本網站使用瀏覽器紀錄 (Cookies) 來提供您最好的使用體驗，我們使用的 Cookie 也包括了第三方 Cookie。相關資訊請訪問我們的隱私權與 Cookie 政策。如果您選擇繼續瀏覽或關閉這個提示，便表示您已接受我們的網站使用條款。 關閉
The HPC platform to be built on Samsung SF4X with LPDDR6 Memory Interface SEOUL, South Korea, June 12, 2024 /PRNewswire/ -- SEMIFIVE, a leading SoC design platform, announced today it has joined Arm Total Design and will begin developing a new high-performance computing (HPC) platform powered by Arm® Neoverse™ Compute Subsystems (CSS). The HPC platform will provide a backbone for high-performance HPC SoCs utilizing Arm Neoverse CSS and cutting-edge LPDDR6 memory interface. SEMIFIVE's HPC platform offers a new paradigm for semiconductor design and manufacturing, promising a significant impact on the market through cost reduction, performance optimization, and development flexibility. This technology will accelerate innovation in the semiconductor industry, meet the needs of diverse customers, and create opportunities for new business models and collaboration across the ecosystem. Arm Total Design provides partners with expertise and support from a fast-growing ecosystem and preferential access to Arm Neoverse CSS, enabling custom silicon development with less risk and quicker time to market. SEMIFIVE, a company specializing in SoC platforms and ASIC design solutions, develops SoC design platforms specifically tailored for AI chips. To date, the company has developed three SoC design platforms and has commenced mass production of three products utilizing these platforms. SEMIFIVE plans to build and expand its HPC platform using the high-performance, power-efficient benefits of Neoverse technology to meet the demands of various AI SoC markets. "It's super exciting to join Arm Total Design and provide the industry with a truly scalable design solution through our strong partnership with Arm," said Brandon Cho, CEO and co-founder of SEMIFIVE. "Thanks to Arm Neoverse technology, the foundation of the age of heterogeneous HPC hardware, the HPC platform powered by Neoverse CSS is a significant milestone in how we approach custom chip design and enable innovations." "Custom silicon solutions enable efficient, specialized processing to support important sustainability objectives while also meeting the current and future energy needs of AI," said SW Hwang, President of Arm Korea. "As part of the Arm Total Design ecosystem, SEMIFIVE can leverage the power efficiency benefits of Neoverse CSS to bring next-generation HPC solutions to the industry while reducing costs and time to market." "Multi-Die Integration (MDI) for AI applications represents a vital growth and focus segment for Samsung Foundry's business. We are pleased to offer our advanced 4nm process technology for developing SEMIFIVE Neoverse HPC Platform," said Taejoong Song, Vice President and Head of Business Development Team at Samsung Electronics. "Samsung Foundry's SAFE™ ecosystem will play a critical role in delivering custom HPC SoC designs." SEMIFIVE will participate in the Samsung Foundry Forum (SFF) and SAFE™ forum events as a partner from June 12 to 13 in San Jose, CA and showcase their advanced SoC design solutions for AI applications. About SEMIFIVE SEMIFIVE is the pioneer of platform based SoC design, working with customers to implement innovative ideas into custom silicon in the most efficient way. Our SoC platforms offer a powerful springboard for new chip designs and leverage configurable domain-specific architectures and pre-validated key IP pools. We offer comprehensive spec-to-system capabilities with end-to-end solutions so that custom SoCs can be realized faster, with reduced cost and risks for key applications such as data center or AI-enabled IoT. With a strong partnership with Samsung Foundry as a leading SAFE™ DSP partner, as well as the larger ecosystem, SEMIFIVE provides a one-stop shop solution for any SoC design needs. For more information, please visit www.semifive.com.
