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World's most advanced power battery works with world's fastest mass-produced EV charger to make recharging as easy as refuelling 1,500kW of charging power achieves a 10%-97% refill in just nine minutes – and even in -30°C, 20%-97% takes only 12 minutes Energy-station integration opens locations to FLASH Charger Stations Plans for 20,000 chargers in China by end of 2026, plus overseas rollout SHENZHEN, China, March 09, 2026 (GLOBE NEWSWIRE) -- BYD, the world's leading manufacturer of new-energy vehicles, is ready to break down the final barriers to truly widespread adoption of EVs through its self-developed FLASH Charging, delivering up to 1500kW through a single connector, and the second generation of its iconic Blade Battery. Together, the two new technologies deliver remarkable recharging speeds, regardless of the conditions. A 10% to 70% refill takes as little as five minutes, while 10% to 97% requires only nine minutes. Even when the temperature is -30°C, conditions that would normally result in a drastic reduction in charging speeds, the FLASH Charger can take a Blade Battery 2.0 from 20% to 97% in only 12 minutes. And the Blade Battery itself is capable of longer distances on a single charge; thanks to a 5% gain in energy density, ranges of more than 1,000km are now possible (Chinese CLTC efficiency test). The new technologies are the result of intensive development by BYD, following extensive research into the barriers consumers still feel are present between them and pure-electric mobility. Despite remarkable gains in EV market penetration in most significant new-car markets worldwide, the fact remains that most buyers of pure-ICE vehicles don't pay much attention to the size of the car's fuel tank, whereas many EV customers are focused on battery capacity and range, even paying significant premiums for a few kilometres more. Wang Chuanfu, Chairman and President of BYD, emphasised today at a showcase in China that the industry needs to address the lingering challenge of slow charging speeds and poor low-temperature charging performance if the remaining consumers are to commit to electric mobility. BLADE BATTERY 2.0 – FASTER CHARGING, MORE RANGE, EXTRA SAFETYDeveloped through six years of intensive research, the second generation of BYD's Blade Battery is the foundation of the latest breakthroughs in FLASH Charging. With traditional batteries, the key qualities of fast charging and high energy density are often seen as conflicting technical goals. But BYD has resolved this trade-off, increasing energy density by five percent while significantly increasing the charging speed. To achieve this while retaining safety and durability, BYD developed a 'FlashPass' Ion Transport System that pushes the boundaries of lithium iron phosphate (LFP) batteries.It's based on three core breakthroughs:the 'Flash-Release' cathode features a directionally engineered, multi-level particle-size architecture that enables dense packing and rapid deintercalation.the 'Flash-Flow' electrolyte uses AI-driven precision optimisation to deliver high ionic conductivity and fast ion mobility.the 'Flash-Intercalate' anode has a multi-dimensional lithium-insertion site construction, allowing 360° 3D high-speed lithium-ion intercalation. Together, these technologies mean significantly reduced internal resistance, cutting heat generation at the source. Further innovation in the anode, which features high-throughput electrode restructuring and graphite particles aligned perpendicular to the electrode plane, reduces lithium-ion transport resistance and allows smooth, faster intercalation – securing not only FLASH Charging performance but also the 5% increase in energy density. Blade Battery 2.0 features a breakthrough Solid Electrolyte Interphase (SEI) layer, a key component of any lithium-ion battery. BYD's solution uses molecular-level engineering and macroscopic structural optimisation to be both ultra-thin, allowing higher ionic conductivity, and highly dense, ensuring chemical stability. It also features dynamic self-repairing technology to strike the balance of 'thin yet strong'. The technical achievements in energy density and charging speed have not come at the cost of safety or durability. In fact, Blade Battery 2.0 has passed a string of fresh benchmark safety evaluations, including the world's first simultaneous FLASH Charging and Nail-Penetration Test, which resulted in no thermal runaway, smoke or fire, even after 500 FLASH Charging cycles. The Blade Battery 2.0 also passed a thermal-runaway test after the forced short circuit of four cells simultaneously, with no fire or explosion, even when reaching temperatures of over 700°C. Furthermore, Blade Battery 2.0 brings an advance in LFP battery durability; compared with the original Blade Battery, its overall capacity degradation is reduced by 2.5%. FLASH CHARGER READY TO REDEFINE THE RECHARGING PROCESSThe second core component of BYD's