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符合「Flip-Chip」新聞搜尋結果, 共 29 篇 ,以下為 1 - 24 篇 訂閱此列表,掌握最新動態
Hikvision achieves TÜV Rheinland Green Product Mark as first in LED display industry

HANGZHOU, China, Oct. 19, 2024 /PRNewswire/ -- Hangzhou Hikvision Digital Technology Co., Ltd. ("Hikvision") announced that 16 of its LED display products received the Green Product Mark certification from TÜV Rheinland—the first in the LED display industry achieving this distinction. Based on the 2 PfG E 0052/06.2024 standard, this certification highlights compliance with stringent environmental criteria. TÜV Rheinland, with over 150 years of history, is a member of the UN Global Compact and the Global Ecolabelling Network, making its certifications widely recognized. Hikvision achieves TÜV Rheinland Green Product Mark as first in LED display industry The certified products include the CW, BW, and other series, covering various mainstream packaging technologies. They passed comprehensive evaluations in product technical compliance, restricted substances control, carbon footprint, and recyclability. Recognized for outstanding environmental performance and sustainability, these products adhere to high green standards throughout. Hikvision achieves TÜV Rheinland Green Product Mark as first in LED display industry Hikvision's LED products strictly follow rigorous environmental standards in material selection and production. By using eco-friendly materials, optimizing designs, implementing intelligent manufacturing, and enforcing strict quality control, the products minimize environmental impact throughout their lifecycle. Notably, the casings are made with up to 90% recycled aluminum, and packaging cartons use 100% recycled materials, significantly reducing waste. Moreover, the new generation of Hikvision's LED products incorporates three energy-saving technologies: flip-chip packaging, common cathode driving, and intelligent power systems. These innovations significantly reduce carbon emissions, standing out among high-energy-consuming industrial products. They also achieve a remarkable reduction in greenhouse gas emissions. In addition to environmental features, these LED products maintain industry-leading quality. They utilize proprietary display control systems for stability and safety. Dynamic energy-saving algorithms automatically recognize high-brightness image details and adjust local brightness seamlessly, providing a comfortable viewing experience while enhancing image quality and reducing energy consumption. Earning the TÜV Rheinland Green Product Mark certification underscores Hikvision's commitment to green and low-carbon production. The company has consistently invested in green innovation, integrating sustainable design concepts like automation, modularization, and recyclability into product development. By focusing on the entire product lifecycle—from raw materials to end-of-life—Hikvision ensures its products meet green requirements throughout. Looking ahead, Hikvision will continue to embed sustainability into its operations, promoting social responsibility alongside business growth. More about Hikvision's LED Products All raw materials of Hikvision's LED products undergo strict inspections, including tests for photoelectric parameters, environmental adaptability, electrical properties, stability, dimensional accuracy, material characteristics, and appearance, ensuring quality before production. By deploying intelligent manufacturing equipment—achieving automatic SMT, assembly, aging, packaging, and warehousing—the entire process is fully automated, effectively preventing quality issues. With bases in Hangzhou and Wuhan, and over 20 automated production lines, annual production of Hikvision LED display screens exceeds 500,000 square meters. Hikvision operates seven laboratories covering EMC, environmental testing, safety regulations, electrical performance, and more, holding certifications such as CNAS, UL, and CCC. These facilities enable LED products to undergo rigorous tests for temperature impact, salt spray, vibration, dissipation, and waterproofing, ensuring stable and reliable operation in various environments. For more details and updates, please visit the official website of Hikvision Commercial Displays.  

