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Global Business News

SK hynix Enhances Leadership in Graphics Memory With Introduction of Industry's Best GDDR7

Industry's best-performing graphics memory with improvement of 60% in speed, 50% in power efficiency to be mass produced in 3Q24 GDDR7 processes data equivalent to 300 Full-HD movies in a second when combined with high-end graphics card AI, high-performance computing, autonomous vehicles expected to adopt GDDR7 SEOUL, South Korea, July 30, 2024 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it introduced the industry's best-performing GDDR7*, a next-generation graphics memory product. SK hynix GDDR7 * Graphics DDR(GDDR): a standard specification of graphics DRAM defined by the Joint Electron Device Engineering Council (JEDEC) and specialized for processing graphics more quickly. Its generation has shifted from GDDR3, GDDR5, GDDR5X, GDDR6 to GDDR7. With the newer generation promising faster speed and higher power efficiency, GDDR has now become one of the most popular memory chips for AI The development of GDDR7 in March comes amid growing interest by global customers in the AI space in the DRAM product that meets both specialized performance for graphics processing and fast speed. The company said that it will start volume production in the third quarter. The new product comes with the operating speed of 32Gbps, a 60% improvement from the previous generation and the speed can grow up to 40Gbps depending on the circumstances. When adopted for the high-end graphics cards, the product can also process data of more than 1.5TB per second, equivalent to 300 Full-HD movies(5GB each), in a second. SK hynix also improved power efficiency by more than 50% compared with the previous generation by adopting the new packaging technology that addresses the heat issue as a result of the ultra-fast processing of data. The company increased the layer number of the heat-dissipating substrates from four to six, while applying the EMC** for the packaging material in a bid to reduce thermal resistance*** by 74%, compared with the previous generation, while maintaining the size of the product unchanged. ** Epoxy Molding Compound (EMC): an essential material for semiconductor packaging that protects chips from various external conditions such as water, heat, shock and charge by sealing them *** Thermal Resistance: a measurement of a material's resistance to heat transfer that is expressed in the temperature generated by a watt. A lower thermal resistance means better heat-dissipation efficiency as heat is dissipated more easily when a different temperature is applied. Sangkwon Lee, Head of DRAM Product Planning & Enablement at SK hynix, said that GDDR7 is expected to be adopted by a wider range of applications such as high-specification 3D graphics, AI, high-performance computing and autonomous driving. "We will continue to work towards enhancing our position as the most trusted AI memory solution provider by strengthening the premium memory lineup further," Lee said. About SK hynix Inc. SK hynix Inc., headquartered in Korea, is the world's top tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM"), flash memory chips ("NAND flash") and CMOS Image Sensors ("CIS") for a wide range of distinguished customers globally. The Company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com. SK hynix GDDR7

文章來源 : PR Newswire 美通社 發表時間 : 2024/7/30 瀏覽次數 : 1349 加入收藏 :

Global Business News

DapuStor Extends Collaboration with Marvell to Unveil Cutting-Edge Flexible Data Placement (FDP) Technology for QLC SSDs

