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符合「HPC」新聞搜尋結果, 共 702 篇 ,以下為 25 - 48 篇 訂閱此列表,掌握最新動態
InPsytech Joins Intel Foundry Accelerator IP Alliance to Boost HPC, AI, And Automotive Applications

HSINCHU, March 14, 2025 /PRNewswire/ -- InPsytech, Inc., a leading provider of high-performance semiconductor intellectual property (IP) solutions under Egis Group, is pleased to announce its participation in the Intel Foundry Accelerator IP Alliance. The collaboration will bring InPsytech's advanced IP offerings to the Intel Foundry ecosystem, enabling mutual customers to design their semiconductor products using Intel Foundry's cutting-edge process technologies. InPsytech provides a range of high-speed interface IPs, including UCIe, ONFI, LPDDR5X, DDR4/5, MIPI D-PHY, MIPI C-PHY, and MIPI A-PHY, for integration into Intel Foundry's advanced process nodes as part of the Intel Foundry Accelerator IP Alliance program. These IPs are crucial for high-speed data transfer, memory interface, and efficient communication in modern semiconductor devices, providing customers with robust and scalable solutions optimized for Intel Foundry's process technology. "Our collaboration with Intel Foundry marks a significant milestone for InPsytech as we expand our footprint in the semiconductor industry," said Alex Wang, CEO of InPsytech, Inc. "By joining the Intel Foundry Accelerator IP Alliance, we aim to provide our global customers with state-of-the-art IP solutions that meet the growing demands of next-generation semiconductor applications, from AI and machine learning to high-performance computing and automotive electronics." InPsytech's IP offerings, such as UCIe and LPDDR5X, provide high-performance connectivity and memory interfaces that are vital for enabling fast, reliable, and energy-efficient designs. By leveraging these IPs, Intel Foundry customers will have access to high-quality solutions that can enhance their design capabilities, reduce development time, and improve product reliability. "Intel Foundry is committed to fostering innovation and providing our partners with the highest level of technology and manufacturing excellence," said Suk Lee, VP & GM of Ecosystem Technology Office, Intel Foundry. "We are excited to welcome InPsytech to the Intel Foundry Accelerator IP Alliance. Their IP solutions in the areas of HPC, AI, and automotive will play a crucial role in helping our mutual customers accelerate their design processes and create innovative semiconductor products efficiently." The Intel Foundry Accelerator Ecosystem Alliance fosters a comprehensive collaboration between Intel Foundry and its ecosystem partners, aiming to streamline the design process, reduce risks and costs, and accelerate time-to-market for innovative semiconductor products. InPsytech's participation in this program aligns with its commitment to delivering cutting-edge IP solutions that empower semiconductor designers worldwide.

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 1486 加入收藏 :
MiTAC Computing Showcases Cutting-Edge AI and HPC Servers at Supercomputing Asia 2025

