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台北2026年1月6日 /美通社/ -- 全球電腦領導品牌技嘉科技將於 CES 2026 展示搭載核心技術 X3D Turbo Mode 2.0 及最新 AMD Ryzen™ 9000 系列 X3D 處理器的 X870E X3D 系列主機板。透過 X3D Turbo Mode 2.0，內建獨家地端動態 AI 超頻模型與板載硬體控制晶片驅動，能針對不同負載，即時且智能調校頻率、功耗與溫度，全面釋放 AMD Ryzen™ 9000 系列 X3D 處理器在遊戲與多工情境的效能，提供玩家與創作者體驗巔峰效能的最佳平台。 技嘉於 CES 2026 以獨家 X3D Turbo Mode 2.0 全面釋放新世代 AMD Ryzen™ 9000 系列 X3D 處理器效能 專為追求極致效能的使用者打造的旗艦機種 X870E AORUS XTREME X3D AI TOP ，支援高達 DDR5 9000+ MT/s 的記憶體速度，提供卓越的頻寬與穩定性。此主機板亦具備全面的散熱設計包含 CPU Thermal Matrix，可有效降低 VRM 與 DDR 記憶體溫度最高達 8.5°C ; DDR Wind Blade XTREME 則能進一步降低記憶體模組溫度達 9°C，而 M.2 Thermal Guard XTREME 結合 M.2 散熱背板則讓 SSD 溫度最高可降低 22°C。此全方位散熱設計能確保重要元件在高負載與長時間運行下依然維持穩定。 為擴展產品陣容，技嘉也推出兼具設計美學與裝機友善的全新選擇。X870E AERO X3D WOOD 主機板透過溫潤的木紋質感、精緻皮革拉環與細膩工藝設計，為科技注入自然簡約的生活美學風格。為回應社群玩家需求，技嘉亦推出 PROJECT STEALTH 系列新款黑色機種 X870 與 B850 AORUS STEALTH 主機板，採用背插式設計，提供便利整線的裝機體驗，同時單純化機殼內空間，降低視覺干擾，玩家可盡情展示水冷裝置、RGB 燈效與風格化設計，自由展現獨一無二的個人電腦。 技嘉於 CES 2026 所呈現的不僅是一系列全新技術與產品，更展現對未來運算體驗的全新定義。欲了解更多資訊，請造訪GIGABYTE EVENT｜CES 2026 官方頁面，或至 CES 2026 技嘉攤位（LVCC North Hall #8519），媒體與貴賓亦可前往 GIGABYTE Ballroom 體驗技嘉最新 AI 技術應用。
TAIPEI, Jan. 6, 2026 /PRNewswire/ -- At CES 2026, GIGABYTE is unlocking the full potential of AMD Ryzen™ 9000 Series Processors with AMD 3D V-Cache technology. Through its exclusive, AI-powered X3D Turbo Mode 2.0, GIGABYTE delivers real-time, adaptive performance tuning that pushes X3D CPUs beyond traditional limits. Built as a true hardware–software fusion and trained with massive real-world datasets, X3D Turbo Mode 2.0 is fully optimized and ready for the latest X3D Powered Ryzen™ 9000 Series Processors—right from day one. GIGABYTE Unleashes the Full Power of X3D Enabled AMD Ryzen™ 9000 Series Processors with AI-powered X3D Turbo Mode 2.0 at CES 2026 Highlighting this breakthrough is the flagship X870E AORUS XTREME X3D AI TOP, engineered for users seeking uncompromising performance. It supports DDR5 speeds up to 9000+ MT/s, enabling exceptional memory bandwidth and stability. Its advanced thermal architecture includes the CPU Thermal Matrix, reducing VRM and DDR temperatures by up to 8.5°C, while DDR Wind Blade XTREME lowers module temperatures by up to 9°C. To maintain storage reliability under heavy workloads, the M.2 Thermal Guard XTREME reduces SSD temperatures by up to 22°C, ensuring sustained speed and endurance. GIGABYTE further expands its lineup with new design-forward and builder-friendly options. The X870E AERO X3D WOOD model introduces warm wood-grain textures, refined leather pull tabs, and detailed craftsmanship to bring a natural, modern aesthetic to PC builds. To respond to the needs of the community, GIGABYTE introduces the latest sleek black additions to the PROJECT STEALTH series, featuring the X870 and B850 AORUS STEALTH motherboards. By adopting a reverse-connector layout, the motherboard provides a clean, cableless visual appearance and an easier assembly experience, offering creators and gamers more freedom to express their style. GIGABYTE introduces more than a lineup of new technologies at CES 2026, please visit the GIGABYTE EVENT | CES 2026 for more information. To experience all showcased products in person, visit the GIGABYTE Booth #8519 at LVCC North Hall during CES 2026 or join media and VIP sessions at Venetian Ballroom Level 3 Lido 3004, 3005, and 3104.