SAN JOSE, Calif., July 30, 2024 /PRNewswire/ -- DapuStor Corporation, a pioneer in high-performance data storage solutions, announced today that it is expanding its collaboration with Marvell to deliver breakthrough Flexible Data Placement (FDP) technology optimized for Quad-Level Cell (QLC) and Triple-Level Cell (TLC) Solid-State Drives (SSDs). This collaboration aims to revolutionize the storage industry by addressing the inherent challenges of QLC SSDs, enhancing their performance, endurance, and capacity, thereby providing a robust and cost-effective solution for data centers, cloud computing, and high-performance computing environments. Unlocking the Potential of QLC SSDs with FDP Technology QLC SSDs are renowned for their ability to store four bits of data per memory cell, offering significant capacity advantages and a lower Total Cost of Ownership (TCO) compared to other SSD types. Despite these benefits, QLC SSDs face challenges such as lower endurance and slower write speeds. The innovative FDP technology supported in the Marvell® Bravera™ SC5 SSD controller with firmware level solution developed by DapuStor directly addresses these issues. FDP technology intelligently distributes data across the QLC Flash memory, optimizing the use of available memory cells and minimizing the impact of write amplification. The FDP algorithms dynamically adjust data placement based on workload and usage patterns, ensuring that the most frequently accessed data is stored in the fastest and most durable regions of the SSD. This results in improved performance, extended endurance, and enhanced reliability. Impressive Performance Metrics with Marvell and DapuStor FDP Solutions Extensive testing has demonstrated that FDP algorithms integrated with the Marvell Bravera SC5 SSD controller and DapuStor firmware can achieve a write amplification (WA) close to 1.0. A WA of 1.0 indicates that the SSD is utilizing the NAND Flash to its full endurance potential without wastage. This optimization ensures that the DapuStor QLC SSD H5000 series can perform at its highest possible efficiency. In addition to intelligent data placement, DapuStor's FDP solutions incorporate advanced error correction and wear leveling techniques, further enhancing the endurance and reliability of QLC SSDs. These advancements enable QLC SSDs to achieve higher write speeds, lower latency, and a longer lifespan, making them ideal for a wide range of demanding applications. Advancing Storage Innovation and Excellence Today's announcement builds on the groundbreaking work that Marvell and DapuStor have achieved in bringing PCIe Gen 5 SSDs to market. The companies' latest cooperation on FDP technology signifies an important milestone in opening new possibilities for QLC applications. By combining Marvell's expertise in data center semiconductor solutions with DapuStor's innovative storage technologies, the collaboration is set to deliver unparalleled advancements in SSD performance and efficiency. "Marvell is excited to extend our longstanding relationship with DapuStor in