G4520G6 and TN85-B8261 Servers Deliver Unparalleled Performance for AI, ML, and HPC Workloads. SINGAPORE, March 11, 2025 /PRNewswire/ -- MiTAC Computing Technology Corp., a subsidiary of MiTAC Holdings Corp. (TSE:3706) and a global leader in server design and manufacturing, will showcase its latest AI and HPC innovations at Supercomputing Asia 2025, taking place from March 11 at Booth #B10. The event highlights MiTAC's commitment to delivering cutting-edge technology with the introduction of the G4520G6 AI server and the TN85-B8261 HPC server—both engineered to meet the growing demands of artificial intelligence, machine learning, and high-performance computing (HPC) applications. Join MiTAC Computing in SCA25 to Empower the Future of AI and HPC G4520G6 AI Server: Performance, Scalability, and Efficiency Redefined The G4520G6 AI server redefines computing performance with an advanced architecture tailored for intensive workloads. Key features include: Exceptional Compute Power – Supports dual Intel® Xeon® 6 Processors with TDP up to 350W, delivering high-performance multi-core processing for AI-driven applications. Enhanced Memory Performance – Equipped with 32 DDR5 DIMM slots (16 per CPU) and 8 memory channels, supporting up to 8,192GB DDR5 RDIMM/3DS RDIMM at 6400 MT/s for superior memory bandwidth. Unmatched GPU Support – Supports up to eight full-height, dual-slot NVIDIA H200 NVL, NVIDIA H100 NVL, or NVIDIA L40S for scale-out AI training, ML, and rendering applications. Featuring the NVIDIA H200 GPU with 141GB of HBM3e memory and nearly 27 petaflops of FP8 deep learning compute, it accelerates AI and HPC workloads with exceptional speed and efficiency. Superior Connectivity – Equipped with three standard PCIe 5.0 x 16 expansion slots and three OCP v3.0 mezzanine slots, the MiTAC G4520G6 platform enables high-performance network connectivity, such as NVIDIA ConnectX NICs, BlueField-3 SuperNICs and DPUs, for clustered computing. Advanced Cooling & Power Efficiency – Engineered for superior thermal management, it includes eight hot-swap system fans and four external hot-swap fan modules. Four hot-swap CRPS power supplies provide (3+1) redundancy, delivering up to 9,600W with 80+ Titanium efficiency. TN85-B8261: Versatile 2U Server for HPC and AI Workloads The TN85-B8261 is a versatile 2U server designed to deliver exceptional performance for high-performance computing and AI applications. Key highlights include: Powerful Dual-Socket Performance – Supports AMD EPYC 9005 / 9004 processors, delivering exceptional computing power for AI and HPC workloads. Scalable Memory Architecture – Features (12+12) DDR5 DIMM slots, supporting up to 6,144GB DDR5-6000 RDIMM/LRDIMM for high-speed data processing. Flexible Expansion Capabilities – Supports up to four full-height, dual-slot enterprise H100 NVL and L40S GPUs for scalable AI training, machine learning, and rendering applications. Additionally, two half-height, half-length PCIe 5.0 x16 slots enable high-performance cluster networking deployment. Optimized Connectivity & Management – Dual 10GBase-T LAN ports for high-bandwidth networking and an AST2600 BMC with IPMI 2.0 & Redfish support for remote server management. Reliable Power Efficiency – (1+1) redundant 2,700W hot-swap CRPS power supplies with 80+ Titanium efficiency, delivering sustainable energy and operational reliability. Driving Innovation in AI and HPC MiTAC Computing is dedicated to pushing the boundaries of AI and HPC technology. The G4520G6 and TN85-B8261 servers are designed to empower enterprises and research institutions with exceptional compute power, scalability, and energy efficiency, ensuring optimal performance for next-generation workloads. Visit MiTAC Computing at Supercomputing Asia 2025 MiTAC Computing invites attendees to experience the power of the G4520G6 AI Server and TN85-B8261 HPC Server firsthand at Supercomputing Asia 2025. Visit our booth #B10 to explore how our latest innovations