SSD experience to consumers, workers and gamers alike," Jacus Long, Head of Display Business, Samsung Electronics Singapore. Enhanced Performance, Power Efficiency and Storage Capacity The 990 EVO Plus is built on decades of Samsung's pioneering semiconductor technology with proven reliability. Featuring Samsung's latest 8th generation V-NAND technology and a 5-nanometer (nm) controller, the 990 EVO Plus offers sequential read speeds of up to 7,250 megabytes-per-second (MB/s) and write speeds of up to 6,300MB/s3,4, enhancing its performance by up to 50% compared to its predecessor, the 990 EVO. The 990 EVO Plus also incorporates an innovative nickel-coated heat shield that minimises overheating, which enhances its power efficiency by 73% compared to its predecessor. To meet the growing storage requirements of consumers, the 990 EVO Plus offers a 4TB model that exceeds the limits of the 990 EVO, to offer even higher storage capacity to users. The 990 EVO Plus is also equipped with Samsung's intelligent TurboWrite 2.0, revamped for maximised performance, to facilitate rapid file transfer speeds and reduce lag. The 990 EVO Plus' 4TB model has an industry-leading random read speed of 1,050K input/output and 1,400K IOPS3,4 for random write, putting its performance almost on par with SSD products with DRAM, without using DRAM cache. This feature makes it an optimal solution for gaming and artificial intelligence (AI) tasks that require high performance. Samsung Magician Software Support To enhance the functionality of all Samsung SSDs, including the 990 EVO Plus, users can make use of the optimisation tools available with the Samsung Magician software. The software can help users to streamline the data migration process for SSD upgrades effortlessly and securely, while valuable data, monitoring SSD health and offering customised performance optimisation. Availability and Pricing The 990 EVO Plus will be available in Singapore from the end of October via the Samsung Online Store, the Samsung Official Store on Lazada and Shopee as well as at selected consumer electronics stores. The recommended retail price for the 1TB 990 Evo Plus is S$159, while the 2TB model retails for S$268 and the 4TB model retails at S$479. For more information — including warranty details — please visit samsung.com/sg/memory-storage/all-memory-storage/?ssd. For a user guide on how to install the 990 EVO Plus onto your laptop or computer, visit https://semiconductor.samsung.com/consumer-storage/ssdupgrade/. Samsung SSD 990 EVO Plus Specifications Category Samsung SSD 990 EVO Plus Interface PCIe® Gen 4.0 x4 / 5.0 x2 NVMe™ 2.01 Form Factor M.2 (2280) Storage Memory Samsung V-NAND 3-bit TLC Controller Samsung In-house Controller Capacity2 1TB 2TB 4TB Sequential Read/Write Speed 3,4 Up to 7,150 MB/s, 6,300 MB/s Up to 7,250 MB/s, 6,300 MB/s Up to 7,250 MB/s, 6,300 MB/s ㄴRandom Read/Write Speed (QD32) 3,4 Up to 850K IOPS, 1,350K IOPS Up to 1,000K IOPS, 1,350K IOPS Up to 1,050K IOPS, 1,400K IOPS Management Software Samsung Magician Software Data Encryption AES 256-bit Full Disk Encryption, TCG/Opal V2.0, Encrypted Drive (IEEE1667) Total Bytes Written 600TB 1,200TB 2,400TB Warranty 5 5-year Limited Warranty 6 1 The NVM Express® design mark is a registered trademark of NVM Express, Inc. 2 1GB = 1,000,000,000 bytes by IDEMA. A certain portion of capacity may be used for system file and maintenance use, so the actual capacity may differ from what is indicated on the product label. 3 Sequential and random performance measurements are based on IOmeter1.1.0. Performance may vary based on an SSD's firmware version, system hardware & configuration. 4 Test system configuration: AMD Ryzen9 7950x 16-Core Processor CPU@4.5GHz, DDR5 4800MHz 16GBx2), OS-Windows 11 Pro 64bit, Chipset - ASRock X670E Taichi 5 Samsung Electronics shall not be liable for any loss, including but not limited to loss of data or other information contained on Samsung Electronics' products or loss of profit or revenue which may be incurred by the user. For more information on the warranty, please visit samsung.com/SSD or semiconductor.samsung.com/internal-ssd/ 6 Five years or total bytes written (TBW), whichever comes first. For more information on the warranty, please refer to the enclosed warranty document in the package. Hashtag: #SamsungSingaporeThe issuer is solely responsible for the content of this announcement.About Samsung Electronics Co., Ltd. Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, home appliances, network systems, and memory, system LSI, foundry and LED solutions, and delivering a seamless connected experience through its SmartThings ecosystem and open collaboration with partners. For the latest news, please visit the Samsung Newsroom at news.samsung.com.