breakthrough in charging is the FLASH Charger, capable of delivering up to 1,500kW through a single connector (Chinese-market specification), while featuring a unique T-shaped overhead design that also removes many of the less appealing aspects of the recharging procedure. BYD has already installed 4,239 FLASH Charging stations across China (as of 5 March 2026), and it expects to have 20,000 in operation by the end of this year. To support this scale and speed of rollout in a wide variety of locations, the station is paired with an ultra-fast-discharge energy storage system that helps to break through grid restrictions. It uses a battery that gets recharged at slower speeds, and can act as both an energy reservoir to prevent grid overload and a power amplifier that enables high-power charging. Conventional charging stations are often criticised for being cumbersome and unhygienic, with heavy connectors and cables that get dirty or wet through contact with the ground. The FLASH Charger's T-shaped design lifts these parts away from potential contaminants, while the lighter connector and a pulley-based, rail-sliding cable make it much easier to hook up a vehicle, regardless of where its charge port is connected. EUROPEAN ROLLOUT TO BE LED BY STUNNING DENZA Z9GTThe first car featuring FLASH Charging and Blade Battery 2.0 to reach European customers will be the DENZA Z9GT, the flagship shooting-brake grand tourer from BYD's premium brand. Final specifications of the European version of the car will be issued in the coming weeks. BYD has committed to make its FLASH Charging Stations available globally. More details on the overseas rollout plans will be communicated in due course. For more information:Press Office LaPresse - ufficio.stampa@lapresse.it
– Proven supply record with global top-tier inspection system manufacturers– Optimized for high-speed inline semiconductor AXI and 3D X-ray CT platforms HWASEONG, South Korea, March 5, 2026 /PRNewswire/ -- With accelerating global investment in AI infrastructure and surging demand for High Bandwidth Memory (HBM) and AI chips, the need for more precise and faster semiconductor inspection processes is growing significantly. Rayence (KOSDAQ: 228850), a global digital X-ray detector manufacturer, unveiled its industrial high-speed CMOS X-ray detector "Flash Series," engineered specifically for semiconductor AXI (Automated X-ray Inspection) systems and high-speed 3D X-ray CT inspection platforms, aiming to aggressively make inroads into the industrial AXI market. AI chips and HBM devices feature complex multi-layered and stacked chip structures, making micron-level internal defect detection highly challenging. As micron-level defect detection is inextricably linked to semiconductor yields, demand for advanced inspection technologies beyond conventional AOI—particularly AXI and 3D X-ray CT—continues to grow. In particular, semiconductor manufacturers are now intensifying efforts to develop high-speed 3D X-ray CT inspection systems capable of shortening inspection times while precisely identifying internal defects. This trend is elevating the importance of securing high-resolution, high-speed CMOS detectors that can operate reliably in high output and high-power X-ray environments—now regarded as a core technology. "Flash Series" is a high-speed CMOS X-ray detector platform designed for inline semiconductor inspection. First commercialized in 2021, the detector has been supplied to global top-tier AXI and 3D X-ray CT system manufacturers, supporting advanced semiconductor production lines. With the rapid expansion of AI chip inspection and HBM inspection volumes, Rayence has established long-term partnerships with leading global inspection-equipment companies and is ramping up supply. The enhanced "Flash Series" delivers a 49.5 μm pixel size and supports up to 70 frames per second, enabling stable micron-level defect detection in high-throughput semiconductor AXI systems. Indeed, it is optimized for inspecting HBM and AI chips with fine patterns and complex stacked structures. When applied to inline AXI and 3D X-ray CT inspection systems, it enables real-time inline inspection and yield improvement across production lines simultaneously. A key differentiator of "Flash Series" is its X-ray robustness of up to 20,000 Gy, ensuring reliable performance under high-output X-ray exposure commonly required in 3D X-ray CT and advanced AXI applications. This high-output X-ray tolerance enables faster scanning speeds and extended operational lifetime. For AXI and 3D X-ray CT system manufacturers, this translates into reduced detector replacement cycles, improved uptime, and lower total cost of ownership. As high-speed 3D X-ray CT systems become critical for next-generation semiconductor inspection—particularly in HBM inspection and AI chip inspection—the need for durable, high-resolution CMOS X-ray detectors continues to grow. Rayence positions the Flash Series as a core detector solution for