can accelerate AI and HPC applications. For more information, please visit the links below: G4520G6 product page: https://www.mitaccomputing.com/en/spec/Barebones/G4520G6_G4520G6U2BC-N#sp  TN85-B8261: https://www.mitaccomputing.com/en/spec/Barebones/TN85B8261_B8261T85E8HR-2T-N About MiTAC Computing Technology Corporation MiTAC Computing Technology Corp., a subsidiary of MiTAC Holdings, delivers comprehensive, energy-efficient server solutions backed by industry expertise dating back to the 1990s. Specializing in AI, HPC, cloud, and edge computing, MiTAC Computing employs rigorous methods to ensure uncompromising quality not just at the barebone level but, more importantly, at the system and rack levels—where true performance and integration matter most. This commitment to quality at every level sets MiTAC Computing apart from others in the industry. The company provides tailored platforms for hyperscale data centers, HPC, and AI applications, guaranteeing optimal performance and scalability. With a global presence and end-to-end capabilities—from R&D and manufacturing to global support—MiTAC Computing offers flexible, high-quality solutions designed to meet unique business needs. Leveraging the latest advancements in AI and liquid cooling, along with the recent integration of Intel DSG and TYAN server products, MiTAC Computing stands out for its innovation, efficiency, and reliability, empowering businesses to tackle future challenges. MiTAC Computing Technology Corporation website: https://www.mitaccomputing.com/

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 788 加入收藏 :
神雲科技嶄新的MiTAC AI 及 HPC 伺服器,將於2025年亞洲超級運算大會亮相

神雲科技將於2025年亞洲超級運算大會,展示嶄新的MiTAC AI 及 HPC 伺服器 – G4520G6 和 TN85-B8261,為人工智慧、機器學習和高效能運算工作負載,提供無與倫比的效能。 新加坡2025年3月11日 /美通社/ -- 作為專業的伺服器設計與製造商,神達控股股份有限公司(股票代號:3706)旗下的子公司 神雲科技股份有限公司(MiTAC Computing Technology Corp.),於 3 月 11 日在2025年亞洲超級運算大會(SCA)的展位 #B10,展出最新伺服器產品。在此次展會聚焦MiTAC G4520G6 AI 伺服器和 TN85-B8261 HPC 伺服器,彰顯神雲科技致力於提供最領先的技術 – 這兩款伺服器均專為滿足人工智慧(AI)、機器學習(ML)和高效能運算(HPC)應用日益增長的需求而設計。 神雲科技參與 2025年亞洲超級運算大會 – 驅動AI與高效能運算創新 MiTAC G4520G6 AI 伺服器:重新定義效能、可擴充性與效率 MiTAC G4520G6 AI 伺服器採用專為密集型工作負載設計的先進架構,重新定義運算效能。主要功能包括: 卓越的運算能力 - 支援雙 Intel® Xeon® 6 處理器,TDP 高達 350W,為 AI 驅動的應用,提供高效能多核心處理能力。 更強的記憶體效能 - 配備 32 組 DDR5 DIMM 插槽(每顆 CPU 16 個)和 8 個記憶體通道,以 6400 MT/s 的速度支援最高 8,192GB DDR5 RDIMM/3DS RDIMM,提供卓越的記憶體頻寬。 無與倫比的 GPU 支援 - 支援多達 8 張全高、雙插槽企業級 NVIDIA H200 NVL,NVIDIA H100 NVL,或 NVIDIA L40S,用於擴充人工智慧訓練、機器學習及渲染應用。主力的NVIDIA H200 GPU,擁有141GB 的HBM3e 記憶體,和近 27 petaflops 的 FP8 深度學習運算能力,可加速 AI 和 HPC 工作負載,提供卓越的速度與效率。 優異的通訊能力 - 配備 3 個標準 PCIe 5.0 x16 擴充插槽和 3 個 OCP v3.0 網路擴充子卡插槽,神雲科技G4520G6 伺服器可為叢集運算提供高效能網路連接。 高階散熱與電源效率 - 針對極致散熱管理所設計,內建 8 顆熱插拔系統風扇與 4 顆外接熱插拔風扇模組。4 顆熱插拔 CRPS 電源供應器可提供(3+1)冗餘,高達 9,600W 的輸出功率,並具備 80+ 鈦金效率。 MiTAC TN85-B8261:適用於高效能運算與 AI 工作負載的多功能 2U 伺服器 MiTAC TN85-B8261 是一款多功能 2U 伺服器,為高效能運算與人工智慧應用提供卓越效能。主要亮點包括: 強大的雙插槽效能 - 支援 AMD EPYC 9005 / 9004 處理器,提供卓越的運算能力,適用於 AI 和 HPC 工作負載。 可擴充的記憶體架構 - 配備 (12+12) 個 DDR5 DIMM 插槽,支援最高 6,144GB DDR5-6000 RDIMM/LRDIMM,提供高速資料處理能力。 靈活的擴充能力 - 支援最多 4 張全高、雙插槽企業級 H100 NVL 和 L40S GPU,適用於可擴充的人工智慧訓練、機器學習與渲染應用。此外,2 個半高半長的 PCIe 5.0 x 16 插槽可支援高效能叢集網路部署。 最佳化的連接與管理 - 雙 10GBase-T網路埠提供高頻寬連線能力,AST2600 BMC 支援 IPMI 2.0 與 Redfish,實現遠端伺服器管理。 可靠的電源效率 – (1+1)冗餘2,700W 熱插拔 CRPS 電源供應器,具備 80+ 鈦金效率,確保能源永續性與系統穩定運行。 推動人工智慧與高效能運算領域的創新 神雲科技致力於推動 AI 和 HPC 技術的發展。MiTAC G4520G6 和 TN85-B8261 伺服器能為企業與研究機構提供卓越的運算能力、可擴充性與能源效率,確保最佳效能,以支援新世代工作負載。 誠摯邀請您參觀 2025年亞洲超級運算大會神雲科技展位 神雲科技誠摯邀請與會者親臨 2025年亞洲超級運算大會,親身體驗MiTAC G4520G6 AI 伺服器與 TN85-B8261 HPC 伺服器的強大功能。歡迎蒞臨展位 #B10,了解我們的最新技術如何加速人工智慧與高效能運算應用。 