文章來源 : Media OutReach Limited 發表時間 : 2024/9/30 瀏覽次數 : 457 加入收藏 :

Supermicro推出新型高效能IntelX14伺服器，專為實現最高效能或效率而最佳化

科技新訊

Supermicro追加推出新型最高效能Intel架構X14伺服器，提供業界內機型種類最全面，且適用於AI、HPC、雲端和邊緣領域的工作負載最佳化系統

Supermicro, Inc.（納斯達克股票代碼：SMCI）作為AI/ML、HPC、雲端、儲存和5G/邊緣領域的全方位IT解決方案提供企業，在其X14系列產品線中新增具有最高效能GPU、多節點配置、機架式設計的新型系統，這些系統搭載了採用效能核心的Intel Xeon 6900系列處理器（原產品代號Granite Rapids-AP）。新型領先業界的工作負載最佳化伺服器系列，可滿足來自現代資料中心、企業和服務供應商的需求。繼搭載Xeon 6700系列處理器（採用效率核心）的效率最佳化X14伺服器在2024年6月被推出後，今天追加推出的系統機型使Supermicro X14系列具備最高的運算密度與算力，提供業界內機型種類最全面的最佳化伺服器，支援從高需求的AI、高效能運算（HPC）、媒體與虛擬化，到高能效邊緣應用、橫向擴充型雲端原生與微服務應用程式等多元工作負載。 Supermicro總裁暨執行長梁見後表示：「Supermicro X14系統經過完全重新設計，能支援最新技術，包括新一代CPU、GPU、具有高頻寬和最低延遲的MRDIMM、PCIe 5.0，以及EDSFF E1.S和E3.S儲存。我們現在不僅提供超過15項系統產品系列，還可以運用這些設計來打造客製化解決方案，並搭配我們完整的機架整合服務和由內部開發的液冷解決方案。」經認可的客戶能透過Supermicro的Early Ship計畫提早取得完善、可部署的系統或經由Supermicro JumpStart進行遠端測試。這些新型Supermicro X14系統採用完全重新設計的架構，包括全新10U和多節點機型規格，能支援新一代GPU和更高的CPU核心密度，另外也具有每個CPU搭配12組記憶體通道的升級版記憶體插槽配置，以及記憶體頻寬比DDR5 DIMM高出37%的全新MRDIMM。全新的Supermicro X14系列包含多個新系統，其中幾個系統具有全新架構，並針對特定工作負載分為三個類別： l 專為純粹的效能和強化型散熱功能所設計的GPU最佳化平台，可支援最新技術與最高瓦數的GPU。該系統架構從最基礎層級起被全新打造，適用於大規模AI訓練、大型語言模型（LLM）、生成式AI、3D媒體和虛擬化應用。 l 高運算密度的多節點機型，包括全新FlexTwin™、SuperBlade®和GrandTwin®，能透過共享電源和冷卻等資源以提高效率。其中的特定機型採用了直達晶片液冷技術，能使密度最大化且不影響效能。 l 經市場認可的Supermicro Hyper機架式平台，將單插槽或雙插槽架構、彈性I/O和傳統外型規格的儲存配置進行結合，幫助企業與資料中心隨著工作負載進化而進行垂直擴充與橫向擴充。 Supermicro的新型最高效能X14系統支援採用效能核心的全新Intel Xeon 6900系列處理器，此外，於2024年6月推出的X14效率最佳化系統則支援採用效率核心的Intel Xeon 6700系列處理器。