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 1212 加入收藏 :
LG Innotek Becomes Industry's First to Use AI to Prevent Input of Defective Raw Materials in Production

Achieved early detection of cause of defects in raw materials through AI, becoming "first to overcome this challenge in the industry" Applied to high-value semiconductor substrates, analyzing raw material defects in only one minute Reduces defect analysis time by up to 90% SEOUL, South Korea, Oct. 7, 2024 /PRNewswire/ -- Today, LG Innotek (CEO Moon Hyuksoo) announced the development and application of the industry's first "Artificial Intelligence (AI)-based inspection system for incoming raw materials", designed to detect defects at the point of receipt and prevent the use of substandard raw materials in the process. LG Innotek applied its AI-based inspection technology, developed by combining material information and AI image processing technologies, to the RF-SiP (Radio Frequency System-in-Package) process. Recently, the technology was also introduced for the FC-BGA (Flip Chip Ball Grid Array), and is expected to further enhance the competitiveness and quality of LG Innotek's high-value semiconductor substrate products. Previously, incoming raw materials underwent only a visual inspection before entering the production process. However, the continued advancement of semiconductor substrate technology changed this. Even after improving all in-process defect causes, failures in reliability evaluations continued to rise. This led the quality of incoming materials to gain attention as a decisive factor affecting reliability evaluations.  The core raw materials (i.e. Prepreg (PPG), Ajinomoto Build-up Film (ABF), and Copper-Clad Laminate (CCL)) that comprise semiconductor substrates arrive as a mixture of glass fibers, inorganic compounds, and other components. In the past, air voids (gaps between particles) or foreign particles generated during the material mixing process did not significantly impact product performance. However, as substrate specifications, such as circuit spacing, have become increasingly stringent, the presence of air voids and foreign particles, depending on their size, has started to cause defects. As a result, it is virtually impossible to identify which part of the raw material is responsible for the defect using traditional visual inspection methods, which has become a significant challenge for the industry. If we were to compare one lot of raw materials mixture (unit of raw materials with the same characteristics that goes into the production process) to a batch of cookie dough, it is impossible for the eye to perceive the concentration of salt or sugar in a certain portion, the number of air holes in the dough, or the number of foreign particles. LG Innotek has found a way to overcome this industry challenge with AI. Its "AI-based Inspection System for Incoming Raw Materials" has been trained with tens of thousands of pieces of data on the composition of materials that are either suitable or unsuitable for a product. Based on this, it analyzes the components and defective areas of semiconductor substrate raw materials in only one minute, with an accuracy rate of over 90%, and visualizes quality deviations in each lot of raw materials. By using AI machine learning to visualize, quantify, and standardize material configurations optimized for quality, LG Innotek has been able to prevent defective raw materials from entering the production process. The company can change the material design based on the quality deviation information visualized by the AI system, allowing it to ensure that the quality of the raw materials lot is uniform at a suitable level before entering the process. An LG Innotek official commented, "With the "AI-based Inspection System for Incoming Raw Materials", the time required to analyze defects has been decreased by up to 90%, and the cost of resolving the causes of defects has been significantly reduced." LG Innotek plans to enhance the AI system's detection capabilities by sharing raw materials-related data with customers and suppliers in the substrate sector through digital partnerships. Additionally, the company aims to expand the system's application to optical solutions, such as camera modules, where the image-based detection of material defects can play a crucial role. LG Innotek CTO S.David Roh said, "With the "AI-based inspection system", we will complete LG Innotek's unique AI ecosystem, which delivers exceptional customer value by identifying causes of product defects early in the production process." He added, "We will continue innovating in digital production technology to create top-quality products at the lowest cost and in the shortest time."

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 202 加入收藏 :
Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024

