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符合「Electro Optical Terahertz Pulse Reflectometry」新聞搜尋結果, 共 5 篇 ,以下為 1 - 5 篇 訂閱此列表,掌握最新動態
Invitation: ACE Solution to Showcase Latest Semiconductor and Silicon Photonics Technologies at SEMICON Taiwan 2024

ACE Solution will participate in SEMICON Taiwan 2024 from September 4th to 6th Location: TaiNEX Hall 1 Booth: K3076 @HON. PRECISION   We will showcase the latest achievements in semiconductors and silicon photonics during the exhibition. ACE Solution will introduce the following solutions: 👉 Teradyne ETS Compound Semiconductor Testing: The industry’s highest-spec power IC testing platform accommodates a wide range of IC types, with testing capabilities reaching 6000V and 4000A. This platform addresses the challenges of high-current and high-voltage testing, particularly in electric vehicle power and battery management applications.   👉 TZ-6000 Non-Destructive Wafer and Material Inspection: Utilizing Terahertz (THz) technology, this solution offers superior penetration depth compared to silicon, silicon carbide, and gallium nitride for semiconductor wafers. It provides non-destructive measurements of wafer quality, including thickness, refractive index, resistivity, dielectric constant, surface/subsurface defects at selected locations, and full-wafer scanning.   👉 EOTPR Non-Destructive Testing for 3DIC Advanced Packaging: The Electro-Optical Terahertz Pulse Reflectometry (EOTPR) system delivers 5-micron accuracy for fault analysis in complex and advanced IC packaging, such as Package-on-Package (PoP), Flip-Chip, and Through-Silicon Via (TSV) in 3D packaging. EOTPR is widely adopted in advanced IC packaging fault analysis and is extensively deployed in quality assurance and inspection within manufacturing environments.   👉 Photonic Integrated Silicon Photonics Testing: In collaboration with Hon Precision, ACE Solution offers a highly integrated electro-optical signal testing system architecture. This solution supports high-capacity, high-channel testing to meet the demands of high-speed data transmission and increased data center traffic. Integrating photonics and electronics significantly enhances transmission rates while reducing power consumption, leading to improved testing efficiency.   We will also be organizing booth tours during the exhibition. Due to limited availability, spots will be arranged based on actual conditions, so please register early:https://docs.google.com/forms/d/e/1FAIpQLSe5vtgle1wl4dIxliik12YMNnObdqAFD7DwdBYVIxaxMWqlxQ/viewform?fbzx=-6591255857878872603   We welcome partners from all sectors to visit and discuss technical and business cooperation. 📢 Follow ACE Group LinkedIn, to stay updated with the news!       For media inquiries, please contact: ADVANCED COMM.ENGINEERING SOLUTION CO., LTD. Peter Lee, Jenny Lin Address: 2F-1, No.28, Taiyuan street, Jhubei City, Hsinchu County, 302, Taiwan Telephone: +886 3 5500909 #3801, +886 3 5500909 #3407 E-mail: service@acesolution.com.tw Website: https://www.acesolution.com.tw/en/   About ACE Solution Established in 2000, ACE Solution (https://www.acesolution.com.tw/en/) is headquartered in Hsinchu City, Taiwan, with branch offices strategically located in Suzhou and Shenzhen, China. Our company is dedicated to delivering tailored test solutions that cater to our customers' specific requirements in electrical components, devices, and system manufacturing. Furthermore, we collaborate with our esteemed partners to provide comprehensive technology solutions. At ACE Solution, we specialize in RF, mmWave, and terahertz technologies, boasting an accomplished technical expert team offering unparalleled support. Our commitment to professionalism, innovation, and versatility enables us to offer cutting-edge, integrated techniques and solutions. By leveraging our expertise, we empower our clients to overcome technological challenges and achieve their desired outcomes efficiently and effectively.  