這些系統所提供的插槽可支援將於2025年第一季度推出，採用效能核心的Intel Xeon 6900系列處理器，以及採用效率核心的Intel Xeon 6700系列處理器，進而帶來額外的靈活性，使系統在每核心效能或每瓦效能方面都能實現最佳化。 Intel Xeon產品副總裁暨總經理Ryan Tabrah表示：「Intel首次在同一代提供兩個截然不同的工作負載最佳化Xeon處理器系列，每個系列的設計皆具備專屬的效能和效率規格，能降低投資報酬所需耗時，為運算、功耗和機架密度層面帶來突破性改變，使現代資料中心的投資報酬率得到最大化。隨著新系列的推出，Supermicro 將能導入這些適用於AI和運算密集型工作負載的全新效能最佳化CPU，為客戶提供更多選擇。」配置了搭載效能核心的Intel Xeon 6900系列處理器後，Supermicro系統可支援內建Intel® AMX加速器上的新型FP16指令，進一步強化AI工作負載效能。這些系統內的每個CPU搭配12 組記憶體通道，支援最高8800MT/s的DDR5-6400與MRDIMM，以及CXL 2.0，同時也為高密度、符合業界標準的EDSFF E1.S和E3.S NVMe硬碟提供更廣泛的支援。 Supermicro液冷解決方案 Supermicro透過機架級整合和液冷性能持續完善其經擴充後的X14產品組合。同時，Supermicro 藉由其領先業界的全球製造產能、廣泛的機架級整合與測試設施，以及一套全面的管理軟體解決方案，只需在幾週內就能設計、建構、測試、驗證和交付任何規模的完整資料中心解決方案。 Supermicro也提供內部開發的完善液冷解決方案，包括用於CPU、GPU和記憶體的散熱板，以及冷卻分配單元、冷卻分配歧管、軟管、連接器和冷卻水塔。液冷技術易於被納入機架級整合中，進一步提高系統效率，減少過熱降頻的發生，並降低資料中心部署的總體擁有成本（TCO）和總體環境成本（TCE）。新型Supermicro最高效能X14系統支援採用效能核心的Intel Xeon 6900系列處理器。這些系統包括： GPU最佳化 – 最高效能的Supermicro X14系統專為，大規模AI訓練、大型語言模型、生成式AI和HPC所設計，能支援八個最新一代的SXM5和SXM6 GPU。這些系統可搭配氣冷或液冷式散熱技術。 PCIe GPU – 專為最大GPU彈性所設計，其散熱性能最佳化5U機箱可支援最高10個雙寬PCIe 5.0加速器卡。這些伺服器非常適合AI推論、媒體、協作設計、模擬、雲端遊戲和虛擬化工作負載。 Intel® Gaudi® 3 AI加速器 – Supermicro也計劃推出業界首款搭載Intel Gaudi 3加速器和Intel Xeon 6處理器的AI伺服器。此系統預計可提高大規模AI模型訓練和AI推論的效率，並降低成本。該系統具有八個Intel Gaudi 3加速器（安裝在OAM通用基板上），並配置了六個整合式OSFP連接埠，能實現高成本效益、橫向擴充式網路，同時也包含一個開放式平台，支援基於社群的開放原始碼軟體堆疊，無需後續軟體授權成本。 SuperBlade® – Supermicro X14系列內的6U高效能、密度最佳化且高能效SuperBlade能最大化機架密度，使每個機架最高可容納100台伺服器與200個GPU。每個節點針對AI、HPC，以及其他運算密集型工作負載進行了最佳化，並具備氣冷或直達晶片液冷技術，能使效率最大化且實現最低電力使用效率（PUE）與最佳總體擁有成本（TCO）。