TAIPEI, June 4, 2024 /PRNewswire/ -- The subsidiary of MiTAC Holdings Corp.(TSE:3706), MiTAC Computing Technology and its server brand TYAN®, the leading manufacturer in server platform design worldwide, unveil their new server systems and motherboards optimized for today's AI, HPC, cloud, and enterprise workloads at COMPUTEX 2024, Booth # M1120 in Taipei, Taiwan from June 4 to June 7. Harnessing the power of the latest Intel® Xeon® 6 processor and 4th and 5th Gen Intel® Xeon® Scalable processors, these solutions deliver cutting-edge performance. Next-Gen Computing: MiTAC and TYAN Launch Intel® Xeon® 6 Processor-Based Servers for AI, HPC, Cloud, and Enterprise Workloads at COMPUTEX 2024 "For over a decade, MiTAC has worked with Intel at the forefront of server technology innovation, consistently delivering cutting-edge solutions tailored for AI and high-performance computing (HPC). The integration of Intel's latest Xeon 6 processors into our MiTAC and TYAN server platforms transforms computational capabilities, significantly enhancing AI performance, boosting efficiency, and scaling cloud operations. These advancements empower our customers with a competitive edge through superior performance and optimized total cost of ownership." said Rick Hwang, President of MiTAC Computing Technology Corporation. New MiTAC/TYAN servers with Intel Xeon 6: trusted performance and exceptional efficiency Intel® Xeon® 6 introduces two classes of processors to meet diverse requirements. Featuring high memory bandwidth and rich I/O with up to 8 channels of DDR5, up to 64 lanes of CXL 2.0, and up to 88 lanes of PCIe 5.0, Intel Xeon 6700 with Efficient-cores (E-cores) deliver high core density and exceptional performance per watt, offering distinct advantages for cloud-scale workloads that demand high throughput. With exceptional memory bandwidth and I/O, Performance-cores (P-cores) excel in the widest range of workloads and provide better AI performance than other CPUs. Additionally, the built-in accelerators of P-cores give an additional boost to targeted workloads for greater performance and efficiency. E-cores and P-cores have a compatible architecture with a shared software stack and enjoy the support of the largest ecosystem of hardware and software vendors. MiTAC presents two new dual-socket server platforms powered by Intel® Xeon® 6 processors. Tailored for HPC and AI workloads, TX86-E7148 (codenamed "Katmai Pass") is the follow-on model of Intel server D50DNP family that accommodates up to 4 computing modules within a 2U enclosure and supports both air and liquid cooling for different facility infrastructure. TX77A-E7142 (codenamed "Deer Creek Pass"), the follow-on model of Intel server M50FCP family, is a full-featured, performance-optimized platform made for data-intensive applications. TYAN debuts three Intel® Xeon® 6-based server products at COMPUTEX. First up is the Thunder HX FT83B-B7149, a 4U dual-socket server platform designed for massive-parallel AI and HPC workloads. Featuring 32 DDR5 RDIMM slots and up to 8 double-width PCIe 5.0 x16 slots, FT83B-B7149 is a powerful platform for computing intensive AI and HPC applications. The next is Thunder CX GC73A-B5660, a single-socket 1U server accommodating 12 hot-swap NVMe U.2 drive bays, 2 standard PCIe 5.0 x16 and 2 OCP 3.0 mezzanine slots for on-prem. edge compute/storage applications. Lastly, TYAN presents the Tempest HX S5662, a single-socket AI server motherboard in standard CEB form factor built for multiple GPU cards deployment. It supports 8 DDR5 RDIMM slots, 5 PCIe 5.0 x16 slots, 2 NVMe M.2 slots, dual 25GbE and one GbE ports. 