semiconductor AXI systems requiring high-speed imaging, high-resolution defect detection, and stable operation under intensive X-ray conditions. Rayence, the only CMOS X-ray detector manufacturer in Korea, is gaining attention for its strong technological capabilities optimized for industrial inspection environments. As demand for AI- and HBM- focused inspection continues to rise and translates into global equipment orders, its industrial detector revenue is expected to remain stable in the first quarter of this year. "As AI infrastructure continues to expand and the structural complexity of HBM and AI chips deepens, the detection of microscopic defects using AXI and 3D X-ray CT has become an essential process in semiconductor manufacturing." said Jaejeong Seo., CEO of Rayence. "Rayence has continuously supplied high-speed CMOS detectors to global top-tier inspection equipment manufacturers, validating our technology and quality at a world-class level. We will further focus on the industrial X-ray inspection market, advancing next-generation high-speed, high-resolution, and high-durability CMOS detectors to strengthen our position as a key partner in AI semiconductor inspection." Company Brief: Rayence Rayence (KOSDAQ: 228850) is a global provider of digital X-ray imaging solutions and industrial CMOS X-ray detectors. The company manufactures both TFT and CMOS detector platforms, serving medical, dental, veterinary, and semiconductor inspection markets. With vertically integrated capabilities including detector ASIC design, scintillator deposition, and image processing technologies, Rayence delivers high-speed, high-resolution, and high-durability X-ray detector solutions for advanced semiconductor AXI and 3D X-ray CT inspection systems.
BARCELONA, Spain, March 3, 2026 /PRNewswire/ -- At MWC Barcelona 2026, Enterprise Strategy Group, now part of Omdia, released a technical validation report on Huawei's New-Gen OceanStor Dorado Converged All-Flash Storage. The report emphasizes that enterprise data volumes are growing rapidly in the AI era, reshaping how organizations operate and raising the bar for storage infrastructure in terms of performance, resilience, intelligence, and cost-effectiveness. While many storage vendors offer all-flash solutions, architectural design trade-offs often make it difficult to balance performance, reliability, and cost, ultimately limiting the benefits delivered to organizations. Huawei New-Gen OceanStor Dorado Converged All-Flash Storage Passes Enterprise Strategy Group Technical Validation The report provides a comprehensive evaluation of New-Gen OceanStor Dorado Converged All-Flash Storage across performance, resilience, intelligent management, and total cost of ownership (TCO). The results confirm that the product leads the way in these key areas and demonstrates strong market competitiveness, delivering a compelling combination of high performance, strong resilience, and optimal TCO. This meets enterprise needs for digital and intelligent transformation. Testing conducted in a simulated high-concurrency database environment shows that the all-flash system sustains ultra-high performance of more than 876,256 IOPS, with an average response time of just 32 μs. The system stores diverse data with native and parallel architecture for blocks, files, and objects. The active-active solution supports seamless failover across data centers. The SmartMatrix full-mesh architecture can tolerate the failure of up to seven out of eight controller enclosures without service interruptions. FlashEver enables cross-gen convergence and eliminates service interruptions during storage replacement. The system delivers end-to-end intelligent protection with built-in ransomware detection for both SAN and NAS. The DataMaster agent of the iMaster DME data management platform enables automatic system health assessment, performance trend prediction, and fault location within minutes. In addition, the five-year TCO analysis indicates that New-Gen OceanStor Dorado Converged All-Flash Storage can reduce TCO by up to 64% compared with traditional hybrid storage. This achieves significant savings in procurement, O&M, and energy consumption. Yuan Yuan, President of Huawei Data Storage Product Line, stated, "This Enterprise Strategy Group technical validation demonstrates Huawei's ongoing leadership in storage technology innovation. Going forward, we will continue to deepen our innovation efforts and help accelerate the digital and intelligent transformation across industries." For more information, visit: https://omdia.tech.informa.com/commissioned-research/articles/huawei-new-gen-oceanstor-dorado-converged-all-flash-storage About Enterprise Strategy Group Enterprise Strategy Group, now part of Omdia, provides focused and actionable market intelligence, demand-side research, analyst advisory services, GTM strategy guidance, solution validations, and custom content supporting enterprise technology buying and selling.