New Report from SEMI, TECHCET and TechSearch International Highlights Growth Drivers through 2028 MILPITAS, Calif., Oct. 1, 2024 /PRNewswire/ -- Powered by strong semiconductor demand across diverse end applications, the global semiconductor packaging materials market is expected to start a growth cycle with a 5.6% compound annual growth rate (CAGR) projected through 2028, SEMI, TECHCET and TechSearch International announced today in their latest Global Semiconductor Packaging Materials Outlook (GSPMO) report. The report highlights AI as an expected growth driver for advanced packaging applications, despite currently low unit volumes due to the newness of the market segment. Global Semiconductor Packaging Materials Outlook through 2028 The GSPMO report provides comprehensive data and forecasts for substrates, leadframes, bonding wire, and additional advanced packaging materials. "After a challenging 2023, which saw a 15.5% decline in the semiconductor packaging materials market, our latest report forecasts a return to growth in 2024," said Lita Shon-Roy, TECHCET President and CEO. "The global packaging materials market is expected to exceed $26 billion by 2025 and continue solid growth through 2028." "Substrates account for a large portion of the revenue for the packaging materials market, and within the category, FC-BGA substrates make up the majority of the revenue growth," said Jan Vardaman, President of TechSearch International. "The CAGR for flip chip BGA/LGA revenue is expected to be 7.6% from 2023 to 2028. Other key growth areas include wafer-level packaging (WLP) dielectrics and flip chip underfill. The laminate substrates segment is expected to grow 7.3% annually in volume, while leadframes and bonding wire are also forecasted to recover, growing by 5.0% and 6.4%, respectively." The GSPMO 2024 report is designed to help companies capitalize on emerging trends, navigate supply chain challenges, and make informed decisions in sourcing high-performance materials. Features of the report include: Technology trends Regional market size and forecast Five-year market forecast to 2028 Market size by product segments in revenue and units Excel workbook file summarizing market information Supplier information and market share For more information on the report or to subscribe, visit SEMI Market Data or contact the SEMI Market Intelligence Team (MIT) at mktstats@semi.org. About SEMISEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members' business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more. Association Contacts Samer Bahou/SEMI CommunicationsPhone: 1.408.943.7870Email: sbahou@semi.org   

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 243 加入收藏 :
Smartkem 宣布與 Chip Foundation 的合作開發協議,攜手開發用於液晶顯示器的新一代 Micro LED 背光技術