4th and 5th Gen Intel® Xeon® Scalable processor server platforms: meeting the growing needs of AI, HPC, and cloud In July 2023, Intel transitioned the right to manufacture and sell products based on the Intel Data Center Solution Group (DSG) designs to MiTAC. Ever since then, MiTAC has dedicated itself to continuous investment in and support for the DSG product lineup. This year at COMPUTEX 2024, MiTAC unveils its DSG products. The Intel server D50DNP family, powered by 4th and 5th Gen Intel Xeon Scalable processors or the Intel Xeon CPU Max series, delivers exceptional computing performance, along with enhanced AI and in-memory analytics acceleration integrated into the processor. In the meantime, the Intel server M50FCP family delivers outstanding compute performance, high-speed I/O, and memory throughput for most of mainstream server applications. TYAN also offers a diverse range of products supporting 4th and 5th Gen Intel® Xeon® Scalable processors. For deskside AI servers, TYAN introduces the Thunder HX FT65T-B5652, a rack-convertible, pedestal single-socket server platform designed for up to 4 double-slot GPU cards adoption. TYAN provides several types of density servers for different workload requirement in space-constraint datacenters. The Thunder CX TD76-B5658 is a 2U enclosure accommodates 4 single-socket server nodes for high-density computing requirement; Thunder CX GC68A-B7136 is a 1U dual-socket server implementation with 16 DDR5 RDIMM slots and hybrid storage configuration; Thunder CX GC79A-B7132 is the other 1U dual-socket server provides up to 32 DDR5 RDIMM slots and all-flash configuration, For mainstream 2U dual-socket storage servers, Thunder HX TS75A-B7132 and Thunder SX TS70A-B7136 are the two platforms providing high data IOPs with hybrid 2.5" drive configurations whereas Thunder SX TS70-B7136 is the other implementation for larger storage capacity requirement by having 12 3.5" hybrid drive bays. For cold data storage, Thunder SX TX88-B5652, a single-socket storage server featuring 24 3.5" SATA and 2 2.5" NVMe hot-swappable and tool-less drive bays, is recommended. In addition to server systems, TYAN also showcases its 4th and 5th Gen Intel® Xeon® CPU-based industry standard motherboards at the booth. The highlighted products are Tempest HX S5652 - an AI server board designed for deploying multiple GPU cards in CEB form factor and Tempest HX S7130, a mainstream dual-socket board supporting 5 PCIe 5.0 slots in EEB form factor. Apart from the mentioned products, MiTAC and TYAN also provide other solutions to cater to various needs. One solution is the TYAN Thunder CX GX40-B5573, equipped with Intel Xeon E-2400 processors, tailored for cloud and on-premise computing. This 1U one-socket server system is designed for cost-effective edge computing, presenting an ideal option for small businesses. And, there's an O-RAN DU server presented by MiTAC: the WS1S11 (Whitestone2). This DU server supports 4th Gen Intel® Xeon® Scalable processors with Intel® vRAN boost and features IEEE1588 time sync, synchronous ethernet, onboard NIC for ORAN FH/MH, and dual -48VDC power input. About MiTAC Computing Technology Corp. MiTAC Computing Technology Corp, a MiTAC Holdings Corp. (TSE:3706) subsidiary, specializes in cloud and edge computing solutions and has over 30 years of design and manufacturing expertise. With a strong focus on large-scale data centers, the company offers flexible and customized supply models for various systems and applications. Its product lineup includes TYAN servers, ORAN servers, high-performance AI servers, and data center products. Intel Datacenter Solutions Group (DSG) transited its business to MiTAC since July 2023, allowing MiTAC expanding its product offerings with cutting-edge total cost of ownership solutions for next-gen data center equipment. MiTAC Computing Technology Corporation website: www.mitacmct.comMiTAC DSG website: https://datacentersolutions.mitacmct.com/ About TYAN TYAN, as a leading server brand of MiTAC Computing Technology Corporation under the MiTAC Holdings Corp. (TSE:3706), designs, manufactures and markets advanced x86 and x86-64 server/workstation board technology, platforms and server solution products. Its products are sold to OEMs, VARs, System Integrators and Resellers worldwide for a wide range of applications. TYAN enables its customers to be technology leaders by providing scalable, highly-integrated, and reliable products for a wide range of applications such as server appliances and solutions for HPC, hyper-scale/data center, server storage, AI and security appliance markets. For more information, please visit TYAN's website at http://www.tyan.com or MiTAC Computing Technology Corporation website at http://www.mitacmct.com Intel, the Intel logo, and other marks are trademarks of Intel Corporation or its subsidiaries.