同時，每個節點也具有最多四個整合式以太網路交換器，支援100G上行鏈路和前置I/O，提供最高400G InfiniBand或400G乙太網路的靈活選擇。 FlexTwin™ – 新型Supermicro X14 FlexTwin架構是專為HPC而設計，具有高能效優勢，並能以多節點配置提供最大運算能力和密度，同時也可使一組48U機架搭載最多24,576個效能核心。每個節點皆針對HPC和其他運算密集型工作負載進行最佳化，並採用直達晶片液冷技術以最大化效率，減少CPU過熱降頻的發生，且具有HPC低延遲前置和後置I/O，支援最高400G的一系列彈性網路選項。 Hyper – X14 Hyper是Supermicro的旗艦級機架式平台，專為高需求的AI、HPC和企業應用程式提供最高效能，而其單插槽或雙插槽配置支援雙寬PCIe GPU，可實現最大工作負載加速。此平台具有氣冷和直達晶片液冷式機型，能支援頂級CPU而不受散熱因素限制，進而降低資料中心的冷卻成本並提高效率。此外，現正供應的Supermicro X14效率最佳化系統搭載採用效率核心的Intel Xeon 6700系列處理器。這些系統包括： SuperBlade® – Supermicro高效能、密度最佳化且高能效的多節點平台，針對 AI、資料分析、HPC、雲端和企業工作負載最佳化。機型規格包括具有10個或5個節點的6U 機體，或具有20個或10個節點的8U機體，可使每個機架配置最高34,560個Xeon運算核心。 Hyper – 旗艦級高效能機架式伺服器，專為橫向擴充雲端工作負載所設計，具有高度儲存和I/O靈活性以提供客製化式機型，進而滿足不同應用需求。 CloudDC – 適用於雲端資料中心的一體成型平台，採用OCP資料中心模組化硬體系統（DC-MHS），具有靈活的I/O和儲存配置及雙AIOM插槽（支援PCIe 5.0；符合 OCP 3.0 標準），可實現最大資料傳輸量。 Petascale Storage – 透過 EDSFF E1.S和E3.S硬碟實現領先業界的All-Flash儲存密度和效能，以1U或2U式機型提供空前的容量和效能。 WIO – 具備高成本效益的架構，並提供靈活的 I/O 配置，可為加速、儲存和網路替代方案實現最佳化，進而加速效能、提高效率，以及完美地因應不同的特定企業應用。 BigTwin® – 2U 2節點或2U 4節點平台，透過每節點雙處理器和熱插拔免工具的設計，提供卓越的密度、效能和可維護性。這些系統的新機型非常適合雲端、儲存和媒體工作負載，包括支援E3.S硬碟，可實現卓越的密度和傳輸量。 GrandTwin® – 專為單處理器效能和記憶體密度所設計，具有前置（冷通道）熱插拔節點，以及前置或後置I/O，便於維護作業。目前的機型也支援E1.S硬碟，具有更佳的儲存密度和傳輸量。 Hyper-E – 提供我們旗艦級Hyper系列的強大功能和靈活性，並針對邊緣應用環境部署進行最佳化。針對邊緣應用的機型特色包括短機身機箱和前置I/O，使Hyper-E適用於邊緣資料中心和電信機櫃。這些短機身系統可支援最多3組高效能GPU或FPGA加速卡。 Edge/Telco – 具備高密度處理效能以及緊湊型機體規格，針對電信機櫃和智慧資料中心的安裝進行最佳化。這些系統可供選擇性搭配直流電源配置，以及最高55°C（131°F）優化式運行溫度設計。