SHENZHEN, China, Jan. 15, 2026 /PRNewswire/ -- BOSGAME, a technology-based electronic product brand, has officially announced the launch of two new AI PC models, the VTA-439 and VTI-490, marking a strategic move aligned with the latest technology roadmaps from both AMD and Intel. The new models are scheduled to become available globally in the first quarter of 2026. "The simultaneous release of two models reflects BOSGAME's dual-platform strategy, covering both AMD and Intel ecosystems to meet diverse user needs," said James Cao, General Manager of BOSGAME. As one of the first-tier brands to adopt the AMD Ryzen 400 Series AI Core, BOSGAME demonstrates its ability to translate upstream technology advancements into market-ready products through close supply-chain coordination and early-stage integration. Powered by the AMD Ryzen AI 9 HX 470 processor, the VTA-439 targets users who demand strong local AI performance without sacrificing flexibility. Its Radeon 890M RDNA 3.5 integrated graphics, combined with Wi-Fi 7 and Bluetooth 5.4 connectivity, support high-throughput workflows and low-latency collaboration. Dual-channel DDR memory with expansion capability and three M.2 2280 PCIe 4.0 SSD slots address a long-standing limitation of mini PCs—restricted memory and storage scalability. A Realtek 2.5Gbps Ethernet controller further ensures stable, high-speed networking. These specifications translate directly into practical value for AI developers, data analysts, and multitasking professionals who increasingly rely on local inference and on-device processing. For users frustrated by insufficient computing power in compact systems or by the need to depend on cloud-based AI resources, the VTA-439 offers an alternative. Positioned as a "super computing desktop hub," the model supports local model execution, content generation, and data processing, functioning as a lightweight workstation replacement for modern hybrid work settings. The VTI-490, built on the Intel Core Ultra X9 388H processor, addresses a different set of performance demands. Equipped with an Arc B390 GPU clocked at up to 2.5 GHz and high-speed LPDDR5 onboard memory reaching 8533 MT/s, the system is optimized for sustained workloads and graphics-accelerated tasks. Wi-Fi 7 and Bluetooth 5.4 provide next-generation wireless performance, while dual LAN ports (10Gbps and 2.5Gbps) cater to network-intensive applications. This configuration is tailored for enterprise users and edge-computing scenarios where reliability, bandwidth, and multi-device connectivity are critical. The VTI-490 is suited for roles such as enterprise office nodes, content production workstations, or compact local servers, as well as testing and development environments that require stable, high-speed data transfer. By consolidating computing, networking, and AI capabilities into a small footprint, the model responds to the growing need for efficient, decentralized computing infrastructure. "The new AI PC lineup reflects a commitment to making high-performance AI computing more widely