文章來源 : 筑波科技股份有限公司 發表時間 : 瀏覽次數 : 498 加入收藏 :
皮托科技/筑波科技攜手成功參與SEMICON TAIWAN國際半導體展

台北,2023年09月06日 - 皮托科技(PITOTECH)與筑波科技(ACE Solution)成功攜手參加於9月6日(三)至9月8日(五)在台灣舉行的SEMICON TAIWAN國際半導體展。在此次展會上,兩家公司共同展示系統模擬、化合物半導體以及車用檢測技術。開幕式邀請政府和業界的重要官員參加,並且由SEMI國際半導體產業協會和鴻海研究院共同主辦功率暨光電半導體論壇(Power and Opto Semiconductor Forum)。   皮托科技與筑波科技攜手,旨在成為CAE模擬與量測的跨界最佳合作夥伴,以擴展半導體模擬與測試服務領域。在本次展覽中,皮托科技展示其解決半導體相關問題的能力,包括設計、規劃、量測和數據分析。特別是,分享使用COMSOL Multiphysics進行半導體元件和製程模擬的案例,詳細介紹半導體元件的設計和相關製程的模擬分析,結合人工智慧(AI)技術。並展示一個實際的半導體模擬器(COMSOL App)。筑波科技則重點介紹Eagle Test System (ETS)半導體製程測試的關鍵設備,ETS是業界最高規格的功率IC測試平台,可以涵蓋不同類型的IC測試,最高可達6000V和4000A,此設備已被歐洲、美國和亞洲等主要車用電子和PMIC設計公司廣泛採用,並分為ETS-88、364和800型系列。筑波科技還展示TZ-6000非破壞性材料和晶圓檢測技術以及EOTPR電光太赫茲脈衝反射儀。   皮托科技是台灣第一家將系統模擬概念引入半導體行業的技術顧問公司,同時也是SEMI智慧製造委員會的成員之一。該公司提供工業4.0解決方案、系統自動化模擬、自動化導入可行性驗證、CAE多重物理模擬等30年專案顧問諮詢服務,幫助客戶通過模擬來減少不必要的成本浪費,實現企業的ESG新使命。筑波科技擁有20年的無線通訊軟硬體系統整合經驗,最近加入SEMI功率暨化合物半導體委員會,以應對全球消費性產品、電動汽車(EV)高功率和高電流測試需求。該公司參與半導體產業鏈生態系統,提供半導體製程、非破壞性材料和晶圓、太赫茲隔離技術檢測等服務,同時在台灣和深圳設立EC半導體工程中心(Engineering Center),以滿足客戶的訂製需求。   聯絡皮托科技 皮托科技股份有限公司Pitotech Co., Ltd. 地址: 500013 彰化市金馬路二段519號12樓 電話: 04-7364000 電子郵件:pitotech@mail.pitotech.com.tw 網站:www.pitotech.com.tw   聯絡筑波科技 筑波科技股份有限公司ACE Solution, Co., Ltd. 地址:新竹縣竹北市台元街28號2樓之1 電話:03-5500909 電子郵件:service@acesolution.com.tw 網站:https://www.acesolution.com.tw/en/index/   關於皮托科技 皮托科技股份有限公司成立於1992年,由軟體系統處、設備工程 處, 兩 大 事 業 處 所 組 成, 主 要 軟 體 COMSOL Multiphysics 是一套高階專業數值模擬分析軟體、用於多重物理耦合建模,包括熱、固、流、聲、電、磁、波動、化學反應工程,藉由 COMSOL Multiphysics 模擬解決方案,讓公司在產品研發初期就能進行設計模擬,大幅縮短研發時程,有效因應高度客製化、彈性化和快速變動產業需求;另一公司主力強項為「 數位分身技術 - 產能策略規劃模擬」可於建廠、擴廠前知道機台要採購多少、產能、AGV 派工、瓶頸站、人機比、機台稼動率,最終能符合老闆期待之預期效益,降低投資風險,另外在機械手臂自動化產線、大數據分析、AI 人工智慧、可靠度工程分析等技術,都是公司引以為傲的技術能量。皮托科技客戶群涵蓋了台積電、奇美、聯電、友達..等,這些上市上櫃的大廠客戶面臨擴廠、整廠及生產線改造時,都選擇皮托科技為其規劃的顧問,不僅僅是因為滿意皮托提供的服務,更是皮托科技有一群專業的規劃顧問,並通過經濟部工業局技術能量登錄認證,秉持專業與服務熱誠,為更多企業廠商服務。   關於筑波科技(ACE Solution) 筑波科技(https://www.acesolution.com.tw/en/index/)成立於2000年,位於台灣新竹,在中國蘇州和深圳設有分公司。我們的使命是提供訂製的測試解決方案,以滿足電氣元件、設備和系統製造商的客戶需求,通過合作夥伴提供技術解決方案。我們專注於射頻、毫米波和太赫茲領域,擁有專業的技術支援團隊,提供專業、創新和多功能的綜合技術和解決方案。