文章來源 : 香港商霍夫曼公關顧問股份有限公司 發表時間 : 2024/9/30 瀏覽次數 : 5464 加入收藏 :

Global Business News

ASUS Introduces All-New Intel Xeon 6 Processor Servers

World-class expertise and engineering combine to deliver next-generation servers ready to empower high-performance computing, peak performance and maximum utilizationSINGAPORE - Media OutReach Newswire - 26 September 2024 - ASUS today announced its all-new line-up of Intel® Xeon® 6 processor-powered servers, ready to satisfy the escalating demand for high-performance computing (HPC) solutions. The new servers include the multi-node ASUS RS920Q-E12, which supports Intel Xeon 6900 series processors for HPC applications; and the ASUS RS720Q-E12, RS720-E12 and RS700-E12 server models, embedded with Intel Xeon 6700 series with E-cores, will also support Intel Xeon 6700/6500 series with P-cores in Q1, 2025, to provide seamless integration and optimization for modern data centers and diverse IT environments. These powerful new servers, built on the solid foundation of trusted and resilient ASUS server design, offer improved scalability, enabling clients to build customized data centers and scale up their infrastructure to achieve their highest computing potential – ready to deliver HPC success across diverse industries and use cases. ESC I8-E11: Ready for the latest Intel Gaudi 3 AI accelerator Responding to the surging demand of AI training and inference, ASUS ESC I8-E11 accommodates eight Intel Gaudi® 3 AI OCP Accelerator Module (OAM) mezzanine cards, and integrates 24 industry-standard RoCE 200GbE RDMA NICs on every Intel Gaudi 3 accelerator. ESC I8-E11, powered by 5th Gen Intel Xeon processors, features a modular design that reduces cable usage, shortening assembly time and improving thermal optimization. It also boasts high power efficiency with redundant 3000W 80 PLUS® PSUs, ensuring reliable and sustainable power supply to offer exceptional performance, efficiency and versatility for deep-learning tasks. RS920Q-E12 and RS720Q-E12: Unleashing data for HPC ASUS RS920Q-E12 is designed to unleash peak performance and features the latest Intel Xeon 6900 series processors, plus up to 96 DDR5 RDIMM 6400MT/s and MRDIMM Gen1 8800 MT/s per 2U system. This server is particularly suited to heavy workloads, ensuring efficient processing and data management. With advanced liquid-cooling technology to maintain optimal performance and prevent overheating, RS920Q-E12 offers stability and reliability in demanding operational environments such as HPC, cloud computing and more. ASUS also presents RS720Q-E12, another new server with Intel Xeon 6700 series with E-cores or Intel Xeon 6700/6500 series with P-cores, engineered for maintaining high resource utilization and reliability. This server balances resources to optimize I/O throughput, simplifying storage management and offering great scalability. With optimal space utilization and efficient performance, RS720Q-E12 offers excellent performance, especially for the complex semiconductor EDA workloads. RS720-E12 and RS700-E12: Effortless deployment and exceptional value ASUS RS720-E12 and RS700-E12 are the latest general-purpose servers, built with the modular and scalable DC-MHS architecture, providing seamless integration and optimization for modern data centers and diverse IT environments. To improve flexibility and security across different data center platforms, RS720-E12 and RS700-E12 with Intel Xeon 6700 series with E-cores or Intel Xeon 6700/6500 series with P-cores incorporate DC-SCM, a versatile baseboard management controller (BMC) module. This innovation shifts common server management, security and control features from the motherboard to a practical, modular component. RS720-E12 is optimized for GPU support, efficiently handling demanding graphical and computational tasks. With Intel Xeon 6 processors, this server can manage multiple processes simultaneously, ensuring rapid data transfer and improving response times. The exclusive ASUS fan-bar design enhances maintenance convenience, and the optimized I/O throughput minimizes bottlenecks and improves storage and retrieval efficiency. For effortless deployment and exceptional value, RS700-E12 provides high-speed data access and transfer rates with all-NVMe storage, multi-core processors, and large memory capacity. This server accommodates extensive data demands while maintaining swift access times, ensuring efficient multitasking, and processing of complex workloads. Availability & Pricing ASUS Intel Xeon 6 products and services are available worldwide. Please visit the solution page: https://www.asus.com/event/intel-xeon-6-processor-servers/ or contact your local ASUS representative for further information. Hashtag: #asusAbout ASUSASUS is a global technology leader that provides the world's most innovative and intuitive devices, components, and solutions to deliver incredible experiences that enhance the lives of people everywhere. With its team of 5,000 in-house R&D experts, the company is world-renowned for continuously reimagining today's technologies. Consistently ranked as one of Fortune's World's Most Admired Companies, ASUS is also committed to sustaining an incredible future. The goal is to create a net zero enterprise that helps drive the shift towards a circular economy, with a responsible supply chain creating shared value for every one of us.

文章來源 : Media OutReach Limited 發表時間 : 2024/9/26 瀏覽次數 : 461 加入收藏 :

Global Business News

Exascend to Showcase Storage Beyond Boundaries at embedded world North America 2024