accessible," added Cao. By being among the first brands to introduce products based on the AMD Ryzen 400 Series AI Core while also advancing Intel-based solutions, BOSGAME continues to redefine expectations for what mini-PCs can deliver, setting a new benchmark for AI-enabled compact computing in the global market. As AI workloads continue to migrate closer to end users and devices, the introduction of the VTA-439 and VTI-490 signals a broader shift in the PC landscape. Compact systems are no longer peripheral tools but central platforms for AI-driven productivity, creativity, and enterprise operations—an evolution that BOSGAME aims to shape through its latest generation of AI PCs. About BOSGAME BOSGAME is a technology-driven electronic brand established in 2021. Its product portfolio includes mini-PCs, external GPUs (eGPUs), and a wide range of computer hardware. With a team of over 300 R&D engineers, BOSGAME consistently delivers cutting-edge innovations to the microcomputer industry. The brand is committed to making high-performance, stylish, and cost-effective mini-PCs accessible to everyone. For more information, please visit https://www.bosgame.com; or connect with BOSGAME: Facebook: https://www.facebook.com/profile.php?id=100087751382203 Instagram: https://www.instagram.com/bosgame.official/
台北2026年1月16日 /美通社/ -- 隨著人工智慧持續從實驗探索走向實際應用，技嘉在CES 2026（2026年國際消費電子展）上展示了一套清晰的本地AI解決方案。技嘉AI TOP Utility突出展示了一種可在本地運行、支援實際工作流程，並能妥善保護敏感資料的AI應用路徑。在CES展會上，技嘉演示了AI如何安全且高效地從雲端轉移至實際工作發生的本地端。 技嘉於 CES 2026 展示面向本地 AI 應用的實用型 AI TOP Utility 技嘉在CES上展示了AI TOP系列的三款系統，包括AI TOP ATOM、AI TOP 100和AI TOP 500，為本地AI應用提供了一條可擴展的路徑。這三款系統均支援AI TOP Utility，這是技嘉自主研發的軟體平台，用於利用本地儲存的資料建立並運行AI工作流程。 本次CES展會演示聚焦於在AI TOP ATOM上運行的檢索增強生成（RAG）。雖然一般系統配置優先追求原始Token生成速度，但AI TOP ATOM憑藉128GB統一記憶體，使其特別適合處理需要超大上下文的RAG任務。這一硬體優勢在AI TOP Utility的協調下，能夠處理傳統多GPU架構難以應對的海量資料集，證明企業級AI也能在緊湊的本地系統上高效運行。 借助AI TOP Utility，企業可將數千頁未公開的研發文件轉化為安全、即時回應的內部知識庫。這種「私有大腦」模式使團隊在無需任何資料離開本地系統的情況下，即可獲得精準的營運支援。透過將資料保留於本地，此作法消除了雲端延遲與訂閱成本，將技術規格轉化為完整資料主權與即時智慧等具體優勢。 AI TOP系統以實際應用為設計核心，支援在開發與部署環境中維持一致的工作流程。旗艦機型AI TOP 500 TRX50，最高可搭載AMD Ryzen Threadripper PRO 7965WX處理器、GeForce RTX 5090顯示卡及768GB DDR5記憶體，提供強大運算效能，能夠穩定且可控地運行高達4050億參數規模的模型。在AI TOP Utility的管理下，這些系統可於Linux環境中與NVIDIA生態系統順暢整合，使AI模型能在相容環境中低摩擦運行。 透過聚焦本地AI運算、資料控管與易用性，技嘉展示了AI TOP Utility如何將AI從概念性能力轉化為能自然融入日常工作的實用工具。 如欲親身體驗AI TOP平台的實際運作，歡迎蒞臨CES 2026技嘉產品展示區，地點位於Venetian Expo三樓Lido 3005。
TAIPEI, Jan. 16, 2026 /PRNewswire/ -- As artificial intelligence continues to move from experimentation toward real-world adoption, GIGABYTE presents a clear local AI solution at CES 2026. GIGABYTE AI TOP suite highlights an approach to AI that is designed to operate locally, support real-world workflows, and be trusted with sensitive data. At CES, GIGABYTE demonstrates how AI can move from the cloud to the edge locally, where work actually happens, securely and efficiently. GIGABYTE Showcases Practical AI TOP Utility for Local AI Applications at CES 2026 GIGABYTE showcases three systems from the AI TOP lineup at CES, including AI TOP ATOM, AI TOP 100, and AI TOP 