TAIPEI, Feb. 24, 2026 /PRNewswire/ -- Infortrend Technology, Inc. (TWSE: 2495), a leading provider of enterprise storage and AI solutions, today announced that its flagship EonStor GS 5024U hybrid flash storage accelerates critical workloads and provides multi-PB capacity while saving costs, addressing the growing demands of AI training, high-performance computing (HPC), and intelligent surveillance. Bridging Performance and Scale for Modern Data Demands As data volumes continue to grow, enterprises in AI, HPC research, and surveillance analytics face a dilemma: These applications demand both high-speed access and massive capacity; however, scaling all-flash storage to a multi-petabyte level is costly, especially considering that peak performance is required only for a subset of data, while HDD-only systems cannot deliver the performance required for active workloads. Infortrend bridges this gap with the EonStor GS 5024U hybrid flash storage solution, featuring unmatched performance for active datasets and massive capacity for cold data at significantly lower cost. EonStor GS 5024U Storage: Flagship Performance with Multi-PB Capacity The EonStor GS family's highest-performance unified storage system, EonStor GS 5024U, delivers up to 125 GB/s throughput and 2.4 million IOPS for performance-demanding workloads. It supports both all-flash and hybrid configurations. In a hybrid configuration, GS 5024U can scale up to 20 PB, providing a flexible platform for both hot and cold datasets. This hybrid setup and support for economical QLC SSDs help to lower the costs by over 50%[1] compared to all-flash deployments. These capabilities ensure that GS 5024U can efficiently meet the demands of large-scale, performance-critical data environments. Maximized Efficiency Across Applications Active datasets, such as AI training data, HPC computation inputs, or high-resolution surveillance streams, are stored on the NVMe SSD tier to ensure high-speed access and maintain compute or analytic efficiency. Less frequently accessed data and processed results can be automatically tiered to HDDs, reducing all-flash storage costs while maintaining accessibility for large-scale datasets. "GS 5024U combines high-speed access for active workloads with cost-efficient capacity for large datasets through a hybrid storage architecture. The solution can deliver up to 100 GB/s throughput using HDDs only, further optimizing costs for large-scale projects," said Frank Lee, Senior Director of Product Planning at Infortrend Technology. Learn more: EonStor GS 5024U About Infortrend Infortrend (TWSE: 2495) has been developing and manufacturing storage solutions since 1993. With a strong emphasis on in-house design, testing, and manufacturing, Infortrend storage delivers performance and scalability with the latest standards, user-friendly data services, personal after-sales support, and unrivaled value. For more information, please visit www.infortrend.com Infortrend® and EonStor® are trademarks or registered trademarks of Infortrend Technology, Inc.; other trademarks are the property of their respective owners. [1] Calculated based on a 1.4 PB raw capacity of GS 5024U with expansion.
Development of the industry's highest-density QLC product completed, commercial launch scheduled for the first half of next year following completion of customer validation Expansion of independent operation units ("planes") enables simultaneous large capacity and high performance, optimized for ultra-high-capacity eSSDs for AI servers Company to broaden cost-competitive, high-capacity product lineup in response to rapidly growing AI demand and high-performance requirements SEOUL, South Korea, Aug. 25, 2025 /PRNewswire/ -- SK hynix Inc. (or 'the company', www.skhynix.com) announced today that it has completed development of its 321-layer 2Tb QLC[1] NAND flash product and has begun mass production. This achievement marks the world's first implementation of more than 300 layers using QLC technology, setting a new benchmark in NAND density. The company plans to release the product in the first half of next year following completion of global customer validation. To maximize the cost competitiveness of its new product, SK hynix developed a 2Tb device with double the capacity of existing solutions. To address potential performance degradation in large-capacity NAND, the company increased the number of planes[2], independent operation units within a chip, from 4 to 6. This enables greater parallel processing and significantly enhances simultaneous read performance. As a result, the 321-layer QLC NAND delivers both higher capacity and improved performance compared to previous QLC products. Data transfer speed has doubled, write performance has improved by up to 56%, and read performance has improved by 18%. In addition, write power efficiency has increased by more than 23%, strengthening competitiveness in AI data centers where low power consumption is critical. The company plans to apply its 321-layer NAND first to PC SSDs, before expanding to enterprise SSDs (eSSD) for data centers and UFS for smartphones. Leveraging its proprietary 32DP[3] technology, which enables the simultaneous stacking of 32 NAND dies in a single package, SK hynix aims to enter the ultra-high-capacity eSSD market for AI servers by achieving twice the integration density. "With the start of mass production, we have significantly strengthened our high-capacity product portfolio and secured cost competitiveness," said Jeong Woopyo, Head of NAND Development. "We will make a major leap forward as a full-stack AI memory provider, in line with the explosive growth in AI demand and high-performance requirements in the data center market." About SK hynix Inc. SK hynix Inc., headquartered in Korea, is the world's top tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM") and flash memory chips ("NAND flash") for a wide range of distinguished customers globally. The Company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com. [1] NAND flash is categorized as single-level cell (SLC), multi-level cell (MLC), triple-level cell (TLC), QLC, and penta-level cell (PLC) depending on how many data bits can be stored in one cell. As the amount of information storage increases, more data can be stored in the same volume.[2] A plane refers to a cell and its peripheral circuitry that can operate independently within a single chip. By increasing the number of planes from 4 to 6, the simultaneous read performance of the chip—a key factor in data processing—is significantly improved.[3] 32DP (32 Die Package): A method of simultaneously packaging 32 dies in one package to increase chip capacity.