欲了解更多資訊,請造訪以下連結: G4520G6 產品頁面:https://www.mitaccomputing.com/cn/spec/Barebones/G4520G6_G4520G6U2BC-N#sp TN85-B8261 產品頁面:https://www.mitaccomputing.com/cn/spec/Barebones/TN85B8261_B8261T85E8HR-2T-N 神雲科技股份有限公司簡介 神雲科技股份有限公司(MiTAC Computing Technology Corp.)為神達控股集團(MiTAC Holdings)旗下子公司,憑藉自 1990 年代以來的深厚產業經驗,提供多元、節能高效的伺服器解決方案。專注於人工智慧(AI)、高效能運算(HPC)、雲端運算及邊緣計算,神雲科技採用嚴謹的方法,確保不僅在單機(Barebone)層級,更重要的是在系統與機櫃層級,皆能達到無與倫比的品質,充分發揮卓越效能與系統整合。這項對品質的承諾,使神雲科技在業界獨樹一幟。神雲科技為超大規模數據中心、HPC 及 AI 應用,提供量身打造的解決方案,確保最佳效能與高擴展性。 神雲科技擁有全球布局與端到端的服務能力,涵蓋研發、製造到全球技術支援,提供靈活且高品質的解決方案,以滿足企業的多元化需求。憑藉 AI 及液冷技術的最新發展,以及 Intel DSG 與 TYAN 伺服器產品的整合,神雲科技致力於打造兼具創新、效率與可靠性的伺服器技術與產品,助力企業迎接未來挑戰。 神雲科技官方網站:https://www.mitaccomputing.com  

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 1884 加入收藏 :
Infortrend Unveils New High-Density Storage Solution with Over 100% Performance Boost for HPC and Media & Entertainment

TAIPEI, Jan. 14, 2025 /PRNewswire/ -- Infortrend® Technology, Inc. (TWSE: 2495), the industry-leading enterprise storage provider, introduces the latest additions to its high-density 4U 90-bay HDD solutions: unified storage EonStor GS 5090 and expansion enclosure JB 4090. The large capacity and high throughput performance of the solutions make them ideal for applications like High-Performance Computing and Media & Entertainment. EonStor GS 5090 is a high-availability unified storage solution with a dual redundant controller design, ensuring uninterrupted operation. With its new hardware powered by the Intel® Xeon® Scalable Processor, the GS 5090 delivers ultra-high performance, achieving 45 GB/s read and 20 GB/s write—around three times the performance of the previous top-performing model. The GS 5090 introduces ultra-fast 200GbE connectivity, setting a new benchmark for data transfer speed while simplifying management to meet the demands of today's high-performance enterprise workloads. It also supports SAS 24G expansion, doubling throughput compared to SAS 12G. Additionally, the GS 5090 features four dedicated U.2 NVMe SSD slots for cache, providing fast data access while fully leveraging the ample capacity of its 90-bay storage. Furthermore, the GS 5090 offers seamless scalability through expansion with the new JB 4090 JBOD. Featuring SAS 24G expansion ports, the JB 4090 delivers double the bandwidth of its 90-bay JBOD predecessor with SAS 12G, effectively eliminating bottlenecks between the storage system and the JBOD. With this enhanced throughput capability, the JB 4090 can efficiently handle large volumes of data. "Our new high-density GS 5090 storage and JB 4090 JBOD deliver impressive capacity and significant performance increase. These products reflect our commitment to innovation in managing the exponential growth of data in modern applications, providing scalability and efficiency without compromising performance," said Frank Lee, Senior Director of Product Planning at Infortrend Technology. Learn more about EonStor GS 5090 and JB 4090 Contact Infortrend to Make an Inquiry  About Infortrend Infortrend (TWSE: 2495) has been developing and manufacturing storage solutions since 1993. With a strong emphasis on in-house design, testing, and manufacturing, Infortrend storage delivers performance and scalability with the latest standards, user-friendly data services, personal after-sales support, and unrivaled value. For more information, please visit www.infortrend.com Infortrend® and EonStor® are trademarks or registered trademarks of Infortrend Technology, Inc.; other trademarks are the property of their respective owners.