bringing innovative storage technologies to market," said Matt Kim, VP of Storage Business at Marvell. "Our collaboration on FDP technology will unlock the full potential of QLC SSDs, providing our customers with higher capacity and performance storage solutions at a lower total cost of ownership." "We are thrilled to collaborate with Marvell in developing FDP solutions," said John Li, VP of DapuStor. "This collaboration underscores our commitment to innovation and excellence in the storage industry. Together, we will set new standards for the DapuStor QLC SSD H5000 series' performance and reliability." Join Us at the 2024 FMS Conference Marvell and DapuStor will showcase the DapuStor QLC SSD H5000 series with FDP solutions at the 2024 FMS: Future of Memory and Storage conference. Attendees are invited to experience firsthand the groundbreaking technology that promises to reshape the future of data storage. About DapuStor Corporation DapuStor Corporation (DapuStor), founded in April 2016, is a leading expert in high-end enterprise solid-state drives (SSD), SOC, and edge computing-related products. With world-class R&D strength and over 400 team members, it has comprehensive capabilities from chip design and product development to mass production. Its products have been widely used in servers, telecom operators, and data centers. For more information, please contact: Contact at DapuStorEmma WangEmail: mkt@dapustor.com Website: dapustor.com

文章來源 : PR Newswire 美通社 發表時間 : 2024/7/30 瀏覽次數 : 1333 加入收藏 :

大陸港澳

晶豪科技獲DEKRA德凱ISO 26262 ASIL B產品認證，車載晶片通過國際認證

台北2024年7月29日 /美通社/ -- 利基型記憶體IC設計公司晶豪科技車載晶片獲得德國認證機構DEKRA德凱頒發的ISO 26262 ASIL B產品認證證書，繼今年(2024)初取得ISO 26262 ASIL D最高等級道路車輛功能安全流程認證後，再度於半年內以DRAM 及Flash Memory兩項產品同時取得ISO 26262 ASIL B產品認證，率先成為全台首家一次通過 2 項產品認證的晶片製造商，充分顯示晶豪科技車用產品研發不僅具備國際規範對硬體所要求的安全性需求相關規格外，更已進階應用至產品從研發開始就啟動的效率和品質，成為車用IC電子市場可靠的企業夥伴。 DEKRA德凱認證總經理孫富樂(右)頒發DEKRA德凱ISO 26262認證證書予晶豪科技總經理張明鑒(左)。 ISO 26262為國際公認的汽車功能安全標準，乃由國際標準化組織ISO針對汽車電子系統制定的功能安全標準，ASIL B（Automotive Safety Integrity Level B）為涵蓋從輕微到中等的安全條件，避免系統失效所造成的危害，達到ASIL安全分析的預期要求。晶豪科技依循SEooC (Safety Element out of Context) 流程建置產品研發之管理制度並落實執行，本次以DRAM及Flash Memory兩款記憶晶片取得產品認證，充分凸顯晶豪科技在車用晶片研發上，已具備國際規範對硬體所要求的安全性需求相關規格，成為車用IC電子市場可靠的企業夥伴。頒證儀式上，晶豪科技董事暨總經理張明鑒代表接受DEKRA德凱認證總經理孫富樂頒發的ISO 26262證書，晶豪科技董事暨總經理張明鑒表示，近年來車用電子已成為半導體產業發展的重要支柱，先進智慧車用電子產品成為主要趨勢，在國際半導體大廠均積極投入的同時，晶豪科技也將車用市場列為重大的策略發展方向。相較於一般應用，車用半導體產品的可靠度與安全性是品質認證上最重要的兩項基本檢視指標，而ISO 26262功能安全標準即是檢核汽車電子供應商是否達到安全標準等級ASIL要求程序的認證指標；晶豪科技經由取得ISO 26262證書，不僅代表開發流程與車用產品已受認可之外，更正式宣告晶豪科技成為可提供符合道路車輛功能安全產品之車用記憶體製造商。 DEKRA德凱認證總經理孫富樂表示，智慧化、電動化已是汽車產業應用的大勢所趨，隨著人類生活對電子系統倚重程度越高，就越須著重功能安全相關議題，才能最大限度地降低故障風險。而DEKRA德凱ASPICE和功能安全團隊目前是台灣最多車廠供應商合作取證的專家團隊，DEKRA德凱也秉持一站式服務理念提供包含ISO 26262功能安全、ISO/SAE 21434道路車輛網路安全、ISO 27001 / TISAX汽車行業資訊安全評估標準、Automotive SPICE軟體發展成熟度模型等整合式解決方案，以協助客戶智慧化的推動汽車產業轉型升級。關於DEKRA德凱 DEKRA德凱成立於1925年，旨在透過車輛檢驗確保道路安全。如今DEKRA 德凱的業務範圍更加廣泛，是在測試、檢驗和認證領域的最大的獨立非上市專家組織。作為一家提供全方位服務和解決方案的全球服務商，我們助力企業提升安全、保障和可持續性發展績效。2023 年，DEKRA德凱營業總額達到41億歐元，業務遍佈世界5大洲60多個國家和地區，逾49,000名員工致力於提供獨立的專家服務。DEKRA德凱連續榮獲EcoVadis鉑金評級，位列前1%的可持續發展公司之列。Website: https://www.dekra.com.tw/