HAMBURG, Germany, May 14, 2024 /PRNewswire/ -- Today, the subsidiary of MiTAC Holdings Corp.(TSE:3706), MiTAC Computing Technology and its server brand TYAN®, the leading manufacturer in server platform design worldwide, bring their new server platforms to the ISC 2024 event, booth #B01 in Hamburg, Germany. These solutions harness the power of the latest AMD EPYC 9004 series and AMD Ryzen 7000 series, along with the 5th Gen Intel Xeon Scalable Processors, offering optimized performance for HPC needs. Advanced HPC Server Platforms by MiTAC and TYAN Spotlighted at ISC High Performance 2024 MiTAC introduces its revolutionary lineup of DSG products Driven by shared values, MiTAC and Intel have had a strong partnership for years. Last year, MiTAC took over the manufacturing and sales of products designed by Intel Datacenter Solution Group (DSG). Today, MiTAC presents two models from its DSG product lineups, which are from the Intel Server M50FCP Family and the Intel Server D50DNP Family, at ISC 2024. First, MiTAC displays a multi-node server, the Intel Server System D50DNP1MHEVAC 1U Half-Width air-cooled compute module with EVAC heatsink from the Intel Server D50DNP Family (Denali Pass). Intel® Server D50DNP family is the highest-performance density server featuring 5th/4th Gen Intel® Xeon® Scalable Processors or the Intel® Xeon® CPU Max Series and purpose-built modules, delivering robust performance, efficiency, and scalability tailored to specific needs for AI computing. Then, there is the 1U Intel Server System M50FCP1UR204 from the Intel Server M50FCP Family (Fox Creek Pass). Supporting 5th/4th Gen Intel® Xeon® Scalable processors, the general purpose Intel® Server M50FCP Family offers robust compute capabilities, integrated accelerators, and exceptional I/O and memory bandwidth, making it the perfect solution for handling data-intensive mainstream tasks. TYAN brings HPC optimized servers at ISC 2024 The Transport CX TD76-B8058 is a 2U 4-node single-socket HCI server powered by AMD EPYC 9004 processors. Each node includes 16 DDR5-4800 DIMM slots, 4 hot-swappable E1.s drive bays, 2 NVMe M.2 slots, 1 OCP v3.0 LAN mezzanine slot, and 1 standard PCIe 5.0 x16 slot. Front I/O facilitates efficient network cable routing, while rear-accessible hot-swappable cooling fans and redundant 80+ Titanium power supplies ensure optimal system serviceability. Powered by 5th/4th Gen Intel Xeon Scalable processor, TYAN Thunder CX TD76-B5658 is a 2U 4 nodes single-socket server designed for high-density cloud server deployment. It comes with shared system fans, redundant 80+ Titanium power supplies, and hot-swappable modules for simple maintenance. Additionally, it offers front I/O for effortless network cable management, and each node supports PCIe 5.0 x16, OCP v3.0 LAN mezzanine, and NVMe E1.s SSDs. Apart from the above, TYAN provides the Transport CX GX40-B8016 for those requiring entry-level servers. This compact 1U AMD Ryzen cloud server is perfect for front-end portal and edge computing tasks in data centers. It features 4 DDR5-4800 UDIMM slots, supports up to 4 SATA drives, 2 NVMe M.2 slots, and one PCIe 5.0 x16 slot. About MiTAC Computing Technology Corp. MiTAC Computing Technology Corp, a MiTAC Holdings Corp. (TSE:3706) subsidiary, specializes in cloud and edge computing solutions and has over 30 years of design and manufacturing expertise. With a strong focus on large-scale data centers, the company offers flexible and customized supply models for various systems and applications. Its product lineup includes TYAN servers, 5G ORAN servers, high-performance AI servers, and data center products. Intel Datacenter Solutions Group (DSG) transited its business to MiTAC since July 2023, allowing MiTAC expanding its product offerings with cutting-edge total cost of ownership solutions for next-gen data center equipment. MiTAC Computing Technology Official website: www.mitacmct.com MiTAC DSG website: https://datacentersolutions.mitacmct.com/ About TYAN TYAN, as a leading server brand of MiTAC Computing Technology Corporation under the MiTAC Holdings Corp. (TSE:3706), designs, manufactures and markets advanced x86 and x86-64 server/workstation board technology, platforms and server solution products. Its products are sold to OEMs, VARs, System Integrators and Resellers worldwide for a wide range of applications. TYAN enables its customers to be technology leaders by providing scalable, highly-integrated, and reliable products for a wide range of applications such as server appliances and solutions for HPC, hyper-scale/data center, server storage, AI and security appliance markets. For more information, please visit TYAN's website at http://www.tyan.com or MiTAC Computing Technology Corporation website at http://www.mitacmct.com AMD, the AMD Arrow logo, EPYC, Ryzen and combinations thereof are trademarks of Advanced Micro Devices, Inc. Intel, the Intel logo, Xeon and combinations thereof are trademarks of Intel Corporation