Revolutionary Automotive-Grade, Radiation-Hardened, and High-Capacity SSDs on Display TAIPEI, Sept. 24, 2024 /PRNewswire/ -- Exascend, a service-oriented provider of innovative storage and memory solutions, is excited to announce its participation in embedded world North America 2024 in Austin, Texas, from October 8-10. At Booth 1935, Exascend will present its latest storage innovations tailored for demanding applications in the automotive, aerospace, and industrial sectors. Attendees will discover how Exascend's automotive-grade SSDs, radiation-hardened storage for space exploration, and high-capacity SATA SSDs push the limits of performance, endurance, and reliability. Visit Exascend at Booth 1935 at embedded world North America 2024 to explore cutting-edge storage solutions for automotive, aerospace, and industrial applications. Driving Innovation in Automotive Storage Exascend will showcase its comprehensive portfolio of automotive-grade storage solutions, engineered to perform in the harshest environments, handling extreme temperatures, shock, vibration, and environmental hazards. Featured products include the ISO 16750-3 certified PA4 Series NVMe SSD, the SA4 Series SATA SSD, the award-winning AEC-Q100 Grade 2 certified AS500 Series BGA SSD, and the EM500 Series eMMC. Empowering Space Exploration with Radiation-Hardened SSDs In aerospace, where reliability is non-negotiable, Exascend's PR4 Series NVMe SSD excels. Featuring Neutron Shield 2.0 technology and advanced protection features, it's ideal for space applications like payload processors and communication systems, with capacities up to 15.36TB and built for extreme conditions. High-Capacity Industrial SATA SSDs For industries needing reliable, high-capacity storage, Exascend's SI4 and SE4 Series SATA SSDs offer up to 15.36TB capacity. The SI4 Series operates in temperatures from -40°C to +85°C, while the SE4 Series supports temperatures from 0°C to 70°C, making them ideal for data-intensive and industrial applications. Visit Exascend at Booth 1935 from October 8-10 at the Austin Convention Center to explore our latest innovations in storage technology for automotive, aerospace, and industrial applications. For more information or to schedule a meeting, visit exascend.com. About Exascend Exascend is a service-oriented provider of cutting-edge storage and memory solutions, specializing in low-power, high-performance, and high-reliability products. We offer a wide range of storage solutions including SSDs, memory cards, managed NAND, and DRAM modules. With end-to-end capabilities spanning hardware, firmware, software, engineering, manufacturing, and customization, we empower global customers to push the boundaries of innovation, offering quality, reliability, and flexibility. Learn more at exascend.com.

文章來源 : PR Newswire 美通社 發表時間 : 2024/9/24 瀏覽次數 : 998 加入收藏 :

Global Business News

Supermicro Adds New Max-Performance Intel-Based X14 Servers, Delivering the Industry's Broadest Range of Workload-Optimized Systems for AI, HPC, Cloud, and Edge