英格蘭曼徹斯特2024年9月12日 /美通社/ -- Smartkem(納斯達克:SMTK)是一間運用其顛覆性有機薄膜晶體管 (OTFT) 為下一代顯示器提供電力的公司,今天宣布已與上海芯基半導體科技有限公司 (簡稱 Chip Foundation) 簽訂聯合開發協議。半導體和集成電路元件製造商(「Chip Foundation」)共同開發用於液晶顯示器的新一代微發光二極體 (Micro LED) 背光技術。 聯合開發協議規定,Smartkem 將向 Chip Foundation 提供其專有的有機介電體單層材料或再分布層 (RDL),以結合其自有的 microLED 裝置,共同開發以 microLED 為基礎的裝置結構。作為共同開發項目的一部分,Smartkem 將開發絕緣材料,可以由 Chip Foundation 使用,將其專有的 Micro LED 設備結合成一個包含四個串聯接線的微 LED 組合中的高性能 Mini LED 封裝。產生的晶片預計具有高亮度和高電流效率的特性,能夠降低驅動背光的功率損耗,並提高照明的均勻性。 Smartkem 董事長兼行政總裁 Ian Jenks 表示:「JDA 與 Chip Chip Foundation 預計將進一步向顯示產業的客戶展現我們介電單層材料的商業可行性。這份 JDA 緊接著我們與台灣工業技術研究院 (ITRI) 簽訂技術合作協議,在其 Gen 2.5 混合動力試產線上進行產品原型開發,並揭示出我們的商業化策略正持續進化。」 Chip Foundation 主席 Maosheng Hao 博士表示:「Smartkem 獲公認為 OTFT 解決方案的領先供應商,在有機介電材料、有機半導體材料和相關工藝方面,擁有豐富的專業知識與經驗。其塗層工藝科技解決方案,非常適合 Chip Foundation 在 mini/MicroLED 領域的專門工序和技術。我們相信兩間公司的合作有潛力,可以加快顯示器行業的進步,和對這項科技的廣泛採用。」 有關 Smartkem 的資訊,可在納斯達克網站上找到:https://www.nasdaq.com/market-activity/stocks/smtk。 Smartkem 簡介 Smartkem 致力於以其顛覆性的有機薄膜電晶體 (OTFT) 重塑電子世界,並借助 OTFT 的潛力驅動下一代顯示器的發展。Smartkem 專利的 TRUFLEX® 半導體和介電墨水(又稱液體電子聚合物),可用於製造一種新型電晶體,有望革新顯示器產業。Smartkem 的墨水能夠實現低溫印列工藝,與現有製造基礎設施相容,繼而提供成本低廉且性能優於現有型號的顯示器。公司的電子聚合物平台可應用於多種顯示技術,包括 microLED、mini LED 和 AMOLED 顯示器,以滿足下一代電視機、手提電腦、虛擬實境 (VR) 頭戴式裝置、智能手錶和智能手機的需求。 Smartkem 在英國曼徹斯特的研發中心開發其材料,而半導體製造業務則在英國的 Centre for Process Innovation (CPI) 進行。Smartkem 亦在台灣設有現場應用辦事處。公司擁有豐富的知識產權矩陣,包括在 19 個專利族中獲得 125 項專利和 40 個經過編碼的商業秘密。有關更多資訊,請瀏覽:www.smartkem.com,並在 LinkedIn 上的 www.linkedin.com/company/smartkem-limited 和 Twitter @SmartkemOTFT 關注我們。 上海芯基半導體科技有限公司 (Chip Foundation) 簡介 上海芯基半導體科技有限公司 (Chip Foundation) 透過多年的持續研究和實踐,為氮化鎵 (GaN) 生長基板開發了全面的化學脫離 (CLO) 技術,並實現了大批生產。基板作為 GaN 材料和晶片的核心支撐,其作用無可取替。Chip Foundation 成功開發了一種新類型的複合圖案藍寶石基板,即介電圖案化藍寶石基板 (DPSS) ,與業界標準的圖案化藍寶石基板 (PSS) 顯著不同。利用精確的晶體平面控制橫向表面生長技術,晶片基底可將 GaN 表面層的位移密度降低至 10^7/cm² 的水平。對於大尺寸 LED 晶片,可以忽略位置的影響;但對於 Micro LED 晶片來說,脫位的負面影響將越來越顯著。基於 DPSS 基板,Chip Foundation 進一步創新了化學升級生長基板的加工技術。與傳統的雷射剝離法 (laser lift-off) 相比,化學剝離法 (chemical lift-off) 在成本效益和產品良率方面表現優異。雷射剝離法對晶片的洩漏性能產生不利影響,而化學剝離法可以有效提高晶片的洩漏性能,這結論已經實驗證,其物理機制也經清楚闡明。 這些技術可以有效促進 MIcro LED 晶片的大批生產,可用於生產迷你薄膜覆晶技術 (Mini Thin-film Flip-chip) LED 晶片。由於省去了基板減薄、雷射劃線和開裂製程,而且晶片之間幾乎不需要劃線通道,因此成本優勢相當顯著。Chip Foundation 已開發以薄膜晶片為基礎的晶圓級封裝 (wafer-level packaging) 技術,以及可充分發揮薄膜晶片優勢的 MIni LED 背光技術。 GaN 材料在電子功率和射頻晶片中的優勢也是無可匹敵的。我們的核心技術(DPSS 基板,橫向表軸生長技術,化學脫離基板技術)可有效解決電子功率和射頻芯片的可靠性和散熱問題;Chip Foundation 期待在這些領域以各種形式與各單位合作。 前瞻性聲明 本新聞稿中所有非歷史事實的陳述均為前瞻性陳述,包括但不限於有關 Smartkem 對其市場地位和市場機會的預期、有關其產品開發、製造和銷售以及與其合作夥伴和投資者的關係的預期和計劃。這些陳述並非歷史事實,而是基於 Smartkem Inc. 當前的預期、估計和預測,當中涉及其業務、營運和其他類似或相關因素。如「可能」、「將」、「能夠」、「會」、「應該」、「預期」、「預測」、「潛在」、「繼續」、「有望」、「打算」、「計劃」、「預測」、「相信」、「估計」和其他類似或相關的表述均用作辨別該等前瞻性陳述,惟並非所有前瞻性陳述均包含該等詞彙。前瞻性陳述涉及諸多已知及未知風險、不確定性及難以或無法預測的假設,乃至在某些情況下超出本公司之控制,因此請勿過度依賴前瞻性陳述。實際結果可能因多種因素而顯著有別於與前瞻性陳述中的結果,其中該等因素包括本公司向美國證券交易委員會提交的文件中所述者。即便獲得新的資訊,本公司概無義務修改或更新本新聞稿所載的資訊,以反映日後的事件或情況。