Complete Data Center Liquid-Cooled Solutions Enable AI Factories to be Constructed at Unprecedented Speeds Using the Latest Dense GPU Servers Equipped with the Highest-Performing CPUs and GPUs SAN JOSE, Calif. and HAMBURG, Germany, May 13, 2024 /PRNewswire/ -- International Supercomputing Conference (ISC) -- Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is addressing the most demanding requirements from customers who want to expand their AI and HPC capacities while reducing data center power requirements. Supermicro delivers complete liquid-cooled solutions, including cold plates, CDUs, CDMs, and entire cooling towers. A significant reduction in the PUE of a data center is quickly realized with data center liquid-cooled servers and infrastructure, and this can reduce overall power consumption in the data center by up to 40%. "Supermicro continues to work with our AI and HPC customers to bring the latest technology, including total liquid cooling solutions, into their data centers," said Charles Liang, president and CEO of Supermicro. "Our complete liquid cooling solutions can handle up to 100 kW per rack, which reduces the TCO in data centers and allows for denser AI and HPC computing. Our building block architecture allows us to bring the latest GPUs and accelerators to market, and with our trusted suppliers, we continue to bring new rack-scale solutions to the market that ship to customers with a reduced time to delivery." Supermicro application-optimized high-performance servers are designed to accommodate the most performant CPUs and GPUs for simulation, data analytics, and machine learning. The Supermicro 4U 8-GPU liquid-cooled server is in a class by itself, delivering petaflops of AI computing power in a dense form factor with the NVIDIA H100/H200 HGX GPUs. Supermicro will soon ship liquid-cooled Supermicro X14 SuperBlade in 8U and 6U configurations, the rackmount X14 Hyper, and the Supermicro X14 BigTwin. Several HPC-optimized server platforms will support the Intel Xeon 6900 with P-cores in a compact, multi-node form factor. Learn more about how Supermicro Rack Scale Integration Services enable you to reduce costs and optimize your data center: https://www.supermicro.com/en/solutions/rack-integration In addition, Supermicro continues its leadership shipping the broadest portfolio of liquid cooled MGX Products in the industry.. Supermicro also confirms its support for delivering the latest accelerators from Intel with its new Intel® Gaudi® 3 accelerator and AMD's MI300X accelerators. With up to 120 nodes per rack with the Supermicro SuperBlade®, large-scale HPC applications can be executed in just a few racks. Supermicro will display a wide range of servers at the International Supercomputing Conference, including Supermicro X14 systems incorporating the Intel® Xeon® 6 processors. Supermicro will also showcase and demonstrate a wide range of solutions designed specifically for HPC and AI environments at ISC 2024. The new 4U 8-GPU liquid-cooled servers with NVIDIA HGX H100 and H200 GPUs highlight the Supermicro lineup. These servers and others will support the NVIDIA B200 HGX GPUs when available. New systems with high-end GPUs accelerate AI training and HPC simulation by bringing more data closer to the GPU than previous generations by using high-speed HBM3 memory. With the incredible density of the 4U liquid-cooled servers, a single rack delivers (8 servers x 8 GPUs x 1979 Tflops FP16 (with sparsity) = 126+ petaflops. The Supermicro SYS-421GE-TNHR2-LCC can use dual 4th or 5th Gen Intel Xeon processors, and the AS -4125GS-TNHR2-LCC is available with dual 4th Gen AMD EPYC™ CPUs. The new AS -8125GS-TNMR2 server gives users access to 8 AMD Instinct™ MI300X accelerators. This system also includes dual AMD EPYC™ 9004 Series Processors with up to 128 cores/256 threads and up to 6TB memory. Each AMD Instinct MI300X accelerator contains 192GB of HBM3 memory per GPU, all connected with an AMD Universal Base Board (UBB 2.0). Moreover, the new AS -2145GH-TNMR-LCC and AS -4145GH-TNMR APU servers are targeted to accelerate HPC workloads with the MI300A APU. Each