TAIPEI, TAIWAN - Media OutReach Newswire - 19 August 2025 - Solid State Storage Technology Corporation (SSSTC) proudly announces the launch of the SSSTC CA8 Series, the world's first industrial M.2 SSD built with BiCS FLASH™ generation 8 3D flash memory technology and a PCIe® Gen5 x4 interface. Offered in the industry-standard M.2 2280 form factor, the SSSTC CA8 Series is available in 512 GB, 1 TB, 2 TB, and 4 TB capacities. The SSSTC CA8 Series is the world’s first industrial M.2 SSD to combine KIOXIA’s 8th-generation BiCS FLASH™ 3D NAND technology with PCIe Gen5 x4 interface, image credit SSSTC. The SSSTC CA8 Series complies with PCIe® 5.0 and NVMe™ 2.0, supporting ultra-high-speed data access with transfer rates up to 32 GT/s per-lane—doubling the throughput of PCIe® 4.0 interface. With SLC caching, the SSSTC CA8 Series achieves sequential read speeds of up to 14,000 MB/s and write speeds up to 12,000 MB/s, along with random performance of up to 2,000K IOPS (read) and 1,600K IOPS (write) — making it one of the fastest industrial SSDs on the market. At its core is KIOXIA's 8th generation BiCS FLASH™ 218-layer 3D TLC NAND Flash Memory with CMOS directly Bonded to Array (CBA) wafer bonding technology , enabling a 20% improvement in write performance, over 10% reduction in read latency, and up to 30% better power consumption. These enhancements make the SSSTC CA8 Series a critical enabler for data-intensive edge computing and high-performance industrial workloads. Designed for long-term reliability and broad system compatibility, the SSSTC CA8 Series features: • MTBF exceeding 3 million hours • Wide operating temperature range (0 °C to 85 °C) • Supply longevity of 5 to 10 years Its robust durability and consistent performance make it ideal for demanding applications such as AIoT, factory automation, networking, in-vehicle systems, and edge servers—especially those involving Edge AI workloads. To ensure data integrity and system resilience, the CA8 Series includes: • High-performance ECC • Power Loss Notification (PLN) to prevent data corruption during unexpected shutdowns • AES-256 encryption and TCG Opal support for advanced data protection As a subsidiary of KIOXIA, SSSTC is committed to delivering highly stable, high-performance SSD solutions to global enterprise and industrial customers. The SSSTC CA8 Series is scheduled to enter mass production in Q4 2025. For more information, please visit the SSSTC website Hashtag: #SSSTCThe issuer is solely responsible for the content of this announcement.About Solid State Storage Technology Corporation (SSSTC)SSSTC, a subsidiary of KIOXIA—one of the world's leading memory solution providers—is dedicated to the development, manufacturing, and sales of solid-state drives (SSDs). By combining its in-house R&D capabilities with KIOXIA's cutting-edge NAND flash technology, SSSTC consistently delivers high-quality, high-reliability industrial-grade and enterprise-grade SSD solutions to customers worldwide. Trademark Notice: -NVMe is a registered or unregistered trademarks of NVM Express, Inc. in the United States and other countries. -PCIe is a registered trademark of PCI-SIG. -Other company names, product names and service names may be trademarks of third-party companies.
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