文章來源 : 筑波科技股份有限公司 發表時間 : 瀏覽次數 : 6903 加入收藏 :
活動訊息:9/6(三)-9/8(五)皮托科技/筑波科技SEMICON TAIWAN國際半導體展

皮托科技是台灣第一家將系統模擬概念導入業界的技術顧問公司,提供工業4.0解決方案、系統自動化模擬、自動化導入可行性驗證、CAE多重物理模擬等30年專案顧問諮詢,以數位分身、工業元宇宙解決方案協助客戶以模擬減少不必要成本浪費以達成企業ESG新使命。筑波科技深耕無線通訊系統逾二十年,也切入車用市場與美商泰瑞達(Teradyne)及英商Teraview攜手合作推廣Eagle Test Systems (ETS)、TZ6000、EOTPR,已於台灣及深圳設立EC半導體工程中心(Engineering Center),滿足客戶客製化需求。基於全球消費性產品、電動汽車(EV)高功率、高電流測試需求,化合物半導體GaN(氮化鎵)與SiC(碳化矽)材料成為新主流,製程測試準確度足以影響整體PMIC,提供半導體製程檢測、非破壞性材料與晶圓檢測、太赫茲隔離技術檢測積體電路中封裝故障和品質為關鍵。   本次皮托科技和筑波科技共同合作參與9/6(三)-9/8(五)SEMICON TAIWAN國際半導體展,展示系統模擬、化合物半導體及車用檢測技術,敬邀您蒞臨交流。   方案展示: Eagle Test System (ETS):半導體製程測試的關鍵設備 TZ-6000:非破壞性材料與晶圓檢測技術 EOTPR:電光太赫茲脈衝反射儀   活動詳情: 日期:9/6(三)-9/8(五) 10:00-18:00 地點:115台北市南港區經貿二路1號(台北南港展覽館一館) 攤位號:K2287、K2288 聯絡窗口:林孟樺03-5500909#3407/ 0922168765 jenny_lin@acesolution.com.tw service@acesolution.com.tw 觀展線上報名:https://www.semicontaiwan.org/zh/about/register       聯絡皮托科技 皮托科技股份有限公司Pitotech Co., Ltd. 地址: 500013 彰化市金馬路二段519號12樓 電話: 04-7364000 電子郵件:pitotech@mail.pitotech.com.tw 網站:www.pitotech.com.tw   聯絡筑波科技 筑波科技股份有限公司ACE Solution, Co., Ltd. 地址:新竹縣竹北市台元街28號2樓之1 電話:03-5500909 電子郵件:service@acesolution.com.tw 網站:https://www.acesolution.com.tw/en/index/   關於皮托科技 皮托科技股份有限公司成立於1992年,由軟體系統處、設備工程 處, 兩 大 事 業 處 所 組 成, 主 要 軟 體 COMSOL Multiphysics 是一套高階專業數值模擬分析軟體、用於多重物理耦合建模,包括熱、固、流、聲、電、磁、波 動、化學反應工程,藉由 COMSOL Multiphysics 模擬解決方案,讓公司在產品研發初期就能進行設計模擬,大幅縮短研發時程,有效因應高度客製化、彈性化和快速變動產業需求;另一公司主力強項為「 數位分身技術 - 產能策略規劃模擬」可於建廠、擴廠前知道機台要採購多少、產能、AGV 派工、瓶頸站、人機比、機台稼動率,最終能符合老闆期待之預期效益,降低投資風險,另外在機械手臂自動化產線、大數據分析、AI 人工智慧、可靠度工程分析等技術,都是公司引以為傲的技術能量。皮托科技客戶群涵蓋了台積電、奇美、聯電、友達..等,這些上市上櫃的大廠客戶面臨擴廠、整廠及生產線改造時,都選擇皮托科技為其規劃的顧問,不僅僅是因為滿意皮托提供的服務,更是皮托科技有一群專業的規劃顧問,並通過經濟部工業局技術能量登錄認證,秉持專業與服務熱誠,為更多企業廠商服務。   關於筑波科技(ACE Solution) 筑波科技(https://www.acesolution.com.tw/en/index/)成立於2000年,位於台灣新竹,在中國蘇州和深圳設有分公司。我們的使命是提供訂製的測試解決方案,以滿足電氣元件、設備和系統製造商的客戶需求,通過合作夥伴提供技術解決方案。我們專注於射頻、毫米波和太赫茲領域,擁有專業的技術支援團隊,提供專業、創新和多功能的綜合技術和解決方案。