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 527 加入收藏 :
Supermicro Begins Volume Shipments of Max-Performance Servers Optimized for AI, HPC, Virtualization, and Edge Workloads

Completely Upgraded Servers with the New Intel® Xeon® 6900 Series Processors with P-Cores Optimized for Maximum Performance are Now Shipping in Volume, Featuring Next-Generation GPU Support, Higher-Bandwidth Memory, 400GbE Networking, E1.S and E3.S Drives, and the Industry's Leading Direct-to-Chip Liquid Cooling Solutions SAN JOSE, Calif., Jan. 9, 2025 /PRNewswire/ -- Supermicro, Inc. (NASDAQ: SMCI) a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge is commencing shipments of max-performance servers featuring Intel Xeon 6900 series processors with P-cores. The new systems feature a range of new and upgraded technologies with new architectures optimized for the most demanding high-performance workloads including large-scale AI, cluster-scale HPC, and environments where a maximum number of GPUs are needed, such as collaborative design and media distribution. SBI-612BA-1NE34 "The systems now shipping in volume promise to unlock new capabilities and levels of performance for our customers around the world, featuring low latency, maximum I/O expansion providing high throughput with 256 performance cores per system, 12 memory channels per CPU with MRDIMM support, and high performance EDSFF storage options," said Charles Liang, president and CEO of Supermicro. "We are able to ship our complete range of servers with these new application-optimized technologies thanks to our Server Building Block Solutions® design methodology. With our global capacity to ship solutions at any scale, and in-house developed liquid cooling solutions providing unrivaled cooling efficiency, Supermicro is leading the industry into a new era of maximum performance computing." Click here for more information. There are currently several X14 systems available to customers for remote testing and validation via Supermicro's JumpStart program. The Supermicro X14 systems are available in a variety of form factors, each optimized for a range of performance-intensive workloads: GPU-optimized supporting the latest generation of SXM and PCIe GPUs, featuring enhanced thermal capacities and direct-to-chip liquid cooling on some models. High density multi-nodes including all-new FlexTwin™ and GrandTwin® models as well as the proven, award-winning SuperBlade® architecture. These models leverage shared components to increase efficiency and can be fitted with direct-to-chip liquid cooling for maximum performance density. Market-proven Supermicro Hyper rackmounts combine single or dual socket architectures with flexible I/O and storage configurations in traditional rackmount form factors to help enterprises and data centers scale up and out as their workloads evolve. Supermicro's max-performance X14 systems support the Intel Xeon 6900 series processors with P-cores, which feature up to 128 performance cores per CPU, support for high bandwidth MRDIMMs up to 8800 MT/s, and built-in accelerators including the AI-specific Intel AMX. The X14 systems represent the perfect building blocks for data centers at any scale, with Supermicro able to provide complete rack-level integration services including design, building, testing, validation, and delivery. An industry-leading global manufacturing capacity of up to 5,000 racks per month (2,000 liquid cooled) and extensive testing and burn-in facilities allow Supermicro to deliver solutions at any scale in a matter of weeks, not months. With Supermicro's complete in-house liquid-cooled direct-to-chip cold plate solutions, liquid cooling can be easily included in rack-level integrations to further increase system efficiency, reduce instances of thermal throttling, and lower both the TCO and Total Cost to Environment (TCE) of data center deployments. These turn-key solutions include the rack, cabling, power, and cooling infrastructure to simplify solution deployment at scale. To maximize the performance and density potential of the latest X14 systems, Supermicro also offers complete in-house developed liquid cooling solutions including cold plates for CPUs, GPUs, memory, Cooling Distribution Units, Cooling Distribution Manifolds, hoses, connectors, and