文章來源 : PR Newswire 美通社 發表時間 : 2024/7/29 瀏覽次數 : 1445 加入收藏 :

Global Business News

GMIF2024 Innovation Summit Invites All to Gather in Shenzhen on September 27

SHENZHEN, China, July 26, 2024 /PRNewswire/ -- Driven by production cuts and price increases from upstream manufacturers, alongside a gradual revival in the consumer electronics market, the memory industry is witnessing a recovery after two years of supply-demand imbalance and significant price declines, and behind it also hides a new trend in the industry fueled by AI applications. According to Gartner, by the end of 2024, smartphone shipments are expected to grow by 4.2% to 1.2 billion units, and PC shipments are projected to increase by 3.5% to 250.4 million units, notably with shipments of generative AI smartphones and AIPCs soaring by 917% to 295 million units. The explosive growth of innovative applications such as AI smartphones, AIPCs, AI servers, and XR is driving rapid development in advanced memory technologies like DDR5/LPDDR5, QLC NAND, CXL, and LPCAMM. Organized by Semiconductor Investment Alliance and Shenzhen Memory Industry Association, co-organized by Guangdong Integrated Circuit Industry Association and Shenzhen Semiconductor Industry Association, and hosted by JW Insights Consulting (Xiamen) Co., Ltd. and Haitong Securities Co., Ltd., "The 3rd GMIF2024 Innovation Summit (Global Memory Innovation Forum)" is scheduled to be held on September 27, 2024 at Renaissance Shenzhen Bay Hotel. Under the theme of "AI Leads Memory's New Momentum", GMIF 2024 will bring together leading enterprises and listed companies from various sectors of the semiconductor memory industry chain, including terminal manufacturers, original equipment manufacturers, platform manufacturers, controller manufacturers, module manufacturers, packaging and testing manufacturers, equipment manufacturers, and material suppliers. The forum will focus on the industry trends and dynamics powered by the recovery of the memory market and emerging AI applications, sharing cutting-edge technologies and the latest products, exploring how to synergize innovation throughout the industry chain, to build a cooperative and win-win industry ecosystem. The highlights of this event include: Sharing Insights on Direction of Industrial Technology Innovation: to invite industry leaders such as global original manufacturers to share developments in NAND Flash and DRAM technologies and discuss how advanced memory technologies like CXL and LPCAMM are supporting innovation and applications in the AI industry. Decoding Global Storage Industry Trends: to bring together representatives of memory industry enterprises and renowned industry consulting firms to decode development trends of global storage industry and seize opportunities and challenges brought by changes in the storage industry cycle. Empowering Business Success Through Diverse Event Formats and Media Resources: to facilitate efficient interactions across the industry chain by participation in keynote speeches, thematic matchmaking meetings, awards ceremonies, Bay Area Nights, friendly golf matches and global live broadcasts. Exploring Investment Opportunities by Capital Market matchmaking and Strategy Sharing: to enable face-to-face exchanges between listed companies, unicorns in the memory industry chain, and investment institutions to highlight investment value and foster win-win cooperation. GMIF2024 features an extensive schedule of events that foster collaboration and highlight investment opportunities in the memory industry. On September 27th, the summit will commence with the Memory Industry Trends Forum, followed by the Memory Equipment and Materials Forum, which will delve into the latest advancements and trends. The day will also include a Strategy Meeting for Listed Companies in the Memory Industry, providing a platform for face-to-face exchanges between listed companies, industry unicorns, and investment institutions. The summit evening will be marked by events involving the Award Dinner and Bay Area Night to celebrate notable achievements and explore networking opportunities in the industry. The first day's events will culminate with a Global Live Broadcast of Memory Trends by major brands. To conclude GMIF2024, a Friendly Golf Match will be held on September 28th, marking the end of the summit and offering a relaxed venue for ongoing technology exchanges. Looking back, GMIF2023, themed "Exploration•Advance•Symbiosis•Win-Win", brought together over 250 companies from around the world. The event featured 18 impressive keynote speeches and attracted over 700 industry professionals. With a "2-day conference + 6 events" format, the forum was characterized by a series of special events including closed sessions, main and sub-forum speeches, awards dinners, global live broadcasts, Bay Area Nights and more. With the support of over 30 mainstream media partners, the summit directly reached over 200,000 engineers, and its online exposure exceeded 300 million views. Many enterprises, including Intel, Huawei, Phytium, Tsinghua Tongfang, EmdoorINFO, IP3 Technology, WEIBU, Yangtze Memory, Changxin Memory, Silicon Motion, BIWIN Storage, Maxio Technology, InnoGrit, Techwinsemi, Yeestor, Powev, KingSpec, IKAUTO, KingFast, Hemei Jingyi, AttachPoint, QUANXING and many more, had been honored with the GMIF2023 Annual Awards, which garnered widespread attention from across the semiconductor memory industry. With aims to recognize and incentivize outstanding enterprises for their exceptional contributions to innovation in the global memory industry chain, the GMIF2024 Annual Awards will continue to highlight and celebrate outstanding enterprises across various segments of the memory industry. There are three major categories of awards established, including the Outstanding Industry Award, Outstanding Product Award, and Outstanding Brand Award, with more than 25 specific awards in these categories. The Third GMIF2024 Innovation Summit stands as a pivotal event for industry leaders and innovators to converge, share insights, and shape the future of the memory industry. As AI continues to drive significant advancements and demand within the sector, GMIF2024 will create an invaluable space for collaboration and the exchange of state-of-the-art ideas and technologies. We look forward to your participation in Shenzhen on September 27, 2024, where together, we can forge a path toward a prosperous and innovative future for the global memory industry. About SMIA Founded in the Guangdong-Hong Kong-Macao Greater Bay Area in 2019, the SMIA(Shenzhen Memory Industry Association), a non-governmental social group in the semiconductor industry, focuses on domestic production and global business. With the goal of "Focus on Memory Sector to Achieve Collaborative Development", the SMIA creates a platform for industry service so as to build a collaborative industry ecosystem. About GMIF The Global Memory Innovation Forum (GMIF) is the most important annual event of SMIA. This forum aims to build an international and professional communication platform for the global memory industry to discuss new technologies, applications, cooperation, and opportunities. The forum is dedicated to providing communication opportunities for upstream and downstream manufacturers in the storage industry, consolidating the synergy and complementary development among industry partners, helping participating companies promote their products and brands, and empowering the global memory industry chain to win together! For more information about GMIF, please visit https://www.gmif.com.cn/. Media Contact: Ms. Gu, (+86)15064010336, wenjing.gu@gmif.com.cn

文章來源 : PR Newswire 美通社 發表時間 : 2024/7/26 瀏覽次數 : 1355 加入收藏 :

Global Business News

Vantage App celebrates the spirit of the Games with "Vantage Medal Mania"