APU combines high-performance AMD CPU, GPU, and HBM3 memory for 912 AMD CDNA™ 3 GPU compute units, 96 "Zen 4" cores, and 512GB of unified HBM3 memory in a single system. At ISC 2024, a Supermicro 8U server with the Intel Gaudi 3 AI Accelerator will be shown. This new system is designed for AI training & Inferencing and can be directly networked with a traditional Ethernet fabric. Twenty-four 200 gigabit (Gb) Ethernet ports are integrated into every Intel Gaudi 3 accelerator, providing flexible and open-standard networking. In addition, 128GB of HBM2e high-speed memory is included. The Intel Gaudi 3 accelerator is designed to scale up and scale out efficiently from a single node to thousands to meet the expansive requirements of GenAI models. Supermicro's Petascale storage systems, which are critical for large-scale HPC and AI workloads, will also be displayed. The Supermicro SuperCloud Composer will be demonstrated for the data center management software, showing how, from a single console, an entire data center can be monitored and managed, including the status of all liquid-cooled servers. Learn more about Supermicro's presence at ISC 2024 at: https://app.swapcard.com/event/isc-high-performance-2024/exhibitor/RXhoaWJpdG9yXzE1NjYyODE=? About Super Micro Computer, Inc. Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first to market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are a Total IT Solutions manufacturer with server, AI, storage, IoT, switch systems, software, and support services. Supermicro's motherboard, power, and chassis design expertise further enable our development and production, enabling next generation innovation from cloud to edge for our global customers. Our products are designed and manufactured in-house (in the US, Asia, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling). Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc. All other brands, names, and trademarks are the property of their respective owners. SMCI-F
Delivering an on-demand Infrastructure as-a-Service (IaaS) model, the new solution fast-tracks the deployment of high-density data centers to empower the adoption of leading high-performance technologies. Further strengthen Hong Kong’s role as an AI Innovation and FinTech Hub in the region. HONG KONG SAR - Media OutReach Newswire - 19 April 2024 - NTT Com Asia Limited ("NTT") today announced the launch of a new High Performance Computing (HPC) as-a-Service Solution in Hong Kong to help enterprises streamline and fast-track the deployment of high-density data centers to fuel the massive growth in compute-intensive workloads, further reinforcing Hong Kong's role as an AI Innovation and FinTech Hub in the region. Developed in collaboration with Dell Technologies (NYSE: DELL), the solution brings together the capabilities of two key market players - combining NTT's direct liquid cooling (DLC) enabled data center infrastructure and managed services with Dell advanced computing technology. From left to right: Steven So, Senior Vice President, Data Center Hong Kong, NTT Com Asia; Alex Chan, Vice President, Enterprise and Digital Solutions, NTT Com Asia; Jackie Kwong, General Manager of Dell Technologies Hong Kong & Macau; Leo Tsou, Director of Systems Engineering of Dell Technologies. The new solution delivers HPC resources to support customers with end-to-end deployment – from co-location, infrastructure hosting, and computing servers to managed services. Available on a flexible as-a-service commercial model, customers can enjoy fast deployment of high-performance computing of more than 50 kW within NTT Financial Data Center and Taipo Data Center in Hong Kong[1]. "We are seeing a rapid take-up of AI and emerging technologies at scale across businesses in Hong Kong and Asia, which poses new challenges to traditional IT infrastructure." Alex Chan, Vice President, Enterprise and Digital Solutions, NTT Com Asia said. "Alongside Dell Technologies, we're offering enterprise customers a turnkey solution that allows them to scale up their IT infrastructure quickly and cost-efficiently with end-to-end deployment to ease operational hassle." Findings from an industry report indicate a surge in demand for data centers, substantially fuelled by the wave of generative AI and the need for more data processing capacity. Cushman & Wakefield predicts that the demand in Southeast Asia and North Asia (including Hong Kong) will grow by over 25% per year through 2028[2]. Despite the growth, increasing power consumption and cooling capabilities of data