cooling towers. Liquid cooling is easily included in rack-level integrations to increase system efficiency, reduce instances of thermal throttling, and lowers both the TCO and Total Cost to the Environment (TCE) of data center deployments. Supermicro max-performance X14 systems featuring Intel Xeon 6900 series processors with P-cores include: GPU-optimized – The highest performance Supermicro X14 systems designed for large-scale AI training, large language models (LLMs), generative AI and HPC, and supporting eight of the latest-generation SXM5 and SXM6 GPUs. These systems are available in air-cooled or liquid-cooled configurations. PCIe GPU – Designed for maximum GPU flexibility, supporting up to 10 double-width PCIe 5.0 accelerator cards in a thermally-optimized 5U chassis or edge-optimized 3U chassis. These servers are ideal for AI inferencing, media, collaborative design, simulation, cloud gaming, and virtualization workloads. Intel® Gaudi® 3 AI Accelerators – Supermicro is now shipping the industry's first AI server based on the Intel Gaudi 3 accelerator hosted by Intel Xeon 6 processors. Designed to increase the efficiency and lower the cost of large-scale AI model training and AI inferencing, the system features eight Intel Gaudi 3 accelerators on an OAM universal baseboard, six integrated OSFP ports for cost-effective scale-out networking, and an open platform designed to use a community-based, open-source software stack, requiring no software licensing costs. SuperBlade® – Supermicro's X14 6U high-performance, density-optimized, and energy-efficient SuperBlade maximizes rack density, with up to 100 servers and 200 GPUs per rack. Optimized for AI, HPC, and other compute-intensive workloads, each node features air cooling or direct-to-chip liquid cooling to maximize efficiency and achieve the lowest PUE with the best TCO, as well as connectivity up to four integrated Ethernet switches with 100G uplinks and front I/O supporting a range of flexible networking options up to 400G InfiniBand or 400G Ethernet per node. FlexTwin™ – The new Supermicro X14 FlexTwin architecture is purpose-built for HPC, cost-efficient, and designed to provide maximum compute power and density in a multi-node configuration with up to 24,576 performance cores in a 48U rack. Optimized for HPC and other compute-intensive workloads, each node features direct-to-chip liquid cooling only to maximize efficiency and reduce instances of CPU thermal throttling, as well as HPC low latency front and rear I/O supporting a range of flexible networking options up to 400G per node. Hyper – X14 Hyper is Supermicro's flagship rackmount platform designed to deliver the highest performance for demanding AI, HPC, and enterprise applications, with single or dual socket configurations supporting double-width PCIe GPUs for maximum workload acceleration. Both air cooling and direct-to-chip liquid cooling models are available to facilitate the support of top-bin CPUs without thermal limitations and reduce data center cooling costs while also increasing efficiency. About Super Micro Computer, Inc. Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first to market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are a Total IT Solutions provider with server, AI, storage, IoT, switch systems, software, and support services. Supermicro's motherboard, power, and chassis design expertise further enables our development and production, enabling next generation innovation from cloud to edge for our global customers. Our products are designed and manufactured in-house (in the US, Asia, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling).   Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.  All other brands, names, and trademarks are the property of their respective owners. SYS-212HA-TN   SYS-212HA-TN-FRONT   SYS-222FT-HEA-LCC-ANGLE   SYS-222FT-HEA-LCC-FRONT   SYS-422GA-NBRT-LCC   SYS-522GA-NRT   SYS-A22GA-NBRT    

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 900 加入收藏 :
S2C Launches Prodigy S8-100 Series: 100M Gate FPGA Prototyping for AI and HPC