PORT VILA, Vanuatu, July 25, 2024 /PRNewswire/ -- Vantage Markets ("Vantage"), a leading multi-asset broker, is thrilled to launch "Vantage Medal Mania" on the Vantage App, celebrating the spirit of competition inspired by the Summer Games. Vantage App celebrates the spirit of the Games with "Vantage Medal Mania" This campaign is available exclusively on the Vantage App, offering clients another exciting way to join in the Games' excitement alongside the ongoing Trading Championship 2024, launched on July 1st. From 25th July to 11th August 2024, "Vantage Medal Mania" invites clients to vote for their favourite teams in 121 medal matches across 17 different sports, earning medals for correct predictions: 6 medals for gold matches, 4 medals for silver matches, and 2 medals for bronze matches. Participants can also earn up to 5 times more medals by engaging in trading or deposit missions linked to selected sports. Achieving specific milestones, such as cumulative check-ins and consecutive accurate guesses, would enhance clients' chances to boost their medal winnings. Medals accumulated through these activities can be exchanged for a variety of trading rewards , including deposit cashback vouchers, cash vouchers, and trade loss vouchers, among others. Additionally, participants stand a chance of winning in a lucky draw with a total prize pool of more than US$10,000, as well as additional V-points*. The promotion also features exclusive flash deals where clients are encouraged to regularly check the dedicated promotions page as they can redeem their accumulated "Medal Mania" medals for trading vouchers at exciting discount rates. *Terms & Conditions apply. "At Vantage, we are passionate about celebrating the spirit of sports and bringing our clients together through exciting initiatives like 'Vantage Medal Mania'," said Lian J, User Growth Director for Vantage App. "This campaign allows us to create a dynamic and engaging experience that mirrors the thrill of sports competition, while rewarding our clients for their participation." Learn more about "Vantage Medal Mania" exclusively on the Vantage App. About Vantage Vantage Markets (or Vantage) is a multi-asset broker offering clients access to a nimble and powerful service for trading Contracts for Difference (CFDs) products, including Forex, Commodities, Indices, Shares, ETFs, and Bonds. With over 14 years of market experience, Vantage transcends the role of broker, providing a trusted trading ecosystem, an award-winning mobile trading app, and a user-friendly trading platform that empowers clients to seize trading opportunities. Download the Vantage App on App Store or Google Play. trade smarter @vantage RISK WARNING : CFD trading carries significant risks. You could lose more than your initial investment.

文章來源 : PR Newswire 美通社 發表時間 : 2024/7/25 瀏覽次數 : 445 加入收藏 :

Global Business News

nubia Unveils Cutting-Edge AI-Powered Flagship Smartphones: Shaping the Future of Innovation

文章來源 : PR Newswire 美通社 發表時間 : 2024/7/23 瀏覽次數 : 574 加入收藏 :

VIAIM Reveals Exclusive 5% Off Discount Price for Stylish Nano+ Conference Recording Earbuds, the Number One Choice for Business Professionals

發表時間 : 2024/7/20

Unlock Amazon Prime Day Savings: CIWETE's Innovative Kitchenware at Unbeatable Prices

發表時間 : 2024/7/15

Milieu Insight cements global reach with latest enhancements to survey and market research platform, Canvas

發表時間 : 2024/7/10

Infortrend Storage Fuels AI Deep Learning Application At One Of The World's Top Five Space Research Organizations

發表時間 : 2024/7/9

VIAIM's Nano+ Conference Recording Earbuds Sales Improve in Singapore Due to Expansion and Making Life More Efficient for Businesspeople

發表時間 : 2024/7/9

NIP Group to Compete in Esports World Cup

發表時間 : 2024/7/7

星競威武集團出征2024電子競技世界杯

發表時間 : 2024/7/7

Taste the world's top craft brews at Asia's premier beer festival

發表時間 : 2024/7/4

SK hynix Develops PCB01 for Artificial Intelligence PCs

發表時間 : 2024/6/28

KLEVV INTRODUCES THE ALL-NEW FIT V DDR5 GAMING/OVERCLOCKING MEMORY

發表時間 : 2024/6/27

DREO Announces Mid-Year Sale Ahead of Prime Day: Unbeatable Deals and Exciting New Products

發表時間 : 2024/6/26

Tineco Announces Third Trade-Up Campaign for Vacuums

發表時間 : 2024/6/20

撐起綠能世界，安泰新能源 2024 SNEC 精彩錦集

發表時間 : 2024/6/18

Shop, Save, and Celebrate in Singapore with the Great iShopChangi Sale & Father’s Day Steals

發表時間 : 2024/6/13

DECO's mmWave Wireless Connection Solution Unveiled at InfoComm, accelerating the Wireless Era of LED Display

發表時間 : 2024/6/12

"The Best Opportunity to Experience K-Fashion": MUSINSA Hosts 'MONSTER SALE,' Its Biggest Summer Promotion, for Two Weeks

發表時間 : 2024/6/10

Expand More Possibilities | HIKSEMI Shines at Computex 2024 Seminar, Embracing the Era of High-Capacity SSDs

發表時間 : 2024/6/8

Agility & Resilience, Leading Finance Digital Infrastructure Innovation

發表時間 : 2024/6/7

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