文章來源 : 筑波科技股份有限公司 發表時間 : 瀏覽次數 : 7330 加入收藏 :
National Yang Ming Chiao Tung University (NYCU) and Linköping University (LiU) Visit ACE Biotek-Achieves Digital Healthcare and Compound Semiconductor Cooperation Innovation

ACE Group develops smart hospital upload systems and third-generation semiconductor material testing solutions based on 20 years of wireless communication, IoT, software, and hardware integration experience. National Yang-Ming Chiao Tung University (NYCU) and Linköping University (LiU) visit the enterprise to see digital healthcare, Terahertz (THz), and semiconductor performance.   Industry-Academy Platform to Build Compound Semiconductor Advanced Materials Cooperation NYCU conducts a crucial project on the compound semiconductor. It applies advanced materials such as silicon carbide (SiC), gallium nitride (GaN) and gallium oxide (Ga2O3) to Power IC and RF. The project can build up advanced materials, software services, and platform design. Moreover, this can reach industry-academy partnerships. The Thin Film Physics Division of LiU conducts application-inspired basic research on thin films to fundamentally understand the atomistic nature of materials' properties and behavior and learn how to make materials perform better through new methods of synthesis and processing. The research concerns the design of new multifunctional materials for rigid and wear-resistant coatings, energy materials, magnetic materials, electronics, neutron-converting materials for the European spallation Source (ESS), wide-band gap semiconductors, and more.   Prof. of NYCU, Horng, Ray-Hua recognizes that" ACE Group differentiates from other material testing companies. We look forward to cooperating with THz technology on non-destructive detection and failure analysis of materials; on the other hand, the Uniiform digital handwriting system can contribute to education." The Professors from LiU also indicates that the THz technology is awe-inspiring and suggests that the possibilities with polarized waves, used for instance in THz-ellipsometry, may further improve and expand the technology. The visitors also commented that the Uniiform digital handwriting system could be a great tool in education.     ACE Group Competitive Advantages: Wireless Communication, Smart Hospital, and Semiconductor Integration Testing ACE Group specializes in RF electronic components, measuring instruments, communication system tests, and integration. Since 2014, the company has been committed to digital medicare and precision medical treatment of early diagnosis technology and devices. Combined with AI, it invents the Uniiform digital handwriting system and Data Stream (DS) for Anesthesiology (Spark), Ophthalmology (Eagle Park 100), and Dentistry medical form digital recording system particularly. ACE uses THz technology (TZ-6000) for wafer testing in the semiconductor testing field. Nowadays, ACE establishes partnerships with Teradyne to promote Eagle Test System (ETS). For the third-generation semiconductor, ETS can fulfill the high voltage and high current test solutions in automotive semiconductor production test requirements.   ACE Group invites Dr. Philip F. Taday, the scientist of Teraview, to join the panel discussion at this event. Electro-Optical Terahertz Pulse Reflectometry (EOTPR) is an innovative time domain reflectometry (TDR) system that Intel and TeraView have successfully developed. It uses the isolation technique that is the first place in the world to detect package failures and monitor the quality of integrated circuits. It’s the first choice for non-destructive defect detection of integrated circuit packaging. Interdisciplinary skills swapping creates the novel industry application and research of advanced semiconductor materials.