More than 15 Product Families of Completely Upgraded Servers Optimized for Maximum Performance or Efficiency, Featuring Next-Generation GPU Support, Higher-Bandwidth Memory, 400GbE Networking, E1.S and E3.S Drives, and Direct-to-Chip Liquid Cooling Support, and are Based on the New Intel® Xeon® 6900 Series Processors with P-Cores and Intel Xeon 6700 Series Processors with E-cores SAN JOSE, Calif., Sept. 24, 2024 /PRNewswire/ -- Supermicro, Inc. (NASDAQ: SMCI) a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, today adds new maximum performance GPU, multi-node, and rackmount systems to the X14 portfolio, which are based on the Intel Xeon 6900 Series Processors with P-Cores (formerly codenamed Granite Rapids-AP). The new industry-leading selection of workload-optimized servers addresses the needs of modern data centers, enterprises, and service providers. Joining the efficiency-optimized X14 servers leveraging the Xeon 6700 Series Processors with E-cores launched in June 2024, today's additions bring maximum compute density and power to the Supermicro X14 lineup to create the industry's broadest range of optimized servers supporting a wide variety of workloads from demanding AI, HPC, media, and virtualization to energy-efficient edge, scale-out cloud-native, and microservices applications. SBI-612BA-1NE34 "Supermicro X14 systems have been completely re-engineered to support the latest technologies including next-generation CPUs, GPUs, highest bandwidth and lowest latency with MRDIMMs, PCIe 5.0, and EDSFF E1.S and E3.S storage," said Charles Liang, president and CEO of Supermicro. "Not only can we now offer more than 15 families, but we can also use these designs to create customized solutions with complete rack integration services and our in-house developed liquid cooling solutions." Approved customers can obtain early access to complete, full-production systems via Supermicro's Early Ship Program or for remote testing with Supermicro JumpStart. These new Supermicro X14 systems feature completely re-designed architectures, including all-new 10U and multi-node form factors that support next-generation GPUs and higher CPU core densities, updated memory slot configurations with 12 memory channels per CPU and new MRDIMMs, which provide up to 37% better memory bandwidth compared to DDR5 DIMMs. The new Supermicro X14 family comprises a number of new systems —several of which are completely new architectures—in three distinct, workload-specific categories: GPU-optimized platforms designed for pure performance and enhanced thermal capacity to support the latest technology and highest-wattage GPUs. System architectures are built from the ground up for large-scale AI training, LLMs, generative AI, 3D media, and virtualization applications. High compute-density multi-nodes including all-new FlexTwin™,SuperBlade®, and GrandTwin®, which leverage resources such as shared power and cooling to increase efficiency, as well as direct-to-chip liquid cooling on specific models to maximize density without compromising on performance. Market-proven Supermicro Hyper rackmounts combine single or dual socket architectures with flexible I/O and storage configurations in traditional form factors to help enterprises and data centers scale up and out as their workloads evolve. Supermicro's new max-performance X14 systems support the new Intel Xeon 6900 series processors with P-cores, while X14 efficiency-optimized systems support the Intel Xeon 6700 series processors with E-cores, which launched in June 2024. These systems will also offer socket compatibility with the upcoming Intel Xeon 6900 series processors with E-cores and Intel Xeon 6700 series processors with P-cores in Q1'25 to provide an additional dimension of flexibility when optimizing systems for either performance-per-core or performance-per-watt. "For the first time, Intel is offering two distinct, workload-optimized families of Xeon processors in the same generation, each designed to deliver specific performance and efficiency profiles that can shorten time-to-results, revolutionize compute, power and rack density, maximizing ROI for modern data centers," said Ryan Tabrah, VP and GM of Xeon Products at Intel. "With the new additions, Supermicro will be able to provide their customers with even more choice with the introduction of these new performance optimized CPUs for AI and compute-intensive workloads." When configured with Intel Xeon 6900 series processors with P-cores, Supermicro systems support new FP16 instructions on the built-in Intel® AMX accelerator to further enhance AI workload performance. These systems include 12 memory channels per CPU with support for both DDR5-6400 and MRDIMMs up to 8800MT/s, CXL 2.0, and feature more extensive support for high-density, industry-standard EDSFF E1.S and E3.S NVMe drives. Supermicro Liquid Cooling Solutions Complementing this expanded X14 product portfolio are Supermicro's rack-scale integration and liquid cooling capabilities. With an industry-leading global manufacturing capacity, extensive rack-scale integration and testing facilities, and a comprehensive suite of management software solutions, Supermicro designs, builds, tests, validates, and delivers complete data center solutions at any scale in a matter of weeks. Supermicro offers a complete in-house developed liquid cooling solution including cold plates for CPUs, GPUs, memory, Cooling Distribution Units, Cooling Distribution Manifolds, hoses, connectors, and cooling towers. Liquid cooling is easily included in rack-level integrations to increase system efficiency, reduce instances of thermal throttling, and lowers both the TCO and Total Cost to the Environment (TCE) of data center deployments. New Supermicro max-performance X14 systems featuring Intel Xeon 6900 series processors with P-cores include: GPU-optimized – The highest performance Supermicro X14 systems designed for