文章來源 : PR Newswire 美通社 發表時間 : 瀏覽次數 : 1120 加入收藏 :
ACE Solution and HON. PRECISION Unveil Advanced Compound Semiconductor and Silicon Photonics Technologies at SEMICON Taiwan 2024

Hsinchu, Taiwan, September 9, 2024 -SEMICON Taiwan officially opened on September 6, 2024, with ACE Solution and HON. PRECISION is joining forces to showcase its latest advancements in silicon photonics testing technology, precision measurement, and automated machinery integration. Their exhibition focused on high-density optoelectronic integration testing solutions designed to meet the increasing demands of silicon photonics for high-capacity and high-channel testing. The integrated optoelectronic signal testing system effectively addresses the challenges posed by increased data center traffic and high-speed transmission needs, significantly boosting transmission rates and reducing energy consumption. With semiconductor packaging evolving towards Co-Packaged Optics (CPO), ACE Solution highlighted its silicon photonics solutions developed through deep collaboration with Quantifi, integrating PXI testing modules to offer an efficient, multi-system testing solution supporting 800G and 1.6T high-speed transmission. These integrated solutions meet the research and production needs for high-speed, high-precision, and high-efficiency testing while offering programmable automation for flexible applications.   ACE Solution also demonstrated its latest innovations in compound semiconductor testing. The Teradyne ETS-88 testing platform is widely used for SiC, GaN, PMIC, automotive electronics, aerospace, and defense industries. Key features include multi-site CP, second-contact KGD, dynamic/static power device FT, and fully automated high-output module FT. The ETS-364 and ETS-800 platforms are tailored for mixed-signal, digital, and analog testing, offering the industry's highest-spec power IC testing capabilities with support for up to 6000V and 4000A, making them ideal for high-current, high-voltage applications, particularly in EV power and battery management.   The TZ-6000 non-destructive wafer and materials inspection system utilizes terahertz (THz) technology, focusing on compound semiconductor testing for GaAs, SiC, and GaN. It offers greater penetration depth and flexibility, handling various sizes and shapes of wafers. Equipped with advanced wafer probes and intelligent software analysis, it can simultaneously measure parameters such as thickness, refractive index, resistivity, dielectric constant, surface/subsurface defects, and full wafer scans, enabling non-destructive wafer quality measurements.   The Electro-Optic Terahertz Pulse Reflectometer (EOTPR) is the world's first instrument to use isolation technology to detect IC package faults and monitor package quality, making it ideal for non-destructive defect detection in 3DIC package analysis. With 5-micron pinpoint precision, the EOTPR is widely used in advanced IC packaging fault analysis for devices such as stacked packages (PoP), flip-chip, and TSV in 3D packaging. Major semiconductor companies have extensively deployed EOTPR for advanced IC packaging quality assurance in manufacturing environments.   Steve Hsu, President of ACE Solution, stated, "With over 20 years of experience in hardware-software integration, ACE Solution has expanded from wireless communication testing to various testing fields, meeting the needs of our local clients. We are thrilled to collaborate with HON. PRECISION to showcase our achievements in automation and precision testing." Alan Hsieh, President of HON. PRECISION commented, "This exhibition marks a new milestone in our partnership with ACE Solution. We look forward to offering more advanced solutions, fostering greater collaboration and innovation across the industry."   For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Peter Lee, Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw Website: https://www.acesolution.com.tw/en/   About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to the specific requirements of our customers in the field of electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished team of technical experts who offer unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively.    