centers remain key challenges for enterprise deployment. "At Dell Technologies, we are dedicated to empowering organizations to generate faster, smarter outcomes with our cutting-edge, smart cooling technology." Jackie Kwong, General Manager of Hong Kong and Macau, Dell Technologies said. "We deliver energy-efficient infrastructure to help customers enhance server performance and cooling capabilities in data centers." "We are proud to be working with Dell Technologies to offer this new solution for all our customers. At NTT, we pride ourselves for the state-of-the-art data center infrastructure and the reliability we bring to our customers. The collaboration makes NTT data center in Hong Kong an ideal location to support the demanding processor-intensive deployments that are fast-becoming vital to the transformation of modern enterprises in the AI era." Steven So, Senior Vice President, Data Center Hong Kong, NTT Com Asia said. More information available at: Power Innovations with Direct Liquid Cooling | NTT Hong Kong [1] Based on NTT's testing result of NTT Financial Data Centre (January 2024) [2] Cushman & Wakefield: KKR, Bain Capital Plow Into Asia Data Centers on AI, Cloud Boom - Bloomberg (January 2024) Hashtag: #NTTThe issuer is solely responsible for the content of this announcement.About NTT Com Asia LimitedAs part of NTT Group, a world-class leader in telecommunications and ICT services, NTT Com Asia Limited ("NTT") is dedicated to delivering the best ICT infrastructure and disruptive technologies with the vision to enable a smarter world. Riding on the leading enterprise mobile technology from docomo business in Japan, we are bringing cutting-edge and ready-to-market IoT, AI and other digital solutions to support enterprises to develop a mobile-first strategy in their digitalization journey. For more information, please visit: www.ntt.com.hk.
TAIPEI, April 10, 2024 /PRNewswire/ -- Infortrend® Technology, Inc. (TWSE: 2495), the industry-leading enterprise storage provider, today announced the release of the cutting-edge EonStor GS 5000U U.2 NVMe hybrid flash unified storage series, specially designed to accelerate the implementation of AI, machine learning (ML), and high-performance computing (HPC) applications. EonStor GS 5024UE, the first released model of the EonStor GS 5000U U.2 NVMe hybrid flash storage series, offers several significant improvements to deliver ultimate performance gains for AI and HPC applications. The newly added features include the 5th Gen Intel® Xeon® Processor, PCIe 5.0, and NVMe-oF, enabling GS 5024UE to double the throughput performance compared to the preceding top-performing model. Combined with 100GbE, GS 5024UE achieves an impressive 50GB/s throughput and 1.3M IOPS with a low latency of 0.3 milliseconds. All these advancements make GS 5024UE stand out as the perfect choice for contemporary AI and HPC applications requiring storage with exceptional performance and low latency for extensive dataset processing workloads featuring simultaneous random and sequential data access. EonStor GS 5024UE provides over 700TB of storage capacity in a compact 2U 24-bay design. The solution can keep pace with the growing data from completed projects with 20PB of hybrid storage achieved by connecting SAS HDD JBOD. With built-in intelligent algorithms, GS 5024UE extends SSD lifespan and safeguards against data loss by preventing failures of multiple SSDs. "We are excited to announce the expansion of our storage portfolio with EonStor GS 5024UE delivering top-tier performance for HPC, AI and ML workloads that require real-time processing, helping enterprises to achieve the desired business outcomes quickly," said Frank Lee, Senior Director of Product Planning at Infortrend Technology. Infortrend will feature EonStor GS 5024UE at booth #SL9133 at the NAB Show, April 14-17, in Las Vegas. Learn more about EonStor GS 5000UE and Solutions for HPC About Infortrend Infortrend (TWSE: 2495) has been developing and manufacturing storage solutions since 1993. With a strong emphasis on in-house design, testing, and manufacturing, Infortrend storage delivers performance and scalability with the latest standards, user friendly data services, personal after-sales support, and unrivaled value. For more information, please visit www.infortrend.com Infortrend® and EonStor® are trademarks or registered trademarks of Infortrend Technology, Inc.; other trademarks are the property of their respective owners.
A12 藝術空間
HPC
請先登入後才能發佈新聞。
還不是會員嗎？立即 加入台灣產經新聞網會員 ，使用免費新聞發佈服務。 （服務項目） （投稿規範）