large-scale AI training, large language models (LLMs), generative AI and HPC, and supporting eight of the latest-generation SXM5 and SXM6 GPUs. These systems are available in air-cooled or liquid-cooled configurations. PCIe GPU – Designed for maximum GPU flexibility, supporting up to 10 double-width PCIe 5.0 accelerator cards in a thermally-optimized 5U chassis. These servers are ideal for AI inferencing, media, collaborative design, simulation, cloud gaming, and virtualization workloads. Intel® Gaudi® 3 AI Accelerators – Supermicro also plans to deliver the industry's first AI server based on the Intel Gaudi 3 accelerator hosted by Intel Xeon 6 processors. The system is expected to increase efficiency and lower the cost of large-scale AI model training and AI inferencing. The system features eight Intel Gaudi 3 accelerators on an OAM universal baseboard, six integrated OSFP ports for cost-effective scale-out networking, and an open platform designed to use a community-based, open-source software stack, requiring no software licensing costs. SuperBlade® - Supermicro's X14 6U high-performance, density-optimized, and energy-efficient SuperBlade maximizes rack density, with up to 100 servers and 200 GPUs per rack. Optimized for AI, HPC, and other compute-intensive workloads, each node features air cooling or direct-to-chip liquid cooling to maximize efficiency and achieve the lowest PUE with the best TCO, as well as connectivity up to four integrated Ethernet switches with 100G uplinks and front I/O supporting a range of flexible networking options up to 400G InfiniBand or 400G Ethernet per node. FlexTwin™ - The new Supermicro X14 FlexTwin architecture is purpose-built for HPC, cost-efficient, and designed to provide maximum compute power and density in a multi-node configuration with up to 24,576 performance cores in a 48U rack. Optimized for HPC and other compute-intensive workloads, each node features direct-to-chip liquid cooling only to maximize efficiency and reduce instances of CPU thermal throttling, as well as HPC low latency front and rear I/O supporting a range of flexible networking options up to 400G per node. Hyper - X14 Hyper is Supermicro's flagship rackmount platform designed to deliver the highest performance for demanding AI, HPC, and enterprise applications, with single or dual socket configurations supporting double-width PCIe GPUs for maximum workload acceleration. Both air cooling and direct-to-chip liquid cooling models are available to facilitate the support of top-bin CPUs without thermal limitations and reduce data center cooling costs while also increasing efficiency. Also, now shipping are Supermicro's X14 efficiency-optimized systems featuring Intel Xeon 6700 series processors with E-cores: SuperBlade® – Supermicro's high-performance, density-optimized, and energy-efficient multi-node platform optimized for AI, Data Analytics, HPC, Cloud, and Enterprise workloads. Available as a 6U enclosure with 10 or 5 nodes, or an 8U enclosure with 20 or 10 nodes, one rack can feature up to 34,560 Xeon compute cores. Hyper – Flagship performance rackmount servers designed for scale-out cloud workloads, with storage & I/O flexibility that provides a custom fit for a wide range of application needs. CloudDC – All-in-one platform for cloud data centers, based on the OCP Data Center Modular Hardware System (DC-MHS) with flexible I/O and storage configurations and dual AIOM slots (PCIe 5.0; OCP 3.0 compliant) for maximum data throughput. Petascale Storage – Industry-leading all-flash storage density and performance with EDSFF E1.S and E3.S drives, allowing unprecedented capacity and performance in a 1U or 2U chassis. WIO – Offers flexible I/O configurations in a cost-effective architecture to enable optimization of acceleration, storage, and networking alternatives to accelerate performance, increase efficiency and find the perfect fit for specific enterprise applications. BigTwin® – 2U 2-Node or 2U 4-Node platform providing superior density, performance, and serviceability with dual processors per node and hot-swappable tool-less design. These systems are ideal for cloud, storage, and media workloads with new models, including E3.S drive support for superior density and throughput. GrandTwin® – Purpose-built for single-processor performance and memory density, featuring front (cold aisle) hot-swappable nodes and front or rear I/O for easier serviceability. Now available with E1.S drives for better storage density and throughput. Hyper-E – Delivers the power and flexibility of our flagship Hyper family optimized for deployment in edge environments. Edge-friendly features include a short-depth chassis and front I/O, making Hyper-E suitable for edge data centers and telco cabinets. These short-depth systems support up to 3 high-performance GPU or FPGA cards. Edge/Telco – High-density processing power in compact form factors optimized for telco cabinet and Edge data center installation. Optional DC power configurations and enhanced operating temperatures up to 55° C (131° F). About Super Micro Computer, Inc. Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first to market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are a Total IT Solutions provider with server, AI, storage, IoT, switch systems, software, and support services. Supermicro's motherboard, power, and chassis design expertise further enable our development and production, enabling next generation innovation from cloud to edge for our global customers. Our products are designed and manufactured in-house (in the US, Asia, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling). Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc. All other brands, names, and trademarks are the property of their respective owners. SYS-A22GA-NBRT SYS-522GA-NRT SYS-422GA-NBRT-LCC SYS-222FT-HEA-LCC SYS-212HA-TN

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