500, presenting a scalable path for local AI adoption. All three systems support AI TOP Utility, GIGABYTE's proprietary software for creating and operating AI workflows using locally stored data. The CES demo focuses on Retrieval Augmented Generation (RAG) running on the AI TOP ATOM. While standard setups prioritize raw token generation speed, AI TOP ATOM features 128GB of unified memory, making it uniquely suited for RAG tasks involving massive contexts. This hardware advantage, orchestrated by AI TOP Utility, enables processing vast datasets that would overwhelm traditional multi-GPU configurations, proving that enterprise-grade AI can thrive on a compact local system. Using AI TOP Utility, organizations can turn thousands of pages of unreleased R&D documents into a secure, instant-response internal knowledge base. This "private brain" scenario enables teams to access accurate operational support without a single byte leaving the local server. By keeping data on-premises, this approach eliminates cloud latency and subscription costs, turning technical specs into the tangible benefit of total data sovereignty and real-time intelligence. Designed for real-world usability, AI TOP systems support consistent workflows across development and deployment environments. The flagship AI TOP 500 TRX50, featuring up to AMD Ryzen Threadripper PRO 7965WX, GeForce RTX 5090, and 768GB DDR5 memory, delivers the power to run models up to 405 billion parameters with confidence and control. Managed by AI TOP Utility, these systems integrate smoothly within NVIDIA's ecosystem on Linux, enabling AI models to operate across compatible environments with minimal friction. By prioritizing local AI execution, data control, and ease of adoption, GIGABYTE demonstrates how AI TOP Utility transforms AI from a conceptual capability into a practical tool that fits naturally into everyday workflows. To experience the AI TOP platform in action, visit the GIGABYTE Product Showcase at CES 2026, located at Venetian Expo Level 3, Lido 3005.
台北2026年1月14日 /美通社/ -- 技嘉科技（GIGABYTE）於 2026 年 1 月 6 日至 9 日 舉行的 CES 2026 上，發佈人類與人工智慧互動方式的全新願景。以「The World as Prompt（世界即提示）」為主題，技嘉打造了一場由 AI 驅動的沉浸式體驗，融合先進筆電技術、智慧軟體與以人為本的互動設計，探索人智協作的新模式。 技嘉於 CES 2026 以沉浸式、參與式體驗重新定義人智互動 進入體驗區後，參觀者將生成一個專屬的 AI 數位分身，作為貫穿整個體驗旅程的「數位護照」。該數位分身將引導參與者體驗一系列互動式 AI 產品，並在旅程結束時生成一段個人化的「任務精彩回顧」短片，作為專屬紀念。 借助技嘉 RTX 50 系列筆電及其智慧 AI 助手 GiMATE，人智互動在現場被生動呈現。透過自然的語音互動方式，GiMATE 能夠靈活適配從創意設計、程式開發到高效辦公與娛樂等多元使用情境，展現 AI 如何直觀回應個人需求與生活方式。即時 AI 運算與裝置端 AI 工作負載處理能力，使系統在無需依賴雲端的情況下，即可實現快速回應與流暢互動。 該體驗亦深入展示硬體設計如何支撐次世代 AI 效能。技嘉的 WINDFORCE INFINITY EX 散熱架構，讓參觀者能夠直觀了解鍵盤下方的內部結構，清楚呈現先進散熱設計如何持續支撐高強度 AI 與 GPU 運算。全新發表的多款筆電，包括搭載 AMD Ryzen™ AI 9 400 系列處理器與 NVIDIA® RTX™ 顯示晶片的 AERO X16 Copilot+ PC，充分展現技嘉對行動 AI 運算的願景，實現工作、娛樂與創作之間的無縫切換。 體驗之旅最終聚焦於 AORUS MASTER 16（2026），展現更輕量化的精緻設計、高階材質工藝，以及高更新率 OLED 顯示器的回歸，為沉浸式遊戲與創作體驗而生。包括由 GiMATE 驅動的 AI 輔助程式開發在內，多項 AI 強化工作流程，具體呈現效能與智慧如何於單一平台中深度整合。 透過 CES 2026 的整體體驗，技嘉描繪了一個 AI 超越自動化、成為創意協作者的未來，不僅回應指令，更能理解並回應人類表達。誠摯邀請蒞臨 CES 2026 威尼斯人會展中心三樓 Lido 3005，親身體驗技嘉的產品展示。
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