文章來源 : 筑波醫電股份有限公司 發表時間 : 瀏覽次數 : 4394 加入收藏 :
National Yang Ming Chiao Tung University (NYCU) and Linköping University (LiU) Visit ACE Biotek-Achieves Digital Healthcare and Compound Semiconductor Cooperation Innovation

ACE Group develops smart hospital upload systems and third-generation semiconductor material testing solutions based on 20 years of wireless communication, IoT, software, and hardware integration experience. National Yang-Ming Chiao Tung University (NYCU) and Linköping University (LiU) visit the enterprise to see digital healthcare, Terahertz (THz), and semiconductor performance.   Industry-Academy Platform to Build Compound Semiconductor Advanced Materials Cooperation NYCU conducts a crucial project on the compound semiconductor. It applies advanced materials such as silicon carbide (SiC) and gallium nitride (GaN) to Power IC and RF. The project can build up advanced materials, software services, and platform design. Moreover, this can reach industry-academy partnerships. The Semiconductor Materials Division of LiU develops and investigates materials for novel electronics, especially on wide bandgap semiconductors, semiconductor device materials, and the sublimation materials unit. LiU focuses on silicon carbide, III-nitrides, and graphene for fundamental and application-motivated issues of interest for Swedish and European industries.   ACE Group Competitive Advantages: Wireless Communication, Smart Hospital, and Semiconductor Integration Testing ACE Group specializes in RF electronic components, measuring instruments, communication system tests, and integration. Since 2014, the company has been committed to digital medicare and precision medical treatment of early diagnosis technology and devices. Combined with AI, it invents the Uniiform digital handwriting system and Data Stream (DS) for Anesthesiology (Spark), Ophthalmology (Eagle Park 100), and Dentistry medical form digital recording system particularly. ACE uses THz technology (TZ-6000) for wafer testing in the semiconductor testing field. Nowadays, ACE establishes partnerships with Teradyne to promote Eagle Test System (ETS). For the third-generation semiconductor, ETS can fulfill the high voltage and high current test solutions in automotive semiconductor production test requirements.   ACE Group invites Dr. Philip F., the scientist of Teraview, to join the panel discussion at this event. Electro-Optical Terahertz Pulse Reflectometry (EOTPR) is an innovative time domain reflectometry (TDR) system that Intel and TeraView have successfully developed. It uses the isolation technique that is the first place in the world to detect package failures and monitor the quality of integrated circuits. It’s the first choice for non-destructive defect detection of integrated circuit packaging. Interdisciplinary skills swapping creates the novel industry application and research of advanced semiconductor materials.

文章來源 : 筑波醫電股份有限公司 發表時間 : 瀏覽次數 : 2665 加入收藏 :
2024 年 10 月 5 日 (星期六) 農曆九月初三日
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