SAN JOSE, Calif., Dec. 20, 2024 /PRNewswire/ -- S2C, a global leader in FPGA-based prototyping solutions, announces its Prodigy S8-100 Logic System, the latest addition to the eighth-generation family, is shipping and deployed by leading enterprises. Designed to address the growing demands of AI and HPC, the S8-100 series delivers unparalleled scalability, flexibility, and efficiency. Powered by AMD Versal™ Premium VP1902 adaptive SoC with 100M ASIC gate capacity, the S8-100 delivers 2x logic resources and 2.5x the I/O bandwidth when compared with its predecessor S7-19P. Available in Single, Dual, and Quad FPGA configurations, the S8-100 supports medium-scale to hyperscale designs with ease, making it a versatile choice for advanced chip development. Highlights: Rich Resources: The S8-100 delivers remarkable resources, featuring 18,507K system logic cells, 858Mb of internal memory, 6,864 DSP slices, dual-core Arm Cortex A72 and dual-core Arm Cortex R5 in each FPGA module. High-Speed & Flexible I/O Architecture: Equipped with 2,212 XPIOs supporting dynamic I/O voltages (1.0V–1.5V) and GTM/GTYP transceivers with PCIe Gen5 and data rates of up to 56Gbps, the S8-100 effortlessly meets a wide range of system requirements. Scaling and Partitioning Made Easy: PlayerPro-CT partitioning software supports TDM-driven, multi-strategy scheduling and placements. Fully automated flow takes RTL to bitstream with simple clicks, significantly boosting productivity. High Productivity Toolchain: Add-on tools, including PlayerPro-DT for multi-FPGA debugging, ProtoBridge for co-simulation, and an extensive library of Prototype Ready IP of pre-validated daughter cards, speed adapters, memory interface models and reference designs, accelerate deployment and shorten the development cycle. The S8-100 Logic System, with a capacity of 100M ASIC gates per FPGA, doubles the resources of its predecessor, the S7-19P, and offers a 2.5x increase in I/O bandwidth. Featuring high I/O counts and 32/56Gbps transceivers supporting protocols such as PCIe Gen5 and QSFP-DD, it combines robust performance with flexible scalability, meeting the demands of complex logic designs. In particular, advanced RISC-V cores can comfortably fit inside a single S8-100 system without the need to partition. A three to five times boost in performance can be expected. For hyperscale AI and HPC designs, the S8-100 reduces partitioning complexity, simplifies topology, and facilitates seamless optimization. To accelerate deployment, S2C offers a library of ready-to-use daughter cards, memory adapters, speed adapters, and reference designs. These tools streamline the setup of validation environments and simplify system integration. Frequently adopted options include high-speed PCIe Gen5, 400G Ethernet, and LPDDR/DDR5, and common SoC interfaces such as QSPI, MIPI D-PHY, and JTAG/debug, matching the needs across diverse applications. Combining the S8-100 with fully automated timing-driven partitioning software enables one-click flow from RTL to bitstream, simplifying the steps of large design partitioning. S2C's robust toolchain, including real-time control (Player Pro-RunTime), multi-debugging (Player Pro-DebugTime) and co-simulation (ProtoBridge), significantly boosts productivity, making it an essential tool for complex chip design. "The era of AI has begun, and chip design is getting ever more difficult to keep up." said Ying J Chen, VP of marketing. "Prodigy S8-100 with expanded capacity and superior performance is here to provide a robust verification solution for innovation in AI and HPC. Availability The Prodigy S8-100 Series (Single/Dual/Quad) is shipping now. For more information, please contact your local S2C representative or visit www.s2cinc.com. About S2C S2C is a leading global supplier of FPGA prototyping solutions for today's innovative SoC and ASIC designs, now with the second largest share of the global prototyping market. S2C has been successfully delivering rapid SoC prototyping solutions since 2003. With over 600 customers, including 11 of the world's top 25 semiconductor companies, our world-class engineering team and customer-centric sales team are experts at addressing our customers' SoC and ASIC verification needs. S2C has offices and sales representatives in San Jose, Seoul, Tokyo, Shanghai, Hsinchu, India, Europe and ANZ.

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 834 加入收藏 :
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