文章來源 : 筑波科技股份有限公司 發表時間 : 瀏覽次數 : 762 加入收藏 :
筑波科技與鴻勁精密亮相 SEMICON Taiwan 2024 展示先進化合物半導體與矽光子技術

台灣新竹,2024年09月09日,SEMICON 國際半導體展盛大開幕,筑波科技 (ACE Solution) 與鴻勁精密 (Hon. Precision) 攜手參展,展示光電整合矽光子測試技術、精密量測及自動化機台的整合,著重高密度與光電結合測試方案,專為應對高容量與高通道的矽光電子測試需求,提供高度集成的光電信號一體化測試系統,有效應對高速傳輸和數據中心流量增加的挑戰,顯著提升傳輸速率並降低能耗。精密半導體封裝已邁向 CPO (Co-Packaged Optics) 發展,筑波科技此次展示的矽光子解決方案來自與 Quantifi 的深度合作,整合 PXI 測試模組提供高效整合的多機一體測試方案,支援 800G 和 1.6T 的高速傳輸。在光通訊與高速訊號介面傳輸的整合中,滿足研發與生產部門對高速率、高精度、高效率的測試需求,也具備靈活的可程式自動化規劃功能。   筑波科技還展示其在化合物半導體測試最新成果。Teradyne ETS-88 測試方案廣泛應用於 SiC、GaN、PMIC、車用電子、航空航天和國防工業等。該方案具備多工位 CP、二次接觸 KGD、動/靜一體功率器件 FT 和全自動高產出模組 FT 四大特色。ETS-364 和 ETS-800 則專門用於混合信號、數位和類比測試,提供業界最高規格功率 IC 測試平台可支持達 6000V 和 4000A 測試,能應對高電流、高電壓需求,尤其在電動車電源和電池管理等應用中具有優越性能。   TZ-6000 非破壞性晶圓和材料檢測系統利用太赫茲 (Terahertz, THz) 技術,專注於砷化鎵、碳化矽和氮化鎵等化合物半導體測試,提供更高穿透深度。具備高度靈活性,適用各種尺寸和形狀的晶圓,並配備獨有多元晶圓探頭及智能軟體分析功能,能同時測量多個參數,如厚度、折射率、電阻率、介電常數、表面/次表面缺陷及整個晶圓掃描,實現非破壞性晶圓品質測量。   電光太赫茲脈衝反射儀 (EOTPR) 是全球首款使用隔離技術檢測積體電路封裝故障和監測封裝品質的設備,特別適用於 3DIC 積體電路封裝的非破壞性缺陷檢測。該儀器提供 5 微米的定位精度,適合用於手機和電腦應用中複雜且先進積體電路芯片的故障分析,包括堆疊式封裝層迭 (PoP)、覆晶 (Flip-Chip) 和 3D 封裝中的矽通孔 (TSV) 等封裝形式。EOTPR 已在各大半導體公司的先進 IC 封裝故障分析領域得到廣泛應用,在品質保證與檢驗的製造環境大量部署。   筑波科技董事長許深福表示:「筑波科技擁有 20 年的軟硬體整合經驗,從無線通訊測試基礎延伸至各個測試領域,致力於滿足本地客戶的需求。我們非常高興能與鴻勁精密合作,共同展示我們的機構自動化與精密測試的協同技術成果。」鴻勁精密董事長謝旼達表示:「此次展會標誌著鴻勁與筑波科技合作的新里程碑。我們期待未來能夠提供更多先進解決方案,促進行業間的交流與合作。」未來筑波科技將與鴻勁精密持續攜手推動創新,為客戶提供卓越方案。   請追蹤筑波集團LinkedIn,掌握最新消息!   聯絡筑波科技 筑波科技股份有限公司ACE Solution, Co., Ltd. 地址:新竹縣竹北市台元街28號2樓之1 電話:03-5500909 電子郵件:service@acesolution.com.tw 網站:https://www.acesolution.com.tw/en/index/   關於筑波科技(ACE Solution) 筑波科技(https://www.acesolution.com.tw/en/index/)成立於2000年,位於台灣新竹,在中國蘇州和深圳以及越南設有分公司,可提供服務。我們的使命是提供訂製的測試解決方案,以滿足電氣元件、設備和系統製造商的客戶需求,通過合作夥伴提供技術解決方案。我們專注於射頻、毫米波和太赫茲領域,擁有專業的技術支援團隊,提供專業、創新和多功能的綜合技術和解決方案。

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